CN203434200U - High-power full-angle uniform light-emitting LED light bar with separated fluorescent powder and chip - Google Patents
High-power full-angle uniform light-emitting LED light bar with separated fluorescent powder and chip Download PDFInfo
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- CN203434200U CN203434200U CN201320536242.3U CN201320536242U CN203434200U CN 203434200 U CN203434200 U CN 203434200U CN 201320536242 U CN201320536242 U CN 201320536242U CN 203434200 U CN203434200 U CN 203434200U
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Abstract
The utility model discloses a high-power full-angle uniform light-emitting LED light bar with separated fluorescent powder and chips. The LED light bar comprises an internal part and an external part, wherein an LED transparent ceramic lath which is evenly adhered with LED chips is arranged inside, the LED transparent ceramic lath is encapsulated by silica gel, the lath is prepared with microstructures for damaging total reflection, an acrylic tube bar painted with yellow fluorescent powder is arranged outside, and the shape of the acrylic tube bar is designed according to the contour line of LED luminous intensity. According to the LED light bar, a fluorescent powder painting and fixing module and LED light emitting modules can be manufactured separately, the flexible combination can be realized, and the purposes of high yield, low manufacturing cost, long service life, high luminous efficacy and full-angle uniform light emitting are easily realized.
Description
Technical field
The utility model relates to LED lamp bar, particularly the high-power LED lamp strip of the even bright dipping of fluorescent material full angle separated with chip.
Background technology
In recent years, LED lighting technology had obtained the development of advancing by leaps and bounds, and the particularly development of LED lamp bar technology has the rapid posture that replaces conventional incandescent especially with advantages such as its high light efficiency, highly reliable, long-life, environmental protections.But incandescent lamp is as traditional lighting, manufacture craft is ripe, with low cost, is still the selection of a lot of ordinary people's lighting sources.If LED will replace incandescent lamp comprehensively, be applied to room lighting, except keeping the high light efficiency of LED, outside the advantages such as long-life, must further reduce LED light fixture cost.
LED lamp bar is divided into soft lamp bar and the hard large class of lamp bar two.The soft lamp bar of LED is to adopt FPC to do assembling wiring board, with paster LED, assemble approximately one or two millimeter of the thickness of its product, indefinite length, there are long 15 LEDs of long 12 LEDs of 30cm, 24 LEDs and 50cm, 30 LEDs etc., can arbitrarily cut off, also can extend arbitrarily and luminous unaffected.FPC material is soft, can be arbitrarily crooked, folding, reel, can be arbitrarily mobile and stretch and can not fracture at three dimensions.The hard lamp bar of LED divides again aluminium base lamp bar and transparency carrier lamp bar, and wherein aluminium base lamp bar is to do assembling wiring board with PCB hardboard, and the useful paster LED of LED is assembled, and also useful straight cutting LED assembles, optionally different and adopt different elements.The advantage of hard lamp bar is to fix than being easier to, and processing and installation are all more convenient; Transparency carrier lamp bar is to make substrate with the transparent ceramic of high thermal conductivity coefficient, and LED chip is directly sealed on ceramic substrate, like this, LED lamp bar is except from the bright dipping of top, having increased from the bright dipping of transparency carrier bottom, greatly improved the light efficiency of lamp bar, is up-and-coming a kind of encapsulation scheme.
Yet, in the white light LEDs of prior art application transparent ceramic encapsulation, mainly contain two kinds, a kind of is to spray yellow fluorescent powder around at blue led, blue light obtains blue yellow mixed wavelengths white light after by fluorescent material, then passes through transparent ceramic outgoing; Another kind is evenly to mix yellow fluorescent powder in transparent ceramic the inside, and blue light, by after pottery, obtains the white light that blue light forms with yellow light mix.These two kinds of encapsulation technologies all require technical merit very high.Chip is very little, is coated with fluorescent material near chip, is easy to just produce the even phenomenon of became uneven, obtains photochromic inhomogeneous bad product, adjacent this chip thermal source of fluorescent material, and luminous efficiency also can be affected; And in pottery, mix fluorescent material, the temperature of ceramic polycrystalline and the best Cheng Jing of fluorescent powder crystal is not identical, mixes to make to be difficult to separately the state that all reaches best; In ceramic material, increased phosphor material powder, made the interval of ceramic polycrystalline, pore increases, thereby transparency and the coefficient of heat conduction all will reduce; Transparent ceramic is inconsistent to different wave length transmitance, thus the light of LED by pottery with often not inconsistent by ceramic color.In addition, once produce after product product photochromic by immutable by these two kinds of technology.
Utility model content
In order to overcome the above-mentioned shortcoming and deficiency of prior art, the purpose of this utility model is to provide the high-power LED lamp strip of the even bright dipping of fluorescent material full angle separated with chip, realized fluorescent material and chip encapsulates respectively, then flexible combination, obtain the high light efficiency of full angle equal white light, cheaply LED lamp bar.
The purpose of this utility model is achieved through the following technical solutions:
The high-power LED lamp strip of the even bright dipping of fluorescent material full angle separated with chip, the two parts that are nested inside and outside comprising, inner for evenly posting the LED board bar of LED chip, outside for inwall scribbles the acrylic solenoid bar of yellow fluorescent powder, the wall shell of described acrylic pipe bar is corrugated.
Further, described LED board bar 1 comprises the transparent ceramic substrate that is embedded with copper foil, described LED chip adopts electrically conducting transparent glue to be in series in-line and is mounted on transparent ceramic substrate, described transparent ceramic substrate right side is welded with the LED electrode being conducted with copper foil, on described transparent ceramic substrate and LED chip, all fills out and is covered with layer of silica gel.
Further, stating LED chip (6) is GaN base blue-ray LED.
Further, the thickness of described transparent ceramic substrate is 1.4 ~ 2mm.Can dispel the heat smoothly, guarantee again the intensity of substrate.
Further, the left and right two ends of described acrylic pipe bar are respectively arranged with left ventilating opening and the right ventilating opening for dispelling the heat.
Further, the cross section ovalize of described acrylic pipe bar, and the curvature of the pipe bar top-arc part of this ellipse top is greater than the curvature of arc portion at the bottom of the pipe bar side arc portion, pipe bar of oval both sides and bottom.
Further, described LED board bar is 1.29:1:0.57 apart from the distance ratio of acrylic pipe bar top, bottom, sidepiece.
Further, described acrylic pipe bar is to be made by polymethyl methacrylate or makrolon material.
Further, the upper surface of described layer of silica gel departs from luminescence center place and is provided with for destroying the silica gel emboss of total reflection.
Further, described transparent ceramic substrate is MgAl
2o
4material hot pressing calcining forms, and refractive index is the blue light transmittance approximately 60% of 1.73,1.5 millimeters thick, and the coefficient of heat conduction is about 17 w/m.K.
Further, described yellow fluorescent powder is YAG:Ce.
Further, described LED electrode is to weld with gold thread.
Further, the circuit connecting mode of described LED chip is series connection.
Compared with prior art, the utlity model has following advantage and beneficial effect:
(1) the utility model is by having adopted transparent ceramic substrate, make the make progress LED of the part light of outgoing and aluminium base encapsulation of LED chip light source basic identical, and increased downwards the mode from transparent ceramic outgoing, the luminous flux of this part is approximately that half of luminous flux of upwards outgoing is many, the LED of namely aluminium base encapsulation can realize 120lm/W, and the LED of transparent ceramic substrate package is expected to reach 200lm/W.Because emergent light is ultra-blue-light, do not exist because transparent ceramic is to the inconsistent photochromic variation causing of different wave length transmitance.Then according to the light intensity equivalent curve of LED, make acrylic sleeve pipe, make the shape of sleeve pipe just consistent with LED spatial light intensity equivalent curve shape.At the inwall of pipe, evenly scribble yellow fluorescent material.The blue light that LED sends is like this after acrylic sleeve pipe, and the yellow light mix that residue blue light and fluorescent material send forms white light, from the outer surface full angle uniform of pipe.Thereby the high light efficiency that reaches fluorescent material and the encapsulation of LED chip composite type and obtain, low cost, blinding free, the LED lamp bar that full angle evenly emits white light.
(2) the utility model changes not quite existing transparent ceramic LED encapsulation technology, and has relatively reduced the technical difficulty of encapsulation, and simple to operate, finished product rate but improves greatly, and cost is corresponding reduction also.
(3) transparent ceramic of not mixing fluorescent material is relatively easily produced high-quality, and high transmission rate is more secure.
(4) with the acrylic pipe bar of inwall painting fluorescent material, realize the white light of LED, make fluorescent material stow away from heat, the life-span is longer, photochromic more stable.
(5) acrylic pipe bar and the LED ceramic wafer difference in size of inwall painting fluorescent material are little, make to apply the high flexibility of having of lamp bar, can use separately in bulb lamp, also can combine on required other light fixtures.
Accompanying drawing explanation
The LED lamp bar structural representation of the full angle uniformly light-emitting that Fig. 1 fluorescent material is separated with chip.
The structural representation of the blue-ray LED of Fig. 2 transparent ceramic substrate paster encapsulation.
Fig. 3 embeds the structural representation of the copper foil of ceramic substrate.
In Fig. 4, be coated with the acrylic sleeve pipe cross-sectional view of yellow fluorescent powder.
In Fig. 5, be coated with the acrylic sleeve pipe cross-sectional structure schematic diagram of yellow fluorescent powder.
The structural representation of Fig. 6 acrylic sleeve pipe wave-like.
Shown in figure, be: 1-LED lath; 2-acrylic pipe bar; 3-silica gel emboss; 4-layer of silica gel; 5-LED electrode; 6-LED chip; 7-transparent ceramic substrate; 8-negative pole; 9-is anodal; The right ventilating opening of 10-; The left ventilating opening of 11-; 12-pipe bar top-arc part; 13-pipe bar side arc portion; Arc portion at the bottom of 14-pipe bar.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail.
As shown in Figure 1 and Figure 2, the high-power LED lamp strip of the even bright dipping of fluorescent material full angle separated with chip, it is characterized in that, the two parts that are nested inside and outside comprising, inner for evenly posting the LED board bar 1 of LED chip 6, outside for inwall scribbles the acrylic pipe bar 2 of yellow fluorescent powder, the wall shell of described acrylic pipe bar 2 is corrugated, and stating LED chip 6 is GaN base blue-ray LED.
Described LED board bar 1 comprises the transparent ceramic substrate 7 that is embedded with copper foil, described LED chip 6 adopts electrically conducting transparent glue to be in series in-line and is mounted on transparent ceramic substrate 7, described transparent ceramic substrate 7 right sides are welded with the LED electrode 5 being conducted with copper foil, on described transparent ceramic substrate 7 and LED chip 6, all fill out and are covered with layer of silica gel 4.
The thickness of described transparent ceramic substrate 7 is 1.4 ~ 2mm.Can dispel the heat smoothly, the intensity of guaranteed substrate.
The left and right two ends of described acrylic pipe bar 2 are respectively arranged with left ventilating opening 11 and the right ventilating opening 10 for dispelling the heat.
The cross section ovalize of described acrylic pipe bar 2, and the curvature of the pipe bar top-arc part 12 of this ellipse top is greater than the curvature of arc portion 14 at the bottom of the pipe bar side arc portion 13, pipe bar of oval both sides and bottom.
Described LED board bar 1 is 1.29:1:0.57 apart from the distance ratio of acrylic pipe bar 2 tops, bottom, sidepiece.
Described acrylic pipe bar 2 is to be made by polymethyl methacrylate or makrolon material.
The upper surface of described layer of silica gel 4 departs from luminescence center place and is provided with for destroying the silica gel emboss 3 of total reflection.
Described transparent ceramic substrate 7 is MgAl
2o
4material hot pressing calcining forms, and refractive index is the blue light transmittance approximately 60% of 1.73,1.5 millimeters thick, and the coefficient of heat conduction is about 17 w/m.K.
Described yellow fluorescent powder is YAG:Ce.
Described LED electrode 5 is to weld with gold thread.
The circuit connecting mode of described LED chip 6 is series connection.
