CN107949168B - 处理装置以及处理方法 - Google Patents

处理装置以及处理方法 Download PDF

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Publication number
CN107949168B
CN107949168B CN201710953541.XA CN201710953541A CN107949168B CN 107949168 B CN107949168 B CN 107949168B CN 201710953541 A CN201710953541 A CN 201710953541A CN 107949168 B CN107949168 B CN 107949168B
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CN
China
Prior art keywords
flexible printed
gripping
printed board
processing
electrical inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710953541.XA
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English (en)
Chinese (zh)
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CN107949168A (zh
Inventor
石井彻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Fine Technologies Co Ltd
Original Assignee
Yamaha Fine Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN107949168A publication Critical patent/CN107949168A/zh
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Publication of CN107949168B publication Critical patent/CN107949168B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201710953541.XA 2016-10-13 2017-10-13 处理装置以及处理方法 Active CN107949168B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-201459 2016-10-13
JP2016201459A JP6726077B2 (ja) 2016-10-13 2016-10-13 処理装置

Publications (2)

Publication Number Publication Date
CN107949168A CN107949168A (zh) 2018-04-20
CN107949168B true CN107949168B (zh) 2021-06-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710953541.XA Active CN107949168B (zh) 2016-10-13 2017-10-13 处理装置以及处理方法

Country Status (3)

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JP (1) JP6726077B2 (ko)
KR (1) KR101973864B1 (ko)
CN (1) CN107949168B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11867753B2 (en) * 2019-05-07 2024-01-09 Nextron Corporation Probe assembly and micro vacuum probe station comprising same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010237179A (ja) * 2009-03-31 2010-10-21 Dainippon Printing Co Ltd 試験試料装着装置、曲げ強さ試験装置、曲げ強さ試験方法、曲げ強さ試験プログラム及び試験試料

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04132970A (ja) * 1990-09-26 1992-05-07 Hitachi Electron Eng Co Ltd 基板の両面検査プローバ機構
JPH08301433A (ja) * 1995-05-10 1996-11-19 Fujitsu Ten Ltd 搬送反転装置
JP3204236B2 (ja) * 1999-01-14 2001-09-04 ヤマハ株式会社 穿孔装置及び穿孔方法
JP4238774B2 (ja) * 2004-04-28 2009-03-18 パナソニック株式会社 曲げ試験装置および曲げ試験方法
JP4919617B2 (ja) * 2005-05-27 2012-04-18 ヤマハファインテック株式会社 プリント基板の電気検査装置および電気検査方法
KR101141962B1 (ko) * 2011-11-28 2012-05-04 주식회사 세인블루텍 플렉시블 회로기판 테스트용 툴
DE102012209353B4 (de) * 2012-06-04 2018-12-06 Continental Automotive Gmbh Prüfvorrichtung zum Testen einer Flachbaugruppe
JP5797240B2 (ja) * 2013-08-12 2015-10-21 太洋工業株式会社 プリント基板検査装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010237179A (ja) * 2009-03-31 2010-10-21 Dainippon Printing Co Ltd 試験試料装着装置、曲げ強さ試験装置、曲げ強さ試験方法、曲げ強さ試験プログラム及び試験試料

Also Published As

Publication number Publication date
JP2018063169A (ja) 2018-04-19
JP6726077B2 (ja) 2020-07-22
KR101973864B1 (ko) 2019-04-29
CN107949168A (zh) 2018-04-20
KR20180041075A (ko) 2018-04-23

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