CN107907811A - A kind of open-circuit structure test method for being used to extract double grid GaAs pHEMT device parasitic capacitances - Google Patents

A kind of open-circuit structure test method for being used to extract double grid GaAs pHEMT device parasitic capacitances Download PDF

Info

Publication number
CN107907811A
CN107907811A CN201710887326.4A CN201710887326A CN107907811A CN 107907811 A CN107907811 A CN 107907811A CN 201710887326 A CN201710887326 A CN 201710887326A CN 107907811 A CN107907811 A CN 107907811A
Authority
CN
China
Prior art keywords
mrow
msub
grid
mfrac
mtd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710887326.4A
Other languages
Chinese (zh)
Other versions
CN107907811B (en
Inventor
吕志浩
党锐锐
徐志伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yantai Xin Yang Ju Array Microelectronics Co ltd
Original Assignee
Zhejiang University ZJU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang University ZJU filed Critical Zhejiang University ZJU
Priority to CN201710887326.4A priority Critical patent/CN107907811B/en
Publication of CN107907811A publication Critical patent/CN107907811A/en
Application granted granted Critical
Publication of CN107907811B publication Critical patent/CN107907811B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/2637Circuits therefor for testing other individual devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2605Measuring capacitance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A kind of open-circuit structure test method for being used to extract double grid GaAs pHEMT device parasitic capacitances, including step 1:Open test structure is designed, and establishes open test structure equivalent circuit;Open test structure includes the interconnection line (Interconnect) for drawing double grid GaAs pHEMT device interfaces and with probe contact come the pad (PAD) that is biased;Step 2:Measure three port S parameters of open test structure;Wherein the S parameter (scattering parameter) of open test structure is measured using vector network analyzer.During measurement, three port S parameters of open-circuit structure are measured in the range of the working frequency range of device using vector network analyzer.Step 3:The S parameter measured in step 1 is converted into Y parameter, the value of parasitic capacitance is calculated by Y parameter.Wherein, three port S parameters are converted to Y parameter and are carried out by s2y functions in Matlab, and Y parameter method for expressing is obtained using the equivalent circuit of open test structure.

Description

A kind of open-circuit structure for being used to extract double grid GaAs pHEMT device parasitic capacitances is surveyed Method for testing
Technical field
The present invention relates to microwave device testing field, is related to a kind of one kind of double grid GaAs pHEMT device parasitic capacitances Open test structure extraction method.
Technical background
Double-gated devices are widely used in power amplifier, phase shifter, frequency mixer and monolithic integrated microwave circuit.Traditional In modeling method, small-signal model is preferentially established to facilitate the foundation of subsequent large-signal model.So accurately establish small Signal model is very crucial.
For the small-signal model of single gate device, most-often used method be by numerical optimization make the S parameter of model with The S parameter fitting measured.But contain ectoparasitism parameter and two for double grid GaAs pHEMT devices, its small-signal The inside intrinsic parameters of pHEMT, add up 29 unknown parameters altogether, therefore, it is desirable to the measurement data by three port S parameters It is extremely difficult to be fitted.In fact, since double-gate structure is different from single grid, it is difficult to directly by the analysis side of single gate device Method is directly applied in double-gated devices.
Deng et al. [Deng W K, Chu T H.Elements extraction of GaAs dual-gate MESFET small-signal equivalent circuit[J].IEEE Transactions on Microwave Theory&Techniques,1998:2383-2390.] propose a set of extraction double grid ectoparasitism parameter and internal intrinsic ginseng Several flows.Using the method for analysis, by the way that in device bias, under cut-off condition, test frequency is to measure in the case of low frequency Y parameter is calculated, so as to directly obtain the value of parasitic capacitance.And in fact, by it is this end in device, low frequency measurement The capacitance that method obtains usually has certain change compared with actual value, and some internal intrinsic parameters are joined for ectoparasitism Several changes is very sensitive, and the inside intrinsic parameters that may be such that extraction are negative value.
The open test structure of single grid just extensive use after doctor's Wijinen invention first in 1987, using single grid Test structure can accurately extract parasitic capacitance parameter, L Shen et al. [Sun L, Gao J, Shen L.Direct Extraction of Equivalent Circuit Parameters for GaAs pHEMT[J].Journal of Computational&Theoretical Nanoscience,2015,12(6):996-1001 (6)] using analysis method and Open test structural approach makes the effective frequency of small-signal modeling be up to 110GHz.It can be seen that single grid GaAs pHEMT devices are opened Road test structure can reach good precision, however, open test structure and method for double grid GaAs pHEMT devices Itd is proposed still without people.
In order to overcome the disadvantages mentioned above of the prior art, the present invention proposes one kind and is applied to double grid GaAs pHEMT devices Open test structure, for extracting the external parasitic capacitances of double grid GaAs pHEMT devices.
The content of the invention
The present invention will overcome the disadvantages mentioned above of the prior art, there is provided it is a kind of applied to double grid GaAs pHEMT devices can In the method for direct, accurate extraction external parasitic capacitances.
To achieve the above object, it is provided by the present invention a kind of for extracting double grid GaAs pHEMT device parasitic capacitances Open-circuit structure test method, include the following steps:
Step 1:Open test structure is designed, and establishes open test structure equivalent circuit;
Step 2:Measure three port S parameters of open test structure;
Step 3:The S parameter measured in step 2 is converted into Y parameter, parasitic capacitance is calculated by Y parameter Value.
In the step 1, designed open-circuit structure as shown in Fig. 2, the structure is similar to device under test test structure, But measured device double grid GaAs pHEMT devices are not included.Open test structure is included double grid GaAs pHEMT device interfaces The interconnection line (Interconnect) of extraction and with probe contact come the pad (PAD) that is biased.Open test structure is equivalent Circuit is as shown in figure 3, including coupling capacitor part 200 between pad parasitic capacitance portion 100 and pad;
