CN107926124B - Method for manufacturing insulating layer and multilayer printed circuit board - Google Patents
Method for manufacturing insulating layer and multilayer printed circuit board Download PDFInfo
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- CN107926124B CN107926124B CN201780002758.0A CN201780002758A CN107926124B CN 107926124 B CN107926124 B CN 107926124B CN 201780002758 A CN201780002758 A CN 201780002758A CN 107926124 B CN107926124 B CN 107926124B
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- HBJPJUGOYJOSLR-UHFFFAOYSA-N naphthalene-2,7-diamine Chemical compound C1=CC(N)=CC2=CC(N)=CC=C21 HBJPJUGOYJOSLR-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
- H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a method for manufacturing an insulating layer, which can realize a uniform and fine pattern while improving efficiency in terms of cost and productivity, and can also ensure excellent mechanical characteristics; and a method of manufacturing a multilayer printed circuit board using the insulating layer obtained by the method of manufacturing an insulating layer.
Description
Technical Field
Cross Reference to Related Applications
The present application claims rights based on the rights of korean patent application No. 10-2016-.
The present invention relates to a method for manufacturing an insulating layer and a method for manufacturing a multilayer printed circuit board. More particularly, the present invention relates to a method for manufacturing an insulating layer, which can realize a uniform and fine pattern while improving efficiency in terms of cost and productivity, and can also ensure excellent mechanical characteristics; and a method of manufacturing a multilayer printed circuit board using the insulating layer obtained by the method of manufacturing an insulating layer.
Background
Recent electronic devices are increasingly miniaturized, light-weighted, and highly functionalized. For this reason, as the application field of a build-up PCB (build-up printed circuit board) is rapidly expanded mainly in a small device, the use of a multilayer printed circuit board is rapidly increased.
The multilayer printed circuit board can be three-dimensionally wired by planar wiring. In the field of industrial electronics in particular, multilayer printed circuit boards have improved the degree of integration of functional elements such as Integrated Circuits (ICs) and large scale integrated circuits (LSIs), and are also products that are advantageous in miniaturization, weight saving, high functionalization, integration of structural electrical functional elements, reduction in assembly time, reduction in cost, and the like of electronic devices.
The build-up PCBs used in these application fields must form vias for the connection between the various layers. The through-holes correspond to interlayer electrical connection paths of the multilayer printed circuit board. In the past, through-holes were machined with a mechanical drill, but as the diameter of the hole became smaller due to micro-machining of circuits, a laser machining method appeared instead due to an increase in machining cost caused by mechanical drilling and a limitation of fine hole machining.
In the case of the laser processing method, CO is used2Or a YAG laser drill. However, since the size of the via is determined by laser drilling, for example, at CO2In the case of laser drilling, there is a limitation that it is difficult to manufacture a through-hole having a diameter of 40 μm or less. In addition, there is also a limitation in that a cost burden is large when a large number of through holes must be formed.
Therefore, a method of forming a through hole having a fine diameter at low cost using a photosensitive insulating material has been proposed instead of the above-described laser processing technique. Specifically, as the photosensitive insulating material, a photosensitive insulating film called "a solder resist" capable of forming a fine opening pattern by utilizing photosensitivity can be mentioned.
Such a photosensitive insulating material or a solder resist may be classified into a case of using a sodium carbonate developer and a case of using an additional developer to form a pattern. In the case of using an additional developer, the photosensitive insulating material or the solder resist has a limitation that it is difficult to be applied to a practical process due to environmental and cost reasons.
On the other hand, when a sodium carbonate developer is used, there is an advantage of being environmentally friendly. In this case, in order to impart photosensitivity, an acid-modified acrylate resin containing a large number of carboxylic acid groups and acrylic acid groups is used, but since most of the acrylate groups and the carboxyl groups are linked by ester bonds, a polymerization inhibitor or the like is contained so as to polymerize in an advantageous form, and a photoinitiator or the like is also contained so as to cause radical reaction by ultraviolet light irradiation.
However, a polymerization inhibitor, a photoinitiator, and the like may diffuse to the outside of the resin under high temperature conditions, thereby possibly causing interfacial separation between the insulating layer and the conductive layer during and after the semiconductor packaging process. In addition, ester bonds within the resin cause hydrolysis reaction at high humidity and decrease the crosslinking density of the resin, which results in an increase in the moisture absorption rate of the resin. When the moisture absorption rate is high as described above, a polymerization inhibitor, a photoinitiator, or the like is converted to the outside of the resin under high temperature conditions and causes interfacial separation between the insulating layer and the conductive layer during and after the semiconductor packaging process, and there is a limitation in that HAST characteristics are deteriorated.
Therefore, it is necessary to develop a method for manufacturing an insulating layer: which can realize a uniform and fine pattern at low cost while preventing interfacial separation between an insulating layer and a conductive layer.
Disclosure of Invention
Technical problem
An object of the present invention is to provide a method for manufacturing an insulating layer, which can realize a uniform and fine pattern while improving efficiency in terms of cost and productivity, and can also ensure excellent mechanical characteristics.
It is another object of the present invention to provide a method of manufacturing a multilayer printed circuit board using an insulating layer obtained by the method of manufacturing an insulating layer.
Technical scheme
One embodiment of the present invention provides a method for manufacturing an insulating layer, comprising the steps of: adhering an opposite surface of the metal layer, on one surface of which the carrier film is adhered, to a polymer resin layer comprising an alkali-soluble resin and a heat-curable binder; forming a patterned photosensitive resin layer on the carrier film; removing the carrier film and the metal layer exposed by the patterned photosensitive resin layer to form a patterned metal layer; separating and removing the carrier film from the patterned metal layer;
alkali developing the polymer resin layer exposed by the patterned metal layer; and thermally curing the polymer resin layer after the alkali development.
Another embodiment of the present invention provides a method for manufacturing a multilayer printed circuit board, which includes the step of forming a metal substrate having a pattern formed thereon on an insulating layer obtained by the method for manufacturing an insulating layer.
Hereinafter, a method for manufacturing an insulating layer and a method for manufacturing a multilayer printed circuit board according to embodiments of the present invention will be described in more detail.
In the present specification, examples of the halogen group include fluorine, chlorine, bromine and iodine.
In the present specification, the alkyl group may be linear or branched, and the number of carbon atoms is not particularly limited, but it is preferably 1 to 40. According to one embodiment, the alkyl group has 1 to 20 carbon atoms. According to another embodiment, the alkyl group has 1 to 10 carbon atoms. According to yet another embodiment, the alkyl group has 1 to 6 carbon atoms. Specific examples of the alkyl group include methyl, ethyl, propyl, n-propyl, isopropyl, butyl, n-butyl, isobutyl, tert-butyl, sec-butyl, 1-methyl-butyl, 1-ethyl-butyl, pentyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, hexyl, n-hexyl, 1-methylpentyl, 2-methylpentyl, 4-methyl-2-pentyl, 3-dimethylbutyl, 2-ethylbutyl, heptyl, n-heptyl, 1-methylhexyl, cyclopentylmethyl, cyclohexylmethyl, octyl, n-octyl, tert-octyl, 1-methylheptyl, 2-ethylhexyl, 2-propylpentyl, n-nonyl, 2-dimethylheptyl, 1-ethyl-propyl, 1-dimethyl-propyl, n-nonyl, 2-dimethylheptyl, 1-ethyl-propyl, 1-dimethyl-propyl, n-butyl, Isohexyl, 2-methylpentyl, 4-methylhexyl, 5-methylhexyl, and the like, but are not limited thereto.
In the present specification, the aryl group is not particularly limited, but preferably has 6 to 60 carbon atoms, and may be a monocyclic aryl group or a polycyclic aryl group. According to one embodiment, the aryl group has 6 to 30 carbon atoms. According to another embodiment, the aryl group has 6 to 20 carbon atoms. As the monocyclic aryl group, the aryl group may be phenyl, biphenyl, terphenyl, etc., but is not limited thereto. Examples of polycyclic aromatic groups include naphthyl, anthryl, phenanthryl, pyrenyl, perylenyl, perylene,
A phenyl group, a fluorenyl group, and the like, but are not limited thereto.
According to an embodiment of the present invention, there is provided a method for manufacturing an insulating layer, including the steps of: adhering an opposite surface of the metal layer, on one surface of which the carrier film is adhered, to a polymer resin layer comprising an alkali-soluble resin and a heat-curable binder; forming a patterned photosensitive resin layer on the carrier film; removing the carrier film and the metal layer exposed by the patterned photosensitive resin layer to form a patterned metal layer; separating and removing the carrier film from the patterned metal layer; alkali developing the polymer resin layer exposed by the patterned metal layer; and thermally curing the polymer resin layer after the alkali development.
According to the method for manufacturing an insulating layer of one embodiment, the present inventors found that a patterned metal layer introduced on an alkali-soluble polymer resin layer serves as a mask for alkali-developing the polymer resin layer, the polymer resin layer portion exposed by the metal layer pattern is removed by alkali development, and the polymer resin layer portion not exposed by the metal layer pattern is protected from an alkali developer, and thus, a fine pattern can be formed in the polymer resin layer by a chemical method.
It has also been found through experiments that an insulating layer formed with a fine pattern by the above method can be rapidly formed at low cost compared to an insulating layer manufactured by laser processing, and the final insulating layer manufactured can realize excellent physical characteristics. The present invention has been developed based on such findings.
In addition, since the finally manufactured insulating layer contains a cured product of a heat-curable resin that is a non-photosensitive insulating material, the content of a photoinitiator or polymerization inhibitor is greatly reduced or it is possible to use no same at all, as compared with the case of manufacturing an insulating layer using a conventional photosensitive insulating material. This makes it possible to manufacture an insulating layer having excellent mechanical characteristics, for example, interfacial separation characteristics between the insulating layer and the conductive layer, which may be caused by a photoinitiator or a polymerization inhibitor, are reduced.
In particular, in the method for manufacturing an insulating layer of this embodiment, when a metal layer is introduced as a mask on a polymer resin layer, since this process is performed with the support film adhered to the metal layer, not only can the metal layer be easily laminated by the support film, but also the support film can be simultaneously removed by the same etchant as the metal layer. Therefore, the metal layer can be easily etched even in a state where the carrier film is adhered.
