CN207993851U - Microelectronics heat exchanger based on earthworm microcosmic surface - Google Patents
Microelectronics heat exchanger based on earthworm microcosmic surface Download PDFInfo
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- CN207993851U CN207993851U CN201820010820.2U CN201820010820U CN207993851U CN 207993851 U CN207993851 U CN 207993851U CN 201820010820 U CN201820010820 U CN 201820010820U CN 207993851 U CN207993851 U CN 207993851U
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- heat
- heat exchanger
- exchanger fin
- earthworm
- fan
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Abstract
The utility model discloses a kind of microelectronics heat exchanger based on earthworm microcosmic surface, including fan fixing rack, fan, bionical heat exchanging body, studdle and heat-conducting base；Fan is mounted on fan fixing rack, and fan is hung on the surface of bionical heat exchanging body by the fan fixing rack；Heat-conducting base is affixed on the underface of bionical heat exchanging body；Fan fixing rack is connect with heat-conducting base by studdle；Bionical heat exchanging body is made of the heat exchanger fin of 1 columned heat carrier and multi-disc en plaque；Heat exchanger fin is fixed in emanant on the side wall of heat carrier；In wavy, i.e. the surface of heat exchanger fin is equipped with a plurality of groove arranged side by side on the surface of every heat exchanger fin, the trends of these grooves with the axis parallel of heat carrier.The utility model designs the heat exchanger fin of microelectronics heat exchanger based on imitative earthworm microscopic surface texture, compares the heat exchanger fin of smooth surface, increases radiating efficiency on unit heat dissipation area, and the heat dissipation performance for exchanging backing has apparent humidification.
Description
Technical field
The utility model is related to technical field of heat exchangers, and in particular to a kind of microelectronics heat exchange based on earthworm microcosmic surface
Device.
Background technology
Due to the fast development of current new and high technology, small to size and compact-sized micro- of high-accuracy electronic component
The heat exchange property of electronics heat exchanger is that requirement is more and more high.For microelectronic device, due to limited by size,
In micron between sub-micron, such structure causes to radiate the inner passage diameter of the microelectronics heat exchanger of microelectronic device
The surface area that is contacted with air of surface area of Heat Conduction Material be very micro, thus being difficult will be produced by heat source (electronic building brick)
Heat be all fully dispersed into air.In addition, due to the limitation of microelectronics size of heat exchanger, need to reach higher processing
Precision, traditional coarse working techniques (such as Electric Discharge Wire-cutting Technology, the disadvantage is that wire electrode is easy to break this；Process thin workpiece
When, fixing Methods in WEDM-HS is also easy to produce shake in the process, influences machining accuracy；It is also easy to produce deformation in process, influences dimensional accuracy；It is high
Fast wire cutting surfaces will appear light and shade striped, influence surface quality etc.) have been unable to meet in processing precise and size it is small
Parts, it is therefore desirable to propose a kind of new processing method, it can be under the premise of meeting microelectronics heat exchanger processing precision, soon
The microelectronics heat exchanger for meeting performance requirement is produced fastly, to cope with the electronic field of current and future high speed development.
Utility model content
It is to be solved in the utility model be traditional coarse working techniques have been unable to meet in processing precise and size it is small
Microelectronics heat exchanger make demand the problem of, a kind of microelectronics heat exchanger based on earthworm microcosmic surface is provided.
To solve the above problems, the utility model is achieved through the following technical solutions：
Microelectronics heat exchanger based on earthworm microcosmic surface, including fan fixing rack, fan, bionical heat exchanging body, support
Screw rod and heat-conducting base；Fan is mounted on fan fixing rack, and fan is hung on bionical change by the fan fixing rack
The surface of hot body；Heat-conducting base is affixed on the underface of bionical heat exchanging body；Fan fixing rack is with heat-conducting base by supporting spiral shell
Bar connects；Bionical heat exchanging body is made of the heat exchanger fin of 1 columned heat carrier and multi-disc en plaque；Heat exchanger fin is in emanant solid
It is scheduled on the side wall of heat carrier；The surface of every heat exchanger fin is in wavy, i.e., the surface of heat exchanger fin is equipped with a plurality of arranged side by side recessed
Slot, these grooves trend with the axis parallel of heat carrier.
In said program, the groove for being opened in heat exchanger fin surface is convex and/or recessed groove.
In said program, fluted institute is semi-circular recesses.
In said program, the both side surface of every heat exchanger fin is in wavy.
