CN107958886A - The augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface - Google Patents
The augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface Download PDFInfo
- Publication number
- CN107958886A CN107958886A CN201810007071.2A CN201810007071A CN107958886A CN 107958886 A CN107958886 A CN 107958886A CN 201810007071 A CN201810007071 A CN 201810007071A CN 107958886 A CN107958886 A CN 107958886A
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- Prior art keywords
- heat
- heat exchanger
- microelectronics
- micro
- augmentation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Abstract
The present invention discloses a kind of augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface, including fan fixing rack, fan, bionical heat exchanging body, studdle and heat-conducting base；Its bionical heat exchanging body is made of the heat exchanger fin of 1 columned heat carrier and multi-disc en plaque；Heat exchanger fin is fixed on the side wall of heat carrier in emanant；The surface of every heat exchanger fin is in wavy, i.e., groove is arranged side by side equipped with a plurality of in the surface of heat exchanger fin, the axis parallel moved towards with heat carrier of these grooves；Fan is installed on fan fixing rack, and fan is hung on the surface of bionical heat exchanging body by the fan fixing rack；Heat-conducting base is affixed on the underface of bionical heat exchanging body；Fan fixing rack is connected with heat-conducting base by studdle.Heat exchanger fin of the present invention based on imitative earthworm microscopic surface texture design microelectronics heat exchanger, compared to the heat exchanger fin of smooth surface, adds radiating efficiency on unit heat dissipation area, the heat dissipation performance for exchanging backing has obvious humidification.
Description
Technical field
The present invention relates to technical field of heat exchangers, and in particular to a kind of augmentation of heat transfer microelectronics of imitative earthworm micro-structure surface
Heat exchanger.
Background technology
Due to the fast development of current new and high technology, small to size and compact-sized micro- of high-accuracy electronic component
The heat exchange property of electronics heat exchanger is that requirement is more and more high.For microelectronic device, due to limited by size,
In micron between sub-micron, such structure causes to radiate the inner passage diameter of the microelectronics heat exchanger of microelectronic device
The surface area of Heat Conduction Material and the surface area of air contact be very micro, thus be difficult by produced by heat source (electronic building brick)
Heat be all fully dispersed into air, heat exchanger heat exchange efficiency is not high.
In miniature electronic device, it is desirable to which the heat exchanger used needs while has the small and good spy of heat exchange property concurrently
Point.However, the radiator of traditional heat exchangers structure is but difficult to take into account the two requirements at the same time.For heat exchanger, its volume
Bigger, heat dissipation performance is then better, its volume is smaller, and heat dissipation performance is then poorer.For this reason, it may be necessary to the structure of traditional heat sinks is carried out
Improve, its heat exchange property is lifted again while structure size is reduced, to tackle the needs of industrial development.
The content of the invention
To be solved by this invention is the problem of traditional heat sinks are difficult to suitable for miniature electronic device, there is provided a kind of
The augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface.
To solve the above problems, the present invention is achieved by the following technical solutions：
The augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface, including fan fixing rack, fan, bionical heat exchange
Body, studdle and heat-conducting base；Wherein bionical heat exchanging body by 1 columned heat carrier and multi-disc en plaque heat exchanger fin group
Into；Heat exchanger fin is fixed on the side wall of heat carrier in emanant；The surface of every heat exchanger fin is in wavy, i.e. the surface of heat exchanger fin
Groove is arranged side by side equipped with a plurality of, the axis parallel moved towards with heat carrier of these grooves；Fan is fixed installed in fan
On stent, and fan is hung on the surface of bionical heat exchanging body by the fan fixing rack；Heat-conducting base is affixed on bionical heat exchange
The underface of body；Fan fixing rack is connected with heat-conducting base by studdle.
In such scheme, the groove for being opened in heat exchanger fin surface is convex and/or recessed groove.
In such scheme, fluted institute is semi-circular recesses.
In such scheme, the both side surface of every heat exchanger fin is in wavy.
In such scheme, axis parallel of the every heat exchanger fin with heat carrier.
In such scheme, all diffusion sheets are distributed on the side wall of heat carrier, i.e., the angle phase between every 2 heat exchanger fins
Deng.
In such scheme, bionical heat exchanging body is made of red copper.
In such scheme, the shaft of fan and the central axes of heat carrier are on same straight line.
In such scheme, the area of heat-conducting base is less than the area of section of bionical heat exchanging body.
Compared with prior art, heat exchanger fin of the present invention based on imitative earthworm microscopic surface texture design microelectronics heat exchanger,
Compared to the heat exchanger fin of smooth surface, this bionical microscopic surface texture increase heat dissipation area 30%-50%, so as to add unit
Radiating efficiency on heat dissipation area, exchanging the heat dissipation performance of backing has obvious humidification, this to be based on earthworm microcosmic surface
Bionical air-cooled minitype radiator can be widely used for the fields such as microelectronic chip, high-capacity LED.
Brief description of the drawings
Fig. 1 is the overlook direction schematic perspective view of the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface.
Fig. 2 looks up direction schematic perspective view for the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface.
