CN108002711A - A kind of high transmission muted color double-silver low-emissivity coated glass and preparation method - Google Patents

A kind of high transmission muted color double-silver low-emissivity coated glass and preparation method Download PDF

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Publication number
CN108002711A
CN108002711A CN201711213080.9A CN201711213080A CN108002711A CN 108002711 A CN108002711 A CN 108002711A CN 201711213080 A CN201711213080 A CN 201711213080A CN 108002711 A CN108002711 A CN 108002711A
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layer
target
ratio
argon
gas
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熊建
宋宇
黄家鸿
江维
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Xianning CSG Energy Saving Glass Co Ltd
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Xianning CSG Energy Saving Glass Co Ltd
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Priority to CN201711213080.9A priority Critical patent/CN108002711A/en
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3649Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer made of metals other than silver
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3626Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer one layer at least containing a nitride, oxynitride, boronitride or carbonitride
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3644Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the metal being silver
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00Methods for coating glass
    • C03C2218/10Deposition methods
    • C03C2218/15Deposition methods from the vapour phase
    • C03C2218/154Deposition methods from the vapour phase by sputtering
    • C03C2218/156Deposition methods from the vapour phase by sputtering by magnetron sputtering

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The present invention provides a kind of high transmission muted color double-silver low-emissivity coated glass and preparation method, belong to magnetron sputtering technology field.The technology is on the basis of double silverskin Rotating fields, by the introducing of film layer optimization design and new material, improves the transmitance and oxidation resistent susceptibility of film layer.A kind of high transmission muted color double-silver low-emissivity coated glass, including glass substrate layer G and film plating layer, film plating layer are outwards compounded with 13 film layers successively from the glass substrate layer, and wherein first layer is SiNxLayer, the second layer are ZnSnO layers, third layer ZnO layer, and the 4th layer is Ag layers, and layer 5 is NiCr layers, layer 6 TixSiyNzLayer, layer 7 SiNxLayer, the 8th layer is ZnSnO layers, and the 9th layer is ZnO layer, and the tenth layer is Ag layers, and eleventh floor is NiCr layers, and Floor 12 is TixSiyNzLayer, the 13rd layer is SiNxLayer, each film plating layer are plated on glass substrate layer successively by way of magnetron sputtering.Glass of the present invention has the advantages that transmitance height, resistance to oxidation.

Description

A kind of high transmission muted color double-silver low-emissivity coated glass and preparation method
Technical field
The invention belongs to magnetron sputtering technology field, and in particular to a kind of double silver low-emissivity coateds of high transmission muted color Glass and preparation method.
Background technology
As a kind of excellent construction material, glass has the function of light transmission, wind-proof snow, quilt due to its good permeability It is widely used in building.With the development of modern science and technology level, glass is endowed various new intensions, wherein low-E glass With its color beautiful and generous, preferable texture and excellent energy conservation characteristic, extensive use has been subject to it in building curtain wall field. Low-E glass is also known as low emissivity glass, often deposits a nanometer film layer in glass substrate surface using magnetron sputtering method, and then change The optics of glass, electricity, performance mechanically and chemically etc., reach the purpose of decoration, energy-saving and environmental protection.
As energy saving building material, the energy conservation characteristic of low-E glass compared with simple glass and heat-reflection coated glass, Low-E glass has high reflectivity to far infrared radiation.Indoor temperature can be kept to stablize, reduce what is built heating or freeze Energy consumption, plays very outstanding effect of energy.And high-transparency Low-E glass is while excellent heat-insulating property is ensured With higher transmission of visible light, so daylighting effect is good, suitable for the high-permeability of north cold area and part region Building, prominent natural lighting effect.
The shortcomings that prior art:
1) existing high double-silver low-emissivity coated glass transmitance thoroughly is still difficult to meet customer need.
2) the problem of existing high generally existing oxidative resistance of double silverskin systems thoroughly is poor, and the monolithic holding time is short.
The content of the invention
In view of the above problems existing in the prior art, the purpose of the present invention is to provide a kind of double silver of high transmission muted color are low How radiation film coating glass and preparation method, the technical problems to be solved by the invention are by the design of film plating layer, improve plating Film glass transmitance, oxidation resistance.
The purpose of the present invention can be realized by following technical proposal:A kind of double silver low-emissivity coated glass of high transmission muted color Glass, including glass substrate layer and film plating layer, the film plating layer are outwards compounded with 13 film layers successively from the glass substrate layer, Wherein first layer is SiNx layer, and the second layer is ZnSnO layers, and third layer is ZnO layer, and the 4th layer is Ag layers, and layer 5 is NiCr layers, Layer 6 is TixSiyNzLayer, layer 7 SiNxLayer, the 8th layer is ZnSnO layers, and the 9th layer is ZnO layer, and the tenth layer is Ag layers, Eleventh floor is NiCr layers, and Floor 12 is TixSiyNzLayer, the 13rd layer is SiNxLayer.
A kind of high transmission muted color double-silver low-emissivity coated glass, it is characterised in that the substrate layer is reachable for light transmittance More than 90% high transparent glass.
A kind of high transmission muted color double-silver low-emissivity coated glass, it is characterised in that the first layer, the second layer, the 3rd Layer is the first dielectric combination layer, and the 4th layer is low radiation functions layer, and layer 5 is the first block protective layer, and layer 6 is mixed for titanium Miscellaneous crystallite protective layer, layer 7, the 8th layer, the 9th layer be the second dielectric combination layer, the tenth layer is low radiation functions layer, the tenth One layer is the second block protective layer, and Floor 12 is titanium doped crystallite protective layer, and the 13rd layer is the 3rd dielectric layer.
Since the art of this patent film layer transmitance is higher, the product chambers produced using common white glass basis piece are observed slightly outside Green, product appearance is neutral gray when being produced using high transparent glass as substrate.
A kind of high transmission muted color double-silver low-emissivity coated glass, it is characterised in that this method includes the following steps:
1), magnetron sputtering film layer;
A, magnetron sputtering first layer:
Target quantity:Exchange rotary target 3~4;Target is configured to sial (SiAl);Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 1:1.14, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 18~20nm;
B, the magnetron sputtering second layer:
Target quantity:Exchange rotary target 2~3;Target is configured to zinc-tin (ZnSn);Process gas ratio:Argon gas and oxygen The ratio of gas, argon gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 7~8nm;
C, magnetron sputtering third layer:
Target quantity:Exchange rotary target 1~2;Target is configured to zinc-aluminium (ZnAl);Process gas ratio:Argon gas and oxygen The ratio of gas, argon gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 15~6nm;
D, the 4th layer of magnetron sputtering:
Target quantity:Direct current planar target 1;Target is configured to silver-colored (Ag);Process gas:Pure argon, sputtering pressure for 2~ 3×10-3mbar;Coating film thickness is 7~7.5nm;
E, magnetron sputtering layer 5:
Target quantity:Exchange rotary target 1;Target is configured to nickel chromium triangle (NiCr);Process gas:Pure argon, sputtering pressure For 2~3 × 10-3mbar;Coating film thickness is 0.1~0.5nm;
F, magnetron sputtering layer 6:
Target quantity:Exchange rotary target 1;Target is configured to titanium doped silicon ceramics;Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 5:1, sputtering pressure is 2~3 × 10-3mbar;Coating film thickness is 5~6nm;
G, magnetron sputtering layer 7:
Target quantity:Exchange rotary target 3~5;Target is configured to sial (SiAl);Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 1:1.14, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 42~44nm;
H, the 8th layer of magnetron sputtering:
Target quantity:Exchange rotary target 2~3;Target is configured to zinc-tin (ZnSn);Process gas ratio:Argon gas and oxygen The ratio of gas, argon gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 18~20nm;
I, the 9th layer of magnetron sputtering:
Target quantity:Exchange rotary target 2~3;Target is configured to zinc-aluminium (ZnAl);Process gas ratio:Argon gas and oxygen The ratio of gas, argon gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 27~29nm;
J, the tenth layer of magnetron sputtering:
Target quantity:Exchange rotary target 1;Target is configured to silver-colored (Ag);Process gas ratio:Pure oxygen, sputtering pressure for 2~ 3×10-3mbar;Coating film thickness is 4~4.5nm;
The tenth layer of magnetron sputtering can also be:
Target quantity:Direct current planar target 1;Target is configured to silver-colored (Ag);Process gas ratio:Pure oxygen, sputtering pressure for 2~ 3×10-3mbar;Coating film thickness is 5.5~6nm;
K, magnetron sputtering eleventh floor:
Target quantity:Exchange rotary target 1;Target is configured to nickel chromium triangle (NiCr);Process gas:Straight argon, sputtering pressure 2 ~3 × 10-3mbar;Coating film thickness is 0.2~0.4nm;
L, magnetron sputtering Floor 12:
Target quantity:Exchange rotary target 1;Target is configured to titanium doped silicon ceramics;Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 1:1.14, sputtering pressure is 2~3 × 10-3mbar;;Coating film thickness is 5~6nm;
M, magnetron sputtering Floor 12:
Target quantity:Exchange rotary target 4~6;Target is configured to sial (SiAl);Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 1:1.14, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 42~43nm;
2), the control of film plating layer gross thickness is between 200~210nm, and sputtering chamber transmission walking speed control is in 4.5-5.0m/min.
The every specific color value (the CIE1976L*a*b* colour spaces) of the double silverskin systems of wherein high muted color.
Advantage of the present invention:
1st, single transmittance > 80%
2nd, appearance color is neutrality, wherein through color a* ∈ [- 4, -3], b* ∈ [1,2];Glass surface color a* ∈ [- 1,0], B* ∈ [- 7, -6];Film surface color a* ∈ [- 7, -6], b* ∈ [1,3];Glass surface low-angle color a* ∈ [- 2, -1], b* ∈ [- 8, - 7]。
3rd, oxidation resistent susceptibility is good, and experiment is placed in workshop, when the time is small more than 70 (humidity >=70%, temperature >=20 DEG C).
4th, photo-thermal function admirable, actual measurement mean heat transfer coefficient is 1.67, shading coefficient 0.48.
Brief description of the drawings
Fig. 1 is this high transmission muted color double-silver low-emissivity coated glass layer structure schematic diagram.
In figure, G, glass substrate layer;1st, first layer;2nd, the second layer;3rd, third layer;4th, the 4th layer;5th, layer 5;6th, the 6th Layer;7th, layer 7;8th, the 8th layer;9th, the 9th layer;10th, the tenth layer;11st, eleventh floor;12nd, Floor 12;13rd, the 13rd layer.
Embodiment
It is the specific embodiment of the present invention and with reference to attached drawing below, technical scheme is further described, But the present invention is not limited to these embodiments.
As shown in Figure 1, this high transmission muted color double-silver low-emissivity coated glass includes glass substrate layer G and film plating layer, plating Film layer is outwards compounded with 13 film layers successively from the glass substrate layer, and wherein first layer 1 is SiNxLayer, the second layer 2 are ZnSnO layers, third layer 3 is ZnO layer, and the 4th layer 4 is Ag layers, and layer 55 is NiCr layers, and layer 66 is TixSiyNzLayer, the 7th Layer 7 is SiNxLayer, the 8th layer 8 is ZnSnO layers, and the 9th layer 9 is ZnO layer, and the tenth layer 10 is Ag layers, and eleventh floor 11 is NiCr Layer, Floor 12 12 is TixSiyNzLayer, the 13rd layer 13 is SiNxLayer.The substrate layer G is light transmittance up to more than 90% High transparent glass.The first layer 1, the second layer 2, third layer 3 are the first dielectric combination layer, and the 4th layer 4 is low radiation functions layer, Layer 55 is the first block protective layer, and layer 66 is titanium doped crystallite protective layer, layer 77, the 8th layer 8, the 9th layer 9 be the Two dielectric combination layers, the tenth layer 10 is low radiation functions layer, and eleventh floor 11 is the second block protective layer, and Floor 12 12 is Titanium doped crystallite protective layer, the 13rd layer 13 is the 3rd dielectric layer.
A kind of high transmission muted color double-silver low-emissivity coated glass, its preparation method include the following steps:
1), magnetron sputtering film layer;
A, magnetron sputtering first layer 1:
Target quantity:Exchange rotary target 3~4;Target is configured to sial (SiAl);Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 1:1.14, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 18~20nm;
B, the magnetron sputtering second layer 2:
Target quantity:Exchange rotary target 2~3;Target is configured to zinc-tin (ZnSn);Process gas ratio:Argon gas and oxygen The ratio of gas, argon gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 7~8nm;
C, magnetron sputtering third layer 3:
Target quantity:Exchange rotary target 1~2;Target is configured to zinc-aluminium (ZnAl);Process gas ratio:Argon gas and oxygen The ratio of gas, argon gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 15~6nm;
D, the 4th layer 4 of magnetron sputtering:
Target quantity:Direct current planar target 1;Target is configured to silver-colored (Ag);Process gas:Pure argon, sputtering pressure for 2~ 3×10-3mbar;Coating film thickness is 7~7.5nm;
E, magnetron sputtering layer 55:
Target quantity:Exchange rotary target 1;Target is configured to nickel chromium triangle (NiCr);Process gas:Pure argon, sputtering pressure For 2~3 × 10-3mbar;Coating film thickness is 0.1~0.5nm;
F, magnetron sputtering layer 66:
Target quantity:Exchange rotary target 1;Target is configured to titanium doped silicon ceramics;Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 5:1, sputtering pressure is 2~3 × 10-3mbar;Coating film thickness is 5~6nm;
G, magnetron sputtering layer 77:
Target quantity:Exchange rotary target 3~5;Target is configured to sial (SiAl);Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 1:1.14, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 42~44nm;
H, the 8th layer 8 of magnetron sputtering:
Target quantity:Exchange rotary target 2~3;Target is configured to zinc-tin (ZnSn);Process gas ratio:Argon gas and oxygen The ratio of gas, argon gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 18~20nm;
I, the 9th layer 9 of magnetron sputtering:
Target quantity:Exchange rotary target 2~3;Target is configured to zinc-aluminium (ZnAl);Process gas ratio:Argon gas and oxygen The ratio of gas, argon gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 27~29nm;
J, the tenth layer 10 of magnetron sputtering:
Target quantity:Exchange rotary target 1;Target is configured to silver-colored (Ag);Process gas ratio:Pure oxygen, sputtering pressure for 2~ 3×10-3mbar;Coating film thickness is 4~4.5nm;
The tenth layer 10 of magnetron sputtering can also be:
Target quantity:Direct current planar target 1;Target is configured to silver-colored (Ag);Process gas ratio:Pure oxygen, sputtering pressure for 2~ 3×10-3mbar;Coating film thickness is 5.5~6nm;
K, magnetron sputtering eleventh floor 11:
Target quantity:Exchange rotary target 1;Target is configured to nickel chromium triangle (NiCr);Process gas:Straight argon, sputtering pressure 2 ~3 × 10-3mbar;Coating film thickness is 0.2~0.4nm;
L, magnetron sputtering Floor 12 12:
Target quantity:Exchange rotary target 1;Target is configured to titanium doped silicon ceramics;Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 1:1.14, sputtering pressure is 2~3 × 10-3mbar;;Coating film thickness is 5~6nm;
M, magnetron sputtering Floor 12 13:
Target quantity:Exchange rotary target 4~6;Target is configured to sial (SiAl);Process gas ratio:Argon gas and nitrogen The ratio of gas, argon gas and nitrogen is 1:1.14, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 42~43nm;
2), the control of film plating layer gross thickness is between 200~210nm, and sputtering chamber transmission walking speed control is in 4.5-5.0m/min.
The every specific color value (the CIE1976L*a*b* colour spaces) of the double silverskin systems of wherein high muted color.
Specific embodiment described herein is only to spirit explanation for example of the invention.Technology belonging to the present invention is led The technical staff in domain can do various modifications or additions to described specific embodiment or replace in a similar way Generation, but without departing from spirit of the invention or beyond the scope of the appended claims.

Claims (2)

1. a kind of high transmission muted color double-silver low-emissivity coated glass, including glass substrate layer G and film plating layer, the film plating layer is certainly The glass substrate layer is outwards compounded with 13 film layers successively, and wherein first layer (1) is SiNxLayer, the second layer (2) is ZnSnO Layer, third layer (3) are ZnO layer, and the 4th layer (4) are Ag layers, and layer 5 (5) is NiCr layers, and layer 6 (6) is TixSiyNzLayer, the Seven layers (7) are SiNxLayer, the 8th layer (8) are ZnSnO layers, and the 9th layer (9) are ZnO layer, and the tenth layer (10) are Ag layers, eleventh floor (11) it is NiCr layers, Floor 12 (12) is TixSiyNzLayer, the 13rd layer (13) are SiNxLayer;Described substrate G layers are light transmittance Up to more than 90% high transparent glass.The first layer (1), the second layer (2), third layer (3) they are the first dielectric combination layer, the Four layers (4) are low radiation functions layer, and layer 5 (5) is the first block protective layer, and layer 6 (6) is titanium doped crystallite protective layer, Layer 7 (7), the 8th layer (8), the 9th layer (9) are the second dielectric combination layer, and the tenth layer (10) are low radiation functions layer, the tenth One layer (11) are the second block protective layer, and Floor 12 (12) is titanium doped crystallite protective layer, and the 13rd layer (13) are the 3rd electricity Dielectric layer.
