CN107541167A - A kind of heat-conducting type underfill and preparation method thereof - Google Patents
A kind of heat-conducting type underfill and preparation method thereof Download PDFInfo
- Publication number
- CN107541167A CN107541167A CN201610473312.3A CN201610473312A CN107541167A CN 107541167 A CN107541167 A CN 107541167A CN 201610473312 A CN201610473312 A CN 201610473312A CN 107541167 A CN107541167 A CN 107541167A
- Authority
- CN
- China
- Prior art keywords
- parts
- heat
- conducting type
- type underfill
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a kind of heat-conducting type underfill, by mass percentage, including following component：40 parts~60 parts of filler, 25 parts~35 parts of epoxy resin, 5 parts~10 parts of curing agent, 2 parts~10 parts of toughener, 1 part~10 parts of diluent, 0.1 part~1 part of dispersant, 0.1 part~1 part of defoamer, 0.1 part~2 parts of coupling agent.Present invention filling glue by with the addition of 40 parts~60 parts of filler in the feed, these fillers are filled in the coefficient of expansion that underfill can be reduced in underfill and form effective passage of heat, so as to improve the thermal conductivity factor of underfill, make the performance of underfill more excellent, and then improve the heat dispersion of electronic device.
Description
Technical field
The present invention relates to heat-conducting type underfill in electronics glue technical field, especially one and preparation method thereof.
Background technology
In recent years, with the development of new technology and new material, silicon Single-Chip Integration degree improves constantly, to integrated antenna package
Requirement it is also more strict, I/O number of pins also sharply increases.To meet the needs of development, on the basis of original encapsulation kind
Develop BGA Package, abbreviation BGA.In BGA package, space be present between tin disk and solder ball, if directly using,
When being impacted, solder joint may shift.Underfill is filled between tin disk and solder ball with regard to energy butt welding point to be compared
Preferably protection.Its technical process is simple, can be very good to improve BGA shock resistance, falls, vibration resistance, while also has good
Good reworkability, therefore the use of underfill substantially increases the stability of electronic product.
In current underfill, the widest of application is exactly epoxide resin material.Epoxy resin has excellent
Good heat resistance, adherence and decay resistance, and its mechanical strength is high, electrical insulation capability is good, water absorption rate is low, and these are excellent
Performance cause epoxy resin to turn into the preferred matrix resin of underfill.
With the degree of integration more and more higher of electronic component, its heat dissipation problem is also more and more prominent.This can not only influence
The job stability of electronic component, can also serious curtailment its service life.But the general heat conduction system of traditional underfill
Number is very low, and the radiating to electronic component does not almost help.
The content of the invention
It is an object of the invention to provide a kind of underfill for having mobility and thermal conductance concurrently, improves electronic component
Heat dispersion, the present invention propose following technical scheme：
A kind of heat-conducting type underfill, by mass percentage, including following component：
40 parts~60 parts of filler, 25 parts~35 parts of epoxy resin, 5 parts~10 parts of curing agent, 2 parts~10 parts of toughness reinforcing
Agent, 1 part~10 parts of diluent, 0.1 part~1 part of dispersant, 0.1 part~1 part of defoamer, 0.1 part~2 parts of coupling
Agent.
As a preferred embodiment of the present invention, the filler is preparing spherical SiO 2, ball-aluminium oxide, spherical nitridation
At least one of aluminium, ball-like diamond powder, particle diameter are 100nm~3000nm.
As another preferred scheme of the present invention, the epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy
At least one of resin and aliphatic epoxy resin.
As another preferred scheme of the present invention, the curing agent is modified amine curing agent.
As the present invention another preferred scheme, the toughener be nitrile rubber, core shell rubbers, polyether elastomer,
At least one of polyurethane elastomer.
As another preferred scheme of the present invention, the diluent is reactive diluent.
As another preferred scheme of the present invention, the reactive diluent is butyl glycidyl ether, phenyl glycidyl is sweet
Oily ether, lauryl diglycidyl ether, octyl glycidyl ether, benzyl glycidyl ether, neopentyl glycol glycidol ether, diethyl
In glycol glycidol ether, butanediol glycidol ether, propanetriol-diglycidyl-ether, trimethylolpropane glycidol ether extremely
Few one kind.
As another preferred scheme of the present invention, the dispersant is acrylic dispersants.
As another preferred scheme of the present invention, the polysiloxane-based defoamer of the defoamer and polyacrylic defoaming
At least one of agent.
As another preferred scheme of the present invention, the coupling agent is that gamma-aminopropyl-triethoxy-silane γ-shrink is sweet
Oily ether oxygen propyl trimethoxy silicane, γ-（Methacryloxypropyl）At least one of propyl trimethoxy silicane.
A kind of preparation method of heat-conducting type underfill, is comprised the following steps that：
Epoxy resin, diluent, toughener are added in mixer successively, stir speed (S.S.) 1000r/min, mixing time 5min~
30min, it is dispersed with stirring uniformly,
Defoamer, dispersant, coupling agent, filler are added successively again, stir speed (S.S.) 1200r/min, mixing time 60min~
120min, it is dispersed with stirring uniformly,
Curing agent, stir speed (S.S.) 1000r/min, mixing time 20min~40min are added, temperature control is stirred below 30 DEG C
Mix and be uniformly dispersed,
Vacuum defoamation 5min~30min, obtain the filling glue.
The beneficial effect that the present invention is brought is：
Present invention filling glue is filled in underfill by with the addition of 40 parts~60 parts of filler, these fillers in the feed
The coefficient of expansion of underfill can be reduced and form effective passage of heat, so as to improve the heat conduction system of underfill
Number, makes the performance of underfill more excellent, and then improves the heat dispersion of electronic device.
Embodiment
Presently preferred embodiments of the present invention is described in detail below so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that apparent clearly defined so as to be made to protection scope of the present invention.
Embodiment 1
By bisphenol F resin EP-4901E 20g of low halogen content, aliphatic epoxy resin EP-4088S 6g, low halogen content work
Property diluent lauryl diglycidyl ether 6g, octyl glycidyl ether 1g, toughener polyurethane elastomer 1g mixing additions are stirred
Mix in machine, stir, preferably mixing speed is 1000r/min, mixing time 5min~30min.Matrix resin stirs
Afterwards, then respectively weighing fatty acid dispersant 0.2g, polysiloxane-based defoamer 0.3g, silane coupler 0.5g, particle diameter is
1900nm preparing spherical SiO 2 19g, the aluminum oxide 39g that particle diameter is 1000nm are added in finely dispersed matrix resin, are used
Mixer is uniformly dispersed, and preferably mixing speed is 1200r/min, mixing time 60min~120min.Weighed after being uniformly dispersed
Modified amine curing agent 7g, continuing to be uniformly dispersed with mixer, preferably mixing speed is 1000r/min, mixing time 20min~
40min, temperature control is below 30 DEG C.Vacuum defoamation 5min~30min after being uniformly dispersed, obtains underfill.
The component proportion of gained underfill is as shown in table 1 below：
Table 1
| Component | Mass percent |
| Filler | 58% |
| Epoxy resin | 26% |
| Curing agent | 7% |
| Toughener | 1% |
| Defoamer | 0.3% |
| Dispersant | 0.2% |
| Coupling agent | 0.5% |
| Diluent | 7% |
The underfill adhesiveness is 20Pas, thermal conductivity factor 0.6W/mK.
Embodiment 2
By bisphenol F resin EP-4901E 30g of low halogen content, bisphenol a resin E-51 4g, low halogen content reactive diluent three
Hydroxymethyl-propane glycidol ether 8g, lauryl diglycidyl ether 2g, toughener core shell rubbers 2g mixing are added in mixer,
Stir, preferably mixing speed is 1000r/min, mixing time 5min~30min.After matrix resin stirs, then divide
Also known as take fatty acid dispersant 0.2g, polysiloxane-based defoamer 0.3g, silane coupler 0.5g, the ball that particle diameter is 1900nm
Shape silica 1 5g, the aluminum oxide 30g that particle diameter is 1000nm are added in finely dispersed matrix resin, are disperseed with mixer
Uniformly, preferably mixing speed is 1200r/min, mixing time 60min~120min.Consolidate after being uniformly dispersed weighing modified amine
Agent 8g, continue to be uniformly dispersed with mixer, preferably mixing speed is 1000r/min, mixing time 20min~40min, temperature
Control is below 30 DEG C.Vacuum defoamation 5min~30min after being uniformly dispersed, obtains underfill.
The component proportion of gained underfill is as shown in table 2 below：
Table 2
| Component | Mass percent |
| Filler | 45% |
| Epoxy resin | 34% |
| Curing agent | 8% |
| Toughener | 2% |
| Defoamer | 0.3% |
| Dispersant | 0.2% |
| Coupling agent | 0.5% |
| Diluent | 10% |
The underfill adhesiveness is 16Pas, thermal conductivity factor 0.4W/mK.
Embodiment 3
By bisphenol F resin EP-4901E 22g of low halogen content, aliphatic epoxy resin EP-4088S 7g, low halogen content work
Property diluent trimethylolpropane glycidol ether 8g, lauryl diglycidyl ether 2g, toughener polyurethane elastomer 2g are mixed
Close and add in mixer, stir, preferably mixing speed is 1000r/min, mixing time 5min~30min.Matrix resin
After stirring, then weigh respectively fatty acid dispersant 0.2g, polysiloxane-based defoamer 0.3g, silane coupler 0.5g,
The aluminum oxide 35g that ball-like diamond powder 15g that particle diameter is 200nm, particle diameter are 1000nm is added to finely dispersed matrix tree
In fat, it is uniformly dispersed with mixer, preferably mixing speed is 1200r/min, mixing time 60min~120min.It is uniformly dispersed
Modified amine curing agent 8g is being weighed afterwards, is continuing to be uniformly dispersed with mixer, preferably mixing speed is 1000r/min, during stirring
Between 20min~40min, temperature control is below 30 DEG C.Vacuum defoamation 5min~30min after being uniformly dispersed, obtains underfill
Glue.
The component proportion of gained underfill is as shown in table 3 below：
Table 3
| Component | Mass percent |
| Filler | 50% |
| Epoxy resin | 29% |
| Curing agent | 8% |
| Toughener | 2% |
| Defoamer | 0.3% |
| Dispersant | 0.2% |
| Coupling agent | 0.5% |
| Diluent | 10% |
The underfill adhesiveness is 23Pas, thermal conductivity factor 0.8W/mK.
Embodiment 4
By bisphenol F resin EP-4901E 20g of low halogen content, aliphatic epoxy resin EP-4088S 9g, low halogen content work
Property diluent trimethylolpropane glycidol ether 8g, lauryl diglycidyl ether 2g, toughener polyurethane elastomer 1g are mixed
Close and add in mixer, stir, preferably mixing speed is 1000r/min, mixing time 5min~30min.Matrix resin
After stirring, then weigh respectively fatty acid dispersant 0.2g, polysiloxane-based defoamer 0.3g, silane coupler 0.5g,
The aluminum oxide 34g that spherical aluminum nitride 17g that particle diameter is 600nm, particle diameter are 1000nm is added in finely dispersed matrix resin,
It is uniformly dispersed with mixer, preferably mixing speed is 1200r/min, mixing time 60min~120min.Claiming after being uniformly dispersed
Modified amine curing agent 8g is taken, continues to be uniformly dispersed with mixer, preferably mixing speed is 1000r/min, mixing time 20min
~40min, temperature control is below 30 DEG C.Vacuum defoamation 5min~30min after being uniformly dispersed, obtains underfill.
The component proportion of gained underfill is as shown in table 4 below：
Table 4
| Component | Mass percent |
| Filler | 51% |
| Epoxy resin | 29% |
| Curing agent | 8% |
| Toughener | 1% |
| Defoamer | 0.3% |
| Dispersant | 0.2% |
| Coupling agent | 0.5% |
| Diluent | 10% |
The underfill adhesiveness is 25Pas, thermal conductivity factor 0.9W/mK.
Embodiment described above is better embodiment of the invention, but can not be therefore understands that for patent model of the present invention
The limitation enclosed, therefore all other any changes made under without departing from the Spirit Essence of the present invention and principle, modification, simplification, replace
In generation etc., all should be included within the scope of present patent application.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those skilled in the art disclosed herein technical scope in, can without the change that creative work is expected or
Replace, should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be limited with claims
Fixed protection domain is defined.