The pad parasitic capacitance portion 100 by first grid parasitic capacitance Cpg1, second grid parasitic capacitance Cpg2 and Drain parasitic capacitance Cpd is formed, wherein:One end of first grid parasitic capacitance Cpg1 is connected with first grid node G1, separately One end is connected with the first source node S-phase;One end of second grid parasitic capacitance Cpg2 is connected with second grid node G2, separately One end is connected with the first source node S-phase;One end of drain parasitic capacitance Cpd is connected with the second drain node D, the other end with First source node S-phase connects;
Coupling capacitor part 200 is by coupled capacitor Cg1g2, the first grid between first grid and second grid between the pad Coupled capacitor Cg2d is formed between coupled capacitor Cg1d and second grid and drain electrode between pole and drain electrode, wherein:First grid and second One end of coupled capacitor Cg1g2 is connected with first grid node G1 between grid, and the other end is connected with second grid node G2; One end of coupled capacitor Cg1d is connected with first grid node G1 between first grid and drain electrode, the other end and the second drain node D is connected;One end of coupled capacitor Cg2d is connected with second grid node G2 between second grid and drain electrode, the other end and second Drain node D is connected.
In the step 2, the S parameter (scattering parameter) of vector network analyzer measurement open test structure is utilized.Measurement When, three port S parameters of open-circuit structure are measured in the range of the working frequency range of device using vector network analyzer, such as 10MHz to 40GHz.
In the step 3, three port S parameters measured in step 2 are converted into Y ginsengs by s2y functions in Matlab Number.The equivalent circuit established from step 1 obtains Y parameter matrix, and the value of each parasitic capacitance is tried to achieve by the imaginary part of Y parameter, public Formula is as follows:
Y11=j ω (Cpg1+Cpg1d+Cpg1g2)
Y22=j ω (Cpg2+Cpg2d)
Y33=j ω (Cpd+Cpg1d+Cpg2d)
Y12=Y21=-j ω Cpg1g2
Y13=Y31=-j ω Cpg1d
Y23=Y32=-j ω Cpg2d
The exact value of parasitic capacitance can be obtained by being calculated by Y parameter:
Wherein, YPAD represents the admittance parameter of open test structure equivalent circuit, it is assumed that first grid node G1 port numbers For 1, second grid node G2 port numbers are 2, and the second drain node D port numbers are 3, then Y11, Y22, Y33 represent 1,2,3 respectively The input admittance of port, Y12 represent that the transfer admittance of port 1 is arrived in port 2, and Y13 represents that the transfer admittance of port 1 is arrived in port 3, Y23 represents that the transfer admittance of port 2 is arrived in port 3.
Wherein, Cpg1 represents that first grid parasitic capacitance, Cpg2 represent that second grid parasitic capacitance, Cpd represent that drain electrode is posted Raw capacitance, Cg1g2 represent that first grid represents to couple electricity between first grid and drain electrode with coupled capacitor, Cg1d between second grid Hold, Cg2d represents coupled capacitor between second grid and drain electrode.The value of each parasitic capacitance can be obtained by being calculated more than.
The beneficial effects of the invention are as follows:
The present invention, which is directed in the method directly extracted for double grid GaAs pHEMT device parasitic capacitances at present, passes through device The capacitance and this inaccurate defect of internal intrinsic parameters that cut-off, the method for low frequency measurement obtain, it is proposed that one kind is used for double The open test structure extraction of parasitic capacitance method of grid GaAs pHEMT devices, parasitic capacitance, physical significance are extracted by this method Clearly, extracting method is simple, and accuracy is high, can effectively improve the precision of double grid GaAs pHEMT device small-signal models.
Brief description of the drawings
Fig. 1 is double grid GaAs pHEMT small-signal equivalent circuits;
Fig. 2 is the open test structure used in the present invention;
Fig. 3 is the equivalent circuit of open test structure;
Fig. 4 is the flow chart of open test structure extraction parasitic capacitance;
Embodiment
Below in conjunction with the attached drawing in present example, the technical solution in present example is carried out clear, complete Description.In without departing substantially from inventive concept spirit and scope, various changes and advantages that will be apparent to those skilled in the art are included in In the present invention, and with the big protection domain of appended claims.Implement procedures, conditions, experimental methods of the present invention etc., remove Outside the content specially referred to below, it is among the general principles and common general knowledge in the art, content is not particularly limited in the present invention.
