CN108054242A - A kind of production method of N-type single side battery - Google Patents

A kind of production method of N-type single side battery Download PDF

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Publication number
CN108054242A
CN108054242A CN201711346915.8A CN201711346915A CN108054242A CN 108054242 A CN108054242 A CN 108054242A CN 201711346915 A CN201711346915 A CN 201711346915A CN 108054242 A CN108054242 A CN 108054242A
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China
Prior art keywords
layer
substrate
production method
passivation layer
forms
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Pending
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CN201711346915.8A
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Chinese (zh)
Inventor
王金艺
徐冠群
包健
张昕宇
金浩
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Zhejiang Jinko Solar Co Ltd
Jinko Solar Co Ltd
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Zhejiang Jinko Solar Co Ltd
Jinko Solar Co Ltd
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Priority to CN201711346915.8A priority Critical patent/CN108054242A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/0547Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/52PV systems with concentrators
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cell Separators (AREA)

Abstract

The invention discloses a kind of production method of N-type single side battery, including:One substrate is provided;P is formed in the front of the substrate+Layer;N is formed at the back side of the substrate+Layer;In the P+Layer sequentially forms the first passivation layer and the second passivation layer away from the one side of the substrate;In the N+Layer forms the 3rd passivation layer away from the one side of the substrate;Deviate from the N in the 3rd passivation layer+The one side of layer forms silver paste film layer by way of silk-screen printing.The production method makes light be reflected back inside battery again, and then adds the short circuit current flow of N-type single side battery by forming one layer of silver paste film layer at the back side of N-type cell.

