CN108028176B - 压印用的模板制造装置以及模板制造方法 - Google Patents
压印用的模板制造装置以及模板制造方法 Download PDFInfo
- Publication number
- CN108028176B CN108028176B CN201680040734.XA CN201680040734A CN108028176B CN 108028176 B CN108028176 B CN 108028176B CN 201680040734 A CN201680040734 A CN 201680040734A CN 108028176 B CN108028176 B CN 108028176B
- Authority
- CN
- China
- Prior art keywords
- template
- lyophobic
- liquid
- convex portion
- volatile solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
- B29C2033/426—Stampers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/757—Moulds, cores, dies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015140424A JP6529842B2 (ja) | 2015-07-14 | 2015-07-14 | インプリント用のテンプレート製造装置及びテンプレート製造方法 |
JP2015-140424 | 2015-07-14 | ||
PCT/JP2016/070799 WO2017010539A1 (ja) | 2015-07-14 | 2016-07-14 | インプリント用のテンプレート製造装置及びテンプレート製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108028176A CN108028176A (zh) | 2018-05-11 |
CN108028176B true CN108028176B (zh) | 2022-02-22 |
Family
ID=57757227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680040734.XA Active CN108028176B (zh) | 2015-07-14 | 2016-07-14 | 压印用的模板制造装置以及模板制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20180117796A1 (zh) |
JP (1) | JP6529842B2 (zh) |
KR (1) | KR102118532B1 (zh) |
CN (1) | CN108028176B (zh) |
TW (1) | TW201707918A (zh) |
WO (1) | WO2017010539A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10446728B2 (en) * | 2014-10-31 | 2019-10-15 | eLux, Inc. | Pick-and remove system and method for emissive display repair |
JP6529843B2 (ja) * | 2015-07-14 | 2019-06-12 | 芝浦メカトロニクス株式会社 | インプリント用のテンプレート製造装置及びテンプレート製造方法 |
US10998190B2 (en) | 2017-04-17 | 2021-05-04 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
JP7233174B2 (ja) * | 2018-05-17 | 2023-03-06 | キヤノン株式会社 | インプリント装置、物品製造方法、平坦化層形成装置、情報処理装置、及び、決定方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101330801A (zh) * | 2007-06-20 | 2008-12-24 | 精工爱普生株式会社 | 图案形成方法及电光学装置制造方法以及电子机器制造方法 |
CN101579667A (zh) * | 2008-05-07 | 2009-11-18 | 大日本网屏制造株式会社 | 涂敷装置 |
CN101785363A (zh) * | 2007-06-28 | 2010-07-21 | 住友化学株式会社 | 薄膜的形成方法、有机电致发光元件的制造方法、半导体元件的制造方法及光学元件的制造方法 |
JP2010251601A (ja) * | 2009-04-17 | 2010-11-04 | Toshiba Corp | テンプレート及びその製造方法、並びにパターン形成方法 |
JP2011053266A (ja) * | 2009-08-31 | 2011-03-17 | Daikin Industries Ltd | 撥液−親液パターニング用トップコート組成物 |
JP2012099729A (ja) * | 2010-11-04 | 2012-05-24 | Toshiba Corp | テンプレート、テンプレートの形成方法及び半導体装置の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52154770A (en) | 1976-06-12 | 1977-12-22 | Niigata Engineering Co Ltd | Apparatus for producing compost |
JP2007245702A (ja) * | 2006-02-20 | 2007-09-27 | Asahi Glass Co Ltd | テンプレートおよび転写微細パターンを有する処理基材の製造方法 |
JP5376136B2 (ja) | 2009-04-02 | 2013-12-25 | ソニー株式会社 | パターン形成方法 |
JP5060517B2 (ja) * | 2009-06-24 | 2012-10-31 | 東京エレクトロン株式会社 | インプリントシステム |
JP6529843B2 (ja) * | 2015-07-14 | 2019-06-12 | 芝浦メカトロニクス株式会社 | インプリント用のテンプレート製造装置及びテンプレート製造方法 |
-
2015
- 2015-07-14 JP JP2015140424A patent/JP6529842B2/ja active Active
-
2016
- 2016-07-14 TW TW105122237A patent/TW201707918A/zh unknown