Claims (11)
- A kind of 1. heat-conducting type underfill, it is characterised in that：By mass percentage, including following component：40 parts~60 parts of filler, 25 parts~35 parts of epoxy resin, 5 parts~10 parts of curing agent, 2 parts~10 parts of toughness reinforcing Agent, 1 part~10 parts of diluent, 0.1 part~1 part of dispersant, 0.1 part~1 part of defoamer, 0.1 part~2 parts of coupling Agent.
- A kind of 2. heat-conducting type underfill according to claim 1, it is characterised in that：The filler is spherical titanium dioxide At least one of silicon, ball-aluminium oxide, spherical aluminum nitride, ball-like diamond powder, particle diameter are 100nm~3000nm.
- A kind of 3. heat-conducting type underfill according to claim 1, it is characterised in that：The epoxy resin is bisphenol-A At least one of type epoxy resin, bisphenol f type epoxy resin and aliphatic epoxy resin.
- A kind of 4. heat-conducting type underfill according to claim 1, it is characterised in that：The curing agent is modified amine Curing agent.
- A kind of 5. heat-conducting type underfill according to claim 1, it is characterised in that：The toughener is butyronitrile rubber At least one of glue, core shell rubbers, polyether elastomer, polyurethane elastomer.
- A kind of 6. heat-conducting type underfill according to claim 1, it is characterised in that：The diluent dilutes for activity Agent.
- A kind of 7. heat-conducting type underfill according to claim 6, it is characterised in that：The reactive diluent is butyl It is glycidol ether, phenyl glycidyl ether, lauryl diglycidyl ether, octyl glycidyl ether, benzyl glycidyl ether, new Pentanediol glycidol ether, diethylene glycol glycidol ether, butanediol glycidol ether, propanetriol-diglycidyl-ether, three hydroxyl first At least one of base propane glycidol ether.
- A kind of 8. heat-conducting type underfill according to claim 1, it is characterised in that：The dispersant is acrylic compounds Dispersant.
- A kind of 9. heat-conducting type underfill according to claim 1, it is characterised in that：The defoamer is polysiloxane-based At least one of defoamer and polyacrylic defoamer.
- A kind of 10. heat-conducting type underfill according to claim 1, it is characterised in that：The coupling agent is γ-ammonia third Ethyl triethoxy silicane alkane γ-glycidyl ether oxygen propyl trimethoxy silicane, γ-（Methacryloxypropyl）Propyl trimethoxy silicon At least one of alkane.
- 11. a kind of preparation method of heat-conducting type underfill according to any one in claim 1~10, its feature It is：Comprise the following steps that：Epoxy resin, diluent, toughener are added in mixer successively, stir speed (S.S.) 1000r/min, mixing time 5min~ 30min, it is dispersed with stirring uniformly,Defoamer, dispersant, coupling agent, filler are added successively again, stir speed (S.S.) 1200r/min, mixing time 60min~ 120min, it is dispersed with stirring uniformly,Curing agent, stir speed (S.S.) 1000r/min, mixing time 20min~40min are added, temperature control is stirred below 30 DEG C Mix and be uniformly dispersed,Vacuum defoamation 5min~30min, obtain the filling glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610473312.3A CN107541167A (en) | 2016-06-27 | 2016-06-27 | A kind of heat-conducting type underfill and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610473312.3A CN107541167A (en) | 2016-06-27 | 2016-06-27 | A kind of heat-conducting type underfill and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107541167A true CN107541167A (en) | 2018-01-05 |
Family
ID=60961198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610473312.3A Pending CN107541167A (en) | 2016-06-27 | 2016-06-27 | A kind of heat-conducting type underfill and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107541167A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109294499A (en) * | 2018-09-20 | 2019-02-01 | 王景硕 | A kind of electronic device bottom filling glue |
| CN111560232A (en) * | 2020-06-08 | 2020-08-21 | 东莞市新懿电子材料技术有限公司 | Single-component epoxy resin flowing type underfill adhesive and preparation method thereof |
| CN113667435A (en) * | 2021-08-02 | 2021-11-19 | 顺德职业技术学院 | Low dielectric epoxy underfill |
| CN113667437A (en) * | 2021-07-29 | 2021-11-19 | 烟台德邦科技股份有限公司 | Preparation method of epoxy underfill with excellent flow property |
| EP4007033A4 (en) * | 2020-03-19 | 2023-03-08 | Suzhou Qingtao New Energy S&T Co., Ltd. | All-solid-state laminated battery |
| CN116179131A (en) * | 2023-03-20 | 2023-05-30 | 广州聚合新材料科技股份有限公司 | Underfill as well as preparation method and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104910845A (en) * | 2015-06-12 | 2015-09-16 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
| CN104962224A (en) * | 2015-07-06 | 2015-10-07 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
-
2016
- 2016-06-27 CN CN201610473312.3A patent/CN107541167A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104910845A (en) * | 2015-06-12 | 2015-09-16 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
| CN104962224A (en) * | 2015-07-06 | 2015-10-07 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109294499A (en) * | 2018-09-20 | 2019-02-01 | 王景硕 | A kind of electronic device bottom filling glue |
| EP4007033A4 (en) * | 2020-03-19 | 2023-03-08 | Suzhou Qingtao New Energy S&T Co., Ltd. | All-solid-state laminated battery |
| CN111560232A (en) * | 2020-06-08 | 2020-08-21 | 东莞市新懿电子材料技术有限公司 | Single-component epoxy resin flowing type underfill adhesive and preparation method thereof |
| CN113667437A (en) * | 2021-07-29 | 2021-11-19 | 烟台德邦科技股份有限公司 | Preparation method of epoxy underfill with excellent flow property |
| CN113667435A (en) * | 2021-08-02 | 2021-11-19 | 顺德职业技术学院 | Low dielectric epoxy underfill |
| CN116179131A (en) * | 2023-03-20 | 2023-05-30 | 广州聚合新材料科技股份有限公司 | Underfill as well as preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107541167A (en) | A kind of heat-conducting type underfill and preparation method thereof | |
| CN104910845B (en) | Underfill and preparation method thereof | |
| CN104152093B (en) | A kind of flame-retarded heat-conducting double-component epoxy resin embedding adhesive and preparation method thereof | |
| CN112409971B (en) | Liquid mold sealing adhesive for protecting five sides of semiconductor chip and preparation method | |
| KR101819264B1 (en) | Epoxy resin composition and semiconductor sealing material using same | |
| CN105295796B (en) | A kind of high reliability epoxy underfill and preparation method thereof | |
| JP2012162585A (en) | Resin sealng material for semiconductor | |
| TW201738350A (en) | A kind of flow type chip level underfill and its preparation method | |
| CN105838030B (en) | Liquid encapsulating material, the electronic unit using the material | |
| CN110218414A (en) | A kind of composition epoxy resin and its preparation method and application | |
| CN105745247B (en) | Reworkable epoxy resin and solidification blend for low thermal expansion application | |
| CN109651761A (en) | A kind of thermal interfacial material and preparation method thereof | |
| CN102115655A (en) | Single component flexible epoxy sealant | |
| CN106281171A (en) | A kind of epoxy resin soldering flux, its preparation method and application | |
| CN107163891A (en) | Double cured epoxy adhesives and preparation method thereof | |
| CN106566450A (en) | Flowing type chip-scale bottom filling adhesive and preparation method thereof | |
| JP2016037529A (en) | Liquid epoxy resin composition and heat sink, and adhesive for stiffener | |
| CN109294499A (en) | A kind of electronic device bottom filling glue | |
| CN107424964A (en) | Underfill constituent and its bottom filling method of use and Electronic Assemblies component | |
| CN105907346A (en) | Epoxy electronic pouring sealant and preparation method thereof | |
| JP4810835B2 (en) | Liquid sealing resin composition for underfill and semiconductor device using the same | |
| CN107974225A (en) | A kind of electronics Heraeus and preparation method thereof | |
| JP2007314702A (en) | Epoxy resin composition and semiconductor device sealed with resin | |
| JP2004256646A (en) | Resin composition for underfilling, and semiconductor device | |
| JP2010144144A (en) | Liquid epoxy resin composition for underfill, and semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 215000 No. 9 Hong Kong Road, Luzhi Town, Wuzhong District, Suzhou, Jiangsu Applicant after: Suzhou Tianmai thermal Polytron Technologies Inc Address before: 215000 No. 9 Hong Kong Road, Luzhi Town, Wuzhong District, Suzhou, Jiangsu Applicant before: Suzhou Tianmai Thermal Technology Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180105 |
|
| RJ01 | Rejection of invention patent application after publication |