In said program, every heat exchanger fin with the axis parallel of heat carrier.
In said program, all diffusion sheets are distributed on the side wall of heat carrier, i.e., the angle phase between every 2 heat exchanger fins
Deng.
Compared with prior art, the utility model designs the heat exchange of microelectronics heat exchanger based on imitative earthworm microscopic surface texture
Piece compares the heat exchanger fin of smooth surface, and this bionical microscopic surface texture increases heat dissipation area 30%-50%, to increase
Radiating efficiency on unit heat dissipation area, the heat dissipation performance for exchanging backing has apparent humidification, this microcosmic based on earthworm
The bionical air-cooled micro heat exchanger on surface can be widely used for the fields such as microelectronic chip, high-capacity LED.
Description of the drawings
Fig. 1 is the overlook direction stereoscopic schematic diagram of the microelectronics heat exchanger based on earthworm microcosmic surface.
Fig. 2 looks up direction stereoscopic schematic diagram for the microelectronics heat exchanger based on earthworm microcosmic surface.
Figure label：1, fan fixing rack；2, fan；3, bionical heat exchanging body；4, studdle；5, heat-conducting base.
Specific implementation mode
To make the purpose of this utility model, technical solution and advantage be more clearly understood, below in conjunction with specific example, and join
According to attached drawing, the utility model is further described.It should be noted that the direction term mentioned in example, such as "upper",
"lower", " in ", " left side " " right side ", "front", "rear" etc., be only the direction of refer to the attached drawing.Therefore, the direction used is intended merely to illustrate
Not it is used for limiting the scope of protection of the utility model.
A kind of microelectronics heat exchanger based on earthworm microcosmic surface, as illustrated in fig. 1 and 2, mainly by fan fixing rack
1, fan 2, bionical heat exchanging body 3, studdle 4 and heat-conducting base 5 form.Fan 2 is mounted on fan fixing rack 1, and wind
Fan 2 is hung on the surface of bionical heat exchanging body 3 by the fan fixing rack 1.Heat-conducting base 5 is being affixed on bionical heat exchanging body 3 just
Lower section.Fan fixing rack 1 is connect with heat-conducting base 5 by studdle 4.The shaft of fan 2 and the central axes of heat carrier exist
On same straight line.The area of heat-conducting base 5 is less than the area of section of bionical heat exchanging body 3.
Bionical heat exchanging body 3 is the critical component of entire microelectronics heat exchanger, by 1 columned heat carrier and multi-disc plate
The heat exchanger fin of sheet forms.In the present invention, bionical heat exchanging body 3 is made of red copper, and with enough hardness, price is low
Honest and clean, light weight, high thermal conductivity coefficient is the economical and practical raw material for meeting the design.In the present embodiment, entire bionical heat exchange
A diameter of 85mm of body 3, the wherein length of monolithic heat exchanger fin and width are 30mm, a diameter of 25mm of center heat carrier.
Heat exchanger fin is fixed in emanant on the side wall of heat carrier.In order to ensure the harmony of heat dissipation, in this practicality
In novel preferred embodiment, all diffusion sheets are fixed on using equally distributed mode on the side wall of heat carrier, i.e., every 2 heat exchange
Angle between piece is equal.When heat exchanger fin is fixed on the side wall of heat carrier, inclined mode may be used and install, change at this time
Backing is in a certain angle with the central axes of heat carrier.When heat exchanger fin is fixed on the side wall of heat carrier, may be used vertical
Mode is installed, at this time heat exchanger fin with the axis parallel of heat carrier.In the preferred embodiment in the utility model, all heat exchanger fins
Be vertically fixed on the side wall of heat carrier, i.e. every heat exchanger fin with the axis parallel of heat carrier, to improve radiating efficiency.
The surface of every heat exchanger fin is in wavy, and it is wavy that can allow a wherein side surface for every heat exchanger fin, also may be used
Wherein both side surface to allow every heat exchanger fin is wavy.In order to improve rate of heat dissipation to the maximum extent, in the utility model
In preferred embodiment, the both side surface of every heat exchanger fin is in wavy.Allow every heat exchanger fin surface be in it is wavy, can
To be realized by opening up a plurality of groove arranged side by side on the surface of the smooth heat exchanger fin in surface.The section of these grooves is semicircle
Arc.In the present embodiment, the section radius of groove is 0.5mm.These grooves can be all using convex groove, and is spaced
Ground is opened on the smooth heat exchanger fin in surface；Convex groove can also all be used down, and to be opened in surface smooth for compartment of terrain
On heat exchanger fin；The groove that convex groove can also be used convex under simultaneously, and the groove for making convex groove convex under is mutual
Interval.In the preferred embodiment in the utility model, using convex groove and under by the way of the convex spaced setting of groove, with
Expand heat exchanger fin surface area as much as possible, enhances heat dissipation effect.In order to preferably guide lower section of the heat from heat exchanger
The top for diffusing to heat exchanger, be opened in the axial direction of the groove on the surface of heat exchanger fin preferably with the axis parallel of heat carrier.
