CN107914424A - A kind of multi-layer board and its manufacture method - Google Patents
A kind of multi-layer board and its manufacture method Download PDFInfo
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- CN107914424A CN107914424A CN201610886422.2A CN201610886422A CN107914424A CN 107914424 A CN107914424 A CN 107914424A CN 201610886422 A CN201610886422 A CN 201610886422A CN 107914424 A CN107914424 A CN 107914424A
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- layer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
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Abstract
A kind of multi-layer board and its manufacture method, the multi-layer board is made of two pieces of non-metal boards and the metal layer being located between two pieces of non-metal boards, the metal layer is penetrated into after fusing in the body hole of non-metal board, is integrally fixed with two pieces of non-metal boards, forms three-layer composite board structure.Present invention additionally comprises a kind of multi-layer board manufacturing method.The present invention is suitable for operation in the environment of any high temperature, high intensity, using that can be formed under material less, light, strength and stiffness are big, high temperature resistant, the entirety of good heat-insulation effect, the integral strength of structure is greatly improved, and it is low to the susceptibility of environmental change, it will not be influenced be subject to environment.
Description
Technical field
The present invention relates to composite plate structure field, particularly a kind of multi-layer board and its manufacture method.
Background technology
Existing carbon fibre material is due to excellent with high temperature resistant, rapid heat dissipation, low, the corrosion-resistant and light weight of linear expansion coefficient etc.
Point, is widely used in the fields such as space flight, nuclear industry, military affairs.
《Material engineering》Deliver that " carbon fibre composite is connected with metal and joint mechanical property on December 15th, 2007
The text of test " one, mentions and being mentioned in the connection method to the metal such as carbon fibre composite and metallic copper, titanium, niobium, aluminium, such as text
The connection mode of carbon fibre composite and titanium alloy is：First expand on carbon fibre composite surface and ooze, deposit 3 μm of a thickness
Metal gradient layer Ni, makes to form diffusion layer between them, carrys out the modification of the carbon fibre composite surface before butt welding, then redeposited
One layer 2 μm of TC4 titanium alloy layers, take high vacuum technique 2 × 103Under the vacuum of Pa, with silver-based kupper solder at 800 ~ 850 DEG C
At a temperature of heat, the connection of carbon fibre composite and titanium alloy can be achieved after cooling.However, this connection is only reason
To a kind of research method of material on, it is only intended to obtain the good interface of carbon fibre composite and titanium, is not belonging to be molded
Structure, this structure cannot be used for the fields such as building, heating equipment.
The content of the invention
A kind of high temperature resistant is provided the purpose of the present invention is overcoming the above-mentioned deficiency of the prior art, intensity is high, heat insulation
Good multi-layer board and its manufacture method.
The technical scheme is that：
A kind of multi-layer board of the present invention, is made of, institute two pieces of non-metal boards and the metal layer being located between two pieces of non-metal boards
State metal layer to penetrate into after fusing in the body hole of non-metal board, be integrally fixed with two pieces of non-metal boards, form three layers again
Board structure.
Advantages of the present invention is：By the sandwiched metal layer between two pieces of non-metal boards, under using material less, light
It can form that strength and stiffness are big, high temperature resistant, the entirety of good heat-insulation effect, greatly improve the integral strength of structure, and to environment
The susceptibility of change is low, will not be influenced be subject to environment.
It is understood that the present invention can between two pieces of non-metal boards whole sandwiched metal layers or a certain
Part sandwiched metal layer, can also be and only this not made specific in the joint sandwiched metal layer of two pieces of non-metal boards, the present invention
Limit.
Further, the material of the metal layer is stainless steel, copper, titanium, nickel or alloy.Metal layer selects dystectic metal
Material so that the three-layer composite board of formation can be used for hot environment under, i.e., in high temperature environments operation when, will not cause metal layer
The phenomenon for producing fusing and causing plate body to loosen occurs, applied widely, and can greatly improve the integral strength of structure.
Further, it is fine can be but not limited to carbon fiber board, carborundum plate, corundum plate or synthesis for two pieces of non-metal boards
Plate is tieed up, is preferably carbon fiber board, since carbon fiber board is using graphite fibre or carbon fiber as enhancing phase, there is high temperature resistant, dissipate
The advantages that hot fast, linear expansion coefficient is low, intensity is high, corrosion-resistant and light weight；In addition, carbon fiber board is easily molded, it is easy to process,
And cost is low, although corundum plate also can high temperature resistant, be not easy to be molded.
Further, the carbon fiber board is carbon fiber reinforced carbon matrix composite material.
Further, the metal layer is in plane, and metal layer is located between the horizontal face of two pieces of non-metal boards, and described two
Block non-metal board is overlapped by way of aliging or misplacing.Overlap joint can make the stress of total in aligned manner
More uniformly, so as to improve the integral strength of structure；Overlapped in a manner of dislocation is in order to while intensity is improved, moreover it is possible to more
Other plate bodys or other multi-layer board are connected well, it is highly practical.
Further, the joint of one of non-metal board in two pieces of non-metal boards is equipped with step so that two pieces
Non-metal board is adapted connection in joint, and metal layer is located between the step surface of two pieces of non-metal boards.Since metal layer presss from both sides
It is between the step surface of two pieces of non-metal boards, i.e., L-shaped, it can preferably connect two pieces of non-metal boards so that two blocks of non-gold
Loosening will not be produced after belonging to plate connection, improves the support strength of joint；In addition, this overlapping mode enables to two blocks of non-gold
Belong to plate and be in same level.
Further, three-layer composite board heatproof >=1200 DEG C.
A kind of manufacture method according to aforenoted multi-layer plate of the present invention, comprises the following steps：
（1）Between metal layer is located in two pieces of non-metal boards, and two pieces of non-metal boards overlap after metal layer is clamped,
Form three-layer composite board；
（2）Three-layer composite board is placed in brazing device, is heated under oxygen-free environment, melts solder heat, after fusing
Solder and metal layer penetrate into non-metal board body hole in；
（3）It is cooled and shaped.
Advantages of the present invention is：On the one hand by the sandwiched metal layer between two pieces of non-metal boards, material less, light is being used
It can form that strength and stiffness are big, high temperature resistant, the entirety of good heat-insulation effect under material, greatly improve the integral strength of structure, and
It is low to the susceptibility of environmental change, it will not be influenced be subject to environment；On the other hand, by lead welding and shaping, total can be made
Be more uniformly stressed；In addition, can ensure that whole welding process will not produce oxidation under oxygen-free environment, and then improve welding matter
Amount.The oxygen-free environment of the present invention can be vacuum environment or be passed through inert gas to closed welding intracavitary.
Further, step（2）In, further comprise the steps：
（2-1）Between three-layer composite board is delivered to two heating dish of brazing device, two heating dish do relative motion, and will
Three-layer composite board compresses, and three-layer composite board is in the welding chamber of anaerobic；
（2-2）The outer surface of three-layer composite board is contacted with the seal face of heating dish respectively, and the seal face is to be arranged at heating dish
On contain porous flase floor, make plus thermogenetic heat three-layer composite board is unhinderedly flowed into by the hole on flase floor
Surface on；
（2-3）Heating dish electrified regulation three-layer composite board, completes soldering.
Further, the brazing device includes upper heating disk and lower heating dish, is equipped with and adds in upper heating disk and lower heating dish
It is equipped with thermal element, upper heating disk and lower heating dish and contains porous flase floor for compress workpiece to be welded；Upper heating disk
It can move up and down, upper heating disk compresses workpiece to be welded when declining, and when rising unclamps workpiece to be welded；Upper heating disk and lower heating dish
Side arrangement has reflecting plate, and reflecting plate links together two heating dish, so as to form the welding chamber of closing.
Contain porous flase floor by being set in heating dish, heat caused by heating element is passed through grid
Hole on plate is unhinderedly flowed on the surface of workpiece to be welded, and in welding process, upper and lower two heating dish will be to be welded
Workpiece compresses, while treats weldering workpiece heat, under the collective effect of reflecting plate, not only can guarantee that the contact area of heating, but also energy
Ensure the efficiency of heating surface, there is the advantage that firing rate is fast, heating effect is good.In addition, reflecting plate is formed with upper and lower two heating dish
The welding chamber of closing can ensure that heat rate of scattering and disappearing is very low, and good energy-conserving effect is highly practical.
