CN108006525A - Intelligent led ceiling lamp - Google Patents
Intelligent led ceiling lamp Download PDFInfo
- Publication number
- CN108006525A CN108006525A CN201711216510.2A CN201711216510A CN108006525A CN 108006525 A CN108006525 A CN 108006525A CN 201711216510 A CN201711216510 A CN 201711216510A CN 108006525 A CN108006525 A CN 108006525A
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- CN
- China
- Prior art keywords
- led
- led light
- light source
- ceiling lamp
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
- F21V23/0471—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor detecting the proximity, the presence or the movement of an object or a person
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
- F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention relates to a kind of intelligent LED ceiling lamp, which includes：LED light source (1), lamp box (2), sensor (3), controller (4) and drive circuit (5)；Wherein, the LED light source (1), the controller (4) and the drive circuit (5) may be contained within the lamp box (2), the sensor (3) is arranged at lamp box (2) outer surface, and the sensor (3), the controller (4), the drive circuit (5), the LED light source (1) are sequentially connected electrically.Intelligent LED ceiling lamp provided by the invention can switch according to the information and control instruction of external environment condition and change intensity of illumination, and its light transmittance is high, good heat dissipation effect, simple in structure.
Description
Technical field
The invention belongs to LED field of luminescent technology, more particularly to a kind of intelligent LED ceiling lamp.
Background technology
Ceiling lamp is one kind of lamps and lanterns, as the term suggests being due to relatively flat above lamps and lanterns, bottom is attached to roof completely during installation
It is upper so referred to as ceiling lamp.Light source has common white light bulb, fluorescent lamp, high-intensity gas discharge lamp, halogen tungsten lamp, light emitting diode
(Light-Emitting Diode, LED) etc..Most popular ceiling lamp is exactly LED ceiling lamp currently on the market, LED ceiling lamp
It is the lamps and lanterns that the various places such as family, office, entertainment place are often selected.
LED ceiling lamp is with long lifespan, luminous efficiency is high, colour rendering is good, safe and reliable, rich in color and easy to maintain
Feature.In current environmental pollution getting worse, under the background of climate warming and energy growing tension, developed based on great power LED
The semiconductor illumination technique got up has been acknowledged as one of 21 century high-tech sector most with prospects.Therefore LED
Ceiling lamp or other LED lamps are the first choices of lamps and lanterns in smart home.
Smart home is the embodiment of the Thingsization under the influence of internet, not only with traditional inhabitation function, is also had both
Building, network service, information household appliances, equipment automatization, there is provided comprehensive information exchange function.Ceiling lamp is daily as people
Essential product in home life, simply realizes illumination functions, and in smart home life popularization instantly, its function seems excessively
It is single, it can not meet the variation of people's home life.
Therefore, manufacture that a kind of high efficiency smart LED ceiling lamp becomes it is particularly important that.
The content of the invention
In order to improve the working performance of intelligent LED ceiling lamp, the present invention provides a kind of intelligent LED ceiling lamp；The present invention
Technical problems to be solved are achieved through the following technical solutions：
The embodiment provides a kind of intelligent LED ceiling lamp, including：LED light source 1, lamp box 2, sensor 3, control
Device 4 and drive circuit 5 processed；Wherein, the LED light source 1, the controller 4 and the drive circuit 5 may be contained within the lamp
In box 2, the sensor 3 is arranged at 2 outer surface of lamp box, the LED light source 1, the drive circuit 5, the controller 4
And the sensor 3 is sequentially connected electrically.
In one embodiment of the invention, the LED light source 1 is fixed in the lamp box 2 by aluminium alloy heat radiator；
Wherein, some circular holes are provided with the aluminium alloy heat radiator.
In one embodiment of the invention, 1 back side of LED light source is provided with circuit board；Wherein, the circuit board electricity
Connect the drive circuit 5.
In one embodiment of the invention, 1 front of LED light source is provided with more than one high-powered LED lamp 11；
Wherein, the 11 rounded spread configuration of LED light is on the LED light source 1.
In one embodiment of the invention, the LED light 11 includes successively from lower to upper：Heat-radiating substrate 111, LED core
Piece 112, the first lens jacket 113, the first layer of silica gel 114, the second lens jacket 115 and the second layer of silica gel 116；Wherein, the heat dissipation
Substrate 111 is provided with some circular holes.
In one embodiment of the invention, the LED chip 112 includes red LED chip, green LED chip and indigo plant
Light LED chip.
In one embodiment of the invention, first lens jacket 113 and second lens jacket 115 include some
The equally distributed silica gel hemisphere of a rectangular or diamond shape.
In one embodiment of the invention, the front of the lamp box 2 is set by transparent lamp shade, the surrounding of the lamp box 2
It is provided with some air holes.
In one embodiment of the invention, the wireless transport module 6 being arranged in the lamp box 2 is further included；Wherein, institute
State wireless transport module 6 and be electrically connected the controller 4.
Compared with prior art, the invention has the advantages that：
1st, the luminous efficiency height of intelligent LED ceiling lamp provided by the invention, good heat dissipation effect, it is simple in structure.
2nd, intelligent LED ceiling lamp provided by the invention can be by the active situation of sensor sensing certain area people, so
The open and close of LED ceiling lamp are automatically controlled afterwards；At the same time it can also by remote control or remote control, realize to part LED light
Open and close, the service life of intelligent LED ceiling lamp is substantially prolongs energy saving while.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Attached drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for this
For the those of ordinary skill of field, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
By the detailed description below with reference to attached drawing, other side of the invention and feature become obvious.But it should know
Road, which is only the purpose design explained, not as the restriction of the scope of the present invention, this is because it should refer to
Appended claims.It should also be noted that unless otherwise noted, it is not necessary to which scale attached drawing, they only try hard to concept
Ground illustrates structure and flow described herein.
Fig. 1 is a kind of structure diagram of intelligent LED ceiling lamp provided in an embodiment of the present invention；
Fig. 2 is a kind of structure diagram of LED light source provided in an embodiment of the present invention；
Fig. 3 is a kind of operation principle schematic diagram of intelligent LED ceiling lamp provided in an embodiment of the present invention；
Fig. 4 is a kind of structure diagram of LED light provided in an embodiment of the present invention；
Fig. 5 is a kind of heat-radiating substrate schematic diagram of LED light provided in an embodiment of the present invention；
Fig. 6 is a kind of LED light production method flow chart provided in an embodiment of the present invention.
Embodiment
Further detailed description is done to the present invention with reference to specific embodiment, but embodiments of the present invention are not limited to
This.
Embodiment one
Fig. 1 is referred to, Fig. 1 is a kind of structure diagram of intelligent LED ceiling lamp provided in an embodiment of the present invention, including：
LED light source 1, lamp box 2, sensor 3, controller 4 and drive circuit 5；Wherein, the LED light source 1, the controller 4 and institute
Drive circuit 5 to be stated to may be contained within the lamp box 2, the sensor 3 is arranged at 2 outer surface of lamp box, the LED light source 1,
The drive circuit 5, the controller 4 and the sensor 3 are sequentially connected electrically.
Preferably, the LED light source 1 is fixed in the lamp box 2 by aluminium alloy heat radiator；Wherein, the aluminium alloy
Some circular holes are provided with radiator.
Wherein, by setting circular hole to increase the passage of air circulation in aluminium alloy heat radiator, the heat of air is utilized
Convection current, adds heat dissipation effect, while intensity has almost no change, reduces the cost of radiator.
Specifically, 1 back side of LED light source is provided with circuit board；Wherein, drive circuit described in the circuit board electrical connection
5。
Preferably, Fig. 2 is referred to, Fig. 2 is a kind of structure diagram of LED light source provided in an embodiment of the present invention, described
1 front of LED light source is provided with more than one high-powered LED lamp 11；Wherein, the 11 rounded spread configuration of LED light is in institute
State on LED light source 1.
Preferably, the front of the lamp box 2 is set is provided with some air holes by transparent lamp shade, the surrounding of the lamp box 2.Its
In, thermal convection current in lamp box and exterior can be effectively realized by air hole, LED is also increased while adding heat dissipation effect
Service life.
Preferably, the sensor 3 includes：Sound transducer 51 and infrared sensor 52.
Preferably, the wireless transport module 6 being arranged in the lamp box 2 is further included；Wherein, the wireless transport module 6
It is electrically connected the controller 4.
Preferably, Fig. 3 is referred to, Fig. 3 shows for a kind of operation principle of intelligent LED ceiling lamp provided in an embodiment of the present invention
It is intended to, wherein, extraneous personnel activity's information is fed back to controller 4 by sensor 3, and controller 4 is generated according to received information and controlled
System instruction, drive circuit 5 drive LED light source to shine or partly shine according to control instruction；It is also possible to by wirelessly passing
Defeated module 6 receives remote control or teleinstruction information, and teleinstruction information forms drive control by the analyzing and processing of controller 4 and refers to
Order, drive circuit 5 shines according to drive control order-driven LED light source or part shines.