A kind of open-circuit structure test side for being used to extract double grid GaAs pHEMT device parasitic capacitances provided by the invention Method, includes the following steps:
Step 1:Open test structure is designed, and establishes open test structure equivalent circuit;
Step 2:Measure three port S parameters of open test structure;
Step 3:The S parameter measured in step 2 is converted into Y parameter, parasitic capacitance is calculated by Y parameter Value.
In the step 1, designed open-circuit structure as shown in Fig. 2, the structure is similar to device under test test structure, But measured device double grid GaAs pHEMT devices are not included.Open test structure is included double grid GaAs pHEMT device interfaces The interconnection line (Interconnect) of extraction and with probe contact come the pad (PAD) that is biased.Open test structure is equivalent Circuit is as shown in figure 3, including coupling capacitor part 200 between pad parasitic capacitance portion 100 and pad;
The pad parasitic capacitance portion 100 by first grid parasitic capacitance Cpg1, second grid parasitic capacitance Cpg2 and Drain parasitic capacitance Cpd is formed, wherein:One end of first grid parasitic capacitance Cpg1 is connected with first grid node G1, separately One end is connected with the first source node S-phase;One end of second grid parasitic capacitance Cpg2 is connected with second grid node G2, separately One end is connected with the first source node S-phase;One end of drain parasitic capacitance Cpd is connected with the second drain node D, the other end with First source node S-phase connects;
Coupling capacitor part 200 is by coupled capacitor Cg1g2, the first grid between first grid and second grid between the pad Coupled capacitor Cg2d is formed between coupled capacitor Cg1d and second grid and drain electrode between pole and drain electrode, wherein:First grid and second One end of coupled capacitor Cg1g2 is connected with first grid node G1 between grid, and the other end is connected with second grid node G2; One end of coupled capacitor Cg1d is connected with first grid node G1 between first grid and drain electrode, the other end and the second drain node D is connected;One end of coupled capacitor Cg2d is connected with second grid node G2 between second grid and drain electrode, the other end and second Drain node D is connected.
In the step 2, the S parameter (scattering parameter) of vector network analyzer measurement open test structure is utilized.Measurement When, three port S parameters of open-circuit structure are measured in the range of the working frequency range of device using vector network analyzer, such as 10MHz to 40GHz.
In the step 3, three port S parameters measured in step 2 are converted into Y ginsengs by s2y functions in Matlab Number.The equivalent circuit established from step 1 obtains Y parameter matrix, and the value of each parasitic capacitance is tried to achieve by the imaginary part of Y parameter, public Formula is as follows:
Y11=j ω (Cpg1+Cpg1d+Cpg1g2)
Y22=j ω (Cpg2+Cpg2d)
Y33=j ω (Cpd+Cpg1d+Cpg2d)
Y12=Y21=-j ω Cpg1g2
Y13=Y31=-j ω Cpg1d
Y23=Y32=-j ω Cpg2d
The exact value of parasitic capacitance can be obtained by being calculated by Y parameter:
Wherein, YPAD represents the admittance parameter of open test structure equivalent circuit, it is assumed that first grid node G1 port numbers For 1, second grid node G2 port numbers are 2, and the second drain node D port numbers are 3, then Y11, Y22, Y33 represent 1,2,3 respectively The input admittance of port, Y12 represent that the transfer admittance of port 1 is arrived in port 2, and Y13 represents that the transfer admittance of port 1 is arrived in port 3, Y23 represents that the transfer admittance of port 2 is arrived in port 3.
Wherein, Cpg1 represents that first grid parasitic capacitance, Cpg2 represent that second grid parasitic capacitance, Cpd represent that drain electrode is posted Raw capacitance, Cg1g2 represent that first grid represents to couple electricity between first grid and drain electrode with coupled capacitor, Cg1d between second grid Hold, Cg2d represents coupled capacitor between second grid and drain electrode.The value of each parasitic capacitance can be obtained by being calculated more than.