Description

A kind of production method of N-type single side battery
Technical field
The present invention relates to technical field of solar batteries, more specifically more particularly to a kind of making of N-type single side battery Method.
Background technology
With the continuous development of science and technology, solar cell is widely used to daily life and industry In, popular is p-type polycrystalline cell piece currently on the market, but its efficiency is not high, can not gradually meet the market demand.
, there is the production of N-type battery slice and application in industry-by-industry in the problem of in order to avoid p-type polycrystalline cell piece, but It is that current N-type battery slice is N-type double-side cell, because there are shady faces to reflect the problem of few, causes the short circuit current flow of battery It is smaller.
In order to solve the problem of that the few short circuit current flow of N-type double-side cell reflection is small, N-type single side battery applications and give birth to, still, In the prior art, the production cost of N-type single side battery is very high, and production yield is low.
The content of the invention
To solve the above problems, the present invention provides a kind of production method of N-type single side battery, which effectively drops The production cost of low N-type single side battery improves production yield.
To achieve the above object, the present invention provides following technical solution:
A kind of production method of N-type single side battery, the production method include:
One substrate is provided;
P is formed in the front of the substrate+Layer;
N is formed at the back side of the substrate+Layer;
In the P+Layer sequentially forms the first passivation layer and the second passivation layer away from the one side of the substrate;
In the N+Layer forms the 3rd passivation layer away from the one side of the substrate;
Deviate from the N in the 3rd passivation layer+The one side of layer forms silver paste film layer by way of silk-screen printing.
Preferably, in above-mentioned production method, the substrate is N-type substrate.
Preferably, it is described to form P in the front of the substrate in above-mentioned production method+Layer includes:
Alkali making herbs into wool processing is carried out to the front of the substrate;
After the completion of alkali making herbs into wool processing, boron diffusion is carried out in the front of the substrate, forms P+Layer;
Etching removes the pn-junction diffuseed to form on the substrate back by boron and the boron diffuseed to form on front by boron Silica glass.
Preferably, in above-mentioned production method, the production method further includes:
Work as P+After layer is formed, in the P+Layer forms mask layer away from the one side of the substrate;
Wherein, the mask layer is SiON layers, and the thickness of the mask layer is 40nm-120nm, including endpoint value.
Preferably, it is described to form N at the back side of the substrate in above-mentioned production method+Layer includes:
After mask layer is formed, phosphorus diffusion is carried out at the back side of the substrate, forms N+Layer;
Etching removes the phosphorosilicate glass formed on the substrate back by phosphorus diffusion and the mask layer.
Preferably, in above-mentioned production method, first passivation layer is Al2O3Layer, and the thickness of first passivation layer For 2nm-20nm, including endpoint value;Second passivation layer is SiN layer, and the thickness of second passivation layer is 60nm- 80nm, including endpoint value.
Preferably, in above-mentioned production method, the 3rd passivation layer is SiN layer, and the thickness of the 3rd passivation layer For 60nm-100nm, including endpoint value.
Preferably, in above-mentioned production method, the P+The depth of layer is 0.3um-2um, including endpoint value.
Preferably, in above-mentioned production method, the N+The depth of layer is 0.2um-1um, including endpoint value.
Preferably, in above-mentioned production method, the thickness of silver paste film layer is 1um-3um, including endpoint value.
By foregoing description, a kind of production method of N-type single side battery provided by the invention includes:One lining is provided Bottom;P is formed in the front of the substrate+Layer;N is formed at the back side of the substrate+Layer;In the P+Layer is away from the substrate One side sequentially forms the first passivation layer and the second passivation layer;In the N+Layer forms the 3rd passivation away from the one side of the substrate Layer;Deviate from the N in the 3rd passivation layer+The one side of layer forms silver paste film layer by way of printing.
It follows that the present invention makes light reflect telegram in reply again by forming one layer of silver paste film layer at the back side of N-type cell Inside pond, and then add the short circuit current flow of N-type single side battery.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this The embodiment of invention, for those of ordinary skill in the art, without creative efforts, can also basis The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of flow diagram of the production method of N-type single side battery provided in an embodiment of the present invention;
Fig. 2-Fig. 6 is a kind of corresponding technique stream of flow diagram of the production method for N-type single side battery that Fig. 1 is provided Journey schematic diagram.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work Embodiment belongs to the scope of protection of the invention.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, it is below in conjunction with the accompanying drawings and specific real Applying mode, the present invention is described in further detail.
With reference to figure 1, Fig. 1 is a kind of flow diagram of the production method of N-type single side battery provided in an embodiment of the present invention.
The production method includes:
S101:One substrate is provided.
Specifically, the substrate is N-type silicon substrate.
S102:P is formed in the front of the substrate+Layer.
Specifically, as shown in Fig. 2, alkali making herbs into wool processing is carried out to the substrate 11 first, for obtaining the suede of pyramid shape The light trapping effect of silicon chip has been improved in face 12, and after the completion of alkali making herbs into wool processing, boron diffusion is carried out in the front of the substrate 11, with Form P+Layer 13, i.e. P-type layer, the P+PN junction is formed between layer 13 and N-type silicon substrate 11, and during boron is spread, meeting exists P+Pyrex are additionally formed on layer 13 and can form pn-junction at the back side of silicon chip, it is therefore desirable to etching removal silicon chip back side The Pyrex diffuseed to form in pn-junction and front by boron.
S103:N is formed at the back side of the substrate+Layer.
Specifically, as shown in figure 3, phosphorus diffusion is carried out at the back side of the substrate 11, to form N+Layer 14, i.e. N-type layer, and It, can be in N and during phosphorus diffusion+Phosphorosilicate glass is additionally formed on layer 14, it is therefore desirable to which etching removes the substrate 11 and carries on the back The phosphorosilicate glass formed on face by phosphorus diffusion.
S104:In the P+Layer sequentially forms the first passivation layer and the second passivation layer away from the one side of the substrate.
Specifically, as shown in figure 4, first passivation layer 15 is used to protect the P with second passivation layer 16+Layer 13 It avoids being influenced be subject to extraneous factor, to improve the reliability of the N-type single side battery.
S105:In the N+Layer forms the 3rd passivation layer away from the one side of the substrate.
Specifically, as shown in figure 5, the 3rd passivation layer 17 is used to protect the N+Layer 14 avoids being subject to extraneous factor It influences, to improve the reliability of the N-type single side battery.
S106:Deviate from the N in the 3rd passivation layer+The one side of layer forms silver paste film by way of silk-screen printing Layer.
Specifically, deviate from the N in the 3rd passivation layer 17+The one side of layer 14 forms silver paste film layer 18, and silver paste Film layer 18 cannot cover the main gate line part of cell backside, and rest part all prints silver paste film layer 18, for making light weight New reflection meeting inside battery, and then add the short circuit current flow of N-type single side battery.
It should be noted that silver paste film layer 18 is non-burn-through silver paste film layer in embodiments of the present invention, to prevent The 3rd passivation layer 17 is burnt during only forming silver paste film layer.
Further, in embodiments of the present invention, the production method further includes:
Work as P+After layer is formed, in the P+Layer forms mask layer away from the one side of the substrate.
Wherein, the mask layer is SiON layers, and the thickness of the mask layer is 40nm-120nm, including endpoint value.
Specifically, as P in step S102+, it is necessary in the P after layer formation+Layer forms mask away from the one side of the substrate Layer plays the protection P+The effect of layer, for avoiding forming the N in step s 103+The P is influenced during layer phosphorus diffusion+ Layer.
It should be noted that as the N+, it is necessary to etch the removal mask layer after layer is formed.
Also, in embodiments of the present invention, the material to the mask layer and be not construed as limiting, only by way of example into Row explanation.
Further, first passivation layer 15 is Al2O3Layer, and the thickness of first passivation layer 15 is 2nm-20nm, Thickness including endpoint value, such as first passivation layer 15 is 3nm or 15nm or 19nm.
Second passivation layer 16 is SiN layer, and the thickness of second passivation layer 16 is 60nm-80nm, including endpoint Value, such as the thickness of second passivation layer 16 is 65nm or 70nm or 75nm.
Also, in embodiments of the present invention, to the material of first passivation layer 15 and second passivation layer 16 simultaneously It is not construed as limiting, only illustrates by way of example.
Further, the P+The depth of layer 13 is 0.3um-2um, including endpoint value, for example, the P+The depth of layer 13 For 0.4um or 1um or 1.5um.
The N+The depth of layer 14 is 0.2um-1um, including endpoint value, for example, the N+The depth of layer 14 for 0.3um or 0.5um or 1um.
The thickness of silver paste film layer 18 is 1um-3um, including endpoint value, for example, the thickness of silver paste film layer 18 It spends for 1.5um or 2um or 2.5um.
By foregoing description, a kind of production method of N-type single side battery provided by the invention passes through in N-type cell The back side forms one layer of silver paste film layer, and light is made to be reflected back inside battery again, and then adds the short circuit electricity of N-type single side battery Stream, and silver paste film layer is formed by way of printing, the production cost of N-type single side battery is effectively reduced, it is good to improve production Rate.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention. A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one The most wide scope caused.