It is understood that the brazing device of the present invention can also be the brazing equipment of other structures, multiple-plate heating
It can be carried out in any anaerobic heating furnace, the present invention does not make brazing device specific limit.
Further, step（2）In, the heating is what is carried out in a manner of being warming up to target temperature step by step.To add step by step
The form of heat can ensure that multi-layer board is heated steadily, not only can guarantee that the efficiency of heating surface, but also can guarantee that heating quality.
It is understood that the mode of heating of the present invention can also carry out heating welding using target temperature is directly risen to,
The present invention is not especially limited this.
Further, weld and pipeline is connected with chamber, pipeline can lead to inert gas to welding intracavitary.Since welding chamber is sealing
Chamber, gas loss can be avoided.
Further, the solder uses copper, titanium or nickel metal.Certainly, these three metals are the preferred solution of the present invention,
The solder of the present invention can also be other dystectic metals, and fusing point is lower than the fusing point of metal layer, in this way, can cause this
The multi-layer board of invention can first be melted in hot environment operation than metal layer, is formed the surface of moistening, is enable metal layer quick
Fusing, equably penetrates into the body hole of non-metal board, so that total is more uniformly stressed.
Multi-layer board prepared by the present invention is practical since for compound plank frame, modularization, can be used directly
Property it is strong, and suitable in the environment of any high-temp and high-strength, such as building, heating equipment field.
Brief description of the drawings
Fig. 1 is the structure diagram of the embodiment of the present invention 1；
Fig. 2 is the structure diagram of the embodiment of the present invention 2.
Embodiment
The present invention is described in further details below with reference to Figure of description and specific embodiment.
Embodiment 1
As shown in Figure 1：A kind of multi-layer board, by two pieces of carbon fiber boards 1 and the stainless steel being located between two pieces of 1 connectors of carbon fiber board
Piece 2 forms, and stainless steel substrates 2 are penetrated into the body hole of two pieces of carbon fiber boards 1 after fusing, is fixed into two pieces of carbon fiber boards 1
One, forms three-layer composite board structure.
Why the present embodiment selects stainless steel substrates 2, is because stainless steel is refractory metal, is not easy in high temperature environments
Fusing, and stainless steel has the chance rustless characteristic of water, if for building or other fields, can prolong the service life.
The stainless steel substrates 2 of the present embodiment are in plane, and stainless steel substrates 2 are located in the horizontal plane tie of two pieces of carbon fiber boards 1
Between, two pieces of carbon fiber boards 1 are overlapped by way of dislocation, are connect by the integrally welded formation soldering of brazing mode
Head.
The present embodiment multi-layer board manufacturing method is：Comprise the following steps：
（1）Stainless steel substrates 2 are located between the horizontal plane tie of two pieces of carbon fiber boards 1, and two pieces of carbon fiber boards 1 are overlapped on one
Stainless steel substrates 2 are clamped after rising, form three-layer composite board；
（2）Solder is placed near play movement or between play movement；
（3）Three-layer composite board is placed in brazing device, and is heated under oxygen-free environment, make the solder of joint with it is stainless
The heating fusing of steel disc 2, solder and stainless steel substrates 2 after fusing are penetrated into the body hole of carbon fiber board 1；
（4）It is cooled and shaped.
Preferably, the solder of the present embodiment is copper-based.
The preferred structure of the brazing device of the present embodiment is：Including upper heating disk and lower heating dish, upper heating disk and it is lower plus
Heating element is equipped with hot plate, is equipped with upper heating disk and lower heating dish and contains porous grid for compress workpiece to be welded
Plate.Upper heating disk can move up and down, and upper heating disk compresses workpiece to be welded when declining, and when rising unclamps workpiece to be welded.Upper heating disk
There is reflecting plate with the side arrangement of lower heating dish, reflecting plate links together two heating dish, so as to form the welding of closing
Chamber.Pipeline is connected with welding chamber, pipeline can lead to inert gas to welding intracavitary.