Embodiment two
The present embodiment is described in detail 11 structure of LED light of the invention as follows on the basis of above-described embodiment.
In the above-described embodiments, LED light can be opened and closed according to external information selected section LED light, in order in LED
Lamp part provides enough intensities of illumination when closing, it is desirable to provide a kind of high-powered LED lamp of new high printing opacity.
Specifically, it refer to Fig. 4, Fig. 4 is a kind of structure diagram of LED light provided in an embodiment of the present invention, the LED
Lamp 11 includes successively from lower to upper：Heat-radiating substrate 111, LED chip 112, the first lens jacket 113, the first layer of silica gel 114, second
115 and second layer of silica gel 116 of lens jacket；
Further, Fig. 5 is referred to, Fig. 5 is a kind of heat-radiating substrate schematic diagram of LED light provided in an embodiment of the present invention,
The heat-radiating substrate is provided with some circular holes；Wherein, the circular hole along the heat-radiating substrate width and with the heat dissipation base
Plate plane is parallel.
Preferably, the spacing between a diameter of 0.2-0.4 millimeter of the circular hole, circular hole is 0.5-10 millimeters.
Wherein, on heat-radiating substrate by the way of intermediate throughholes, solve due to heat dissipation metal substrate is relatively thin, thermal capacitance compared with
It is small, and the problem of be easily deformed, cause it to contact defective tightness with heat sink bottom surface and influence heat dissipation effect；Meanwhile strong
Degree reduces heat-radiating substrate cost, increases the passage of air circulation while have almost no change, using the thermal convection current of air,
Add heat dissipation effect.
Specifically, the LED chip 112 includes red LED chip, green LED chip and blue-light LED chip.Wherein, adopt
Undoped fluorescent powder with three-primary color LED chip its layer of silica gel, can be adulterated to avoid fluorescent powder uneven cause light extraction uneven
The problem of declining with light emission rate.
Preferably, it is equal to include several rectangular or diamond shapes for first lens jacket 113 and second lens jacket 115
The silica gel hemisphere of even distribution.Wherein, silica gel hemisphere is rectangular evenly distributed or diamond array, it is ensured that the light of light source exists
Concentration zones are uniformly distributed.
Preferably, the refractive index of first layer of silica gel 114 is less than second layer of silica gel 116 and first lens jacket
113 refractive index, the refractive index of second lens jacket 115 are more than first layer of silica gel 114 and second layer of silica gel 116
Refractive index.
Wherein, LED light uses the sandwich construction of the first lens jacket, the first layer of silica gel, the second lens jacket and the second layer of silica gel；
Using the characteristics of variety classes silica gel refractive index is different in sandwich construction, lens are formed in silica gel, improves LED chip and shines point
The problem of dissipating, enables the light that light source is sent more to concentrate；At the same time, it is ensured that LED chip can more pass through encapsulation
Material shines out.
Specifically, it is preferably to meet formula (1) that the first lens jacket 113, which is considered as " planoconvex lens ", its focal length,：
R1/(n2-n1)；------------(1)
Wherein, n1For the refractive index of silica gel in the first layer of silica gel 114, n2To form the silica gel material of the first lens jacket 113
Refractive index, R1For the radius of silica-gel sphere in the first lens jacket 113；
Second lens jacket, 115 focal length is preferably to meet formula (2)：
R2/(n4-n3)；------------(2)
Wherein, n3For the refractive index of silica gel in the second layer of silica gel 116, n4To form the silica gel material of the second lens jacket 115
Refractive index, R2For the radius of silica-gel sphere in the second lens jacket 115.It could so ensure the light emission rate highest of LED well.
In addition, being experimentally confirmed, the other specification of the optimal LED of light emission rate further includes：
The thickness H of first layer of silica gel 1141It should meet formula (3)：
R1/2+2×R1/(n2-n1)≥H1≥R1/2；----------------(3)
Wherein, H1For the thickness of the first layer of silica gel 114；
The thickness of second layer of silica gel 116 should meet formula (4)：
R2/2+2×R2/(n4-n3)≥H2≥R2/2；----------------(4)
Wherein, H2For the thickness of the second layer of silica gel 116.Certainly, the thickness of the first layer of silica gel 114 and the second layer of silica gel 116
Can not be too thick, it is too thick also to influence its light emission rate.