Claims (1)

1. a kind of open-circuit structure test method for being used to extract double grid GaAs pHEMT device parasitic capacitances, includes the following steps:
Step 1:Open test structure is designed, and establishes open test structure equivalent circuit;
Step 2:Measure three port S parameters of open test structure;
Step 3:The S parameter measured in step 2 is converted into Y parameter, parasitic capacitance is calculated by Y parameter Value;
In the step 1, open test structure is identical with the test structure of device under test, but not comprising tested double grid GaAs PHEMT devices;Open test structure include by double grid GaAs pHEMT device interfaces draw interconnection line Interconnect and With probe contact come the pad PAD that is biased;Open test structure equivalent circuit include pad parasitic capacitance portion (100) and Coupling capacitor part (200) between pad;
The pad parasitic capacitance portion (100) is by first grid parasitic capacitance Cpg1, second grid parasitic capacitance Cpg2 and leakage Pole parasitic capacitance Cpd is formed, wherein:One end of first grid parasitic capacitance Cpg1 is connected with first grid node G1, another End is connected with the first source node S-phase;One end of second grid parasitic capacitance Cpg2 is connected with second grid node G2, another End is connected with the first source node (S);One end of drain parasitic capacitance Cpd is connected with the second drain node D, the other end with First source node S-phase connects;
Coupling capacitor part (200) is by coupled capacitor Cg1g2, first grid between first grid and second grid between the pad Coupled capacitor Cg2d is formed between coupled capacitor Cg1d and second grid and drain electrode between drain electrode, wherein:First grid and second gate One end of interpolar coupled capacitor Cg1g2 is connected with first grid node G1, and the other end is connected with second grid node G2;The One end of coupled capacitor Cg1d is connected with first grid node G1 between one grid and drain electrode, the other end and the second drain node D It is connected;One end of coupled capacitor Cg2d is connected with second grid node G2 between second grid and drain electrode, the other end and second Drain node D is connected;
In the step 2, the S parameter (scattering parameter) of vector network analyzer measurement open test structure is utilized;During measurement, Three port S parameters of open-circuit structure are measured in the range of the working frequency range of device using vector network analyzer, such as 10MHz is arrived 40GHz;
In the step 3, three port S parameters measured in step 2 are converted into Y parameter by s2y functions in Matlab;From The equivalent circuit established in step 1 obtains Y parameter matrix, the value of each parasitic capacitance is tried to achieve by the imaginary part of Y parameter, formula is such as Shown in lower:
<mrow> <msub> <mi>Y</mi> <mrow> <mi>P</mi> <mi>A</mi> <mi>D</mi> </mrow> </msub> <mo>=</mo> <mfenced open = "[" close = "]"> <mtable> <mtr> <mtd> <mrow> <mi>j</mi> <mi>&amp;omega;</mi> <mrow> <mo>(</mo> <msub> <mi>C</mi> <mrow> <mi>p</mi> <mi>g</mi> <mn>1</mn> </mrow> </msub> <mo>+</mo> <msub> <mi>C</mi> <mrow> <mi>g</mi> <mn>1</mn> <mi>d</mi> </mrow> </msub> <mo>+</mo> <msub> <mi>C</mi> <mrow> <mi>g</mi> <mn>1</mn> <mi>g</mi> <mn>2</mn> </mrow> </msub> <mo>)</mo> </mrow> </mrow> </mtd> <mtd> <mrow> <mo>-</mo> <msub> <mi>j&amp;omega;C</mi> <mrow> <mi>g</mi> <mn>1</mn> <mi>g</mi> <mn>2</mn> </mrow> </msub> </mrow> </mtd> <mtd> <mrow> <mo>-</mo> <msub> <mi>j&amp;omega;C</mi> <mrow> <mi>g</mi> <mn>1</mn> <mi>d</mi> </mrow> </msub> </mrow> </mtd> </mtr> <mtr> <mtd> <mrow> <mo>-</mo> <msub> <mi>j&amp;omega;C</mi> <mrow> <mi>g</mi> <mn>1</mn> <mi>g</mi> <mn>2</mn> </mrow> </msub> </mrow> </mtd> <mtd> <mrow> <mi>j</mi> <mi>&amp;omega;</mi> <mrow> <mo>(</mo> <msub> <mi>C</mi> <mrow> <mi>p</mi> <mi>g</mi> <mn>2</mn> </mrow> </msub> <mo>+</mo> <msub> <mi>C</mi> <mrow> <mi>g</mi> <mn>2</mn> <mi>d</mi> </mrow> </msub> <mo>)</mo> </mrow> </mrow> </mtd> <mtd> <mrow> <mo>-</mo> <msub> <mi>j&amp;omega;C</mi> <mrow> <mi>g</mi> <mn>2</mn> <mi>d</mi> </mrow> </msub> </mrow> </mtd> </mtr> <mtr> <mtd> <mrow> <mo>-</mo> <msub> <mi>j&amp;omega;C</mi> <mrow> <mi>g</mi> <mn>1</mn> <mi>d</mi> </mrow> </msub> </mrow> </mtd> <mtd> <mrow> <mo>-</mo> <msub> <mi>j&amp;omega;C</mi> <mrow> <mi>g</mi> <mn>2</mn> <mi>d</mi> </mrow> </msub> </mrow> </mtd> <mtd> <mrow> <mi>j</mi> <mi>&amp;omega;</mi> <mrow> <mo>(</mo> <msub> <mi>C</mi> <mrow> <mi>p</mi> <mi>d</mi> </mrow> </msub> <mo>+</mo> <msub> <mi>C</mi> <mrow> <mi>g</mi> <mn>1</mn> <mi>d</mi> </mrow> </msub> <mo>+</mo> <msub> <mi>C</mi> <mrow> <mi>g</mi> <mn>2</mn> <mi>d</mi> </mrow> </msub> <mo>)</mo> </mrow> </mrow> </mtd> </mtr> </mtable> </mfenced> </mrow>