- 2016-07-14 CN CN201680040734.XA patent/CN108028176B/zh active Active
- 2016-07-14 KR KR1020187004481A patent/KR102118532B1/ko active IP Right Grant
- 2016-07-14 WO PCT/JP2016/070799 patent/WO2017010539A1/ja active Application Filing
-
2018
- 2018-01-02 US US15/860,075 patent/US20180117796A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101330801A (zh) * | 2007-06-20 | 2008-12-24 | 精工爱普生株式会社 | 图案形成方法及电光学装置制造方法以及电子机器制造方法 |
CN101785363A (zh) * | 2007-06-28 | 2010-07-21 | 住友化学株式会社 | 薄膜的形成方法、有机电致发光元件的制造方法、半导体元件的制造方法及光学元件的制造方法 |
CN101579667A (zh) * | 2008-05-07 | 2009-11-18 | 大日本网屏制造株式会社 | 涂敷装置 |
JP2010251601A (ja) * | 2009-04-17 | 2010-11-04 | Toshiba Corp | テンプレート及びその製造方法、並びにパターン形成方法 |
JP2011053266A (ja) * | 2009-08-31 | 2011-03-17 | Daikin Industries Ltd | 撥液−親液パターニング用トップコート組成物 |
JP2012099729A (ja) * | 2010-11-04 | 2012-05-24 | Toshiba Corp | テンプレート、テンプレートの形成方法及び半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20180117796A1 (en) | 2018-05-03 |
KR20180030160A (ko) | 2018-03-21 |
JP2017022307A (ja) | 2017-01-26 |
TW201707918A (zh) | 2017-03-01 |
WO2017010539A1 (ja) | 2017-01-19 |
CN108028176A (zh) | 2018-05-11 |
KR102118532B1 (ko) | 2020-06-04 |
JP6529842B2 (ja) | 2019-06-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20200395230A1 (en) | Substrate cleaning method, substrate cleaning system, and memory medium | |
CN108028176B (zh) | 压印用的模板制造装置以及模板制造方法 | |
JP6313591B2 (ja) | インプリント装置、異物除去方法及び物品の製造方法 | |
US10043652B2 (en) | Substrate cleaning method, substrate cleaning system, and memory medium | |
CN108140557B (zh) | 压印用的模板制造装置及模板制造方法 | |
US10668496B2 (en) | Imprint template treatment apparatus | |
KR101357506B1 (ko) | 임프린트 방법, 컴퓨터 기억 매체 및 임프린트 장치 | |
CN109494174B (zh) | 基片处理装置、基片处理方法和计算机存储介质 | |
JP2016058663A (ja) | 感光性組成物、インプリント方法および層間層 | |
TW201210781A (en) | Method of processing template, program, computer storage medium, and template processing device | |
TWI648767B (zh) | 基板處理方法及基板處理裝置 | |
JP2017208424A (ja) | インプリント装置、及び物品の製造方法 | |
WO2016159312A1 (ja) | インプリント用のテンプレート製造装置 | |
TW201305724A (zh) | 成膜方法,程式,電腦記憶媒體及成膜裝置 | |
TW201342511A (zh) | 評估用樣品製造裝置,評估用樣品製造方法及基板處理裝置 | |
CN109669322B (zh) | 掩模清洁设备和清洁掩模的方法 | |
JP5145397B2 (ja) | テンプレート処理方法、プログラム、コンピュータ記憶媒体及びテンプレート処理装置 | |
KR102162260B1 (ko) | 가이드 핀 및 이를 구비하는 포토 마스크 지지 유닛과 포토 마스크 세정 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Kanagawa Applicant after: SHIBAURA MACHINE CO.,LTD. Applicant after: Kaixia Co.,Ltd. Address before: Kanagawa Applicant before: SHIBAURA MACHINE CO.,LTD. Applicant before: TOSHIBA MEMORY Corp. Address after: Kanagawa Applicant after: SHIBAURA MACHINE CO.,LTD. Applicant after: TOSHIBA MEMORY Corp. Address before: Kanagawa Applicant before: SHIBAURA MACHINE CO.,LTD. Applicant before: Japanese businessman Panjaya Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220110 Address after: Kanagawa Applicant after: SHIBAURA MACHINE CO.,LTD. Applicant after: Japanese businessman Panjaya Co.,Ltd. Address before: Kanagawa Applicant before: SHIBAURA MACHINE CO.,LTD. Applicant before: TOSHIBA MEMORY Corp. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |