CN107974225A - A kind of electronics Heraeus and preparation method thereof - Google Patents
A kind of electronics Heraeus and preparation method thereof Download PDFInfo
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- CN107974225A CN107974225A CN201711312178.XA CN201711312178A CN107974225A CN 107974225 A CN107974225 A CN 107974225A CN 201711312178 A CN201711312178 A CN 201711312178A CN 107974225 A CN107974225 A CN 107974225A
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- electronics
- heraeus
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention discloses a kind of electronics Heraeus and preparation method thereof, and the electronics Heraeus includes the component of following mass fraction：Diluent 5~10%, latent curing agent 15~18%, curing accelerator 0.5~3%, thixotropic agent 5~9%, organic phase change material 1~3%, pigment 2~3.5%, filler 18~26% and epoxy resin 35~48%.Electronics Heraeus provided by the invention can meet relatively low heat release value requirement, it can meet every mechanical property requirements after curing again, and with good adhesive property, heat resistance and colloidality energy can be dripped, hardening time is short, meet the surface mount requirement of semiconductor components and devices, can be widely used for the encapsulation of semiconductor components and devices.
Description
Technical field
The present invention relates to electronic package material technical field, more particularly to a kind of electronics Heraeus and preparation method thereof.
Background technology
In the surface-assembled technique of semiconductor printed wiring version, the main function of electronics Heraeus is in wave-soldering or returns
Being adhesively fixed before fluid welding for the preliminary of component, thus avoid printed wiring board in transmit process may because accelerating, vibrating,
The position of some components of reason such as impact shifts or even comes off (especially bigger in double-sided wiring board or component
In the case of, component produces offset or the probability higher to come off).After wave-soldering or Reflow Soldering, although electronics Heraeus is still
Remain on substrate, but at this time there is no bonding effect, and retaining element has been replaced by solder, and reliable electronics is provided and is connected
Connect effect.
In recent years, one side encapsulation technology makes package speed significantly to high densification, the development of small size, light weight direction
Improve；On the other hand since the component of encapsulation is less and less, the requirement to heat is higher and higher, generally requires electronics Heraeus
Heat release value control in below 300J/g, still, many electronics Heraeus on the market can not realize this requirement at present.
The content of the invention
The main object of the present invention is to propose a kind of electronics Heraeus and preparation method thereof, it is intended to reduces electronics Heraeus
Heat release value.
To achieve the above object, a kind of electronics Heraeus proposed by the present invention, includes the component of following mass fraction：Dilution
Agent 5~10%, latent curing agent 15~18%, curing accelerator 0.5~3%, thixotropic agent 5~9%, organic phase change material 1
~3%, pigment 2~3.5%, filler 18~26% and epoxy resin 35~48%.
Preferably, the diluent includes to phenyl glycidyl ether, benzyl glycidyl ether, shrinks to tert-butyl-phenyl
In glycerin ether, aliphatic glycidyl ether, tertiary carbonic acid glycidyl ester, epoxy propane butyl ether and propylene oxide phenyl ether
One or two kinds of mixtures.
Preferably, the latent curing agent includes diethylenetriamine, two aminodiphenylmethane, curing agent EH-
In 4070S, curing agent EH-4337S, curing agent DICY, curing agent PN-23, curing agent PN-40J and curing agent MY-24 extremely
Few one kind.
Preferably, the curing accelerator is included in curing accelerator MC120B and curing accelerator MC120D at least
It is a kind of.
Preferably, the thixotropic agent includes polyethylene, polypropylene wax, gas-phase silicon R720, gas-phase silicon R805 and gas-phase silicon
The mixture of one or both of R202.
Preferably, the organic phase change material includes one kind or two in paraffin, synthetic wax, Tissuemat E and stearic acid
The mixture of kind.
Preferably, the pigment includes at least one of permanent bordeaux and permanent yellow.
Preferably, the filler includes the mixture of one or both of silicon powder, precipitated calcium carbonate and talcum powder.
Preferably, the epoxy resin includes bisphenol A epoxide resin, bisphenol F epoxy resin and phenolic aldehyde based epoxy resin
At least one of.
The present invention also proposes a kind of preparation method of electronics Heraeus as described above, includes the following steps：
Stirred after epoxy resin, diluent, thixotropic agent, organic phase change material and filler are mixed, form mixture；
Mixture is ground to form slurry；
Stirred after pigment, latent curing agent and curing accelerator are sequentially added into slurry, then vacuumize de-
Bubble processing, obtains electronics Heraeus.
Electronics Heraeus provided by the invention, can meet relatively low heat release value requirement and meet every power after curing
Performance requirement is learned, and with good adhesive property, heat resistance and colloidality energy can be dripped, hardening time is short, meets semiconductor
The surface mount requirement of component, can be widely used for the encapsulation of semiconductor components and devices.
Embodiment
, below will be in the embodiment of the present invention to make the purpose, technical scheme and advantage of the embodiment of the present invention clearer
Technical solution be clearly and completely described.The person that is not specified actual conditions in embodiment, builds according to normal condition or manufacturer
The condition of view carries out.Reagents or instruments used without specified manufacturer, is the conventional production that can be obtained by commercially available purchase
Product.
A kind of electronics Heraeus proposed by the present invention, includes the component of following mass fraction：Diluent 5~10%, hide
Type curing agent 15~18%, curing accelerator 0.5~3%, thixotropic agent 5~9%, organic phase change material 1~3%, pigment 2~
3.5%th, filler 18~26% and epoxy resin 35~48%.
Electronics Heraeus provided by the invention, can meet relatively low heat release value requirement and meet every power after curing
Performance requirement is learned, and with good adhesive property, heat resistance and colloidality energy can be dripped, hardening time is short, meets semiconductor
The surface mount requirement of component, can be widely used for the encapsulation of semiconductor components and devices.
The diluent include to phenyl glycidyl ether, benzyl glycidyl ether, to tert-butyl-phenyl glycidol ether,
Aliphatic glycidyl ether, tertiary carbonic acid glycidyl ester, epoxy propane butyl ether and one kind in propylene oxide phenyl ether or
Two kinds of mixture.Wherein, the diluent especially with basic bisphenol A epoxide resin, such as E51, mass ratio (E51/ dilute
Agent) the electronics Heraeus performance that is mixed to get between 0.2~0.4 is best, the operable of the electronics Heraeus can be made
Property is optimal with adhesive property overall balance.In embodiments of the present invention, the additive amount of the diluent is the electronics Heraeus
The 5~10% of gross mass.
The latent curing agent includes diethylenetriamine, two aminodiphenylmethane, curing agent EH-4070S, curing agent
At least one of EH-4337S, curing agent DICY, curing agent PN-23, curing agent PN-40J and curing agent MY-24.Generally
In fact, using the curing rate and bonding that can make the electronics Heraeus after two or three of latent curing agent compounding
Intensity is more balanced, while after can guarantee that welding again, the electronics Heraeus effectively can be repaired.Of the invention real
Apply in example, the additive amount of the latent curing agent is the 15~18% of the electronics Heraeus gross mass.
The curing accelerator includes at least one of curing accelerator MC120B and curing accelerator MC120D.It is logical
Cross and select suitable curing accelerator and control its additive amount, it is ensured that the electronics Heraeus has suitable curing rate
And good initial bond strength etc..In embodiments of the present invention, the additive amount of the curing accelerator pastes for the electronics
The 0.5~3% of piece glue gross mass.
The thixotropic agent includes polyethylene, in polypropylene wax, gas-phase silicon R720, gas-phase silicon R805 and gas-phase silicon R202
One or two kinds of mixtures.By selecting suitable thixotropic agent, the gluing process speed of the electronics Heraeus can be adjusted
And shape of glue point etc., so as to meet the high-speed demand of attachment process.In embodiments of the present invention, the thixotropic agent adds
Dosage is the 5~9% of electronics Heraeus gross mass.
The organic phase change material includes the mixed of one or both of paraffin, synthetic wax, Tissuemat E and stearic acid
Compound.The heat release value of the electronics Heraeus can be greatly reduced by adding a certain amount of organic phase change material, together
When by controlling its additive amount, make its do not influence or the extremely low influence electronics patch adhesive curing after mechanical property and work
Skill operating characteristics.In embodiments of the present invention, the additive amount amount of the organic phase change material for electronics Heraeus gross mass 1~
3%.
The pigment includes at least one of permanent bordeaux and permanent yellow.Institute can be adjusted by adding suitable pigment
State the appearance color of electronics Heraeus.In embodiments of the present invention, the additive amount of the pigment is the total matter of electronics Heraeus
The 2~3.5% of amount.
The filler includes the mixture of one or both of silicon powder, precipitated calcium carbonate and talcum powder.Pass through choosing
Select suitable filler and control its additive amount, so that the electronics Heraeus meets high speed gluing process.Implement in the present invention
In example, the additive amount of the filler is the 18~26% of the electronics Heraeus gross mass.
The epoxy resin is included in bisphenol A epoxide resin, bisphenol F epoxy resin and phenolic aldehyde based epoxy resin at least
It is a kind of.By select suitable epoxy resin species can adjust the electronics Heraeus product viscosity, cure after bonding
Intensity and process operability etc..Bisphenol F type epoxy resins (epoxy resin E51) are for example selected, described fill out can be increased
The amount of inserting of material, reduces cost etc.；Selection phenolic aldehyde based epoxy resin can increase the bonding after the electronics patch adhesive curing
Intensity, strengthens heat resistance of the electronics Heraeus etc..In embodiments of the present invention, the additive amount of the epoxy resin is
The 35~48% of the electronics Heraeus gross mass.
The present invention also proposes a kind of preparation method of electronics Heraeus as described above, includes the following steps：
Step S10, stir, formed after mixing epoxy resin, diluent, thixotropic agent, organic phase change material and filler
Mixture；
In step slo, stirred tank can be selected to be mixed and stirred for raw material, concrete operations are as follows：By epoxy resin, dilute
Release agent, thixotropic agent, organic phase change material and filler to add in stirred tank, stir about 30min, all raw materials is reached uniformly mixed
Close, so as to form mixture.
Step S20, mixture is ground to form slurry；
In step S20, three-roll grinder can be selected to grind the mixture, concrete operations are as follows：Will be described mixed
Compound is placed in three-roll grinder, is repeated grinding three times, the mixture is formed slurry after being fully ground.
Step S30, stir, then carry out after pigment, latent curing agent and curing accelerator are sequentially added into slurry
Vacuumizing and defoaming processing, obtains electronics Heraeus.
In step s 30, its whipping process can be completed in planet stirred tank, and concrete operations are as follows：By the institute of grinding
State slurry to add in planet stirring kettle, pigment, latent curing agent and curing accelerator are then sequentially added, after stirring evenly
Vacuumizing and defoaming processing 1h is carried out, after the completion for the treatment of deaeration, is packed on request, you can obtain the electronics Heraeus.
Technical scheme is described in further detail below in conjunction with specific embodiment, it will be appreciated that following real
Example is applied only to explain the present invention, is not intended to limit the present invention.
Embodiment 1
(1) raw material is weighed：To tert-butyl-phenyl glycidol ether 15.3%, curing agent PN-23 15.3%, cure promotion
Agent MC120B 3%, gas-phase silicon R720 9%, Tissuemat E 2%, permanent bordeaux 3.4%, calcium carbonate 20% and epoxy resin E51
38.8%.
(2) prepared by electronics Heraeus：Add to tert-butyl-phenyl glycidol ether, gas-phase silicon R720, gather in stirred tank
Ethylene waxes, calcium carbonate and epoxy resin E51, uniform mixture is formed after stirring 30min；Then mixture is ground with three rollers
Grinding machine is ground 3 times, forms slurry；Slurry is put into planet stirring kettle, sequentially add permanent bordeaux, curing agent PN-23 and
Curing accelerator MC120B, after stirring 25min, carries out vacuumizing and defoaming processing 1h, up to electronics Heraeus.
Embodiment 2
(1) raw material is weighed：Tertiary carbonic acid glycidyl ester E10P 5.5%, curing agent EH-4070S 17.5%, cure promotion
Agent MC120B 1%, polypropylene wax 7.5%, paraffin 1%, permanent bordeaux 2.5%, calcium carbonate 18% and epoxy resin E51
41.5% and phenolic aldehyde based epoxy resin DEN438 5.5%.
(2) prepared by electronics Heraeus：Tertiary carbonic acid glycidyl ester E10P, polypropylene wax, paraffin, carbon are added in stirred tank
Sour calcium, epoxy resin E51 and phenolic aldehyde based epoxy resin DEN438, uniform mixture is formed after stirring 30min；Then will be mixed
Compound is ground 3 times with three-roll grinder, forms slurry；Slurry is put into planet stirring kettle, permanent bordeaux is sequentially added, cures
Agent EH-4070S and curing accelerator MC120B, after stirring 25min, carries out vacuumizing and defoaming processing 1h, up to electronics patch
Glue.
Embodiment 3
(1) raw material is weighed：Tertiary carbonic acid glycidyl ester E10P 4.5%, to phenyl glycidyl ether 5.5%, curing agent
PN-40 16%, curing accelerator MC120D 2.5%, gas-phase silicon R805 8%, stearic acid 2.5%, permanent bordeaux 3.4%, silicon are micro-
Powder 26% and epoxy resin E51 25.8% and phenolic aldehyde based epoxy resin DEN4386.2%.
(2) prepared by electronics Heraeus：Tertiary carbonic acid glycidyl ester E10P is added in stirred tank, to phenyl glycidyl
Ether, gas-phase silicon R805, stearic acid, silicon powder, epoxy resin E51 and phenolic aldehyde based epoxy resin DEN438, stir shape after 30min
Into uniform mixture；Then mixture three-roll grinder is ground 3 times, forms slurry；Slurry is put into planet stirring kettle
In, permanent bordeaux, curing agent PN-40 and curing accelerator MC120D are sequentially added, after stirring 25min, vacuumize de-
Bubble processing 1h, up to electronics Heraeus.
Embodiment 4
(1) raw material is weighed：Tertiary carbonic acid glycidyl ester E10P 7%, curing agent DICY 14%, curing agent PN-23 4%,
Curing accelerator MC120D 3%, polyethylene 5%, Tissuemat E 2.8%, permanent yellow 2%, talcum powder 23% and epoxy resin
E51 41.7%.
(2) prepared by electronics Heraeus：Added in stirred tank tertiary carbonic acid glycidyl ester E10P, polyethylene, Tissuemat E,
Talcum powder and epoxy resin E51, uniform mixture is formed after stirring 30min；Then mixture is ground with three-roll grinder
Mill 3 times, forms slurry；Slurry is put into planet stirring kettle, sequentially adds permanent yellow, curing agent DICY, curing agent PN-23
And curing accelerator MC120D, after stirring 25min, vacuumizing and defoaming processing 1h is carried out, up to electronics Heraeus.
Test according to standard SJ/T 11187-1998, indices are as shown in table 1.
Every test index of the Heat Conduction Material of 1 each embodiment of table and comparative example
As shown in Table 1, electronics Heraeus provided in an embodiment of the present invention, under 150 DEG C of solidification temperatures, hardening time is 90
Between~110 seconds；Curing rear surface is hard and without any bubble；Volume resistivity >=2.0 × 1014Ω, has good moisture-resistant
Property and corrosion resistance；Glass transition temperature is moderate, so as to reprocess performance with good；Especially its heat release value is below 300J/
G, can meet the requirement of the low exothermicity in electronic component encapsulation to electronics Heraeus.
In conclusion electronics Heraeus provided by the invention, can meet relatively low heat release value requirement and meet to cure
Every mechanical property requirements afterwards, and with good adhesive property, heat resistance and colloidality energy can be dripped, glue point is not trickled, no
Wire drawing, glue point is clear-cut, highly moderate, and hardening time is short, meets the surface mount requirement of semiconductor components and devices, can be wide
The general encapsulation for semiconductor components and devices.
It these are only the preferred embodiment of the present invention, be not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow shift that bright description is made, is directly or indirectly used in other relevant technology necks
Domain, is included within the scope of the present invention.
Claims (10)
1. a kind of electronics Heraeus, it is characterised in that include the component of following mass fraction：Diluent 5~10%, resting form are solid
Agent 15~18%, curing accelerator 0.5~3%, thixotropic agent 5~9%, organic phase change material 1~3%, pigment 2~3.5%,
Filler 18~26% and epoxy resin 35~48%.
2. electronics Heraeus as claimed in claim 1, it is characterised in that the diluent include to phenyl glycidyl ether,
Benzyl glycidyl ether, to tert-butyl-phenyl glycidol ether, aliphatic glycidyl ether, tertiary carbonic acid glycidyl ester, epoxy
The mixture of one or both of propane butyl ether and propylene oxide phenyl ether.
3. electronics Heraeus as claimed in claim 1, it is characterised in that the latent curing agent include diethylenetriamine,
Two aminodiphenylmethane, curing agent EH-4070S, curing agent EH-4337S, curing agent DICY, curing agent PN-23, curing agent
At least one of PN-40J and curing agent MY-24.
4. electronics Heraeus as claimed in claim 1, it is characterised in that the curing accelerator includes curing accelerator
At least one of MC120B and curing accelerator MC120D.
5. electronics Heraeus as claimed in claim 1, it is characterised in that the thixotropic agent includes polyethylene, polypropylene wax, gas
The mixture of one or both of phase silicon R720, gas-phase silicon R805 and gas-phase silicon R202.
6. electronics Heraeus as claimed in claim 1, it is characterised in that the organic phase change material include paraffin, synthetic wax,
The mixture of one or both of Tissuemat E and stearic acid.
7. electronics Heraeus as claimed in claim 1, it is characterised in that the pigment is included in permanent bordeaux and permanent yellow
It is at least one.
8. electronics Heraeus as claimed in claim 1, it is characterised in that the filler include silicon powder, precipitated calcium carbonate with
And the mixture of one or both of talcum powder.
9. electronics Heraeus as claimed in claim 1, it is characterised in that the epoxy resin includes bisphenol A epoxide resin, double
At least one of phenol F epoxy resin and phenolic aldehyde based epoxy resin.
10. the preparation method of a kind of electronics Heraeus as described in claim 1 to 9 any one, it is characterised in that including such as
Lower step：
Stirred after epoxy resin, diluent, thixotropic agent, organic phase change material and filler are mixed, form mixture；
Mixture is ground to form slurry；
Stir, then carried out at vacuumizing and defoaming after pigment, latent curing agent and curing accelerator are sequentially added into slurry
Reason, obtains electronics Heraeus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711312178.XA CN107974225A (en) | 2017-12-07 | 2017-12-07 | A kind of electronics Heraeus and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711312178.XA CN107974225A (en) | 2017-12-07 | 2017-12-07 | A kind of electronics Heraeus and preparation method thereof |
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| CN107974225A true CN107974225A (en) | 2018-05-01 |
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| CN201711312178.XA Pending CN107974225A (en) | 2017-12-07 | 2017-12-07 | A kind of electronics Heraeus and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108893085A (en) * | 2018-05-31 | 2018-11-27 | 苏州盛威佳鸿电子科技有限公司 | A kind of paster glue for surface mounting technology |
| WO2021035816A1 (en) * | 2019-08-26 | 2021-03-04 | 张立强 | Two-component thermal storage potting material and preparation method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1974704A (en) * | 2006-11-30 | 2007-06-06 | 三友（天津）高分子技术有限公司 | Low temperature fast curing adhesive for mounting chip element and device |
| CN102850948A (en) * | 2012-09-20 | 2013-01-02 | 烟台德邦科技有限公司 | Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive |
| US20170145251A1 (en) * | 2014-05-16 | 2017-05-25 | Namics Corporation | Liquid sealing material, and electronic component using same |
-
2017
- 2017-12-07 CN CN201711312178.XA patent/CN107974225A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1974704A (en) * | 2006-11-30 | 2007-06-06 | 三友（天津）高分子技术有限公司 | Low temperature fast curing adhesive for mounting chip element and device |
| CN102850948A (en) * | 2012-09-20 | 2013-01-02 | 烟台德邦科技有限公司 | Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive |
| US20170145251A1 (en) * | 2014-05-16 | 2017-05-25 | Namics Corporation | Liquid sealing material, and electronic component using same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108893085A (en) * | 2018-05-31 | 2018-11-27 | 苏州盛威佳鸿电子科技有限公司 | A kind of paster glue for surface mounting technology |
| WO2021035816A1 (en) * | 2019-08-26 | 2021-03-04 | 张立强 | Two-component thermal storage potting material and preparation method therefor |
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Application publication date: 20180501 |