In addition, in order to form a pattern on the carrier film and the metal layer, the photosensitive resin layer introduced on the carrier film can be easily removed by physical peeling between the carrier film and the metal layer. Therefore, even if a separate stripping liquid treatment is not used to remove the photosensitive resin layer, it is advantageous in terms of process efficiency.
In addition, since the alkali-soluble resin used in the method for manufacturing an insulating layer of one embodiment includes both a characteristic cyclic imide functional group substituted with an amino group and an acidic functional group in a molecular structure, alkali solubility can be achieved by the acidic functional group, and curing density can be increased by a typical cyclic imide functional group substituted with an amino group when reacting with a heat-curable binder, thereby improving heat-resistant reliability and mechanical characteristics, and also improving adhesion at another interface.
Thus, the polymer resin layer including the alkali-soluble resin may have improved interfacial adhesion with the metal layer laminated on the upper side, and in particular, may have adhesion greater than interfacial adhesion between the metal layer and the carrier film laminated on the upper portion of the metal layer. Thus, as described later, physical peeling between the carrier film and the metal layer is possible.
Specifically, the method for manufacturing the insulating layer may include the steps of: adhering an opposite surface of the metal layer, on one surface of which the carrier film is adhered, to a polymer resin layer comprising an alkali-soluble resin and a heat-curable binder; forming a patterned photosensitive resin layer on a carrier film; removing the carrier film and the metal layer exposed by the patterned photosensitive resin layer to form a patterned metal layer; separating and removing the carrier film from the patterned metal layer; alkali developing the polymer resin layer exposed by the patterned metal layer; and thermally curing the polymer resin layer after the alkali development.
Details of the respective steps will be described below.
Adhering the opposite surface of the metal layer having the support film adhered to one surface thereof to a substrate comprising an alkali-soluble resin and a metal oxide
Step of thermally curing the polymer resin layer of the binder
In the step of adhering the opposite surface of the metal layer, on one surface of which the support film is adhered, to the polymer resin layer including the alkali-soluble resin and the heat-curable binder, the polymer resin layer means a film formed by drying the polymer resin composition including the alkali-soluble resin and the heat-curable binder.
The polymer resin layer may be present alone, or may be present in a state of being formed on a substrate (e.g., a circuit board, a sheet, a multilayer printed wiring board, etc.) containing a semiconductor material. Examples of the method of forming the polymer resin layer on the substrate are not particularly limited, but for example, a method in which the polymer resin composition is directly coated on the substrate, or a method in which the polymer resin composition is coated on the carrier film or the metal layer on which the carrier film is adhered and then laminated with the substrate, or the like may be used.
Further, examples of a method of adhering the opposite surface of the metal layer, on one surface of which the support film is adhered, to the polymer resin layer comprising the alkali-soluble resin and the heat-curable binder may include a method of: a polymer resin composition comprising an alkali-soluble resin and a heat-curable binder is coated on one surface thereof on the opposite surface of the metal layer to which the support film is adhered, and the coating is dried.
The polymer resin layer may include an alkali-soluble resin and a heat-curable binder.
The polymer resin layer may include a heat-curable binder in an amount of 1 to 150 parts by weight, 10 to 100 parts by weight, or 20 to 50 parts by weight, based on 100 parts by weight of the alkali-soluble resin. When the content of the heat-curable binder is too high, the developability of the polymer resin layer is deteriorated and the strength may be reduced. In contrast, when the content of the heat-curable binder is too low, not only the polymer resin layer is excessively developed, but also coating uniformity may be reduced.
The heat curable adhesive may comprise an epoxy group; and is selected from the group consisting of a thermally curable functional group, an oxetanyl group, a cyclic ether group, a cyclic thioether group, a cyanide group, a maleimide group and a benzo group
At least one functional group in the oxazine group. That is, the heat-curable adhesive must contain an epoxy group and be ring-removedIn addition to the oxygen radical, it may also contain oxetanyl, cyclic ether, cyclic thioether, cyanide, maleimide, benzo
An oxazine group, or a mixture of two or more thereof. Such a heat-curable binder can form a cross-linking bond with an alkali-soluble resin or the like by heat curing, thereby ensuring heat resistance or mechanical properties of the insulating layer.
More specifically, as the heat-curable binder, a polyfunctional resin compound containing two or more of the above-described functional groups in the molecule can be used.
The polyfunctional resin compound may include a resin containing two or more cyclic ether groups and/or cyclic thioether groups (hereinafter referred to as cyclic (thio) ether groups) in the molecule.
The heat-curable binder containing two or more cyclic (thio) ether groups in the molecule may be a compound having two or more selected from any one or two of 3-, 4-, or 5-membered cyclic ether groups or cyclic thioether groups in the molecule.
Examples of the compound having two or more cyclic sulfide groups in the molecule include bisphenol a type cyclic sulfide resin YL 7000 manufactured by Japan epoxy resins co.
In addition, the polyfunctional resin compound may include a polyfunctional epoxy compound having at least two or more epoxy groups in the molecule, a polyfunctional oxetane compound having at least two or more oxetanyl groups in the molecule, or an episulfide resin having at least two or more sulfide groups, a polyfunctional cyanate ester compound having at least two or more cyanide groups in the molecule, or a polyfunctional cyanate ester compound having at least two or more benzo groups in the molecule
Multifunctional benzo of oxazine groups
Oxazine compounds, and the like.
Specific examples of the polyfunctional epoxy compound may include bisphenol A type epoxy resins, hydrogenated bisphenol A type epoxy resins, brominated bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, novolac type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, N-glycidyl epoxy resins, bisphenol A novolac epoxy resins, biphenol epoxy resins, biphenol epoxy resin, chelate epoxy resin, glyoxal epoxy resin, amino group-containing epoxy resin, rubber-modified epoxy resin, dicyclopentadiene phenol epoxy resin, diglycidyl phthalate resin, heterocyclic epoxy resin, tetraglycidyl xylenol-ethane resin, silicone-modified epoxy resin, epsilon-caprolactone-modified epoxy resin, and the like. Further, in order to impart flame retardancy, a compound having a structure in which an atom such as phosphorus is introduced may be used. These epoxy resins can improve characteristics such as adhesion of the cured coating film, solder heat resistance, electroless plating resistance, and the like by thermal curing.
Examples of the polyfunctional oxetane compound may include polyfunctional oxetanes such as bis [ (3-methyl-3-oxetanylmethoxy) methyl ] ether, bis [ (3-ethyl-3-oxetanylmethoxy) methyl ] ether, 1, 4-bis [ (3-methyl-3-oxetanylmethoxy) methyl ] benzene, 1, 4-bis [ (3-ethyl-3-oxetanylmethoxy) methyl ] benzene, (3-methyl-3-oxetanyl) methyl acrylate, (3-ethyl-3-oxetanyl) methyl acrylate, (3-methyl-3-oxetanyl) methyl methacrylate, (3-ethyl-3-oxetanyl) methyl methacrylate, methyl methacrylate, And oligomers or copolymers thereof, and may include, in addition thereto, etherification products of oxetanols with hydroxyl-containing resins such as novolak resins, poly (p-hydroxystyrene), cardo-type bisphenols, calixarenes, silsesquioxanes, and the like. In addition, a copolymer of an unsaturated monomer having an oxetane ring and an alkyl (meth) acrylate may be included.
Examples of the polyfunctional cyanate ester compound may include bisphenol a type cyanate ester resin, bisphenol E type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol S type cyanate ester resin, bisphenol M type cyanate ester resin, novolac type cyanate ester resin, phenol novolac type cyanate ester resin, cresol novolac type cyanate ester resin, bisphenol a novolac type cyanate ester resin, biphenol type cyanate ester resin, oligomers or copolymers thereof, and the like.
Examples of the polyfunctional maleimide compound may include 4,4' -diphenylmethane bismaleimide, phenylmethane bismaleimide, m-phenylmethane bismaleimide, bisphenol a diphenylether bismaleimide, 3' -dimethyl-5, 5' -diethyl-4, 4' -diphenylmethane bismaleimide, 4-methyl-1, 3-phenylene bismaleimide, 1,6' -bismaleimide- (2,2, 4-trimethyl) hexane, and the like.
Multifunctional benzo
Examples of the oxazine compound may include bisphenol A type benzo
Oxazine resin, bisphenol F-type benzo
Oxazine resin, phenolphthalein type benzo
Oxazine resin, thiodiphenol type benzo
Oxazine resin, dicyclopentadiene type benzo
Oxazine resin, 3- (methylene-1, 4-diphenylene) bis (3, 4-dihydro-2H-1, 3-benzo
Oxazine) resins, and the like.
More specific examples of the polyfunctional resin compound may include YDCN-500-80P(Kukdo chemical Co. Ltd.), phenol novolak type cyanide ester resin PT-30S (Lonza Ltd.), phenylmethane type maleimide resin BMI-2300(Daiwa Kasei Co. Ltd.), Pd type benzo
Oxazine resins (Shikoku Chemicals), and the like.
Meanwhile, the alkali-soluble resin may include at least one or more or two or more selected from the group consisting of an acidic functional group and an amino-substituted cyclic imide functional group. Examples of acidic functional groups may include, but are not limited to, carboxyl or phenolic groups. The alkali soluble resin includes at least one or more or two or more acidic functional groups so that the polymer resin layer exhibits higher alkali development characteristics and the development rate of the polymer resin layer can be controlled.
The amino-substituted cyclic imide functional group contains an amino group and a cyclic imide group in the structure of the functional group, and may contain at least one or more of them or two or more of them. Since the alkali-soluble resin includes at least one or more or two or more amino-substituted cyclic imide functional groups, the alkali-soluble resin has a structure in which a large number of active hydrogens contained in the amino groups are present. Therefore, while reactivity with the heat-curable binder during heat curing is improved, curing density can be increased, thereby improving heat-resistant reliability and mechanical characteristics.
In addition, since a large amount of cyclic imide functional groups are present in the alkali-soluble resin, the polarity is increased due to carbonyl groups and tertiary amine groups contained in the cyclic imide functional groups, so that the interfacial adhesion of the alkali-soluble resin may be increased. Thus, the polymer resin layer including the alkali-soluble resin may have increased interfacial adhesion with the metal layer laminated on the upper side, and in particular, may have greater adhesion than interfacial adhesion between the metal layer and the carrier film laminated on the upper portion of the metal layer. Thus, as described later, physical peeling between the carrier film and the metal layer is possible.
More specifically, the amino-substituted cyclic imide functional group may include a functional group represented by the following chemical formula 1.
[ chemical formula 1]
In chemical formula 1, R1Is an alkylene or alkenyl group having 1 to 10 carbon atoms, 1 to 5 carbon atoms or 1 to 3 carbon atoms, and ". dot" means a bonding site. Alkylene is a divalent functional group derived from an alkane, such as a linear, branched, or cyclic group, and includes methylene, ethylene, propylene, isobutylene, sec-butyl, tert-butyl, pentylene, hexylene, and the like. One or more hydrogen atoms contained in the alkylene group may be substituted with another substituent, and examples of the additional substituent include an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, an aryl group having 6 to 12 carbon atoms, a heteroaryl group having 2 to 12 carbon atoms, an arylalkyl group having 6 to 12 carbon atoms, a halogen atom, a cyano group, an amino group, an amidino group, a nitro group, an amido group, a carbonyl group, a hydroxyl group, a sulfonyl group, a carbamate group, an alkoxy group having 1 to 10 carbon atoms, and the like.
The term "substituted" as used herein means that another functional group is bonded in the compound in place of a hydrogen atom, and the substitution position is not limited as long as it is a position in place of a hydrogen atom (i.e., a position in which a substituent can be substituted). When two or more substituents are substituted, the two or more substituents may be the same as or different from each other.
Alkenyl means that the above-mentioned alkylene group contains at least one carbon-carbon double bond in the middle or at the terminal thereof, and examples thereof include ethylene, propylene, butene, hexene, acetylene and the like. One or more hydrogen atoms in the alkenyl group may be substituted with a substituent in the same manner as in the alkylene group.
Preferably, the amino-substituted cyclic imide functional group may be a functional group represented by the following chemical formula 2.
[ chemical formula 2]
In chemical formula 2, "+" means a bonding site.
As described above, the alkali-soluble resin contains an amino-substituted cyclic imide functional group and an acidic functional group. Specifically, the acidic functional group may be bonded to at least one terminal of the amino-substituted cyclic imide functional group. In this case, the amino-substituted cyclic imide functional group and the acidic functional group may be bonded through a substituted or unsubstituted alkylene group or a substituted or unsubstituted arylene group. For example, the acidic functional group may be bonded to the terminal of the amino group contained in the amino-substituted imide functional group through a substituted or unsubstituted alkylene group or a substituted or unsubstituted arylene group. The acidic functional group may be bonded to the terminal of the cyclic imide functional group contained in the amino-substituted imide functional group through a substituted or unsubstituted alkylene group or a substituted or unsubstituted arylene group.
More specifically, the end of the amino group contained in the amino-substituted cyclic imide functional group means a nitrogen atom contained in the amino group in chemical formula 1, and the end of the imide functional group contained in the amino-substituted cyclic imide functional group means a nitrogen atom contained in the cyclic imide functional group in chemical formula 1.
Alkylene is a divalent functional group derived from an alkane, such as a linear, branched, or cyclic group, and includes methylene, ethylene, propylene, isobutylene, sec-butyl, tert-butyl, pentylene, hexylene, and the like. One or more hydrogen atoms contained in the alkylene group may be substituted with another substituent, and examples of the additional substituent include an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, an aryl group having 6 to 12 carbon atoms, a heteroaryl group having 2 to 12 carbon atoms, an arylalkyl group having 6 to 12 carbon atoms, a halogen atom, a cyano group, an amino group, an amidino group, a nitro group, an amido group, a carbonyl group, a hydroxyl group, a sulfonyl group, a carbamate group, an alkoxy group having 1 to 10 carbon atoms, and the like.
Arylene means a divalent functional group derived from aromatic hydrocarbons, such as a cyclic group, and may include phenyl, naphthyl, and the like. One or more hydrogen atoms contained in the arylene group may be substituted with another substituent. Examples of the substituent include an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, an aryl group having 6 to 12 carbon atoms, a heteroaryl group having 2 to 12 carbon atoms, an arylalkyl group having 6 to 12 carbon atoms, a halogen atom, a cyano group, an amino group, an amidino group, a nitro group, an amide group, a carbonyl group, a hydroxyl group, a sulfonyl group, a carbamate group, an alkoxy group having 1 to 10 carbon atoms, and the like.
Examples of the method for producing the alkali-soluble resin are not particularly limited, but, for example, the alkali-soluble resin may be produced by the reaction of a cyclic unsaturated imide compound and an amine compound. In this case, at least one of the cyclic unsaturated imide compound and the amine compound may include an acidic functional group substituted at a terminal thereof. That is, the acidic functional group may be substituted at the terminal of the cyclic unsaturated imide compound, the amine compound, or both of these compounds. Details of the acidic functional groups are as described above.
The cyclic imide compound is a compound containing the above-mentioned cyclic imide functional group, and the cyclic unsaturated imide compound means a compound containing at least one unsaturated bond (i.e., double bond or triple bond) in the cyclic imide compound.
The alkali-soluble resin may be generated by a reaction of an amino group included in the amine compound and a double bond or a triple bond included in the cyclic unsaturated imide compound.
Examples of the weight ratio of the cyclic unsaturated imide compound to the amine compound to be reacted are not particularly limited, but for example, the amine compound may be reacted by mixing in an amount of 10 parts by weight to 80 parts by weight or 30 parts by weight to 60 parts by weight, based on 100 parts by weight of the cyclic unsaturated imide compound.
Examples of the cyclic unsaturated imide compound include N-substituted maleimide compounds. The term "N-substituted" means that a functional group is bonded to a nitrogen atom contained in the maleimide compound in place of a hydrogen atom, and the N-substituted maleimide compound may be classified into a monofunctional N-substituted maleimide compound and a multifunctional N-substituted maleimide compound according to the number of N-substituted maleimide compounds.
The monofunctional N-substituted maleimide compound is a compound in which a nitrogen atom contained in one maleimide compound is substituted with a functional group, and the polyfunctional N-substituted maleimide compound is a compound in which nitrogen atoms contained in each of two or more maleimide compounds are bonded through a functional group.
In the monofunctional N-substituted maleimide compound, the functional group substituted on the nitrogen atom contained in the maleimide compound may include, but is not limited to, various known aliphatic, alicyclic or aromatic functional groups, and the functional group substituted on the nitrogen atom may include a functional group in which the aliphatic, alicyclic or aromatic functional group is substituted with an acidic functional group. Details of the acidic functional groups are as described above.
Specific examples of the monofunctional N-substituted maleimide compound include o-tolylmaleimide, p-hydroxyphenylmaleimide, p-carboxyphenylmaleimide, dodecylmaleimide and the like.
In the polyfunctional N-substituted maleimide compound, the functional group interposed between the nitrogen-nitrogen bonds contained in each of the two or more maleimide compounds may include, but is not limited to, various known aliphatic, alicyclic or aromatic functional groups. In specific examples, a 4,4' -diphenylmethane functional group, or the like, may be used. The functional group substituted on the nitrogen atom may include a functional group in which an aliphatic, alicyclic or aromatic functional group is substituted with an acidic functional group. Details of the acidic functional groups are as described above.
Specific examples of multifunctional N-substituted maleimide compounds include 4,4' -diphenylmethane bismaleimide (BMI-1000, BMI-1100, etc., available from Daiwakasei Industry Co., Ltd.), phenylmethane bismaleimide, m-phenylene methane bismaleimide, bisphenol A diphenyl ether bismaleimide, 3' -dimethyl-5, 5' -diethyl-4, 4' -diphenylmethane bismaleimide, 4-methyl-1, 3-phenylene bismaleimide, 1,6' -bismaleimide- (2,2, 4-trimethyl) hexane, and the like.
The amine compound may be one containing at least one amino group (-NH) in the molecular structure2) The primary amine compound of (1). More preferably, an amino-substituted carboxylic acid compound, a polyfunctional amine compound containing at least two amine groups, or a mixture thereof may be used.
Among the amino-substituted carboxylic acid compounds, the carboxylic acid compound is a compound containing a carboxylic acid (-COOH) functional group in the molecule, and may include all aliphatic, alicyclic and aromatic carboxylic acids according to the kind of hydrocarbon bonded to the carboxylic acid functional group. Since a large number of carboxylic acid functional groups, which are acidic functional groups, are included in the alkali-soluble resin by the amino-substituted carboxylic acid compound, the developability of the alkali-soluble resin can be improved.
The term "substitution" means that another functional group is bonded in the compound in place of a hydrogen atom, and the position of substitution of an amino group in the carboxylic acid compound is not limited as long as it is a position substituting a hydrogen atom. The number of amino groups to be substituted may be 1 or more.
Specific examples of the amino-substituted carboxylic acid compound include 20 kinds of α -amino acids, 4-aminobutyric acid, 5-aminopentanoic acid, 6-aminocaproic acid, 7-aminoheptanoic acid, 8-aminocaprylic acid, 4-aminobenzoic acid, 4-aminophenylacetic acid, 4-aminocyclohexanecarboxylic acid and the like, which are known as raw materials of proteins.
In addition, the polyfunctional amine compound containing two or more amino groups may be a compound containing at least two amino groups (-NH) in the molecule2) And may include all aliphatic, alicyclic and aromatic polyfunctional amines, depending on the kind of the hydrocarbon bonded to the amino group. The flexibility, toughness, adhesion to a copper foil, and the like of the alkali-soluble resin may be improved by the polyfunctional amine compound including at least two amino groups.
Specific examples of the polyfunctional amine compound containing two or more amino groups include 1, 3-cyclohexanediamine, 1, 4-cyclohexaneDiamine, 1, 3-bis (aminomethyl) -cyclohexane, 1, 4-bis (aminomethyl) -cyclohexane, bis (aminomethyl) -norbornene, octahydro-4, 7-methylenebisindan-1 (2), 5- (6) -dimethylamine (5- (6) -dimethanamine), 4 '-methylenebis (cyclohexylamine), 4' -methylenebis (2-methylcyclohexylamine), isophoronediamine, 1, 3-phenylenediamine, 1, 4-phenylenediamine, 2, 5-dimethyl-1, 4-phenylenediamine, 2,3,5, 6-tetramethyl-1, 4-phenylenediamine, 2,4,5, 6-tetrafluoro-1, 3-phenylenediamine, 2,3,5, 6-tetrafluoro-1, 4-phenylenediamine, 4, 6-diaminoresorcinol, 2, 5-diamino-1, 4-benzenedithiol, 3-aminobenzylamine, 4-aminobenzylamine, m-xylylenediamine, p-xylylenediamine, 1, 5-diaminobenzidine, 2, 7-diaminonaphthalene, 2, 6-diaminodiphenyl-2, 5-diaminodiphenyl-1, 4-diaminodiphenyl-2, 4-diaminodiphenyl-amine, 3-diaminodiphenyl-4-diaminobenzidine, 2 '-bis (3, 4' -diaminodiphenyl-3, 4 '-bis (3, 4' -di-aminophenyl) -aniline, 3,4 '-bis (3, 4' -bis (3 '-chloro-phenyl) -1, 4' -diaminodiphenyl-3 '-bis (2, 4-bis (3, 4-bis) aniline), 2, 4-bis (3' -tetrafluoro-2, 4-bis (3 '-bis (3-chloro-phenyl) -aniline), 2, 4-bis (3-phenyl) -aniline), 2, 4-bis (3' -bis (4-chloro-phenyl) -aniline), 2, 4-bis (4-phenyl) -2, 4-phenyl) -aniline), 2, 4-bis (3-bis (4-chloro-bis (3-2, 4-bis (4-chloro-phenyl) aniline), 2, 4-bis (3-phenyl) aniline), 2, 4-bis (3-chloro-phenyl) aniline), 2, 4-bis (3-phenyl) aniline), 2, 4-bis (3-2, 4-bis (3-chloro-phenyl) aniline]Benzene, 1' -bis (4-aminophenyl) -cyclohexane, 9' -bis (4-aminophenyl) -fluorene, 9' -bis (4-amino-3-chlorophenyl) fluorene, 9' -bis (4-amino-3-fluorophenyl) fluorene, 9' -bis (4-amino-3-methylphenyl) fluorene, 3,4' -diaminodiphenyl ether, 4' -diaminodiphenyl ether, 1, 3-bis (3-aminophenoxy) -benzene, 1, 3-bis (4-aminophenoxy) -benzene, 1, 4-bis (4-amino-2-trifluoromethylphenoxy) -benzene, toluene, xylene, 4,4 '-bis (4-aminophenoxy) -biphenyl, 2' -bis [4- (4-aminophenoxy) -phenyl]Propane, 2' -bis [4- (4-aminophenoxy) -phenyl]Hexafluoropropane, bis (2-aminophenyl)) Thioether, bis (4-aminophenyl) thioether, bis (3-aminophenyl) sulfone, bis (4-aminophenyl) sulfone, bis (3-amino-4-hydroxy) sulfone, bis [4- (3-aminophenoxy) -phenyl ] -sulfone]Sulfone, bis [4- (4-aminophenoxy) -phenyl]Sulfones, o-tolidine sulfones, 3, 6-diaminocarbazole, 1,3, 5-tris (4-aminophenyl) -benzene, 1, 3-bis (3-aminopropyl) -tetramethyldisiloxane, 4' -diaminobenzanilide, 2- (3-aminophenyl) -5-aminobenzimidazole, 2- (4-aminophenyl) -5-aminobenzimidazole
Oxazole, 1- (4-aminophenyl) -2, 3-dihydro-1, 3, 3-trimethyl-1H-indene-5-amine, 4, 6-diaminoresorcinol, 2,3,5, 6-pyridylamine, polyfunctional amines containing a Shin-Etsu Silicone siloxane structure (PAM-E, KF-8010, X-22-161A, X-22-161B, KF-8012, KF-8008, X-22-1660B-3, X-22-9409), polyfunctional amines containing a Dow Corning siloxane structure (Dow Corning 3055), polyfunctional amines containing a polyether structure (Huntsman, BASF) and the like.
In addition, the alkali-soluble resin may include at least one repeating unit represented by the following chemical formula 3 and at least one repeating unit represented by the following chemical formula 4.
[ chemical formula 3]
In chemical formula 3, R2Is a direct bond, an alkylene group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms or an arylene group having 6 to 20 carbon atoms, and ". dot" means a bonding site.
[ chemical formula 4]
In chemical formula 4, R3Is a direct bond, alkylene having 1 to 20 carbon atoms, alkenyl having 1 to 20 carbon atoms or arylene having 6 to 20 carbon atoms, R4is-H, -OH, -NR5R6Halogen or utensilAlkyl having 1 to 20 carbon atoms, R5And R6May each independently be hydrogen, an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms, and ". dot" means a bonding site.
Preferably, in formula 3, R2Is phenylene, in formula 4, R3Is phenylene and R4May be-OH.
Meanwhile, the alkali-soluble resin may include a vinyl-based repeating unit in addition to the repeating unit represented by chemical formula 3 and the repeating unit represented by chemical formula 4. The vinyl-based repeating unit is a repeating unit contained in a homopolymer of a vinyl-based monomer containing at least one or more vinyl groups in a molecule, and examples of the vinyl-based monomer may include, but are not limited to, ethylene, propylene, isobutylene, butadiene, styrene, acrylic acid, methacrylic acid, maleic anhydride, maleimide, and the like.
The alkali-soluble resin including at least one repeating unit represented by the above chemical formula 3 and at least one repeating unit represented by the above chemical formula 4 may be produced by reacting a polymer including a repeating unit represented by the following chemical formula 5, an amine represented by the following chemical formula 6, and an amine represented by the following chemical formula 7.
[ chemical formula 5]
[ chemical formula 6]
[ chemical formula 7]
In chemical formulas 5 to 7, R2To R4The same as described above in chemical formulas 3 and 4, and ". star" means a bonding site.
Specific examples of the polymer including the repeating unit represented by Chemical formula 5 may include, but are not limited to, sma (crayvalley), xiran (polyscope), scripset (solenis), isobam (kuraray), polyanhydride resin (chevron phillips Chemical Company), maldene (lindau chemicals), and the like.
In addition, the alkali-soluble resin including at least one repeating unit represented by the above chemical formula 3 and at least one repeating unit represented by the above chemical formula 4 may be produced by reacting a compound represented by the following chemical formula 8 and a compound represented by the following chemical formula 9.
[ chemical formula 8]
[ chemical formula 9]
In chemical formulas 8 and 9, R2To R4The same as described above in chemical formulas 3 and 4.
Further, the alkali-soluble resin may be a well-known conventional carboxyl group-containing resin or phenol group-containing resin containing a carboxyl group or a phenol group in its molecule. Preferably, a carboxyl group-containing resin or a mixture of a carboxyl group-containing resin and a phenol group-containing resin may be used.
Examples of the carboxyl group-containing resin include the resins listed in the following (1) to (7), but are not limited thereto.
(1) Carboxyl group-containing resins obtained by reacting a polyfunctional epoxy resin with a saturated or unsaturated monocarboxylic acid, followed by reaction with a polybasic acid anhydride,
(2) carboxyl group-containing resins obtained by reacting a bifunctional epoxy resin with a bifunctional phenol and/or dicarboxylic acid, followed by reaction with a polybasic acid anhydride,
(3) a carboxyl group-containing resin obtained by reacting a polyfunctional phenol resin with a compound having 1 epoxy group in the molecule, followed by reaction with a polybasic acid anhydride,
(4) a carboxyl group-containing resin obtained by reacting a compound having two or more alcoholic hydroxyl groups in the molecule with a polybasic acid anhydride,
(5) a polyamic acid resin obtained by reacting a diamine and a dianhydride resin, or a copolymer of a polyamic acid resin,
(6) polyacrylic resins obtained by reaction with acrylic acid, or copolymers of polyacrylic resins,
(7) resins prepared by ring opening maleic anhydride resins by reaction of maleic anhydride and anhydride of maleic anhydride copolymers with weak acids, diamines, imidazoles or dimethyl sulfoxide.
More specific examples of the carboxyl group-containing resin include CCR-1291H (Nippon Kayaku), SHA-1216CA60(Shin-AT & C), Noverite K-700(Lubrizol), or a mixture of two or more thereof.
Examples of the phenol group-containing resin are not particularly limited, but, for example, a novolac resin such as phenol novolac resin, cresol novolac resin, bisphenol f (bpf) novolac resin; or a bisphenol a based resin such as 4,4' - (1- (4- (2- (4-hydroxyphenyl) propan-2-yl) phenyl) ethane-1, 1-diyl) diphenol.
The polymer resin layer may further include at least one additive selected from the group consisting of a thermal curing catalyst, an inorganic filler, a leveling agent, a dispersant, a release agent, and a metal adhesion promoter.
An example of a method of measuring the acid value of an alkali-soluble resin, which may be from 50mgKOH/g to 250mgKOH/g or from 70mgKOH/g to 200mgKOH/g, as determined by KOH titration, is not particularly limited, but, for example, a method of preparing a KOH solution (solvent: methanol) having a concentration of 0.1N as an alkali solution, preparing α -naphthol benzyl alcohol (pH: 0.8 to 8.2 yellow, 10.0 blue-green) as an indicator, then, collecting about 1g to 2g of an alkali-soluble resin as a sample and dissolving in 50g of Dimethylformamide (DMF) solvent to which the indicator is added, and then titrating with the alkali solvent, the acid value is determined in units of mg KOH/g using the amount of the alkali solvent used when properly completed, may be used.
When the acid value of the alkali-soluble resin is excessively reduced to less than 50mgKOH/g, the development characteristics of the alkali-soluble resin are reduced, thereby making it difficult to perform a development process. In addition, when the acid value of the alkali-soluble resin is excessively increased to more than 250mgKOH/g, phase separation from other resins may occur due to the increase in polarity.
The heat curing catalyst is used to promote heat curing of the heat curable binder. Examples of the heat curing catalyst include imidazole derivatives such as imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole and 1- (2-cyanoethyl) -2-ethyl-4-methylimidazole; amine compounds such as dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N-dimethylbenzylamine and 4-methyl-N, N-dimethylbenzylamine; hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide; phosphorus compounds, such as triphenylphosphine; and so on. Examples of commercially available products include 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ and 2P4MHZ (product name of imidazole compound) manufactured by Shikoku Chemicals Corporation; U-CAT3503N and UCAT3502T (product name of blocked isocyanate compound of dimethylamine), manufactured by San-Apro Ltd., and DBU, DBN, U-CATS A102, U-CAT5002 (bicyclic amidine compound and salt thereof). However, the heat curing catalyst is not limited to these, and may be a heat curing catalyst for an epoxy resin or an oxetane compound, or a compound that accelerates the reaction of an epoxy group and/or an oxetane group with a carboxyl group. These catalysts may be used alone or as a mixture of two or more. Further, S-triazine derivatives such as guanamine, acetoguanamine, benzoguanamine, melamine, 2, 4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-4, 6-diamino-S-triazine-isocyanuric acid adduct, 2, 4-diamino-6-methacryloyloxyethyl-S-triazine-isocyanuric acid adduct, and the like can be used. Preferably, a compound which also functions as these adhesion-imparting agents may be used in combination with a heat curing catalyst.
Examples of inorganic fillers include silica, barium sulfate, barium titanate, talc, clay, magnesium carbonate, calcium carbonate, alumina, aluminum hydroxide, mica, or a mixture of two or more thereof.
The content of the inorganic filler is not particularly limited. However, in order to achieve high rigidity of the polymer resin layer, the inorganic filler may be added in an amount of 100 parts by weight or more, 100 parts by weight to 600 parts by weight, 150 parts by weight to 500 parts by weight, or 200 parts by weight to 500 parts by weight, based on 100 parts by weight of the entire resin components contained in the polymer resin layer.
Examples of the release agent include polyolefin waxes such as low molecular weight polypropylene and low molecular weight polyethylene, ester wax, carnauba wax, paraffin wax, and the like.
The metal adhesion promoter may be a material that does not cause surface deterioration or transparency problems of the metal material, for example, a silane coupling agent, an organometallic coupling agent, and the like.
Leveling agents are used to remove protrusions or depressions on the surface during film coating, for example, BYK-380N, BYK-307, BYK-378, BYK-350, and the like available from BYK-Chemie GmbH can be used.
Further, the polymer resin layer may further contain a resin or elastomer having a molecular weight of 5000 or more, which is capable of causing phase separation. Thereby, the cured product of the polymer resin layer can be subjected to the roughening treatment. Examples of the method of determining the molecular weight of the resin or elastomer having a molecular weight of 5000 or more are not particularly limited, and for example, it means a weight average molecular weight measured by GPC (gel permeation chromatography) in terms of polystyrene. In the determination of the weight average molecular weight from polystyrene by GPC, a conventionally known analytical apparatus, a detector such as a differential refractive index detector, and an analytical column can be used. The conditions of temperature, solvent and flow rate that are generally applied may be used. Specific examples of the measurement conditions include a temperature of 30 ℃, Tetrahydrofuran (THF), and a flow rate of 1 mL/min.
In addition, in order to impart photocurable characteristics to the polymer resin layer, the polymer resin layer may further include a heat-curable binder containing a photoreactive unsaturated group or an alkali-soluble resin containing a photoreactive unsaturated group and a photoinitiator. Specific examples of the heat-curable binder containing a photoreactive unsaturated group or the alkali-soluble resin containing a photoreactive unsaturated group and a photoinitiator are not particularly limited, and various compounds used in the technical field related to the photocurable resin composition may be used without limitation.
On the other hand, the opposite surface of the one surface of the metal layer on which the carrier film is adhered may be adhered to the polymer resin layer. Examples of the metal contained in the metal layer include: metals such as gold, silver, copper, tin, nickel, aluminum, and titanium; and alloys comprising mixtures of two or more of these metals. The thickness of the metal layer may be 10nm to 10 μm. If the thickness of the metal layer is excessively increased to more than 10 μm, an excessive amount of metal is required to form the metal layer, thereby increasing raw material costs and reducing economic efficiency.
A carrier film may be adhered to one surface of the metal layer. The carrier film may be adhered to one surface of the metal layer to prevent direct contact with the surface of the metal layer in a process such as moving or adhering the metal layer, and after the metal layer is adhered, the carrier film may be easily removed because physical peeling is possible. Specific examples of the support film are not particularly limited, and for example, various organic materials and inorganic materials such as polymers, metals, and rubbers may be applied. In one embodiment, the same material as the metal layer can preferably be used as the material of the carrier film. Thus, as described below, the carrier film and the metal layer may be etched simultaneously by the same etchant to form a pattern.
On the other hand, the opposite surface of the one surface of the metal layer on which the carrier film is adhered may be adhered to the polymer resin layer. The opposite surface of one surface of the metal layer means a surface parallel to and facing one surface of the metal layer. When the opposite surface of one surface of the metal layer on which the carrier film is adhered to the polymer resin layer, a structure in which a metal is laminated on the polymer resin layer and the carrier film is sequentially laminated on the metal layer may be formed.
In this case, since the adhesive force between the carrier film and the metal layer may be smaller than the adhesive force between the polymer resin layer and the metal layer, peeling of the polymer resin layer and the metal layer during physical peeling of the carrier film and the metal layer may be prevented, as described later. When the adhesive force between the polymer resin layer and the metal layer is smaller than the adhesive force between the carrier film and the metal layer, the polymer resin layer and the metal layer are peeled off during physical peeling of the carrier film and the metal layer, so it may be difficult to form a fine pattern on the polymer resin layer.
Step of forming a patterned photosensitive resin layer on a carrier film
The photosensitive resin layer may be laminated on the carrier film in a state where a pattern is formed, or may be patterned after lamination, but more preferably, a pattern may be formed after lamination on the carrier film.
Examples of the photosensitive resin layer may include a photosensitive Dry Film Resist (DFR) and the like, which is alkali-soluble or non-thermosetting.
The step of forming a patterned photosensitive resin layer on the support film may include exposing and alkali developing the photosensitive resin layer formed on the support film. In this case, the photosensitive resin layer may be used as a protective layer of the carrier film, or as a patterned mask.
In the step of forming the patterned photosensitive resin layer on the carrier film, the thickness of the photosensitive resin layer formed on the carrier film may be 1 μm to 500 μm, 3 μm to 200 μm, 1 μm to 60 μm, or 5 μm to 30 μm. When the thickness of the photosensitive resin layer is excessively increased, the resolution of the polymer resin layer may be decreased.
In the step of exposing and alkali developing the photosensitive resin layer formed on the support film, examples of a method of forming the photosensitive resin layer on the support film are not particularly limited, and for example, a method of laminating a film-like photosensitive resin such as a photosensitive dry film resist on the support film, or a method of coating a photosensitive resin composition on the support film by spraying or dipping and press-coating the film, or the like can be used.
In the step of exposing and alkali developing the photosensitive resin layer formed on the support film, examples of the method of exposing and alkali developing the photosensitive resin layer are not particularly limited, but for example, may beThe exposure is selectively performed by: a method of bringing a photomask formed with a predetermined pattern into contact with a photosensitive resin layer and then irradiating with ultraviolet rays; a method of imaging a predetermined pattern contained in a mask through a projection objective lens and then irradiating with ultraviolet rays; a method of directly imaging a predetermined pattern contained in a mask using a laser diode as a light source and then irradiating with ultraviolet rays; and so on. In this case, examples of the ultraviolet irradiation conditions may include irradiation with 5mJ/cm2To 600mJ/cm2Is irradiated with a light quantity of (1).
Further, in the steps of exposing and alkali developing the photosensitive resin layer formed on the carrier film, examples of a method of developing the photosensitive resin layer may include a method of treatment with an alkaline developer. Examples of the alkaline developer are not particularly limited, but, for example, an alkaline aqueous solution such as potassium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia, tetramethylammonium hydroxide, amine, and the like may be used, and preferably, a 1% sodium carbonate developer at 30 ℃ may be used. The specific amount of the alkaline developer to be used is not particularly limited.
In the case of treatment with an alkaline developer, only a portion of the photosensitive resin layer is removed by development, and the polymer resin layer including the alkaline soluble resin and the heat-curable binder positioned at the lower portion may be protected by the carrier film, thereby preventing the layer from being developed. Therefore, the resolution of the via hole can be improved by similarly reducing the aspect ratio using the fine metal layer formed on the polymer layer as a resist mask without requiring a separate step for preventing the polymer resin layer from developing (for example, a step of previously curing the polymer resin layer, or a step of introducing two or more different metal layers to sequentially perform patterning with different etchants).
A step of removing the carrier film and the metal layer exposed by the patterned photosensitive resin layer to form a patterned metal layer
Method for preparing a Chinese medicinal composition
In the step of removing the carrier film and the metal layer exposed by the patterned photosensitive resin layer, the photosensitive resin pattern is used as a resist for forming a pattern on the carrier film and the metal layer. Accordingly, the carrier film and the metal layer exposed by the photosensitive resin layer pattern mean portions of the carrier film and the metal layer whose surfaces are not in contact with the photosensitive resin layer.
Specifically, the step of removing the carrier film and the metal layer exposed by the photosensitive resin layer pattern may include a step in which an etchant passes through the photosensitive resin layer having the pattern formed thereon and contacts the carrier film and the metal layer.
The etchant may be selected according to the kinds of the carrier film and the metal layer, and it is preferable to use a substance that has little influence on the underlying copper wire and does not influence the photosensitive resin layer, if possible.
However, as described above, in this embodiment, it is preferable to use the same material as the metal layer as the material of the support film, whereby the support film and the metal layer are removed sequentially or simultaneously by the same etchant, and thus, a pattern can be easily formed.
On the other hand, in the step of removing the support film and the metal layer exposed by the patterned photosensitive resin layer to form the patterned metal layer, the removal rate of the polymer resin layer may be 0.01 wt% or less based on the total weight of the polymer resin layer. The phrase "the removal rate of the polymer resin layer is 0.01 wt% or less based on the total weight of the polymer resin layer" may mean that the degree to which the polymer resin layer is removed is very insignificant, or that the polymer resin layer is not removed.
That is, the etchant used in the step of removing the support film and the metal layer exposed by the patterned photosensitive resin layer to form the patterned metal layer has no physical and chemical influence on the polymer resin layer at all. Therefore, the polymer resin layer can be stably maintained until the fine metal pattern layer is formed, and the resolution of the via hole can be improved by lowering the aspect ratio using the fine metal pattern layer as a resist mask.
Step of separating and removing carrier film from patterned metal layer
After the step of removing the carrier film and the metal layer exposed by the patterned photosensitive resin layer to form the patterned metal layer as described above, the patterned metal layer, the patterned carrier film, and the patterned photosensitive resin layer may be laminated in order.
At this time, in order to form the insulating layer, all remaining layers except the polymer resin layer and the patterned metal layer formed on the polymer resin layer need to be removed. For this reason, conventionally, an alkaline developer is used for removing the photosensitive resin layer for pattern formation. In this case, there is a problem that the polymer resin layers are simultaneously or sequentially developed by the alkali developer. In addition, in the case of using a metal layer for patterning, since the metal layer is removed using an etchant, problems such as corrosion of a lower copper line may occur.
On the other hand, in the case of one embodiment, the remaining layers other than the patterned metal layer formed on the polymer resin layer may be easily removed by a simple method of separating and removing the support film from the metal layer.
In the above embodiments, since the adhesive force between the carrier film and the metal layer is smaller than the adhesive force between the polymer resin layer and the metal layer, the peeling of the polymer resin layer and the metal layer can be prevented during the physical peeling of the carrier film and the metal layer.
Further, in the process of separating the carrier film from the metal layer, since the carrier film and the photosensitive resin layer formed on the carrier film are removed together in a bonded or peeled state, it is possible to easily leave only a fine metal pattern mask on the polymer resin layer even without using an etchant, and thus, the resolution of the via hole can be improved by reducing the aspect ratio through the patterning process described below.
A step of alkali developing the polymer resin layer exposed from the patterned metal layer
In addition, the method of manufacturing the insulating layer may include alkali-developing the polymer resin layer exposed by the patterned metal layer. By the process of selectively contacting the surface portion of the polymer resin layer exposed only by the pattern formed on the metal layer with the alkaline developer as described above, it is possible to secure the same level of accuracy and higher process economy while replacing the conventional laser etching method.
In the step of alkali-developing the polymer resin layer exposed by the patterned metal layer, the metal layer pattern serves as a resist for forming a pattern on the polymer resin layer. Accordingly, the polymer resin layer exposed by the metal layer pattern means a portion of the polymer resin layer whose surface is not in contact with the metal layer.
Specifically, the step of alkali-developing the polymer resin layer exposed by the patterned metal layer may include a step in which an alkali developer passes through the metal layer having the pattern formed thereon and comes into contact with the polymer resin layer.
Since the polymer resin layer includes an alkali-soluble resin, it has an alkali-solubility such that it is dissolved in an alkali developer, resulting in that a portion of the polymer resin layer, which is in contact with the alkali developer, can be dissolved and removed.
On the other hand, 0.1 to 85 wt%, 0.1 to 50 wt%, or 0.1 to 10 wt% may remain based on the total weight of the polymer resin layer exposed by the patterned metal layer after the step of alkali-developing the polymer resin layer exposed by the patterned metal layer. This is considered to be because the alkali-soluble resin contained in the polymer resin layer has been removed by the alkali developer, but the heat-curable binder or inorganic filler having a small alkali developing property remains without being removed.
Therefore, when the patterned metal layer is removed by an etching process as needed, the lower copper foil exposed by the pattern may be etched together therewith, thereby minimizing the occurrence of an etch back (etch back).
Meanwhile, the polymer resin layer remaining after the step of alkali-developing the polymer resin layer exposed by the patterned metal layer may be removed by treatment with a stripping liquid or the like. That is, after the step of alkali-developing the polymer resin layer exposed from the patterned metal layer, the method may further include a step of treatment with a stripping liquid, and the type of the stripping liquid and the treatment method are not particularly limited.
In particular, in order to control the degree of retention of the inorganic filler and the heat-curable binder, the weight ratio of the heat-curable binder and the inorganic filler with respect to the alkali-soluble resin, the ratio of acidic functional groups on the surface of the inorganic filler, and the like may be controlled. Preferably, 20 to 100 parts by weight of the heat-curable binder and 100 to 600 parts by weight of the inorganic filler may be added based on 100 parts by weight of the alkali-soluble resin. The surface of the inorganic filler may have an acid value of 0 to 5mgKOH/g or 0.01 to 5 mgKOH/g. Details of the acid value are the same as those in the method of determining the acid value of the alkali-soluble resin.
Examples of the alkaline developer are not particularly limited, but, for example, an alkaline aqueous solution such as potassium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia, tetramethylammonium hydroxide, amine, etc. may be used, and preferably, a 1% sodium carbonate developer may be used at 30 ℃. The specific amount of the alkaline developer to be used is not particularly limited.
A step of thermally curing the polymer resin layer after the alkali development
In addition, the method of manufacturing the insulating layer may include thermally curing the polymer resin layer after the alkali development. The step of thermally curing the polymer resin layer may be performed at a temperature of 100 ℃ to 250 ℃.
Meanwhile, after the step of thermally curing the polymer resin layer, the method may further include removing the metal layer on the polymer resin layer. The method of removing the metal layer may include a method of removing the metal layer without removing the underlying copper wire of the polymer resin layer or simultaneously removing only a portion thereof.
As a specific example, by making the thickness of the copper foil of the metal layer extremely thin (3 μm or less), the metal layer is removed at the same time as the lower copper line is partially removed, or an etchant that removes the metal layer without affecting the lower copper line may be used.
On the other hand, according to another embodiment of the present invention, there is provided a method for manufacturing a multilayer printed circuit board, which includes the step of forming a metal substrate having a pattern formed thereon on the insulating layer manufactured in the embodiment.
The present inventors have found that, since the insulating layer manufactured in the above-described embodiment includes a certain opening pattern, the opening pattern is filled with metal in a process of newly laminating a metal base material on the insulating layer, whereby the metal base materials positioned at the upper and lower portions are connected based on the insulating layer, thereby manufacturing a multilayer printed circuit board. The present invention has been completed based on such findings.
The insulating layer may be used as an interlayer insulating material of a multilayer printed circuit board, and may include a cured product of an alkali-soluble resin and a heat-curable binder. Details of the alkali-soluble resin and the heat-curable binder include those described in the above-described embodiments. If necessary, a copper foil layer having a thickness of 5 μm or less may be formed on the surface of the insulating layer.
The step of forming a metal base material on which a pattern is formed on an insulating layer is a fine circuit pattern forming process called a semi-additive process (SAP) or a modified semi-additive process (MSAP). The SAP means a process in which a fine circuit pattern is formed on an insulating layer in a state where nothing is present, and the MSAP means a process in which a fine circuit pattern is formed in a state where a copper foil having a thickness of 5 μm or less is formed on an insulating layer.
More specific examples of the step of forming a metal substrate having a pattern formed thereon on an insulating layer include the steps of: forming a metal film on the insulating layer; forming a photosensitive resin layer on the metal thin film, on which a pattern is formed; depositing a metal on the metal thin film exposed by the pattern of the photosensitive resin layer pattern; removing the photosensitive resin layer; and removing the exposed metal film.
In the step of forming the metal thin film on the insulating layer, examples of a method of forming the metal thin film include a dry deposition method or a wet deposition method, and specific examples of the dry deposition method include vacuum deposition, ion plating, sputtering, and the like. On the other hand, as a specific example of the wet deposition method, electroless plating of various metals and the like can be mentioned, and more specifically, electroless copper plating can be used. In addition, a roughening treatment step may also be included before or after vapor deposition.
In addition, as for the method of forming a metal thin film on an insulating layer, in the case of using a metal layer as a protective layer in the method for manufacturing an insulating layer of one embodiment, the resulting insulating layer may be used as it is.
The roughening treatment process may be a dry process and a wet process depending on conditions. Examples of the dry method include vacuum treatment, atmospheric pressure treatment, gas plasma treatment, gas excimer UV treatment, and the like. Examples of wet processes include desmear processes. By these roughening treatment processes, it is possible to increase the surface roughness of the metal thin film and improve the adhesion with the metal deposited on the metal thin film.
The step of forming a metal film on the insulating layer may further include the step of forming a surface treatment layer on the insulating layer before depositing the metal film. This can improve the adhesion between the metal thin film and the insulating layer.
Specifically, as an example of a method of forming a surface treatment layer on an insulating layer, any one selected from an ion assisted reaction method, an ion beam treatment method, and a plasma treatment method may be used. The plasma processing method may include any one of an atmospheric plasma processing method, a DC plasma processing method, and an RF plasma processing method. As a result of the surface treatment process, a surface treatment layer including a reactive functional group may be formed on the surface of the insulating layer. As another example of a method of forming a surface treatment layer on an insulating layer, a method of depositing chromium (Cr) and titanium (Ti) metals having a thickness of 50nm to 300nm on a surface of an insulating layer may be mentioned.
Meanwhile, the step of forming the photosensitive resin layer in which the pattern is formed on the metal film may include a step of exposing and developing the photosensitive resin layer formed on the metal film. Details of the photosensitive resin layer, exposure, and development may include those in one embodiment described above.
In the step of depositing a metal on the metal film exposed by the photosensitive resin layer pattern, the metal film exposed by the photosensitive resin layer pattern means a portion of the metal film which is not in contact with the photosensitive resin layer on the surface. The metal to be deposited may be copper. Examples of the deposition method are not particularly limited, and various well-known physical or chemical vapor deposition methods may be used without limitation. As a general example, an electrolytic copper plating method can be used.
In the steps of removing the photosensitive resin layer and removing the exposed metal thin film, a photoresist stripper may be used in the example of the method of removing the photosensitive resin layer, and an etchant may be used in the example of the method of removing the metal thin film exposed due to the removal of the photosensitive resin layer.