Preferably, R1=R2=R, and R is preferably 5 μm~100 μm, and ball spacing A is preferably 5 μm~100 μm.
The present embodiment solves that the heat dissipation of common LED lamp is bad, and translucency is not strong by using high printing opacity high-powered LED lamp
The problem of, the characteristic of the high printing opacity of LED light low energy consumption is realized, larger range of can be suitable for intelligent power saving household.
Embodiment three
The present embodiment is described in detail LED light production method of the invention as follows on the basis of above-described embodiment.
Specifically, Fig. 6 is refer to, Fig. 6 is a kind of LED light production method flow chart provided in an embodiment of the present invention, including
Following steps：
S11, choose LED chip；
S12, choose heat-radiating substrate and stent；
S13, by the LED chip be welded in the heat-radiating substrate；
S14, in the LED chip successively crossbar system for multiple lens regions and layer of silica gel；
S15, at a temperature of 100-150 DEG C, encapsulated when baking 4-12 is small with completing the LED.
Specifically, S12 can include：
S121, choose stent and heat-radiating substrate；
S122, clean the stent and the heat-radiating substrate；
S123, toast the stent and the heat-radiating substrate and do.
Preferably, the heat-radiating substrate uses round-meshed iron material；
Wherein, by the way of middle tiltedly circular groove, while intensity has almost no change, reduce heat-radiating substrate into
This；Increase the passage of air circulation at the same time, using the thermal convection current speed of stack effect lifting air, add heat dissipation effect.
Specifically, S13 can include：
S131, printing solder and the die bond for examining the solder：
S132, using solder reflow process, the LED chip is welded in the heat-radiating substrate, and by the heat dissipation base
Plate is installed on the stent.
Specifically, S14 can include：
S141, prepare the first lens jacket in the LED chip；
S142, apply the first silica gel the first layer of silica gel of formation on first lens jacket；
S143, prepare the second lens jacket in first layer of silica gel；
S144, apply the second silica gel the second layer of silica gel of formation on second lens jacket.
Further, can also include after S144：
S145, prepare the 3rd lens jacket in second layer of silica gel；
S146, apply the 3rd silica gel the 3rd layer of silica gel of formation on the 3rd lens jacket.
Preferably, can also include after S146：
S147, prepare the 4th lens jacket in the 3rd layer of silica gel；
S148, apply the 4th silica gel the 4th layer of silica gel of formation on the 4th lens jacket.
Preferably, S141 can include：
S1411, apply the 5th silica gel in the LED chip；
S1412, using hemispherical prepare some first hemispherical lens on the 5th silica gel；
Remove mould after S1413, band mould baking and form first lens jacket.
Preferably, S142 can include：
S1421, apply first silica gel on first lens jacket；
First layer of silica gel is formed after S1422, baking；
Further, S143 can include：
S1431, apply the 6th silica gel in the LED chip；
S1432, using hemispherical prepare some second hemispherical lens on the 6th silica gel；
Remove mould after S1433, band mould baking and form second lens jacket.
Preferably, when second layer of silica gel is the outermost layer of LED encapsulation structure, S144 can include：
S1441, apply second silica gel on second lens jacket；
S1442, using hemispherical form outer layer hemisphere on second silica gel；
Remove mould after S1443, band mould baking and form second layer of silica gel.
Specifically, further included after S15：Packaging is detected to the LED encapsulation structure.
In conclusion specific case used herein is set forth the principle of the present invention and embodiment, the above
The explanation of embodiment is only intended to help and understands the present invention and its core concept；Meanwhile for those of ordinary skill in the art,
According to the thought of the present invention, there will be changes in specific embodiments and applications, in conclusion in this specification
Appearance should not be construed as limiting the invention, and protection scope of the present invention should be subject to appended claim.
Claims (9)
- A kind of 1. intelligent LED ceiling lamp, it is characterised in that including：LED light source (1), lamp box (2), sensor (3), controller (4) and drive circuit (5)；Wherein, the LED light source (1), the controller (4) and the drive circuit (5) may be contained within In the lamp box (2), the sensor (3) is arranged at lamp box (2) outer surface, the sensor (3), the controller (4), the drive circuit (5), the LED light source (1) are sequentially connected electrically.
- 2. ceiling lamp according to claim 1, it is characterised in that the LED light source (1) is fixed by aluminium alloy heat radiator In the lamp box (2)；Wherein, some circular holes are provided with the aluminium alloy heat radiator.