Figure label：1st, fan fixing rack；2nd, fan；3rd, bionical heat exchanging body；4th, studdle；5th, heat-conducting base.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with instantiation, and with reference to attached
Figure, the present invention is described in more detail.It should be noted that the direction term mentioned in example, such as " on ", " under ",
" in ", " left side " " right side ", "front", "rear" etc., be only refer to the attached drawing direction.Therefore, the direction used is intended merely to explanation
For limiting the scope of the invention.
A kind of augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface, as illustrated in fig. 1 and 2, it is mainly by fan
Fixing bracket 1, fan 2, bionical heat exchanging body 3, studdle 4 and heat-conducting base 5 form.
Bionical heat exchanging body 3 is the critical component of whole microelectronics heat exchanger, it is by 1 columned heat carrier and more sheets
The heat exchanger fin composition of sheet.In the present invention, bionical heat exchanging body 3 is made of red copper, it is cheap with enough hardness,
Light weight, high thermal conductivity coefficient, is the economical and practical raw material for meeting the design.In the present embodiment, whole bionical heat exchanging body 3
A diameter of 85mm, the wherein length of monolithic heat exchanger fin and width is 30mm, a diameter of 25mm of center heat carrier.
Heat exchanger fin is fixed on the side wall of heat carrier in emanant.In order to ensure the harmony of heat dissipation, in the present invention
In preferred embodiment, all diffusion sheets are fixed on the side wall of heat carrier using equally distributed mode, i.e., every 2 heat exchanger fins it
Between angle it is equal.When heat exchanger fin is fixed on the side wall of heat carrier, can be installed using inclined mode, at this time heat exchanger fin
It is in a certain angle with the central axes of heat carrier.When heat exchanger fin is fixed on the side wall of heat carrier, vertical mode can be used
Install, at this time axis parallel of the heat exchanger fin with heat carrier.In a preferred embodiment of the invention, all heat exchanger fins are vertically solid
It is scheduled on the side wall of heat carrier, i.e. axis parallel of the every heat exchanger fin with heat carrier, to improve radiating efficiency.
In wavy, it is wavy that can allow the wherein side surface of every heat exchanger fin, also may be used on the surface of every heat exchanger fin
Wherein both side surface to allow every heat exchanger fin is wavy.In order to improve rate of heat dissipation to greatest extent, of the invention preferred
In embodiment, the both side surface of every heat exchanger fin is in wavy.The surface of every heat exchanger fin is allowed to be in wavy, Ke Yitong
Cross to open up on the surface of the smooth heat exchanger fin in surface and a plurality of groove is arranged side by side to realize.The section of these grooves is semi arch
Shape.In the present embodiment, the section radius of groove are 0.5mm.These grooves can be all using convex groove, and compartment of terrain
It is opened on the smooth heat exchanger fin in surface；Convex groove can also all be used down, and compartment of terrain is opened in that surface is smooth to be changed
On backing；Can also be at the same time using convex groove groove convex with, and make convex groove groove convex with mutual
Every.In a preferred embodiment of the invention, using convex groove and under by the way of the convex spaced setting of groove, with as far as possible
Ground expands heat exchanger fin surface area, strengthens heat dissipation effect.In order to preferably guide heat to be diffused to below radiator
The top of radiator, is opened in the axial direction preferably axis parallel with heat carrier of the groove on the surface of heat exchanger fin.
Fan 2 is installed on fan fixing rack 1, and fan 2 is hung on bionical heat exchanging body by the fan fixing rack 1
3 surface.Heat-conducting base 5 is affixed on the underface of bionical heat exchanging body 3.Fan fixing rack 1 is with heat-conducting base 5 by supporting spiral shell
Bar 4 connects.The shaft of fan 2 and the central axes of heat carrier are on same straight line.The area of heat-conducting base 5 is less than bionical heat exchange
The area of section of body 3.
Heat caused by heat source electrical component reaches bionical heat exchanging body 3 through heat-conducting base 5.With bionical heat exchanging body 3
The rotation of top fan 2, heat are directed to the top of bionical heat exchanging body 3 from the lower section of bionical heat exchanging body 3.When heat is passing through
During bionical 3 inside of heat exchanging body, heat exchange occurs with bionical 3 heat exchanger fin of heat exchanging body.Bionical 3 inner passage of heat exchanging body has dynamically
Heat exchange medium is output and input, i.e., heat forms forced convertion state with heat exchange medium, so as to form single-phase heat transfer.Using micro-
Microelectronics heat exchanger, can be in contact by a kind of this operation principle and heat transfer process of electronics heat exchanger with the chip of electrical equipment,
And be integrally formed therewith, it is not only but compact-sized, also it has been greatly improved the efficiency of heat exchange.In addition, the heat exchanger fin of the present invention
Based on imitative earthworm surface microstructure, on the heat exchanger channels wall for the microchannel for being molded over high heat conductive material i.e. on heat carrier.