The multilayer printed wiring board manufactured by the method of manufacturing a multilayer printed wiring board can be reused as a build-up material. For example, a first step of forming an insulating layer on a multilayer printed circuit board according to the manufacturing method of an insulating layer of one embodiment, and a second step of forming a metal base material on an insulating layer according to the manufacturing method of a multilayer printed circuit board of another embodiment may be repeatedly performed.
Therefore, the number of lamination layers included in the multilayer printed circuit board manufactured by the method for manufacturing a multilayer printed circuit board is not particularly limited, and it may have, for example, one to twenty layers according to the application purpose and use.
Advantageous effects
According to the present invention, it is possible to provide a method for manufacturing an insulating layer, which can realize a uniform and fine pattern while improving efficiency in terms of cost and productivity, and can also ensure excellent mechanical characteristics; and a method of manufacturing a multilayer printed circuit board using the insulating layer obtained by the method of manufacturing an insulating layer.
Drawings
Fig. 1 schematically shows a manufacturing process of an insulating layer of embodiment 1.
Fig. 2 schematically shows a manufacturing process of the multilayer printed circuit board of embodiment 2.
Detailed Description
Hereinafter, the present invention will be described in more detail by examples. However, these examples are provided for illustrative purposes only and should not be construed as limiting the scope of the present invention.
< preparation example: preparation of alkali-soluble resin >
Preparation example 1
In a 2-liter reaction vessel having heating and cooling capabilities and equipped with a thermometer, a stirrer, a reflux condenser and a quantitative moisture analyzer were placed 632g of Dimethylformamide (DMF) as a solvent, 358g of BMI-1100 (product name, manufactured by Daiwakasei) as an N-substituted maleimide compound and 151g of 4-aminophenylacetic acid as an amine compound and mixed, and stirred at 85 ℃ for 24 hours to prepare an alkali-soluble resin solution having a solid content of 50%.
Preparation example 2
In a 2-liter reaction vessel having heating and cooling capabilities and equipped with a thermometer, a stirrer, a reflux condenser and a quantitative moisture analyzer were placed 632g of Dimethylformamide (DMF) as a solvent, 434g of p-carboxyphenylmaleimide as an N-substituted maleimide compound and 198g of 4, 4-diaminodiphenylmethane as an amine compound and mixed, and stirred at 85 ℃ for 24 hours to prepare an alkali-soluble resin solution having a solid content of 50%.
Preparation example 3
In a 2 liter reaction vessel having heating and cooling capabilities and equipped with a thermometer, a stirrer, a reflux condenser and a quantitative humidity analyzer, 543g of dimethylacetamide (DMAc) as a solvent was placed and mixed, and 350g of SMA1000(Cray Valley), 144g of 4-aminobenzoic acid (PABA) and 49g of 4-aminophenol (PAP) were added thereto and mixed. After the temperature of the reactor was set to 80 ℃ under a nitrogen atmosphere, the acid anhydride was reacted with the aniline derivative for 24 hours to form amic acid. Then, after the temperature of the reactor was set to 150 ℃, the imidization reaction was continued for 24 hours to prepare an alkali-soluble resin solution having a solid content of 50%.
Preparation example 4
In a 2-liter reaction vessel having heating and cooling capabilities and equipped with a thermometer, a stirrer, a reflux condenser and a quantitative moisture analyzer, 516g of Methyl Ethyl Ketone (MEK) as a solvent was placed and mixed, and 228g of p-carboxyphenylmaleimide, 85g of p-hydroxyphenylmaleimide, 203g of styrene and 0.12g of Azobisisobutyronitrile (AIBN) were added and mixed. After gradually increasing the temperature of the reactor to 70 ℃ under a nitrogen atmosphere, the reaction was continued for 24 hours to prepare an alkali-soluble resin solution having a solid content of 50%.
< example 1: production of insulating layer >
Referring to fig. 1, a polymer resin composition obtained by mixing 16g of the alkali-soluble resin synthesized in preparation example 1, 5g of MY-510 (manufactured by Huntsman) as a heat-curable binder, and 35g of SC2050 MTO (manufactured by adamantech) as an inorganic filler was coated on an ultra-thin copper foil 4MT18SD-H (manufactured by Mitsui Kinzoku) having a thickness of 3 μm, to which a carrier copper foil 5 was adhered, and dried to prepare a polymer resin layer 1 having a thickness of 15 μm. Then, the polymer resin layer 1 was vacuum-laminated on the circuit board in which the copper wire 2 was formed on the copper foil laminate 3 at 85 ℃, and a photosensitive dry film resist KL 1015 (manufactured by Kolon Industries) 6 having a thickness of 15 μm was laminated on the carrier copper foil 5 at 110 ℃.
A circular negative photomask having a diameter of 30 μm was brought into contact with the photosensitive dry film resist 6 and irradiated with ultraviolet rays (25 mJ/cm)2The amount of light). Then, the dry film resist 6 was developed by a 1% sodium carbonate developer at 30 ℃ to form a certain pattern.
Subsequently, the carrier copper foil 5 and the ultra-thin copper foil 4 are etched by treatment with an etchant. At this time, the photosensitive dry film resist 6 on which the pattern is formed serves as a protective layer of the carrier copper foil 5 and the ultra-thin copper foil 4, so that the same pattern as the photosensitive dry film resist 6 is formed even in the carrier copper foil 5 and the ultra-thin copper foil 4.
Subsequently, the ultra-thin copper foil 4 is separated from the carrier copper foil 5, so that the carrier copper foil 5 and the photosensitive dry film resist 6 laminated on the carrier copper foil 5 are removed.
Next, the polymer resin layer 1 was developed by a 1% sodium carbonate developer at 30 ℃. At this time, the ultra-thin copper foil 4 on which a pattern is formed serves as a protective layer of the polymer resin layer 1, so that the via hole 7 is formed even in the polymer resin layer 1 while the same pattern as the ultra-thin copper foil 4 is formed.
Subsequently, heat curing was performed at a temperature of 110 ℃ for 1 hour, and then treated with an etchant to remove the ultra-thin copper foil 4, and a heat curing process was further performed at a temperature of 200 ℃ for 1 hour to produce an insulating layer.
< example 2: production of multilayer printed Wiring Board
Referring to fig. 2, by a sputtering method, while a mixed gas of argon and oxygen was supplied to the upper surface of the insulating layer 1 and the side surface of the via hole 7 manufactured in example 1 with a vapor deposition apparatus, titanium (Ti) metal was deposited in a thickness of 50nm and (Cu) was deposited in a thickness of 0.5 μm to form a seed layer 8.
Subsequently, the photosensitive resin layer is exposed and developed on the seed layer 8 to form a photosensitive resin pattern 9. Then, a metal base material 10 made of copper is formed on the seed layer 8 by electrolytic plating. Next, the photosensitive resin pattern 9 is removed using a photosensitive resin stripping liquid, so that the exposed seed layer 8 is removed by etching, thereby producing a multilayer printed circuit board.
< example 3: production of insulating layer >
An insulating layer was manufactured in the same manner as in example 1, except that the alkali-soluble resin synthesized in preparation example 2 was used in place of the alkali-soluble resin synthesized in preparation example 1 in the method for manufacturing an insulating layer in example 1.
< example 4: production of insulating layer >
An insulating layer was manufactured in the same manner as in example 1, except that the alkali-soluble resin synthesized in preparation example 3 was used in place of the alkali-soluble resin synthesized in preparation example 1 in the method for manufacturing an insulating layer in example 1.
< example 5: production of insulating layer >
An insulating layer was manufactured in the same manner as in example 1, except that the alkali-soluble resin synthesized in preparation example 4 was used in place of the alkali-soluble resin synthesized in preparation example 1 in the method for manufacturing an insulating layer in example 1.
< comparative example 1: production of insulating layer >
A polymer resin composition obtained by mixing 16g of the alkali-soluble resin synthesized in preparation example 1, 5g of MY-510 (manufactured by Huntsman) as a heat-curable binder, and 35g of SC2050 MTO (manufactured by adamantech) as an inorganic filler was coated on a PET film (25 μm) and dried to prepare a polymer resin layer 1 having a thickness of 15 μm. Then, the polymer resin layer 1 was vacuum-laminated on the circuit board in which the copper wire 2 was formed on the copper foil laminate 3 at 85 ℃, and the PET film was removed.
A photosensitive dry film resist KL 1015 (manufactured by Kolon Industries) having a thickness of 15 μm was laminated on the polymer resin layer at 110 ℃. A circular negative photomask having a diameter of 30 μm was brought into contact with the photosensitive dry film resist and irradiated with ultraviolet rays (25 mJ/cm)2Light amount of) is irradiated. Then, the photosensitive dry film resist and the polymer resin layer were sequentially developed by a 1% sodium carbonate developer at 30 ℃.
At this time, the photosensitive dry film resist serves as a protective layer of the polymer resin layer, and the through-hole is formed even in the polymer resin layer while the same pattern as the photosensitive dry film resist is formed.
Subsequently, heat curing was performed at a temperature of 100 ℃ for 1 hour, and then treated with a 3% sodium hydroxide resist stripping solution to remove the photosensitive dry film resist, and further heat curing was performed at a temperature of 200 ℃ for 1 hour to produce an insulating layer.
< comparative example 2: production of multilayer printed Wiring Board
A multilayer printed circuit board was produced in the same manner as in example 2, except that the insulating layer produced in comparative example 1 was used instead of the insulating layer produced in example 1.
< experimental examples: measurement of physical characteristics of insulating layers obtained in examples and comparative examples >
Physical properties of the insulating layers obtained in the above examples and comparative examples were measured by the following methods, and the results are shown in table 1 below.
1. Diameter of through hole
The diameters of the upper openings (through holes) of the insulating layers obtained in examples 1 and 3 to 7 and comparative example 1 were measured using an optical microscope.
2. Metal adhesion due to hygroscopicity
The multilayer printed circuit boards obtained in example 2 and comparative example 2 were allowed to stand at 135 ℃ under 85% moisture absorption conditions for 48 hours, and then the peel strength of the metal was measured according to the IPC-TM-650 standard.
Thereby obtaining metal adhesion.
3. High accelerated temperature and humidity stress test (HAST) resistance
HAST resistance of the multilayer printed circuit boards obtained in example 2 and comparative example 2 was determined according to the standards of JESD 22-A101. Specifically, a voltage of 3V was applied to a circuit board of a test piece having a width of 50 μm, an interval of 50 μm and a thickness of 12 μm, and then allowed to stand for 168 hours, and then it was determined whether or not there was an appearance abnormality of the circuit board of the test piece according to the following criteria.
OK: no abnormality was observed in the film appearance
NG: blisters and peeling were observed in the films [ Table 1]
Results of experimental examples of examples and comparative examples
| Classification | Diameter of through hole (mum) | Metal adhesion (kgf/cm) | HAST Property (μm) |
| Example 1 | 32 | - | - |
| Example 2 | - | 0.4 | OK |
| Example 3 | 33 | - | - |
| Example 4 | 33 | - | - |
| Example 5 | 32 | - | - |
| Comparative example 1 | 45 | - | - |
| Comparative example 2 | - | 0.3 | OK |
As shown in table 1, in the case of the insulating layer of comparative example 1 in which the via hole was formed using only the photosensitive dry film as the protective layer, the diameter of the via hole was shown to be 45 μm, while the diameter of the via hole included in the insulating layers manufactured in examples 1 and 3 to 5 was reduced to 32 μm or 33 μm. From this, it can be confirmed that, in the case of the embodiment, a finer pattern can be achieved.
Further, it was confirmed that in the case of the multilayer printed circuit board of comparative example 2 obtained from the insulating layer of comparative example 1, the metal adhesion was measured to be 0.3kgf/cm, whereas in the case of the multilayer printed circuit board of example 2, the metal adhesion was measured to be as high as 0.4kgf/cm, thereby improving the interfacial adhesion between the insulating layer and the conductive layer and exhibiting excellent HAST resistance.
[ description of reference ]
1: polymer resin layer
2: copper wire
3: copper foil laminate
4: ultra-thin copper foil
5: carrier copper foil
6: photosensitive Dry Film Resist (DFR)
7: through hole
8: seed layer
9: photosensitive resin pattern
10: metal base material
<1> to <8 >: sequence of execution of the method
Claims (18)
1. A method for manufacturing an insulating layer, comprising the steps of:
adhering an opposite surface of the metal layer, on one surface of which the carrier film is adhered, to a polymer resin layer comprising an alkali-soluble resin and a heat-curable binder;
forming a patterned photosensitive resin layer on the carrier film;
removing the carrier film and the metal layer exposed by the patterned photosensitive resin layer to form a patterned metal layer;
separating and removing the carrier film from the patterned metal layer;
alkali developing the polymer resin layer exposed by the patterned metal layer; and
thermally curing the polymer resin layer after the alkali development,
wherein the alkali-soluble resin comprises at least one acid functional group and at least one amino-substituted cyclic imide functional group, or wherein the alkali-soluble resin comprises at least one repeating unit represented by the following chemical formula 3 and at least one repeating unit represented by the following chemical formula 4:
[ chemical formula 3]
Wherein, in chemical formula 3, R2Is a direct bond, alkylene having 1 to 20 carbon atoms, alkenylene having 1 to 20 carbon atoms or arylene having 6 to 20 carbon atoms, and ". dot" means the point of bonding,
[ chemical formula 4]
Wherein, in chemical formula 4, R3Is a direct bond, alkylene having 1 to 20 carbon atoms, alkenylene having 1 to 20 carbon atoms or arylene having 6 to 20 carbon atoms,
R4is-H, -OH, -NR5R6Halogen or alkyl having 1 to 20 carbon atoms,
R5and R6Can each independently be hydrogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and
"" means a bond site.
2. The method for manufacturing an insulation layer according to claim 1, wherein in the step of adhering the opposite surface of the metal layer to which the support film is adhered on one surface thereof to the polymer resin layer comprising an alkali-soluble resin and a heat-curable binder, the adhesion force between the support film and the metal layer is smaller than the adhesion force between the polymer resin layer and the metal layer.
3. The method for manufacturing an insulating layer according to claim 1, wherein in the step of separating and removing the carrier film from the patterned metal layer, the carrier film and the photosensitive resin layer formed on the carrier film are removed together.
4. The method for manufacturing an insulating layer according to claim 1, wherein in the step of removing the carrier film and the metal layer exposed by the patterned photosensitive resin layer to form a patterned metal layer, the carrier film and the metal layer are removed sequentially or simultaneously by the same etchant.
5. The method for manufacturing an insulation layer according to claim 1, wherein in the step of removing the support film and the metal layer exposed by the patterned photosensitive resin layer to form a patterned metal layer, a removal rate of the polymer resin layer is 0.01 wt% or less based on the total weight of the polymer resin layer.
6. The method for manufacturing an insulating layer according to claim 1, wherein the step of forming a patterned photosensitive resin layer on the support film comprises the steps of exposing and alkali developing the photosensitive resin layer formed on the support film.
7. The method for manufacturing an insulating layer according to claim 6, wherein the polymer resin layer is protected by the support film in the steps of exposing and alkali developing the photosensitive resin layer formed on the support film.
8. The method for manufacturing an insulating layer according to claim 1, wherein after the step of thermally curing the polymer resin layer, the method can further comprise removing the metal layer on the polymer resin layer.
9. The method for manufacturing an insulation layer according to claim 1, wherein the alkali soluble resin comprises at least one acid functional group and at least one amino-substituted cyclic imide functional group, wherein the amino-substituted cyclic imide functional group includes a functional group represented by the following chemical formula 1:
[ chemical formula 1]
Wherein, in chemical formula 1, R1Is an alkylene or alkenyl group having 1 to 10 carbon atoms, and ". dot" means a bonding site.
10. The method for manufacturing an insulating layer according to claim 1, wherein the alkali-soluble resin comprises at least one acid functional group and at least one amino-substituted cyclic imide functional group, wherein the alkali-soluble resin is produced by a reaction of a cyclic unsaturated imide compound and an amine compound, and at least one of the cyclic unsaturated imide compound and the amine compound comprises an acid functional group substituted at a terminal thereof.
11. The method for manufacturing an insulating layer according to claim 10, wherein the amine compound comprises at least one selected from an amino-substituted carboxylic acid compound and a polyfunctional amine compound containing two or more amino groups.
12. The method for manufacturing an insulating layer according to claim 1, wherein the alkali-soluble resin comprises at least one repeating unit represented by the chemical formula 3 and at least one repeating unit represented by the chemical formula 4, wherein the alkali-soluble resin is produced by reacting a polymer comprising a repeating unit represented by the following chemical formula 5, an amine represented by the following chemical formula 6, and an amine represented by the following chemical formula 7:
[ chemical formula 5]
[ chemical formula 6]
[ chemical formula 7]
Wherein, in chemical formulas 5 to 7, R2To R4The same as those defined in claim 1, and "×" means bonding sites.
13. The method for manufacturing an insulating layer according to claim 1, wherein the alkali-soluble resin comprises at least one repeating unit represented by the chemical formula 3 and at least one repeating unit represented by the chemical formula 4, wherein the alkali-soluble resin is produced by reacting a compound represented by the following chemical formula 8 and a compound represented by the following chemical formula 9:
[ chemical formula 8]
[ chemical formula 9]
Wherein, in chemical formulas 8 and 9, R2To R4The same as those defined in claim 1.
14. The method for producing an insulating layer according to claim 1, wherein the acid value of the alkali-soluble resin as determined by KOH titration is 50mgKOH/g to 250 mgKOH/g.
15. The method for manufacturing an insulating layer according to claim 1, wherein the polymer resin layer comprises a heat-curable binder in an amount of 1 to 150 parts by weight based on 100 parts by weight of the alkali-soluble resin.
16. The method for manufacturing an insulation layer according to claim 1, wherein the heat-curable adhesive comprises a thermosetting resinFrom oxetane groups, cyclic ether groups, cyclic thioether groups, cyanide groups, maleimide groups and benzo groups
At least one functional group in the oxazine group and an epoxy group.
17. The method for manufacturing an insulation layer according to claim 1, wherein the polymer resin layer further comprises at least one additive selected from the group consisting of a thermal curing catalyst, an inorganic filler, a leveling agent, a dispersant, a release agent, and a metal adhesion promoter.
18. A method for manufacturing a multilayer printed circuit board, comprising the step of forming a metal base material on the insulating layer manufactured according to any one of claims 1 to 17, wherein the metal base material has a pattern formed thereon.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
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| KR20160101419 | 2016-08-09 | ||
| KR10-2016-0101419 | 2016-08-09 | ||
| KR1020170096355A KR101947150B1 (en) | 2016-08-09 | 2017-07-28 | Method for manufacturing insulating film and multilayered printed circuit board |
| KR10-2017-0096355 | 2017-07-28 | ||
| PCT/KR2017/008247 WO2018030694A1 (en) | 2016-08-09 | 2017-07-31 | Insulating layer manufacturing method and multilayered printed circuit board manufacturing method |
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| CN107926124A CN107926124A (en) | 2018-04-17 |
| CN107926124B true CN107926124B (en) | 2020-07-03 |
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| JP (1) | JP6600088B2 (en) |
| KR (1) | KR101947150B1 (en) |
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| KR102257926B1 (en) | 2018-09-20 | 2021-05-28 | 주식회사 엘지화학 | Multilayered printed circuit board, method for manufacturing the same, and semiconductor device using the same |
| JP2021017454A (en) * | 2019-07-17 | 2021-02-15 | 住友ベークライト株式会社 | Polymer production method, polymer-containing composition, and polymer |
| WO2021080203A1 (en) * | 2019-10-24 | 2021-04-29 | 주식회사 엘지화학 | Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same |
| TWI795012B (en) * | 2021-10-05 | 2023-03-01 | 艾姆勒科技股份有限公司 | Substrate structure having thick conductive layer and method for etching the same |
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- 2017-07-31 JP JP2018518413A patent/JP6600088B2/en active Active
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| JP6600088B2 (en) | 2019-10-30 |
| TWI630224B (en) | 2018-07-21 |
| JP2018530167A (en) | 2018-10-11 |
| KR20180018333A (en) | 2018-02-21 |
| KR101947150B1 (en) | 2019-02-12 |
| TW201823304A (en) | 2018-07-01 |
| CN107926124A (en) | 2018-04-17 |
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