CN1974704A

CN1974704A - Low temperature fast curing adhesive for mounting chip element and device

Info

Publication number: CN1974704A
Application number: CN 200610129791
Authority: CN
Inventors: 李士学; 高之香
Original assignee: Sanyou Tianjin Macromolecular Techonoloy Co Ltd
Current assignee: Sanyou Tianjin Macromolecular Techonoloy Co Ltd
Priority date: 2006-11-30
Filing date: 2006-11-30
Publication date: 2007-06-06

Abstract

The low temperature fast curing adhesive for mounting chip element and device is compounded with liquid epoxy resin 30-60 wt%, diluent 5-15 wt%, curing agent 8-20 wt%, promoter 2-10 wt%, thixotropic agent 4-12 wt%, plasticizer 5-10 wt%, pigment 1-3 wt% and inorganic filler 0-20 wt%. It has curing period of 80 sec at 120 deg.c and 180 sec at 100 deg.c, adhesion strength of 10-20 MPa, absolute resistivity high than 1013 Ohm. cm, water absorption less than 0.5 %, storage life over 2 months at 20 deg.c, and zero rolling. It is used in the surface mounting of electronic elements and device.

Description

Low temperature fast curing adhesive for mounting chip element and device

Technical field

The present invention relates to adhesive material, particularly a kind of low temperature fast curing adhesive for mounting chip element and device that is used for electronic industry chip components and parts surface mounting technology.

Technical background

Along with developing rapidly of electronic industry, more and more higher to surface mounting technology (SMT) with the performance requriements of glue, not only require electronic devices and components in automatic assembly line production surface mount intensity height, high temperature resistant, electrical insulating property good, be suitable for that the SMT automatic placement machine mounts or stencilization mounts, and requires that solidification value is low, the time short.Yet existing chip components and parts surface adhesive generally needs to solidify down at 150 ℃, can cause damage to some components and parts, as paster set time of certain chemical industry institute be 5 minutes under 150 ℃, be 12 minutes under 130 ℃, be 3 months storage period below 5 ℃.

Summary of the invention

In view of there are the problems referred to above in prior art, the purpose of this invention is to provide the quick-setting single-component surface adhesive of a kind of low temperature, its materials and weight proportion are:

Liquid-state epoxy resin 30-60%

Thinner 5-15%

Latent curing agent 8-20%

Latent promotor 2-10%

Thixotropic agent 4-12%

Softening agent 5-10%

Pigment 1-30%

Mineral filler 0-20%

Characteristics of the present invention are that its curing speed is 80 seconds in the time of 120 ℃, is 180 seconds in the time of 100 ℃, be 10 days storage period in the time of 40 ℃, at room temperature can store more than 2 months, can store more than 6 months in the time of 10 ℃, the devices that mounted under 260 ℃ do not come off, wear resistance is good; In addition, this glue also has and does not trickle, do not have wire drawing when at a high speed putting glue, and there is certain intensity on the limit of not collapsing after the coating, is suitable for using in the wave soldering streamline of surface-assembled.

Embodiment

Embodiment one

E56 Resins, epoxy: 32%

E51 Resins, epoxy: 22%

Epoxy propane butyl ether: 5%

Dibutyl phthalate: 7%

Aliphatic amide phenol mixture: 22%

Alkyl imidazole salt: 4%

Aerosil: 6%

Inorganic red or yellow pigment: 2%

Embodiment two

Hydrogenated bisphenol A epoxy resin: 45%

To the tert-butyl-phenyl glycidyl ether: 5.5%

Dibutyl phthalate: 7.5%

Modified fat amine adduct: 28%

Aerosil: 5%

Aluminum oxide powder: 6%

Inorganic red: 3%

Embodiment three

Bisphenol F epoxy resin: 55%

Dibutyl phthalate: 8%

M-phthalic acid two hydrazides: 10%

23# replaces urea: 8%

Aerosil: 7%

Silicon powder: 6%

Aluminum oxide powder: 5%

Oil red pigment: 1%

Embodiment four

E51 Resins, epoxy: 50%

Resorcinol 2-glycidyl ester: 6%

Dibutyl phthalate: 6%

Trimeric cyanamide: 10%

10# replaces urea: 15%

Aerosil: 5%

Silicon powder: 2%

Aluminum oxide powder: 5%

Oil red pigment: 1%

By after the above-mentioned formulated, grind 3～5 times with three-roll grinder the back that stirs, and carries out vacuum defoamation and handle behind the above net filtration of 60 orders, and the Heraeus of gained has following technical indicator:

Non-volatility:＞98%

Viscosity: 5～15 * 10 ⁴Mpa.s

Mobile: 0mm

Set time (120 ℃): 70～90 seconds

Bonding strength: 10～20Mpa.

Insulation resistivity:＞10 ¹³Ω .cm

Water-intake rate:＜0.5%

Storage period (20 ℃):＞2 months.

Claims

1. low temperature fast curing adhesive for mounting chip element and device, its materials and weight proportion are:

Liquid-state epoxy resin 30-60%

Thinner 5-15%

Latent curing agent 8-20%

Latent promotor 2-10%

Thixotropic agent 4-12%

Softening agent 5-10%

Pigment 1-3%

Mineral filler 0-20%.

2. low temperature fast curing adhesive for mounting chip element and device as claimed in claim 1, wherein liquid-state epoxy resin is selected bisphenol A diglycidyl ether, Hydrogenated Bisphenol A diglycidylether, Bisphenol F diglycidylether, tetrahydrophthalic acid 2-glycidyl ester or Resorcinol 2-glycidyl ester for use, its viscosity is 2000～15000mpa.s, and oxirane value is 0.45～0.8.

3. low temperature fast curing adhesive for mounting chip element and device as claimed in claim 1, wherein thinner select reactive thinner such as epoxy propane butyl ether for use, to tert-butyl-phenyl glycidyl ether, ethylene glycol diglycidylether, T 55.

4. low temperature fast curing adhesive for mounting chip element and device as claimed in claim 1, wherein latent curing agent is selected phenolic complex, modified fat acid adduct, three aliphatic amide glyceryl ester, the trimeric cyanamide of m-phthalic acid two hydrazides amine, amine for use.

5. low temperature fast curing adhesive for mounting chip element and device as claimed in claim 1, wherein promotor is selected replacement carbamide compound, phenolic compound or the alkyl imidazole of amino-complex and carbimide preparation for use.

6. low temperature fast curing adhesive for mounting chip element and device as claimed in claim 1, wherein thixotropic agent is selected aerosil, polyethylene wax, tetrafluoroethylene wax or hydrogenated castor oil for use.

7. low temperature fast curing adhesive for mounting chip element and device as claimed in claim 1, wherein softening agent is selected dibutyl phthalate or dioctyl phthalate (DOP) for use.

8. low temperature fast curing adhesive for mounting chip element and device as claimed in claim 1, wherein pigment is selected inorganic red, oil red or yellow ultramarine for use.

9. low temperature fast curing adhesive for mounting chip element and device as claimed in claim 1, wherein aluminum oxide powder, silicon powder, lime carbonate are selected in mineral filler for use.

10. the method for preparing the described low temperature fast curing adhesive for mounting chip element and device of claim 1 is characterized in that may further comprise the steps:

(a). grind 3～4 times with three-roll grinder by stirring after the above-mentioned formulated;

(b). through the above net filtration of 60 orders;

(c). vacuum defoamation is handled;

More than each step all carry out at normal temperatures.