Y11=j ω (Cpg1+Cpg1d+Cpg1g2)
Y22=j ω (Cpg2+Cpg2d)
Y33=j ω (Cpd+Cpg1d+Cpg2d)
Y12=Y21=-j ω Cpg1g2
Y13=Y31=-j ω Cpg1d
Y23=Y32=-j ω Cpg2d
The exact value of parasitic capacitance can be obtained by being calculated by Y parameter:
<mrow> <msub> <mi>C</mi> <mrow> <mi>p</mi> <mi>g</mi> <mn>1</mn> </mrow> </msub> <mo>=</mo> <mfrac> <mn>1</mn> <mi>&amp;omega;</mi> </mfrac> <mi>Im</mi> <mrow> <mo>(</mo> <msub> <mi>Y</mi> <mn>11</mn> </msub> <mo>+</mo> <msub> <mi>Y</mi> <mn>12</mn> </msub> <mo>+</mo> <msub> <mi>Y</mi> <mn>13</mn> </msub> <mo>)</mo> </mrow> </mrow>
<mrow> <msub> <mi>C</mi> <mrow> <mi>p</mi> <mi>g</mi> <mn>2</mn> </mrow> </msub> <mo>=</mo> <mfrac> <mn>1</mn> <mi>&amp;omega;</mi> </mfrac> <mi>Im</mi> <mrow> <mo>(</mo> <msub> <mi>Y</mi> <mn>22</mn> </msub> <mo>+</mo> <msub> <mi>Y</mi> <mn>23</mn> </msub> <mo>)</mo> </mrow> </mrow>
<mrow> <msub> <mi>C</mi> <mrow> <mi>p</mi> <mi>d</mi> </mrow> </msub> <mo>=</mo> <mfrac> <mn>1</mn> <mi>&amp;omega;</mi> </mfrac> <mi>Im</mi> <mrow> <mo>(</mo> <msub> <mi>Y</mi> <mn>33</mn> </msub> <mo>+</mo> <msub> <mi>Y</mi> <mn>13</mn> </msub> <mo>+</mo> <msub> <mi>Y</mi> <mn>23</mn> </msub> <mo>)</mo> </mrow> </mrow>
<mrow> <msub> <mi>C</mi> <mrow> <mi>g</mi> <mn>1</mn> <mi>g</mi> <mn>2</mn> </mrow> </msub> <mo>=</mo> <mo>-</mo> <mfrac> <mn>1</mn> <mi>&amp;omega;</mi> </mfrac> <msub> <mi>ImY</mi> <mn>12</mn> </msub> <mo>=</mo> <mo>-</mo> <mfrac> <mn>1</mn> <mi>&amp;omega;</mi> </mfrac> <msub> <mi>ImY</mi> <mn>21</mn> </msub> </mrow>
<mrow> <msub> <mi>C</mi> <mrow> <mi>g</mi> <mn>1</mn> <mi>d</mi> </mrow> </msub> <mo>=</mo> <mo>-</mo> <mfrac> <mn>1</mn> <mi>&amp;omega;</mi> </mfrac> <msub> <mi>ImY</mi> <mn>13</mn> </msub> <mo>=</mo> <mo>-</mo> <mfrac> <mn>1</mn> <mi>&amp;omega;</mi> </mfrac> <msub> <mi>ImY</mi> <mn>31</mn> </msub> </mrow>
<mrow> <msub> <mi>C</mi> <mrow> <mi>g</mi> <mn>2</mn> <mi>d</mi> </mrow> </msub> <mo>=</mo> <mo>-</mo> <mfrac> <mn>1</mn> <mi>&amp;omega;</mi> </mfrac> <msub> <mi>ImY</mi> <mn>23</mn> </msub> <mo>=</mo> <mo>-</mo> <mfrac> <mn>1</mn> <mi>&amp;omega;</mi> </mfrac> <msub> <mi>ImY</mi> <mn>32</mn> </msub> <mo>;</mo> </mrow>
Wherein, YPADRepresenting the admittance parameter of open test structure equivalent circuit, it is assumed that first grid node G1 port numbers are 1, the Two gate node G2 port numbers are 2, and the second drain node D port numbers are 3, then Y11, Y22, Y33 represent 1,2,3 ports respectively Input admittance, Y12 represent that the transfer admittance of port 1 is arrived in port 2, and Y13 represents that the transfer admittance of port 1 is arrived in port 3, and Y23 is represented The transfer admittance of port 2 is arrived in port 3;
Wherein, Cpg1 represents that first grid parasitic capacitance, Cpg2 represent that second grid parasitic capacitance, Cpd represent drain parasitic electricity Hold, Cg1g2 represent coupled capacitor between first grid and second grid, Cg1d represent coupled capacitor between first grid and drain electrode, Cg2d represents coupled capacitor between second grid and drain electrode;The value of each parasitic capacitance can be obtained by being calculated more than.
CN201710887326.4A 2017-09-27 2017-09-27 It is a kind of for extracting the open-circuit structure test method of double grid GaAs pHEMT device parasitic capacitor Active CN107907811B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710887326.4A CN107907811B (en) 2017-09-27 2017-09-27 It is a kind of for extracting the open-circuit structure test method of double grid GaAs pHEMT device parasitic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710887326.4A CN107907811B (en) 2017-09-27 2017-09-27 It is a kind of for extracting the open-circuit structure test method of double grid GaAs pHEMT device parasitic capacitor