The long 50mm of transparent ceramic substrate 7, wide 7mm, thick 1.5 ~ 2mm; The size of LED chip 6 is 10*23mil(mil), 6 the LED chip 6 of totally 1 watt be arranged in a row equally spacedly, with electrically conducting transparent sticker on transparent ceramic substrate 7, and they with the mode of series connection receive shown in Fig. 3 in the negative pole 8 and anodal 9 of copper foil electrode on; Above LED chip 6, the upper surface of layer of silica gel 4 is provided with silica gel emboss 3, that diameter is greater than 1 wavelength, be less than the silica gel point of epirelief of the arbitrary shape of 1 millimeter, be after departing from luminescence center 30 degree angles, in order to overcome the total reflection of surperficial beam projecting and the high reflex of wide-angle, on surface, do some micro-structures; In 5 pairs, LED electrode, connect the LED chip 6 of series connection, externally connect driving power, be also the passage that LED chip 6 heats flow to radiator simultaneously.Exterior portion is the acrylic pipe bar 2 that inwall scribbles yellow fluorescent powder, and as shown in Figure 4, Figure 5, inside is colored yellow fluorescent material evenly for appearance structure, and outside presents uneven as wave-like.The two ends of acrylic pipe bar 2 are respectively equipped with right ventilating opening 10, left ventilating opening 11, guarantee gas communication, strengthen the heat radiation of LED chip 6, and the opening of left ventilating opening 11 are drawn the effect of LED electrode 5 in addition; The top at longitudinal interface of acrylic pipe bar 2, the amplitude of fluctuating is relatively little, is because the silica gel of upper surface has been done the result of the light transmission of the wide-angle direction that a lot of salient points strengthen; And lower surface is smooth pottery, the hard and easy embrittlement of material, is unfit to do fine structure, therefore, luminous from LED directly over to the isopleth big rise and fall of the light intensity of center, LED interval top.Fig. 5 is the cross sectional representation of acrylic pipe bar 2, can be divided into three sections of upper, middle and lowers, because LED chip 6 side direction bright dippings are about 20% of gross energy, top outgoing approximately 50%, and below outgoing is about 30%, so, for LED chip 6 tops, take with increasing distance and area increased, optical density to be equated with the optical density of side and bottom surface.Therefore have, pipe bar top-arc part 12 curvature of acrylic pipe bar 2 tops are large, and at the bottom of the pipe bar side arc portion 13 of side and bottom, pipe bar, arc portion 14 curvature are less.
Fig. 6 is the position view for the key parameter place of sleeve pipe relief intensity.
Here continue to illustrate the method for designing of two critical components of the high-power LED lamp strip of the even bright dipping of fluorescent material full angle separated with chip.
(1) calculate the distance of sleeve pipe each point and LED.The ratio of the optical energy density relation on LED exiting surface is about: upper surface: lower surface: side=50%:30%:10%=1.67:1:0.33, so there is H1:H2:H3=1.29:1:0.57; H1 wherein, H2, H3 is respectively LED upper surface as shown in Figure 5, and bottom surface and side are to the vertical range of sleeve pipe.Like this, the luminous intensity of 360 degree in a lateral direction at acrylic pipe bar 2 is all consistent.And pipe box longitudinally on, also to make wave-like, pipe box each point is dropped on the isopleth of light intensity.As an example, H3 value is 3.3mm here, and H2 is 7mm so, and H1 is 9mm, and so, bottom surface longitudinal trough H5 of place equals 3.6mm, and the trough H4 of upper surface equals 5.3mm, and the lamp bar surface obtaining like this light intensity is everywhere consistent substantially.The ripple of longitudinal direction, except eliminating lamp bar surface blackening, guarantee that each position brightness is consistent outside, also strengthen the illumination of the longitudinal direction of lamp bar, the more convenient luminous intensity distribution design of each light fixture simultaneously.
(2) the basic thickness of calculative determination transparent ceramic.LED chip 6 operating voltages are generally about 3.3 volts, and the photon energy of blue light is 2.64ev, that is to say that tube core electric energy conversion is that the maximal efficiency of luminous energy is about 0.8; And the external quantum efficiency of LED is except being subject to material scattering loss, outside material absorbs, LED light extracts also very very difficult.Consider the transmitance problem of reflection loss and the ceramic substrate at interface, electric energy conversion is luminous energy the energy approximately 50% launched, that is to say that 50% energy will be converted into heat, need to distribute by substrate.And 6 tube cores in lamp bar, as long as the heat of discrete heat device tube core farthest can conduct, the work of so whole lamp bar will be normal, therefore, only need to calculate the heat radiation of last tube core.In calculating, utilized formula λ A(θ 2-θ 1)/L=W, the coefficient of heat conduction that wherein λ is ceramic substrate, A is area of section, the maximum temperature that θ 2 can bear for tube core normal operation, θ 1 is radiator temperature, the length that L is heat dissipation channel, and W is the heat that tube core produces farthest.Wherein the width in ceramic cross section is 7mm, and length is 40mm, and calculating ceramic thickness is 1.4mm.If extract the Efficiency Decreasing to 30% of LED light, the thickness of ceramic substrate should be 2mm so.
Above-mentioned is the high-power LED lamp strip detailed content of the even bright dipping of the utility model fluorescent material full angle separated with chip.
Above-described embodiment of the present utility model is only for the utility model example is clearly described, and is not the restriction to execution mode of the present utility model.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all execution modes.All any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in the protection range of the utility model claim.
Claims (9)
1. the high-power LED lamp strip of the even bright dipping of fluorescent material full angle separated with chip, it is characterized in that, the two parts that are nested inside and outside comprising, inner for evenly posting the LED board bar (1) of LED chip (6), outside for inwall scribbles the acrylic pipe bar (2) of yellow fluorescent powder, the wall shell of described acrylic pipe bar (2) is corrugated.