Claims (10)

1. a kind of production method of N-type single side battery, which is characterized in that the production method includes:
One substrate is provided;
P is formed in the front of the substrate+Layer;
N is formed at the back side of the substrate+Layer;
In the P+Layer sequentially forms the first passivation layer and the second passivation layer away from the one side of the substrate;
In the N+Layer forms the 3rd passivation layer away from the one side of the substrate;
Deviate from the N in the 3rd passivation layer+The one side of layer forms silver paste film layer by way of silk-screen printing.
2. production method according to claim 1, which is characterized in that the substrate is N-type substrate.
3. production method according to claim 1, which is characterized in that described to form P in the front of the substrate+Layer includes:
Alkali making herbs into wool processing is carried out to the front of the substrate;
After the completion of alkali making herbs into wool processing, boron diffusion is carried out in the front of the substrate, forms P+Layer;
Etching removes the pn-junction diffuseed to form on the substrate back by boron and the borosilicate glass diffuseed to form on front by boron Glass.
4. production method according to claim 1, which is characterized in that the production method further includes:
Work as P+After layer is formed, in the P+Layer forms mask layer away from the one side of the substrate;
Wherein, the mask layer is SiON layers, and the thickness of the mask layer is 40nm-120nm, including endpoint value.
5. production method according to claim 4, which is characterized in that described to form N at the back side of the substrate+Layer includes:
After mask layer is formed, phosphorus diffusion is carried out at the back side of the substrate, forms N+Layer;
Etching removes the phosphorosilicate glass formed on the substrate back by phosphorus diffusion and the mask layer.
6. production method according to claim 1, which is characterized in that first passivation layer is Al2O3Layer, and described the The thickness of one passivation layer is 2nm-20nm, including endpoint value;Second passivation layer is SiN layer, and second passivation layer Thickness is 60nm-80nm, including endpoint value.
7. production method according to claim 1, which is characterized in that the 3rd passivation layer is SiN layer, and the described 3rd The thickness of passivation layer is 60nm-100nm, including endpoint value.
8. production method according to claim 1, which is characterized in that the P+The depth of layer is 0.3um-2um, including end Point value.
9. production method according to claim 1, which is characterized in that the N+The depth of layer is 0.2um-1um, including end Point value.
10. production method according to claim 1, which is characterized in that the thickness of silver paste film layer is 1um-3um, Including endpoint value.
CN201711346915.8A 2017-12-15 2017-12-15 A kind of production method of N-type single side battery Pending CN108054242A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101853897A (en) * 2010-03-31 2010-10-06 晶澳(扬州)太阳能光伏工程有限公司 Method for preparing N-type crystalline silicon solar cell with aluminum-based local emitters on back side
CN102122674A (en) * 2011-01-14 2011-07-13 中国科学院上海技术物理研究所 Crystalline silicon solar cell and preparation method thereof
CN104966761A (en) * 2015-07-08 2015-10-07 四川银河星源科技有限公司 Manufacturing method of crystalline silicon solar cell

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101853897A (en) * 2010-03-31 2010-10-06 晶澳(扬州)太阳能光伏工程有限公司 Method for preparing N-type crystalline silicon solar cell with aluminum-based local emitters on back side
CN102122674A (en) * 2011-01-14 2011-07-13 中国科学院上海技术物理研究所 Crystalline silicon solar cell and preparation method thereof
CN104966761A (en) * 2015-07-08 2015-10-07 四川银河星源科技有限公司 Manufacturing method of crystalline silicon solar cell

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Application publication date: 20180518

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