Step（2）In, use the brazing device prepare multiple-plate specific method for：
（2-1）Three-layer composite board is delivered between two heating dish of brazing device；
Welding zone is treated specifically, three-layer composite board is transported to so that carbon fiber board below connects with the flase floor in lower heating dish
Touch；
（2-2）Two heating dish do relative motion, and three-layer composite board is compressed, and the outer surfaces of two pieces of carbon fiber boards is respectively with two
A flase floor contact；
（2-3）Upper heating disk and lower heating dish electrified regulation three-layer composite board, complete soldering；
Specifically, the heating element in upper heating disk and lower heating dish heats three-layer composite board, mode of heating use by
The mode that level is warming up to target temperature carries out；Thermogenetic heat is added unhinderedly to be flowed into three layers again by the hole on flase floor
On the surface of plywood.
Step（3）In, the type of cooling is：Brazing device is had a power failure and cools down three-layer composite board, after cooling, upper heating disk rises
Depart from three-layer composite board.
The present embodiment can strengthen the whole of three-layer composite board by the sandwiched stainless steel substrates between two pieces of carbon fiber board connectors
Body intensity, and high temperature resistant, heat-insulated and good heat conduction effect.
The three-layer composite board of the present embodiment can more than 1200 DEG C of high temperature resistant.
Embodiment 2
As shown in Figure 2：Difference lies in the joint of one of carbon fiber board in two pieces of carbon fiber board 1' with embodiment 1
Equipped with step 3 so that two pieces of carbon fiber board 1' are adapted connection in joint, and stainless steel substrates 2' is located in two pieces of carbon fiber board 1'
Step surface between, i.e. stainless steel substrates 2' is L-shaped.
The other the same as in Example 1.
Embodiment 3
Difference lies in be substituted for titanium metal plate, solder is using Ni-based by stainless steel substrates with embodiment 1 or embodiment 2.
The other the same as in Example 1 or embodiment 2.
Embodiment 4
Difference lies in be substituted for nickel sheet metal, solder is using copper-based by titanium metal plate with embodiment 3.
The other the same as in Example 3.
Embodiment 5
Difference lies in stainless steel substrates are in plane, two pieces of identical carbon fiber board alignment overlap joints, and overlap joint with embodiment 1
Sandwiched stainless steel substrates in entire surface.
The other the same as in Example 1.
Be due to the bridging arrangement of carbon fiber board it will be appreciated by those skilled in the art that, not again with other attached drawings into
Row represents.
Embodiment 6
Difference lies in replaced two pieces of carbon fiber boards by two pieces of carborundum plates, the other the same as in Example 1 with embodiment 1.
Embodiment 7
Difference lies in replaced two pieces of carbon fiber boards by two blocks of corundum plates, the other the same as in Example 1 with embodiment 1.
It these are only the preferred embodiment of the present invention, be not intended to limit the invention, it is clear that those skilled in the art can
To carry out various changes, modification without departing from the spirit and scope of the present invention to the present invention.If these modifications to the present invention
Within the scope of belonging to the claims in the present invention and its equivalent technologies with modification, protection scope of the present invention is belonged to.
Claims (10)
1. a kind of multi-layer board, it is characterised in that by two pieces of non-metal boards and the metal layer group being located between two pieces of non-metal boards
Into the metal layer is penetrated into after fusing in the body hole of non-metal board, is integrally fixed with two pieces of non-metal boards, forms three
Layer composite plate structure.
2. multi-layer board according to claim 1, it is characterised in that the material of the metal layer is stainless steel, copper, titanium, nickel
Or alloy.
3. multi-layer board according to claim 1, it is characterised in that two pieces of non-metal boards are carbon fiber board, carborundum
Plate, corundum plate or pressboard.
4. multi-layer board according to claim 3, it is characterised in that the carbon fiber board is carbon fiber reinforced carbon matrix composite wood
Material.
