CN108006525B

CN108006525B - Intelligent LED ceiling lamp

Info

Publication number: CN108006525B
Application number: CN201711216510.2A
Authority: CN
Inventors: 张亮
Original assignee: Guangzhou Boman Photoelectric Technology Co ltd
Current assignee: GUANGZHOU BOMAN PHOTOELECTRIC TECHNOLOGY Co.,Ltd.
Priority date: 2017-11-28
Filing date: 2017-11-28
Publication date: 2020-06-02
Anticipated expiration: 2037-11-28
Also published as: CN108006525A

Abstract

The invention relates to an intelligent LED ceiling lamp, which comprises: the LED lamp comprises an LED light source (1), a lamp box (2), a sensor (3), a controller (4) and a driving circuit (5); the LED lamp comprises a lamp box (2), a sensor (3), a controller (4), a driving circuit (5), an LED light source (1), the controller (4) and the driving circuit (5), wherein the LED light source (1), the controller (4) and the driving circuit (5) are all arranged in the lamp box (2), the sensor (3) is arranged on the outer surface of the lamp box (2), and the sensor (3), the controller (4), the driving circuit (5) and the LED light source (1) are sequentially and electrically connected. The intelligent LED ceiling lamp provided by the invention can be switched on and off according to the information of the external environment and the control instruction, and the illumination intensity is changed, and the intelligent LED ceiling lamp is high in light transmittance, good in heat dissipation effect and simple in structure.

Description

Intelligent LED ceiling lamp

Technical Field

The invention belongs to the technical field of LED luminescence, and particularly relates to an intelligent LED ceiling lamp.

Background

The ceiling lamp is one of lamps, and the ceiling lamp is called as the ceiling lamp as the name suggests because the lamp top is relatively flat, and the bottom pastes on the roof completely during installation. The Light source includes a general white Light bulb, a fluorescent lamp, a high-intensity gas discharge lamp, a tungsten halogen lamp, a Light-Emitting Diode (LED), and the like. The most popular ceiling lamp in the market at present is the LED ceiling lamp, and the LED ceiling lamp is a lamp often selected and used in various places such as families, offices, entertainment places and the like.

The LED ceiling lamp has the characteristics of long service life, high luminous efficiency, good color rendering, safety, reliability, rich colors and easiness in maintenance. Under the background of today's increasingly serious environmental pollution, climate warming and energy shortage, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21 st century. Therefore, the LED ceiling lamp or other LED lamps are the first choice of lamps in the smart home.

The intelligent home is embodied in an internet manner under the influence of the internet, not only has the traditional living function, but also has the functions of building, network communication, information household appliances and equipment automation, and provides an all-round information interaction function. The ceiling lamp is used as an essential article in daily household life of people, only realizes the lighting function, and when the intelligent household life is popularized, the function of the ceiling lamp is too single, so that the diversification of the household life of people cannot be met.

Therefore, it becomes especially important to make a high-efficient intelligent LED ceiling lamp.

Disclosure of Invention

In order to improve the working performance of the intelligent LED ceiling lamp, the invention provides the intelligent LED ceiling lamp; the technical problem to be solved by the invention is realized by the following technical scheme:

the embodiment of the invention provides an intelligent LED ceiling lamp, which comprises: the LED lamp comprises an LED light source 1, a lamp box 2, a sensor 3, a controller 4 and a driving circuit 5; the LED light source 1, the controller 4 and the driving circuit 5 are all arranged in the lamp box 2, the sensor 3 is arranged on the outer surface of the lamp box 2, and the LED light source 1, the driving circuit 5, the controller 4 and the sensor 3 are sequentially and electrically connected.

In one embodiment of the invention, the LED light source 1 is fixed in the lamp box 2 by an aluminum alloy heat sink; wherein, a plurality of round holes are arranged in the aluminum alloy radiator.

In one embodiment of the invention, a circuit board is arranged on the back of the LED light source 1; wherein the circuit board is electrically connected with the driving circuit 5.

In one embodiment of the invention, more than one high-power LED lamp 11 is arranged on the front surface of the LED light source 1; the LED lamps 11 are arranged on the LED light source 1 in a circular arrangement.

In an embodiment of the present invention, the LED lamp 11 sequentially includes, from bottom to top: the LED chip comprises a heat dissipation substrate 111, an LED chip 112, a first lens layer 113, a first silica gel layer 114, a second lens layer 115 and a second silica gel layer 116; the heat dissipation substrate 111 is provided with a plurality of round holes.

In one embodiment of the present invention, the LED chips 112 include a red LED chip, a green LED chip, and a blue LED chip.

In an embodiment of the present invention, each of the first lens layer 113 and the second lens layer 115 includes a plurality of rectangular or rhombic silica gel hemispheres uniformly distributed.

In one embodiment of the invention, the front surface of the lamp box 2 is provided with a light-transmitting lampshade, and the periphery of the lamp box 2 is provided with a plurality of air holes.

In one embodiment of the invention, the lamp box further comprises a wireless transmission module 6 arranged in the lamp box 2; wherein, the wireless transmission module 6 is electrically connected with the controller 4.

Compared with the prior art, the invention has the following beneficial effects:

1. the intelligent LED ceiling lamp provided by the invention has the advantages of high luminous efficiency, good heat dissipation effect and simple structure.

2. The intelligent LED ceiling lamp provided by the invention can sense the activity condition of people in a certain area through the sensor, and then automatically control the LED ceiling lamp to be turned on and off; meanwhile, the LED ceiling lamp can be turned on and off by remote control or remote control, and the service life of the intelligent LED ceiling lamp is greatly prolonged while energy is saved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Other aspects and features of the present invention will become apparent from the following detailed description, which proceeds with reference to the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.

Fig. 1 is a schematic structural diagram of an intelligent LED ceiling lamp provided in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an LED light source according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a working principle of the intelligent LED ceiling lamp provided by the embodiment of the invention;

fig. 4 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention;

fig. 5 is a schematic view of a heat dissipation substrate of an LED lamp according to an embodiment of the present invention;

fig. 6 is a flowchart of a method for manufacturing an LED lamp according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.

Example one

Referring to fig. 1, fig. 1 is a schematic structural diagram of an intelligent LED ceiling lamp provided in an embodiment of the present invention, including: the LED lamp comprises an LED light source 1, a lamp box 2, a sensor 3, a controller 4 and a driving circuit 5; the LED light source 1, the controller 4 and the driving circuit 5 are all arranged in the lamp box 2, the sensor 3 is arranged on the outer surface of the lamp box 2, and the LED light source 1, the driving circuit 5, the controller 4 and the sensor 3 are sequentially and electrically connected.

Preferably, the LED light source 1 is fixed in the lamp box 2 through an aluminum alloy heat sink; wherein, a plurality of round holes are arranged in the aluminum alloy radiator.

Wherein, can increase the passageway of circulation of air through set up the round hole in aluminum alloy radiator, utilize the thermal convection of air, increased the radiating effect, when intensity does not change almost, reduced the cost of radiator.

Specifically, a circuit board is arranged on the back of the LED light source 1; wherein the circuit board is electrically connected with the driving circuit 5.

Preferably, referring to fig. 2, fig. 2 is a schematic structural diagram of an LED light source provided in an embodiment of the present invention, where the front of the LED light source 1 is provided with more than one high-power LED lamp 11; the LED lamps 11 are arranged on the LED light source 1 in a circular arrangement.

Preferably, the front surface of the lamp box 2 is provided with a light-transmitting lampshade, and the periphery of the lamp box 2 is provided with a plurality of air holes. The lamp box can effectively realize heat convection with the outside through the air holes, so that the service life of the LED is prolonged while the heat dissipation effect is improved.

Preferably, the sensor 3 comprises: a sound sensor 51 and an infrared sensor 52.

Preferably, the lamp box also comprises a wireless transmission module 6 arranged in the lamp box 2; wherein, the wireless transmission module 6 is electrically connected with the controller 4.