By the way that imitative earthworm surface micro-structure is designed at heat exchanger channels wall, heat dissipation can be increased on the premise of finite size
The surface area of Heat Conduction Material, adds the area of heat exchanger and heat air contact, improves and departs from frequency, and it is single-phase right to reach reinforcing
The heat exchange purpose of stream.So not only reduce and leak out, lack wind, the situation of incomplete contact between, substantially increase on windward side
Effective heat exchange area so that the heat of heat source electronic component is transmitted in air, and uses forced convertion, by air from passage
Outwardly convey, realize the function of high performance heat dissipation.
It should be noted that although embodiment of the present invention is illustrative above, but it is to the present invention that this, which is not,
Limitation, therefore the invention is not limited in above-mentioned embodiment.Without departing from the principles of the present invention, it is every
The other embodiment that those skilled in the art obtain under the enlightenment of the present invention, is accordingly to be regarded as within the protection of the present invention.
Claims (9)
1. the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface, it is characterized in that, including fan fixing rack (1), wind
Fan (2), bionical heat exchanging body (3), studdle (4) and heat-conducting base (5)；Wherein bionical heat exchanging body (3) columned is led by 1
The heat exchanger fin of hot body and multi-disc en plaque forms；Heat exchanger fin is fixed on the side wall of heat carrier in emanant；Every heat exchanger fin
Surface in wavy, i.e., the surface of heat exchanger fin be equipped with it is a plurality of groove is arranged side by side, these grooves move towards with heat carrier
Axis is parallel；Fan (2) is installed on fan fixing rack (1), and fan (2) is hung on by the fan fixing rack (1)
The surface of bionical heat exchanging body (3)；Heat-conducting base (5) is affixed on the underface of bionical heat exchanging body (3)；Fan fixing rack (1) with
Heat-conducting base (5) is connected by studdle (4).
2. the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface according to claim 1, it is characterized in that：Open up
Groove on heat exchanger fin surface is convex and/or recessed groove.
3. the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface according to claim 1 or 2, it is characterized in that：
Fluted institute is semi-circular recesses.
4. the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface according to claim 1 or 2, it is characterized in that：
The both side surface of every heat exchanger fin is in wavy.
5. the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface according to claim 1, it is characterized in that, every
Axis parallel of the heat exchanger fin with heat carrier.
6. the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface according to claim 1, it is characterized in that, own
Diffusion sheet is distributed on the side wall of heat carrier, i.e., the angle between every 2 heat exchanger fins is equal.
7. the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface according to claim 1, it is characterized in that：It is bionical
Heat exchanging body (3) is made of red copper.
8. the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface according to claim 1, it is characterized in that：Fan
(2) shaft and the central axes of heat carrier are on same straight line.
9. the augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface according to claim 1, it is characterized in that：Heat conduction
The area of base (5) is less than the area of section of bionical heat exchanging body (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007071.2A CN107958886A (en) | 2018-01-04 | 2018-01-04 | The augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007071.2A CN107958886A (en) | 2018-01-04 | 2018-01-04 | The augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107958886A true CN107958886A (en) | 2018-04-24 |
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ID=61956126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810007071.2A Pending CN107958886A (en) | 2018-01-04 | 2018-01-04 | The augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065513A (en) * | 2018-08-06 | 2018-12-21 | 中国科学院工程热物理研究所 | Finned radiator with triangular groove extended surface |
| CN109548381A (en) * | 2018-12-21 | 2019-03-29 | 华中科技大学 | There is the radiator of protrusion on a kind of radial fin surface |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010014011A1 (en) * | 2000-02-08 | 2001-08-16 | Noriyasu Sasa | Heat sink-equipped cooling apparatus |
| US20060196636A1 (en) * | 2005-03-02 | 2006-09-07 | Wen-Hao Liu | Cooling mechanism |
| CN201689879U (en) * | 2009-11-20 | 2010-12-29 | 王新 | Radiating device |
| CN207993849U (en) * | 2018-01-04 | 2018-10-19 | 钦州学院 | The augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface |
-
2018
- 2018-01-04 CN CN201810007071.2A patent/CN107958886A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010014011A1 (en) * | 2000-02-08 | 2001-08-16 | Noriyasu Sasa | Heat sink-equipped cooling apparatus |
| CN1309341A (en) * | 2000-02-08 | 2001-08-22 | 山洋电气株式会社 | Cooling device provided with radiator |
| US20060196636A1 (en) * | 2005-03-02 | 2006-09-07 | Wen-Hao Liu | Cooling mechanism |
| CN201689879U (en) * | 2009-11-20 | 2010-12-29 | 王新 | Radiating device |
| CN207993849U (en) * | 2018-01-04 | 2018-10-19 | 钦州学院 | The augmentation of heat transfer microelectronics heat exchanger of imitative earthworm micro-structure surface |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065513A (en) * | 2018-08-06 | 2018-12-21 | 中国科学院工程热物理研究所 | Finned radiator with triangular groove extended surface |
| CN109548381A (en) * | 2018-12-21 | 2019-03-29 | 华中科技大学 | There is the radiator of protrusion on a kind of radial fin surface |
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