Publications (2)

Publication Number Publication Date
CN107907811A true CN107907811A (en) 2018-04-13
CN107907811B CN107907811B (en) 2019-06-11

Family

ID=61841051

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710887326.4A Active CN107907811B (en) 2017-09-27 2017-09-27 It is a kind of for extracting the open-circuit structure test method of double grid GaAs pHEMT device parasitic capacitor

Country Status (1)

Country Link
CN (1) CN107907811B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023240742A1 (en) * 2022-06-14 2023-12-21 长鑫存储技术有限公司 Circuit noise parameter acquisition method and electronic device
US12087385B2 (en) 2022-06-14 2024-09-10 Changxin Memory Technologies, Inc. Method for obtaining circuit noise parameters and electronic device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102521447A (en) * 2011-12-08 2012-06-27 清华大学 Parametric modeling method of millimeter wave field effect transistor based on binary combination
CN102542077A (en) * 2010-12-15 2012-07-04 中国科学院微电子研究所 Parameter extraction method of AlGaN/GaN HEMT small-signal model
CN103995933A (en) * 2014-06-18 2014-08-20 上海傲亚微电子有限公司 Novel transistor small-signal equivalent circuit model
CN104142436A (en) * 2013-05-07 2014-11-12 上海华虹宏力半导体制造有限公司 Testing structures and testing method for three-port RF devices
CN104298837A (en) * 2014-11-12 2015-01-21 东南大学 Device equivalent circuit model parameter extracting method and bonding pad parasitic parameter extracting method
CN105046066A (en) * 2015-07-02 2015-11-11 中航(重庆)微电子有限公司 AlGaN/GaN HETM small-signal model and parameter extraction method thereof
CN105138730A (en) * 2015-07-27 2015-12-09 电子科技大学 Method for extracting small-signal model parameters of gallium nitride high-electron-mobility transistor
CN107167724A (en) * 2017-06-02 2017-09-15 厦门市三安集成电路有限公司 What a kind of small-signal was measured goes embedding method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102542077A (en) * 2010-12-15 2012-07-04 中国科学院微电子研究所 Parameter extraction method of AlGaN/GaN HEMT small-signal model
CN102521447A (en) * 2011-12-08 2012-06-27 清华大学 Parametric modeling method of millimeter wave field effect transistor based on binary combination
CN104142436A (en) * 2013-05-07 2014-11-12 上海华虹宏力半导体制造有限公司 Testing structures and testing method for three-port RF devices
CN103995933A (en) * 2014-06-18 2014-08-20 上海傲亚微电子有限公司 Novel transistor small-signal equivalent circuit model
CN104298837A (en) * 2014-11-12 2015-01-21 东南大学 Device equivalent circuit model parameter extracting method and bonding pad parasitic parameter extracting method
CN105046066A (en) * 2015-07-02 2015-11-11 中航(重庆)微电子有限公司 AlGaN/GaN HETM small-signal model and parameter extraction method thereof
CN105138730A (en) * 2015-07-27 2015-12-09 电子科技大学 Method for extracting small-signal model parameters of gallium nitride high-electron-mobility transistor
CN107167724A (en) * 2017-06-02 2017-09-15 厦门市三安集成电路有限公司 What a kind of small-signal was measured goes embedding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023240742A1 (en) * 2022-06-14 2023-12-21 长鑫存储技术有限公司 Circuit noise parameter acquisition method and electronic device
US12087385B2 (en) 2022-06-14 2024-09-10 Changxin Memory Technologies, Inc. Method for obtaining circuit noise parameters and electronic device