Preferably, please refer to fig. 3, and fig. 3 is a schematic diagram of a working principle of the intelligent LED ceiling lamp provided in the embodiment of the present invention, wherein the sensor 3 feeds back the activity information of the external personnel to the controller 4, the controller 4 generates a control instruction according to the received information, and the driving circuit 5 drives the LED light source to emit light or partially emit light according to the control instruction; meanwhile, remote control or remote instruction information can be received through the wireless transmission module 6, the remote instruction information is analyzed and processed through the controller 4 to form a driving control instruction, and the driving circuit 5 drives the LED light source to emit light or part of the LED light source to emit light according to the driving control instruction.

Example two

This embodiment describes in detail the structure of the LED lamp 11 of the present invention on the basis of the above-described embodiments, as follows.

In the above embodiments, the LED lamp may select a part of the LED lamps to be turned on or off according to external information, and in order to provide sufficient illumination intensity when the part of the LED lamp is turned off, a novel high-transmittance high-power LED lamp is required.

Specifically, referring to fig. 4, fig. 4 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention, where the LED lamp 11 sequentially includes, from bottom to top: the LED chip comprises a heat dissipation substrate 111, an LED chip 112, a first lens layer 113, a first silica gel layer 114, a second lens layer 115 and a second silica gel layer 116;

further, please refer to fig. 5, fig. 5 is a schematic diagram of a heat dissipation substrate of an LED lamp according to an embodiment of the present invention, wherein the heat dissipation substrate is provided with a plurality of circular holes; the circular hole is parallel to the radiating substrate plane along the width direction of the radiating substrate.

Preferably, the diameter of the round holes is 0.2-0.4 mm, and the distance between the round holes is 0.5-10 mm.

The radiating substrate is provided with the middle through hole, so that the problem that the radiating effect is influenced because the metal radiating substrate is thin, has small heat capacity and is easy to deform and is not contacted with the bottom surface of the radiating fin tightly is solved; meanwhile, the strength is almost unchanged, the cost of the radiating substrate is reduced, air circulation channels are increased, and the radiating effect is improved by utilizing the heat convection of air.

Specifically, the LED chips 112 include a red LED chip, a green LED chip, and a blue LED chip. The silica gel layer of the three-primary-color LED chip is not doped with fluorescent powder, so that the problems of uneven light emitting and reduced light emitting rate caused by uneven doping of the fluorescent powder can be solved.

Preferably, the first lens layer 113 and the second lens layer 115 each include a plurality of rectangular or rhombic silica gel hemispheres uniformly distributed. Wherein, the silica gel hemisphere is rectangle align to grid or rhombus and arranges, can guarantee that the light of light source is in the district evenly distributed of concentrating.

Preferably, the refractive index of the first silicone gel layer 114 is smaller than the refractive indices of the second silicone gel layer 116 and the first lens layer 113, and the refractive index of the second lens layer 115 is larger than the refractive indices of the first silicone gel layer 114 and the second silicone gel layer 116.

The LED lamp is of a multilayer structure comprising a first lens layer, a first silica gel layer, a second lens layer and a second silica gel layer; the lens is formed in the silica gel by utilizing the characteristic that different types of silica gel in the multilayer structure have different refractive indexes, so that the problem of light emission dispersion of the LED chip is solved, and light emitted by the light source can be more concentrated; meanwhile, the LED chip can be ensured to be irradiated out through more packaging materials.

Specifically, the first lens layer 113 can be regarded as "plano-convex lens", and the focal length thereof preferably satisfies formula (1):

R₁/(n₂-n₁)；------------(1)

wherein n is₁Is the refractive index of the silica gel in the first silica gel layer 114, n₂Refractive index, R, of the silica gel material forming the first lens layer 113₁Is the radius of the silica gel ball in the first lens layer 113;

the second lens layer 115 focal length preferably satisfies formula (2):

R₂/(n₄-n₃)；------------(2)

wherein n is₃Is the refractive index of the silica gel in the second silica gel layer 116, n₄Refractive index, R, of the silica gel material forming the second lens layer 115₂Is the radius of the silicone ball in the second lens layer 115. The highest light-emitting rate of the LED can be well ensured.