2. the high-power LED lamp strip of the even bright dipping of fluorescent material according to claim 1 full angle separated with chip, it is characterized in that, described LED board bar (1) comprises the transparent ceramic substrate (7) that is embedded with copper foil, described LED chip (6) adopts electrically conducting transparent glue to be in series in-line and is mounted on transparent ceramic substrate (7), described transparent ceramic substrate (7) right side is welded with the LED electrode (5) being conducted with copper foil, on described transparent ceramic substrate (7) and LED chip (6), all fills out and is covered with layer of silica gel (4).
3. the high-power LED lamp strip of the even bright dipping of fluorescent material according to claim 2 full angle separated with chip, is characterized in that, described LED chip (6) is GaN base blue-ray LED.
4. the high-power LED lamp strip of the even bright dipping of fluorescent material according to claim 2 full angle separated with chip, is characterized in that, the thickness of described transparent ceramic substrate (7) is 1.4 ~ 2mm.
5. the high-power LED lamp strip of the even bright dipping of fluorescent material according to claim 1 full angle separated with chip, it is characterized in that, the left and right two ends of described acrylic pipe bar (2) are respectively arranged with left ventilating opening (11) and the right ventilating opening (10) for dispelling the heat.
6. the high-power LED lamp strip of the even bright dipping of fluorescent material according to claim 1 full angle separated with chip, it is characterized in that, the cross section ovalize of described acrylic pipe bar (2), and the curvature of the pipe bar top-arc part (12) of this ellipse top is greater than the curvature of arc portion (14) at the bottom of the pipe bar side arc portion (13), pipe bar of oval both sides and bottom.
7. the high-power LED lamp strip of the even bright dipping of fluorescent material according to claim 1 full angle separated with chip, it is characterized in that, described LED board bar (1) is 1.29:1:0.57 apart from the distance ratio of acrylic pipe bar (2) top, bottom, sidepiece.
8. the high-power LED lamp strip of the even bright dipping of fluorescent material according to claim 1 full angle separated with chip, is characterized in that, described acrylic pipe bar (2) is to be made by polymethyl methacrylate or makrolon material.
9. the high-power LED lamp strip of the even bright dipping of fluorescent material according to claim 2 full angle separated with chip, is characterized in that, the upper surface of described layer of silica gel (4) departs from luminescence center place and is provided with the silica gel emboss (3) for destroying total reflection.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320536242.3U CN203434200U (en) | 2013-08-30 | 2013-08-30 | High-power full-angle uniform light-emitting LED light bar with separated fluorescent powder and chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320536242.3U CN203434200U (en) | 2013-08-30 | 2013-08-30 | High-power full-angle uniform light-emitting LED light bar with separated fluorescent powder and chip |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103441207A (en) * | 2013-08-30 | 2013-12-11 | 华南理工大学 | All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated |
| WO2015139369A1 (en) * | 2014-03-21 | 2015-09-24 | 苏州东山精密制造股份有限公司 | Led light bar manufacturing method and led light bar |
| WO2015180238A1 (en) * | 2014-05-29 | 2015-12-03 | 惠州市华瑞光源科技有限公司 | Led lamp filament |
| CN106653990A (en) * | 2015-11-04 | 2017-05-10 | 涂波 | Novel thermal conducting method for LED packaging |
-
2013
- 2013-08-30 CN CN201320536242.3U patent/CN203434200U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103441207A (en) * | 2013-08-30 | 2013-12-11 | 华南理工大学 | All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated |
| WO2015139369A1 (en) * | 2014-03-21 | 2015-09-24 | 苏州东山精密制造股份有限公司 | Led light bar manufacturing method and led light bar |
| US9905542B2 (en) | 2014-03-21 | 2018-02-27 | Suzhou Dongshan Precision Manufacturing Co., Ltd. | LED light bar manufacturing method and LED light bar |
| WO2015180238A1 (en) * | 2014-05-29 | 2015-12-03 | 惠州市华瑞光源科技有限公司 | Led lamp filament |
| US9982854B2 (en) | 2014-05-29 | 2018-05-29 | Huizhou Very Light Source Technology Co., Ltd | LED lamp filament |
| CN106653990A (en) * | 2015-11-04 | 2017-05-10 | 涂波 | Novel thermal conducting method for LED packaging |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140212 Termination date: 20160830 |