CN108054100A - 鳍式场效应晶体管的制作方法 - Google Patents
鳍式场效应晶体管的制作方法 Download PDFInfo
- Publication number
- CN108054100A CN108054100A CN201711325799.1A CN201711325799A CN108054100A CN 108054100 A CN108054100 A CN 108054100A CN 201711325799 A CN201711325799 A CN 201711325799A CN 108054100 A CN108054100 A CN 108054100A
- Authority
- CN
- China
- Prior art keywords
- fin
- height
- short
- soi substrate
- field effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005669 field effect Effects 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 12
- 238000001259 photo etching Methods 0.000 claims description 11
- 239000007943 implant Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 229940090044 injection Drugs 0.000 description 14
- 238000002347 injection Methods 0.000 description 14
- 239000007924 injection Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711325799.1A CN108054100B (zh) | 2017-12-12 | 2017-12-12 | 鳍式场效应晶体管的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711325799.1A CN108054100B (zh) | 2017-12-12 | 2017-12-12 | 鳍式场效应晶体管的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108054100A true CN108054100A (zh) | 2018-05-18 |
CN108054100B CN108054100B (zh) | 2021-06-11 |
Family
ID=62132357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711325799.1A Expired - Fee Related CN108054100B (zh) | 2017-12-12 | 2017-12-12 | 鳍式场效应晶体管的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108054100B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110151652A1 (en) * | 2009-07-27 | 2011-06-23 | Yuichiro Sssaki | Method for fabricating semiconductor device and plasma doping system |
US20120313169A1 (en) * | 2011-06-09 | 2012-12-13 | Globalfoundries Inc. | Fin-fet device and method and integrated circuits using such |
US20130082329A1 (en) * | 2011-10-03 | 2013-04-04 | International Business Machines Corporation | Multi-gate field-effect transistors with variable fin heights |
CN103681339A (zh) * | 2012-09-20 | 2014-03-26 | 中芯国际集成电路制造(上海)有限公司 | 一种鳍片场效应晶体管的制备方法 |
US20140113420A1 (en) * | 2012-10-24 | 2014-04-24 | Globalfoundries Inc. | Methods of avoiding shadowing when forming source/drain implant regions on 3d semiconductor devices |
CN104752503A (zh) * | 2013-12-27 | 2015-07-01 | 台湾积体电路制造股份有限公司 | 用于形成具有不同鳍高度的finfet的方法 |
-
2017
- 2017-12-12 CN CN201711325799.1A patent/CN108054100B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110151652A1 (en) * | 2009-07-27 | 2011-06-23 | Yuichiro Sssaki | Method for fabricating semiconductor device and plasma doping system |
US20120313169A1 (en) * | 2011-06-09 | 2012-12-13 | Globalfoundries Inc. | Fin-fet device and method and integrated circuits using such |
US20130082329A1 (en) * | 2011-10-03 | 2013-04-04 | International Business Machines Corporation | Multi-gate field-effect transistors with variable fin heights |
CN103681339A (zh) * | 2012-09-20 | 2014-03-26 | 中芯国际集成电路制造(上海)有限公司 | 一种鳍片场效应晶体管的制备方法 |
US20140113420A1 (en) * | 2012-10-24 | 2014-04-24 | Globalfoundries Inc. | Methods of avoiding shadowing when forming source/drain implant regions on 3d semiconductor devices |
CN104752503A (zh) * | 2013-12-27 | 2015-07-01 | 台湾积体电路制造股份有限公司 | 用于形成具有不同鳍高度的finfet的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN108054100B (zh) | 2021-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20090134457A1 (en) | Segmented pillar layout for a high-voltage vertical transistor | |
CN102738235B (zh) | 单边存取装置及其制造方法 | |
TWI610435B (zh) | 具有橫向擴散金屬氧化物半導體結構之高壓鰭式場效電晶體元件及其製造方法 | |
JPH1187710A (ja) | トレンチ接触法 | |
CN104576743B (zh) | 沟槽功率mos器件及其制造方法 | |
JP5498107B2 (ja) | 半導体装置およびその製造方法 | |
WO2018121132A1 (zh) | Ldmos器件及其制作方法 | |
US9257327B2 (en) | Methods of forming a Field Effect Transistor, including forming a region providing enhanced oxidation | |
US20160380081A1 (en) | Finfet and method of fabricating the same | |
CN104425520B (zh) | 半导体器件及形成方法 | |
US20140124858A1 (en) | Semiconductor device and fabricating method thereof | |
US11652170B2 (en) | Trench field effect transistor structure free from contact hole | |
TWI487112B (zh) | 半導體裝置及其製造方法 | |
US8569134B2 (en) | Method to fabricate a closed cell trench power MOSFET structure | |
CN108054100A (zh) | 鳍式场效应晶体管的制作方法 | |
CN208923147U (zh) | 晶体管及半导体器件 | |
TWI517402B (zh) | 半導體裝置及其製造方法 | |
JP4780905B2 (ja) | 半導体装置の製造方法 | |
CN108109965B (zh) | 叠加三维晶体管及其制作方法 | |
TWI514575B (zh) | 具有溝渠式閘極結構的功率元件及其製作方法 | |
CN107564817B (zh) | 一种FinFET器件的制造方法 | |
TWI467765B (zh) | 半導體裝置及其製造方法 | |
US20220384193A1 (en) | Method for forming finfet super well | |
TWI668802B (zh) | 金屬氧化物半導體元件及其製造方法 | |
CN107331700B (zh) | 一种沟槽式晶体管结构及其制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210527 Address after: 518000 15th floor, tefa information technology building, 2 Qiongyu Road, Science Park community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Wuxin Intelligent Technology Co.,Ltd. Address before: 518000 Guangdong Shenzhen Longhua New District big wave street Longsheng community Tenglong road gold rush e-commerce incubation base exhibition hall E commercial block 706 Applicant before: Shenzhen Meliao Technology Transfer Center Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211102 Address after: 518000 15th floor, tefa information technology building, 2 Qiongyu Road, Science Park community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Wuxin Technology Holding Group Co.,Ltd. Address before: 518000 15th floor, tefa information technology building, 2 Qiongyu Road, Science Park community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Wuxin Intelligent Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210611 |
|
CF01 | Termination of patent right due to non-payment of annual fee |