2. a kind of preparation method of high transmission muted color double-silver low-emissivity coated glass, it is characterised in that this method includes as follows Step:
1), magnetron sputtering film layer;
A, magnetron sputtering first layer (1):
Target quantity:Exchange rotary target 3~4;Target is configured to sial (SiAl);Process gas ratio:Argon gas and nitrogen, argon The ratio of gas and nitrogen is 1:1.14, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 18~20nm;
B, the magnetron sputtering second layer (2):
Target quantity:Exchange rotary target 2~3;Target is configured to zinc-tin (ZnSn);Process gas ratio:Argon gas and oxygen, argon The ratio of gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 7~8nm;
C, magnetron sputtering third layer (3):
Target quantity:Exchange rotary target 1~2;Target is configured to zinc-aluminium (ZnAl);Process gas ratio:Argon gas and oxygen, argon The ratio of gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 15~6nm;
D, the 4th layer of magnetron sputtering (4):
Target quantity:Direct current planar target 1;Target is configured to silver-colored (Ag);Process gas:Pure argon, sputtering pressure for 2~3 × 10-3mbar;Coating film thickness is 7~7.5nm;
E, magnetron sputtering layer 5 (5):
Target quantity:Exchange rotary target 1;Target is configured to nickel chromium triangle (NiCr);Process gas:Pure argon, sputtering pressure for 2~ 3×10-3mbar;Coating film thickness is 0.1~0.5nm;
F, magnetron sputtering layer 6 (6):
Target quantity:Exchange rotary target 1;Target is configured to titanium doped silicon ceramics;Process gas ratio:Argon gas and nitrogen, argon The ratio of gas and nitrogen is 5:1, sputtering pressure is 2~3 × 10-3mbar;Coating film thickness is 5~6nm;
G, magnetron sputtering layer 7 (7):
Target quantity:Exchange rotary target 3~5;Target is configured to sial (SiAl);Process gas ratio:Argon gas and nitrogen, argon The ratio of gas and nitrogen is 1:1.14, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 42~44nm;
H, the 8th layer of magnetron sputtering (8):
Target quantity:Exchange rotary target 2~3;Target is configured to zinc-tin (ZnSn);Process gas ratio:Argon gas and oxygen, argon The ratio of gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 18~20nm;
I, the 9th layer of magnetron sputtering (9):
Target quantity:Exchange rotary target 2~3;Target is configured to zinc-aluminium (ZnAl);Process gas ratio:Argon gas and oxygen, argon The ratio of gas and oxygen is 1:2, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 27~29nm;
J, the tenth layer of magnetron sputtering (10):
Target quantity:Exchange rotary target 1;Target is configured to silver-colored (Ag);Process gas ratio:Pure oxygen, sputtering pressure for 2~3 × 10-3mbar;Coating film thickness is 4~4.5nm;
The tenth layer of magnetron sputtering (10) can also be:
Target quantity:Direct current planar target 1;Target is configured to silver-colored (Ag);Process gas ratio:Pure oxygen, sputtering pressure for 2~3 × 10-3mbar;Coating film thickness is 5.5~6nm;
K, magnetron sputtering eleventh floor (11):
Target quantity:Exchange rotary target 1;Target is configured to nickel chromium triangle (NiCr);Process gas:Straight argon, sputtering pressure are 2~3 ×10-3mbar;Coating film thickness is 0.2~0.4nm;
L, magnetron sputtering Floor 12 (12):
Target quantity:Exchange rotary target 1;Target is configured to titanium doped silicon ceramics;Process gas ratio:Argon gas and nitrogen, argon The ratio of gas and nitrogen is 1:1.14, sputtering pressure is 2~3 × 10-3mbar;;Coating film thickness is 5~6nm;
M, magnetron sputtering Floor 12 (13):
Target quantity:Exchange rotary target 4~6;Target is configured to sial (SiAl);Process gas ratio:Argon gas and nitrogen, argon The ratio of gas and nitrogen is 1:1.14, sputtering pressure is 3~5 × 10-3mbar;Coating film thickness is 42~43nm;
2), the control of film plating layer gross thickness is between 200~210nm, and sputtering chamber transmission walking speed control is in 4.5-5.0m/min.
CN201711213080.9A 2017-11-28 2017-11-28 A kind of high transmission muted color double-silver low-emissivity coated glass and preparation method Pending CN108002711A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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CN111847900A (en) * 2019-04-29 2020-10-30 贵州省巨三奇节能玻璃有限公司 Low-emissivity coated glass and preparation method thereof
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