- 3. ceiling lamp according to claim 1, it is characterised in that LED light source (1) back side is provided with circuit board；Its In, drive circuit (5) described in the circuit board electrical connection.
- 4. ceiling lamp according to claim 1, it is characterised in that LED light source (1) front is provided with more than one High-powered LED lamp (11)；Wherein, the rounded arrangement of the LED light (11) is uniformly arranged on the LED light source (1).
- 5. ceiling lamp according to claim 4, it is characterised in that the LED light (11) includes successively from lower to upper：Heat dissipation Substrate (111), LED chip (112), the first lens jacket (113), the first layer of silica gel (114), the second lens jacket (115) and second Layer of silica gel (116)；Wherein, the heat-radiating substrate (111) is provided with some circular holes.
- 6. ceiling lamp according to claim 5, it is characterised in that the LED chip (112) includes：Red LED chip, Green LED chip and blue-light LED chip.
- 7. ceiling lamp according to claim 5, it is characterised in that first lens jacket (113) and second lens Layer (115) includes the equally distributed silica gel hemisphere of several rectangular or diamond shapes.
- 8. ceiling lamp according to claim 1, it is characterised in that the front of the lamp box (2) sets transparent lamp shade, described The surrounding of lamp box (2) is provided with some air holes.
- 9. ceiling lamp according to claim 1, it is characterised in that further include the wireless biography being arranged in the lamp box (2) Defeated module (6)；Wherein, the wireless transport module (6) is electrically connected the controller (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711216510.2A CN108006525B (en) | 2017-11-28 | 2017-11-28 | Intelligent LED ceiling lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711216510.2A CN108006525B (en) | 2017-11-28 | 2017-11-28 | Intelligent LED ceiling lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108006525A true CN108006525A (en) | 2018-05-08 |
| CN108006525B CN108006525B (en) | 2020-06-02 |
Family
ID=62054079
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711216510.2A Active CN108006525B (en) | 2017-11-28 | 2017-11-28 | Intelligent LED ceiling lamp |
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| CN201796891U (en) * | 2010-09-27 | 2011-04-13 | 四川新力光源有限公司 | Radiating device for integrated LED |
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| CN202750270U (en) * | 2012-07-25 | 2013-02-20 | 苏州晶雷光电照明科技有限公司 | Intelligent light-emitting diode (LED) ceiling lamp |
| CN105698078A (en) * | 2014-11-27 | 2016-06-22 | 宁波贝克照明电器有限公司 | Self-control ceiling lamp |
| WO2016150837A1 (en) * | 2015-03-20 | 2016-09-29 | Osram Opto Semiconductors Gmbh | Optoelectronic lighting device and method for the production of an optoelectronic lighting device |
| CN205807134U (en) * | 2016-04-21 | 2016-12-14 | 吉安兴创半导体照明有限公司 | A kind of lamp affixed to the ceiling remotely controlled by wifi |
| CN107342353A (en) * | 2017-06-06 | 2017-11-10 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | One kind focuses on ultraviolet LED encapsulating structure and preparation method thereof |
-
2017
- 2017-11-28 CN CN201711216510.2A patent/CN108006525B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102270629A (en) * | 2010-06-01 | 2011-12-07 | Lg伊诺特有限公司 | Light emitting device package and lighting system |
| CN201796891U (en) * | 2010-09-27 | 2011-04-13 | 四川新力光源有限公司 | Radiating device for integrated LED |
| CN202750270U (en) * | 2012-07-25 | 2013-02-20 | 苏州晶雷光电照明科技有限公司 | Intelligent light-emitting diode (LED) ceiling lamp |
| CN105698078A (en) * | 2014-11-27 | 2016-06-22 | 宁波贝克照明电器有限公司 | Self-control ceiling lamp |
| WO2016150837A1 (en) * | 2015-03-20 | 2016-09-29 | Osram Opto Semiconductors Gmbh | Optoelectronic lighting device and method for the production of an optoelectronic lighting device |
| CN205807134U (en) * | 2016-04-21 | 2016-12-14 | 吉安兴创半导体照明有限公司 | A kind of lamp affixed to the ceiling remotely controlled by wifi |
| CN107342353A (en) * | 2017-06-06 | 2017-11-10 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | One kind focuses on ultraviolet LED encapsulating structure and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN108006525B (en) | 2020-06-02 |
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