In addition, experiments prove that other parameters of the LED with the optimal light-emitting rate further include:

thickness H of the first silicone gel layer 114₁Equation (3) should be satisfied:

R₁/2+2×R₁/(n₂-n₁)≥H₁≥R₁/2；----------------(3)

wherein H₁The thickness of the first silicone gel layer 114;

the thickness of the second silicone gel layer 116 should satisfy formula (4):

R₂/2+2×R₂/(n₄-n₃)≥H₂≥R₂/2；----------------(4)

wherein H₂Is the thickness of the second silicone gel layer 116. Of course, the thicknesses of the first silicone gel layer 114 and the second silicone gel layer 116 cannot be too thick, and too thick may affect the light extraction rate.

Preferably, R₁＝R₂R, and R is preferably 5 to 100 μm, and the ball pitch a is preferably 5 to 100 μm.

The embodiment solves the problems of poor heat dissipation and poor light transmission of a common LED lamp by adopting the high-light-transmission high-power LED lamp, realizes the characteristic of low energy consumption and high light transmission of the LED lamp, and can be applied to intelligent energy-saving homes in a wider range.

EXAMPLE III

In this embodiment, a method for manufacturing an LED lamp according to the present invention is described in detail below on the basis of the above embodiments.

Specifically, referring to fig. 6, fig. 6 is a flowchart of a method for manufacturing an LED lamp according to an embodiment of the present invention, including the following steps:

s11, selecting an LED chip;

s12, selecting a heat dissipation substrate and a support;

s13, welding the LED chip on the heat dissipation substrate;

s14, sequentially and crosswise preparing a plurality of lens areas and a silica gel layer on the LED chip;

s15, baking for 4-12 hours at the temperature of 100-150 ℃ to finish the LED package.

Specifically, S12 may include:

s121, selecting a support and a heat dissipation substrate;

s122, cleaning the support and the heat dissipation substrate;

s123, drying the support and the heat dissipation substrate.

Preferably, the heat dissipation substrate is made of an iron material with round holes;

the middle inclined circular groove is adopted, so that the cost of the radiating substrate is reduced while the strength is almost unchanged; meanwhile, a channel for air circulation is added, the heat convection rate of air is improved by utilizing the chimney effect, and the heat dissipation effect is improved.

Specifically, S13 may include:

s131, printing solder and checking the die bonding of the solder:

s132, welding the LED chip to the radiating substrate by adopting a reflow soldering process, and installing the radiating substrate on the support.

Specifically, S14 may include:

s141, preparing a first lens layer on the LED chip;

s142, coating first silica gel on the first lens layer to form a first silica gel layer;

s143, preparing a second lens layer on the first silica gel layer;

and S144, coating second silica gel on the second lens layer to form a second silica gel layer.

Further, after S144, the method may further include:

s145, preparing a third lens layer on the second silica gel layer;

and S146, coating third silica gel on the third lens layer to form a third silica gel layer.

Preferably, after S146, the method may further include:

s147, preparing a fourth lens layer on the third silica gel layer;

and S148, coating fourth silica gel on the fourth lens layer to form a fourth silica gel layer.

Preferably, S141 may include:

s1411, coating fifth silica gel on the LED chip;

s1412, preparing a plurality of first hemispherical lenses on the fifth silica gel by using a hemispherical mold;

s1413, baking the belt mold, and removing the mold to form the first lens layer.

Preferably, S142 may include:

s1421, coating the first silica gel on the first lens layer;

s1422, forming the first silica gel layer after baking;

further, S143 may include:

s1431, coating sixth silica gel on the LED chip;

s1432, preparing a plurality of second hemispherical lenses on the sixth silica gel by using a hemispherical mold;

and S1433, removing the mold after baking the belt mold to form the second lens layer.

Preferably, when the second silicone gel layer is the outermost layer of the LED package structure, S144 may include:

s1441, coating the second silicone gel on the second lens layer;

s1442, forming an outer layer hemisphere on the second silica gel by using a hemispherical mold;

s1443, removing the mold after baking the belt mold to form the second silica gel layer.

Specifically, S15 is followed by: and detecting and packaging the LED packaging structure.

In summary, the principle and embodiments of the present invention are explained herein by using specific examples, and the above descriptions of the examples are only used to help understanding the present invention and its core ideas; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention, and the scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides an intelligence LED ceiling lamp, its characterized in that includes: the LED lamp comprises an LED light source (1), a lamp box (2), a sensor (3), a controller (4) and a driving circuit (5); the LED light source (1), the controller (4) and the driving circuit (5) are all arranged in the lamp box (2), the sensor (3) is arranged on the outer surface of the lamp box (2), and the sensor (3), the controller (4), the driving circuit (5) and the LED light source (1) are electrically connected in sequence;

more than one high-power LED lamp (11) is arranged on the front surface of the LED light source (1); the LED lamp (11) sequentially comprises from bottom to top: the LED chip comprises a heat dissipation substrate (111), an LED chip (112), a first lens layer (113), a first silica gel layer (114), a second lens layer (115) and a second silica gel layer (116);

the first lens layer (113) and the second lens layer (115) respectively comprise a plurality of silica gel hemispheres which are in contact with each other and have intervals; the refractive index of the first silicone gel layer (114) is less than the refraction of the second silicone gel layer (116) and the first lens layer (113)A refractive index of the second lens layer (115) is greater than refractive indices of the first silicone gel layer (114) and the second silicone gel layer (116); the focal length of the first lens layer (113) satisfies the formula R₁/(n₂-n₁)；n₁Is the refractive index of silica gel in the first silica gel layer (114), n₂A refractive index, R, of a silica gel material forming the first lens layer (113)₁Is the radius of the silica gel ball in the first lens layer (113); the focal length of the second lens layer (115) satisfies the formula R₂/(n₄-n₃)；n₃Is the refractive index of silica gel in the second silica gel layer (116), n₄A refractive index, R, of a silica gel material forming the second lens layer (115)₂Is the radius of the silica gel ball in the second lens layer (115); the thickness H of the first silica gel layer (114)₁Satisfies the following conditions: r₁/2+2×R₁/(n₂-n₁)≥H₁≥R₁2; the thickness H of the second silica gel layer (116)₂Satisfies the following conditions: r₂/2+2×R₂/(n₄-n₃)≥H₂≥R₂/2。

2. The ceiling lamp according to claim 1, wherein the LED light source (1) is fixed in the lamp box (2) by an aluminum alloy radiator; wherein, a plurality of round holes are arranged in the aluminum alloy radiator.

3. The ceiling lamp according to claim 1, characterized in that a circuit board is arranged on the back of the LED light source (1); wherein the circuit board is electrically connected with the driving circuit (5).

4. The ceiling lamp according to claim 1, wherein the LED lamps (11) are arranged on the LED light source (1) in a circular arrangement.

5. The ceiling lamp according to claim 4, characterized in that the heat-dissipating substrate (111) is provided with a number of circular holes.

6. A ceiling lamp according to claim 5, characterized in that the LED chip (112) comprises: red light LED chips, green light LED chips and blue light LED chips.

7. The ceiling lamp of claim 5, wherein the first lens layer (113) and the second lens layer (115) comprise a plurality of silica gel hemispheres uniformly distributed in a rectangular or diamond shape.

8. The ceiling lamp according to claim 1, wherein a light-transmitting lampshade is arranged on the front surface of the lamp box (2), and a plurality of air holes are formed around the lamp box (2).

9. The ceiling lamp according to claim 1, further comprising a wireless transmission module (6) disposed within the light box (2); wherein the wireless transmission module (6) is electrically connected with the controller (4).