Also Published As

Publication number Publication date
CN107907811B (en) 2019-06-11

Similar Documents

Publication Publication Date Title
CN105787210B (en) GaN high electron mobility transistor small-signal circuit model parameter extracting method
CN105138730B (en) GaN high electron mobility transistor small-signal model parameter extracting method
CN106529102B (en) AlGaN/GaN HEMT small signal model and parameter extraction method thereof
CN106372357B (en) A kind of GaN HEMT nonlinear noise method for establishing model
CN105426570B (en) GaN HEMT large-signal model improved method based on active compensation sub-circuit
CN106202835A (en) Comprise the field-effect transistor small signal equivalent circuit model of the senior parasitic antenna of raceway groove
CN104298837B (en) Device equivalent circuit model parameter extracting method and pad parasitic parameter extraction method
CN105825005B (en) The construction method of the non-linear scalable model of GaN high electron mobility transistor
CN107907811B (en) It is a kind of for extracting the open-circuit structure test method of double grid GaAs pHEMT device parasitic capacitor
CN105844059B (en) A kind of microwave high-power transistor modeling method
CN105184032A (en) Establishing method for improved HBT small-signal equivalent circuit model
CN101976293A (en) MOS (Metal Oxide Semiconductor) transistor radio frequency macro model establishing method
CN107167724B (en) A kind of small measuring signal goes embedding method
CN111679171A (en) Circuit topological structure based on interconnection line unit and de-embedding method for interconnection line unit cascade
CN206421387U (en) AlGaN/GaN HEMT small-signal models
Cho et al. A shield-based three-port de-embedding method for microwave on-wafer characterization of deep-submicrometer silicon MOSFETs
CN109683078B (en) Schottky diode testing method and device
CN112434482A (en) Circuit structure for constructing CNTFET small signal model and parameter extraction method
Jargon et al. Nonlinear large-signal scattering parameters: Theory and applications
CN106055765B (en) The noise model method for building up of millimeter wave FET
CN104978443B (en) Device analog method for integrated circuit
CN110008489A (en) A kind of THz frequency range InP DHBT device test structure modeling method
Huang et al. A new extraction method of extrinsic elements of GaAs/GaN HEMTs
CN106250622A (en) A kind of FET microwave noise method for establishing model
Lai et al. LDMOS modeling

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230323

Address after: 316000 Room 202, 11 Baichuan Road, Lincheng street, Dinghai District, Zhoushan City, Zhejiang Province (centralized office)

Patentee after: ZHEJIANG JISU HEXIN TECHNOLOGY CO.,LTD.

Address before: 310027 No. 38, Zhejiang Road, Hangzhou, Zhejiang, Xihu District

Patentee before: ZHEJIANG University

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230627

Address after: Plant 1, No. 13, Guiyang Avenue, Yantai Economic and Technological Development Zone, Shandong Province, 264000

Patentee after: Yantai Xin Yang Ju Array Microelectronics Co.,Ltd.

Address before: 316000 Room 202, 11 Baichuan Road, Lincheng street, Dinghai District, Zhoushan City, Zhejiang Province (centralized office)

Patentee before: ZHEJIANG JISU HEXIN TECHNOLOGY CO.,LTD.