CN108022911A - 一种倒装芯片封装的片上系统 - Google Patents

一种倒装芯片封装的片上系统 Download PDF

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Publication number
CN108022911A
CN108022911A CN201610930989.5A CN201610930989A CN108022911A CN 108022911 A CN108022911 A CN 108022911A CN 201610930989 A CN201610930989 A CN 201610930989A CN 108022911 A CN108022911 A CN 108022911A
Authority
CN
China
Prior art keywords
protection circuit
bump
chip
conducting wire
kernel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201610930989.5A
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English (en)
Chinese (zh)
Inventor
杨劲松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanechips Technology Co Ltd
Shenzhen ZTE Microelectronics Technology Co Ltd
Original Assignee
Shenzhen ZTE Microelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen ZTE Microelectronics Technology Co Ltd filed Critical Shenzhen ZTE Microelectronics Technology Co Ltd
Priority to CN201610930989.5A priority Critical patent/CN108022911A/zh
Priority to PCT/CN2017/089079 priority patent/WO2018076722A1/fr
Publication of CN108022911A publication Critical patent/CN108022911A/zh
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN201610930989.5A 2016-10-31 2016-10-31 一种倒装芯片封装的片上系统 Withdrawn CN108022911A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610930989.5A CN108022911A (zh) 2016-10-31 2016-10-31 一种倒装芯片封装的片上系统
PCT/CN2017/089079 WO2018076722A1 (fr) 2016-10-31 2017-06-19 Système sur puce de conditionnement de puce retournée

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610930989.5A CN108022911A (zh) 2016-10-31 2016-10-31 一种倒装芯片封装的片上系统

Publications (1)

Publication Number Publication Date
CN108022911A true CN108022911A (zh) 2018-05-11

Family

ID=62023082

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610930989.5A Withdrawn CN108022911A (zh) 2016-10-31 2016-10-31 一种倒装芯片封装的片上系统

Country Status (2)

Country Link
CN (1) CN108022911A (fr)
WO (1) WO2018076722A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1507052A (zh) * 2002-12-06 2004-06-23 松下电器产业株式会社 半导体集成电路装置及半导体集成电路装置的制造方法
US20130063843A1 (en) * 2011-09-08 2013-03-14 Taiwan Semiconductor Manufacturing Co., Ltd. Esd protection for 2.5d/3d integrated circuit systems
CN103165599A (zh) * 2011-12-19 2013-06-19 Arm有限公司 集成电路和在集成电路内提供静电放电保护的方法
CN103515945A (zh) * 2013-10-23 2014-01-15 青岛歌尔声学科技有限公司 Esd补强电路

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031669A (ja) * 2001-07-13 2003-01-31 Ricoh Co Ltd 半導体装置
CN102117803B (zh) * 2009-12-31 2014-10-08 无锡中星微电子有限公司 一种具有高静电释放性能的芯片
US9929139B2 (en) * 2015-03-09 2018-03-27 Apple Inc. Modular electrostatic discharge (ESD) protection

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1507052A (zh) * 2002-12-06 2004-06-23 松下电器产业株式会社 半导体集成电路装置及半导体集成电路装置的制造方法
US20130063843A1 (en) * 2011-09-08 2013-03-14 Taiwan Semiconductor Manufacturing Co., Ltd. Esd protection for 2.5d/3d integrated circuit systems
CN103165599A (zh) * 2011-12-19 2013-06-19 Arm有限公司 集成电路和在集成电路内提供静电放电保护的方法
CN103515945A (zh) * 2013-10-23 2014-01-15 青岛歌尔声学科技有限公司 Esd补强电路

Also Published As

Publication number Publication date
WO2018076722A1 (fr) 2018-05-03

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Application publication date: 20180511