5. according to claim 1 ~ 4 any one of them multi-layer board, it is characterised in that the metal layer is in plane, metal layer
It is located between the horizontal face of two pieces of non-metal boards, two pieces of non-metal boards are overlapped on one by way of aliging or misplacing
Rise.
6. according to claim 1 ~ 4 any one of them multi-layer board, it is characterised in that wherein one in two pieces of non-metal boards
The joint of block non-metal board is equipped with step so that two pieces of non-metal boards are adapted connection in joint, and metal layer is located in two
Between the step surface of block non-metal board.
It is 7. a kind of according to any one of claim 1 ~ 6 multi-layer board manufacturing method, it is characterised in that to comprise the following steps：
（1）Between metal layer is located in two pieces of non-metal boards, and two pieces of non-metal boards overlap after metal layer is clamped,
Form three-layer composite board；
（2）Three-layer composite board is placed in brazing device, is heated under oxygen-free environment, melts solder heat, after fusing
Solder and metal layer penetrate into non-metal board body hole in；
（3）It is cooled and shaped.
8. multi-layer board manufacturing method according to claim 7, it is characterised in that step（2）In, further comprise following step
Suddenly：
（2-1）Between three-layer composite board is delivered to two heating dish of brazing device, two heating dish do relative motion, and will
Three-layer composite board compresses, and three-layer composite board is in the welding chamber of anaerobic；
（2-2）The outer surface of three-layer composite board is contacted with the seal face of heating dish respectively, and the seal face is to be arranged at heating dish
On contain porous flase floor, make plus thermogenetic heat three-layer composite board is unhinderedly flowed into by the hole on flase floor
Surface on；
（2-3）Heating dish electrified regulation three-layer composite board, completes soldering.
9. according to the multi-layer board manufacturing method of claim 7 or 8, it is characterised in that step（2）In, it is described heating be with
It is warming up to what the mode of target temperature carried out step by step.
10. according to the multi-layer board manufacturing method of claim 7 or 8, it is characterised in that the solder uses copper, titanium or nickel
Metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610886422.2A CN107914424A (en) | 2016-10-11 | 2016-10-11 | A kind of multi-layer board and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610886422.2A CN107914424A (en) | 2016-10-11 | 2016-10-11 | A kind of multi-layer board and its manufacture method |
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| Publication Number | Publication Date |
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| CN107914424A true CN107914424A (en) | 2018-04-17 |
Family
ID=61892635
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610886422.2A Pending CN107914424A (en) | 2016-10-11 | 2016-10-11 | A kind of multi-layer board and its manufacture method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114679874A (en) * | 2020-12-24 | 2022-06-28 | 富联裕展科技(深圳)有限公司 | Metal composite part, preparation method of metal composite part and shell of electronic device |
| WO2023227461A1 (en) * | 2022-05-24 | 2023-11-30 | Siemens Energy Global GmbH & Co. KG | Method for connecting by means of a solder |
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| CN102924109A (en) * | 2012-10-18 | 2013-02-13 | 北京科技大学 | Cf/SiC ceramic matrix composite connecting method |
| CN104446592A (en) * | 2014-12-04 | 2015-03-25 | 河北工业大学 | Large-area connection method of ceramic and ceramic or ceramic and metal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1792535A (en) * | 2005-11-29 | 2006-06-28 | 西北工业大学 | Carbon/carbon composite and titanium alloy welding method |
| CN101734941A (en) * | 2008-11-20 | 2010-06-16 | 北京有色金属研究总院 | Vacuum active brazing process for C/C or C/SiC composite material and metal |
| CN101462890A (en) * | 2009-01-12 | 2009-06-24 | 北京科技大学 | Connecting method for Cf/SiC composite material and titanium alloy |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114679874A (en) * | 2020-12-24 | 2022-06-28 | 富联裕展科技(深圳)有限公司 | Metal composite part, preparation method of metal composite part and shell of electronic device |
| WO2023227461A1 (en) * | 2022-05-24 | 2023-11-30 | Siemens Energy Global GmbH & Co. KG | Method for connecting by means of a solder |
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