By the microelectronics heat exchanger made by imitative earthworm microcosmic surface, the surface area of the Heat Conduction Material of heat dissipation is increased,
To increase the area contacted with air, and increases and be detached from frequency.So it not only reduces and leaks out, lack wind, is endless
The case where Full connected, substantially increases the effective heat exchange area on windward side so that the heat of heat source electronic component is transmitted to sky
In gas, and forced convertion is used, air is outwardly conveyed from channel, realizes efficient heat sinking function.
It should be noted that although the above embodiment described in the utility model is illustrative, this is not to this
The limitation of utility model, therefore the utility model is not limited in above-mentioned specific implementation mode.The utility model is not being departed from
In the case of principle, the other embodiment that every those skilled in the art obtain under the enlightenment of the utility model is accordingly to be regarded as
Within the protection of the utility model.
Claims (6)
1. the microelectronics heat exchanger based on earthworm microcosmic surface, including fan fixing rack (1), fan (2), bionical heat exchanging body
(3), studdle (4) and heat-conducting base (5)；Fan (2) is mounted on fan fixing rack (1), and fan (2) passes through the wind
Fan fixing bracket (1) is hung on the surface of bionical heat exchanging body (3)；Heat-conducting base (5) be affixed on bionical heat exchanging body (3) just under
Side；Fan fixing rack (1) is connect with heat-conducting base (5) by studdle (4)；It is characterized in that bionical heat exchanging body (3) is by purple
Copper the heat exchanger fin of 1 columned heat carrier and multi-disc en plaque at and being made of；Heat exchanger fin is fixed on heat conduction in emanant
On the side wall of body；The surface of every heat exchanger fin is in wavy, i.e., the surface of heat exchanger fin is equipped with a plurality of groove arranged side by side, these are recessed
Slot trend with the axis parallel of heat carrier.
2. the microelectronics heat exchanger according to claim 1 based on earthworm microcosmic surface, it is characterized in that：It is opened in heat exchanger fin
The groove on surface is convex and/or recessed groove.
3. the microelectronics heat exchanger according to claim 1 or 2 based on earthworm microcosmic surface, it is characterized in that：Institute is fluted
It is semi-circular recesses.
4. the microelectronics heat exchanger according to claim 1 or 2 based on earthworm microcosmic surface, it is characterized in that：Every heat exchange
The both side surface of piece is in wavy.
5. the microelectronics heat exchanger according to claim 1 based on earthworm microcosmic surface, characterized in that every heat exchanger fin is equal
With the axis parallel of heat carrier.
6. the microelectronics heat exchanger according to claim 1 based on earthworm microcosmic surface, characterized in that all diffusion sheets are equal
For cloth on the side wall of heat carrier, i.e., the angle between every 2 heat exchanger fins is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820010820.2U CN207993851U (en) | 2018-01-04 | 2018-01-04 | Microelectronics heat exchanger based on earthworm microcosmic surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820010820.2U CN207993851U (en) | 2018-01-04 | 2018-01-04 | Microelectronics heat exchanger based on earthworm microcosmic surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207993851U true CN207993851U (en) | 2018-10-19 |
Family
ID=63819683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820010820.2U Expired - Fee Related CN207993851U (en) | 2018-01-04 | 2018-01-04 | Microelectronics heat exchanger based on earthworm microcosmic surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207993851U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107968080A (en) * | 2018-01-04 | 2018-04-27 | 钦州学院 | Microelectronics heat exchanger and its manufacture method based on earthworm microcosmic surface |
-
2018
- 2018-01-04 CN CN201820010820.2U patent/CN207993851U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107968080A (en) * | 2018-01-04 | 2018-04-27 | 钦州学院 | Microelectronics heat exchanger and its manufacture method based on earthworm microcosmic surface |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181019 Termination date: 20200104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |