CN107892892A - A kind of high temperature resistant adhesive for silicon nitride antenna house and application thereof and method - Google Patents
A kind of high temperature resistant adhesive for silicon nitride antenna house and application thereof and method Download PDFInfo
- Publication number
- CN107892892A CN107892892A CN201711217284.XA CN201711217284A CN107892892A CN 107892892 A CN107892892 A CN 107892892A CN 201711217284 A CN201711217284 A CN 201711217284A CN 107892892 A CN107892892 A CN 107892892A
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- CN
- China
- Prior art keywords
- high temperature
- temperature resistant
- resistant adhesive
- silicon nitride
- antenna house
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of high temperature resistant adhesive for silicon nitride antenna house and application thereof and method, the bonding agent to include the component of following mass fraction：10 parts of epoxy resin, 1 part of liquid nitrile rubber, 5 parts of schmigels and 1~2 part of 2 methylimidazole of ethyl 4.The high temperature resistant adhesive of the present invention, certain surface treatment, technique for sticking is coordinated to realize the bonding to silicon nitride antenna house, disclosure satisfy that the bonding application of silicon nitride antenna house in Aero-Space industry field, can under the severe environmental conditions such as high/low temperature, high humility, mechanical oscillation normal work.
Description
Technical field
The present invention relates to a kind of high temperature resistant adhering method, and in particular to a kind of high temperature resistant for silicon nitride antenna house is bonded
Agent and application thereof and method.
Background technology
Silicon nitride antenna house is used for the erosion for protecting an antenna from the adverse circumstances such as high/low temperature, high humility, sleet, sand and dust,
Ensure that antenna and internal component are normal, reliably work, it has the function that important.Therefore, it is necessary to using suitable method
Silicon nitride antenna house and metal connection ring are connected.
Because silicon nitride material property is hard, crisp, the connected modes such as conventional screw thread, welding can not be taken, therefore using resistance to
High temperature adhesive bonding is a kind of optimal connected mode, and the performance indications of the high-temperature resistance adhesive are as shown in table 1：
Table 1：The performance indications of high-temperature resistance adhesive
。
By the inquiry to domestic existing patent, prior art discloses the knot of some high temperature resistant silicon nitride antenna houses
Structure, material and preparation method.As Chinese patent CN103724036A discloses a kind of Wave-transparent silicon nitride radome material and its system
Preparation Method, Chinese patent CN102916251A disclose a kind of gradient porous silicon nitride antenna cover structure of high-temperature wide-frequency, and China is specially
Sharp CN102931483A discloses a kind of high-temperature wide-frequency symmetric gradient porous silicon nitride antenna cover structure etc., but these patents do not have
Relate to the high temperature resistant adhering method of silicon nitride antenna house.
The content of the invention
It is an object of the invention to provide a kind of high temperature resistant adhesive for silicon nitride antenna house and application thereof and method, solution
Determine bonding problem of the silicon nitride antenna house with metal connection ring, can be in adverse circumstances such as high/low temperature, high humility, mechanical oscillation
Under the conditions of normal work, adhesive property is good, meets the bonding application of silicon nitride antenna house in Aero-Space industry field.
In order to achieve the above object, the invention provides a kind of high temperature resistant adhesive for silicon nitride antenna house, this is viscous
Connect the component that agent includes following mass fraction：10 parts of epoxy resin, 1 part of liquid nitrile rubber, 5 parts of schmigels and 1~2 part of 2- second
Base -4-methylimidazole.
Described epoxy resin includes：Bisphenol A type epoxy resin.
Described bisphenol A type epoxy resin is EP01441-310 bisphenol A type epoxy resins.
This law invention additionally provides a kind of purposes of high temperature resistant adhesive, and the high temperature resistant adhesive is to be used for nitrogen as mentioned
The high temperature resistant adhesive of SiClx antenna house, it is used for bonding between metal and nonmetallic materials.
The silicon nitride antenna house that described high temperature resistant adhesive is used for aerospace field is bonding with metal connection ring.
The application temperature of described high temperature resistant adhesive is -40 DEG C~200 DEG C.
This law invention additionally provides a kind of bonding side of the high temperature resistant adhesive for silicon nitride antenna house described in basis
Method, this method include：Antenna house is polished, applies glue sticking in bonding gap, bonding completes solidify afterwards.
Described polishing uses the white fused alumina sand paper of 80 mesh.
Described bonding gap is 0.15~0.30mm.
The temperature of described solidification is 100 DEG C.
High temperature resistant adhesive for silicon nitride antenna house of the present invention and application thereof and method, solve silicon nitride antenna
The bonding problem with metal connection ring is covered, there is advantages below：
(1) high temperature resistant adhesive of the invention is directed to loose nitride porous silicon materials, and it can realize adhesive strength height, resistance to
High temperature and the high requirement of reliability；
(2) high temperature resistant adhesive of the invention has certain toughness, intensity high, is adapted between metal and nonmetallic materials
Bonding, can apply to temperature in use as the bonding under the conditions of -40 DEG C~200 DEG C；
(3) high temperature resistant adhesive of the invention disclosure satisfy that the bonding of silicon nitride antenna house in Aero-Space industry field should
With, can under the severe environmental conditions such as high/low temperature, high humility, mechanical oscillation normal work；
(4) requirement of method of the invention to bonding gap, it can be ensured that optimal adhesive strength, while high temperature resistant can be glued
Connect agent to keep fixing in gap, be not lost in, it is ensured that adhesive strength；
(5) the strict control of method of the invention to the temperature of solidification, can make curing efficiency highest, adhesive strength optimal,
Reduce the internal stress in solidification process simultaneously.
Embodiment
Technical scheme is described further with reference to embodiments.
A kind of high temperature resistant adhesive for silicon nitride antenna house, the bonding agent include the component of following mass fraction：10
Part epoxy resin, 1 part of liquid nitrile rubber, 5 parts of schmigels and 1~2 part of 2-ethyl-4-methylimidazole.In high-temperature resistance adhesive
Using epoxy resin as matrix composition.Liquid nitrile rubber is toughener, can improve the hard crisp characteristic of epoxy resin.Schmigel is to fill out
Material, plays strengthening action.2-ethyl-4-methylimidazole is curing agent.
Epoxy resin includes：Bisphenol A type epoxy resin.
Bisphenol A type epoxy resin is EP01441-310 bisphenol A type epoxy resins.
A kind of purposes of high temperature resistant adhesive, the high temperature resistant adhesive are that the above-mentioned high temperature resistant for silicon nitride antenna house is glued
Agent is connect, it is used for bonding between metal and nonmetallic materials.
The silicon nitride antenna house that the high temperature resistant adhesive is used for aerospace field is bonding with metal connection ring, and it is applied
Temperature is -40 DEG C~200 DEG C.
A kind of adhering method of the above-mentioned high temperature resistant adhesive for silicon nitride antenna house, this method include：To antenna house
Polished, apply glue sticking in bonding gap, bonding completes solidify afterwards.
Polishing uses the white fused alumina sand paper of 80 mesh.From white fused alumina sand paper when polishing silicon nitride antenna house, it will not produce
Raw coloured cut.Polishing can ensure polishing effect using the specification of 80 mesh in the case where ensuring that roughness, uniformity are consistent
Rate.
Bonding gap is 0.15~0.30mm, it can be ensured that optimal adhesive strength, while can make high temperature resistant adhesive
Fixing is kept in gap, is not lost in, it is ensured that adhesive strength.
The temperature of solidification is 100 DEG C, curing efficiency highest, adhesive strength can be made optimal, while reduce in solidification process
Internal stress.
Embodiment 1
A kind of high temperature resistant adhesive for silicon nitride antenna house, original of the bonding agent based on comprising following mass fraction
Material：100 parts of bisphenol A-type EP01441-310 epoxy resin, 10 parts of liquid nitrile rubber, 50 parts of schmigel, 10 parts of 2-
Ethyl -4-methylimidazole, it is not necessary to add other solvents.
By being stirred above-mentioned component, high temperature resistant adhesive is made.The white fused alumina sand paper pair of 80 mesh is used before bonding
Antenna house is polished, and bonding gap is 0.15mm, solidifies 3h at 100 DEG C after the completion of painting glue sticking.
As shown in table 2, for the embodiment of the present invention 1 high temperature resistant epoxy shear strength performance test data, contrast table 1
Understand that the properties of embodiment 1 meet index request with table 2.
Table 2：The shear strength performance test data of the high temperature resistant epoxy of the embodiment of the present invention 1
Embodiment 2
A kind of high temperature resistant adhesive for silicon nitride antenna house, original of the bonding agent based on comprising following mass fraction
Material：100 parts of bisphenol A-type EP01441-310 epoxy resin, 10 parts of liquid nitrile rubber, 50 parts of schmigel, 20 parts of 2-
Ethyl -4-methylimidazole, it is not necessary to add other solvents.
By being stirred above-mentioned component, high temperature resistant adhesive is made.The white fused alumina sand paper pair of 80 mesh is used before bonding
Antenna house is polished, and bonding gap is 0.30mm, solidifies 3h at 100 DEG C after the completion of painting glue sticking.
As shown in table 3, for the embodiment of the present invention 2 high temperature resistant epoxy shear strength performance test data, contrast table 1
With table 3, the properties of embodiment 2 meet index request.
Table 3：The shear strength performance test data of the high temperature resistant epoxy of the embodiment of the present invention 2
Embodiment 3
A kind of high temperature resistant adhesive for silicon nitride antenna house, original of the bonding agent based on comprising following mass fraction
Material：100 parts of bisphenol A-type EP01441-310 epoxy resin, 10 parts of liquid nitrile rubber, 50 parts of schmigel, 10 parts of 2-
Ethyl -4-methylimidazole, it is not necessary to add other solvents.
By being stirred above-mentioned component, high temperature resistant adhesive is made.The white fused alumina sand paper pair of 80 mesh is used before bonding
Antenna house is polished, and bonding gap is 0.30mm, solidifies 3h at 100 DEG C after the completion of painting glue sticking.
As shown in table 4, for the embodiment of the present invention 3 high temperature resistant epoxy shear strength performance test data, contrast table 1
With table 4, the properties of embodiment 3 meet index request.
Table 4：The shear strength performance test data of the high temperature resistant epoxy of the embodiment of the present invention 3
Embodiment 4
A kind of high temperature resistant adhesive for silicon nitride antenna house, original of the bonding agent based on comprising following mass fraction
Material：100 parts of bisphenol A-type EP01441-310 epoxy resin, 10 parts of liquid nitrile rubber, 50 parts of schmigel, 20 parts of 2-
Ethyl -4-methylimidazole.
By being stirred above-mentioned component, high temperature resistant adhesive is made.The white fused alumina sand paper pair of 80 mesh is used before bonding
Antenna house is polished, and bonding gap is 0.15mm, solidifies 3h at 100 DEG C after the completion of painting glue sticking.
As shown in table 5, for the embodiment of the present invention 4 high temperature resistant epoxy shear strength performance test data, contrast table 1
With table 5, the properties of embodiment 4 meet index request.
Table 5：The shear strength performance test data of the high temperature resistant epoxy of the embodiment of the present invention 4
Embodiment 5
A kind of high temperature resistant adhesive for silicon nitride antenna house, original of the bonding agent based on comprising following mass fraction
Material：100 parts of bisphenol A-type EP01441-310 epoxy resin, 10 parts of liquid nitrile rubber, 50 parts of schmigel, 10 parts of 2-
Ethyl -4-methylimidazole.
By being stirred above-mentioned component, high temperature resistant adhesive is made.The white fused alumina sand paper pair of 80 mesh is used before bonding
Antenna house is polished, and bonding gap is 0.22mm, solidifies 3h at 100 DEG C after the completion of painting glue sticking.
As shown in table 6, for the embodiment of the present invention 5 high temperature resistant epoxy shear strength performance test data, contrast table 1
With table 6, the properties of embodiment 5 meet index request.
Table 6：The shear strength performance test data of the high temperature resistant epoxy of the embodiment of the present invention 5
Embodiment 6
A kind of high temperature resistant adhesive for silicon nitride antenna house, original of the bonding agent based on comprising following mass fraction
Material：100 parts of bisphenol A-type EP01441-310 epoxy resin, 10 parts of liquid nitrile rubber, 50 parts of schmigel, 20 parts of 2-
Ethyl -4-methylimidazole.
By being stirred above-mentioned component, high temperature resistant adhesive is made.The white fused alumina sand paper pair of 80 mesh is used before bonding
Antenna house is polished, and bonding gap is 0.22mm, solidifies 3h at 100 DEG C after the completion of painting glue sticking.
As shown in table 7, for the embodiment of the present invention 6 high temperature resistant epoxy shear strength performance test data, contrast table 1
With table 7, the property indices of embodiment 6 meet the requirements.
Table 7：The shear strength performance test data of the high temperature resistant epoxy of the embodiment of the present invention 6
The high temperature resistant adhesive for silicon nitride antenna house obtained by embodiments of the invention 1-6, there is necessarily tough
Property and intensity it is high, be adapted to bonding between metal and nonmetallic materials.After tested, what method of the invention obtained is used for silicon nitride
The high temperature resistant adhesive of antenna house can apply to temperature in use as the bonding under the conditions of -40 DEG C~200 DEG C.
In summary, high temperature resistant adhesive for silicon nitride antenna house of the invention and application thereof and method, the resistance to height
Warm bonding agent uses high temperature resistant adhesive, coordinates certain surface treatment, technique for sticking to realize the bonding to silicon nitride antenna house,
The bonding application of silicon nitride antenna house in Aero-Space industry field is disclosure satisfy that, can be in high/low temperature, high humility, machinery
Normal work under the severe environmental conditions such as vibration.
Although present disclosure is discussed in detail by above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read the above, for the present invention's
A variety of modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (10)
1. a kind of high temperature resistant adhesive for silicon nitride antenna house, it is characterised in that the bonding agent includes following mass fraction
Component：10 parts of epoxy resin, 1 part of liquid nitrile rubber, 5 parts of schmigels and 1~2 part of 2-ethyl-4-methylimidazole.
2. the high temperature resistant adhesive according to claim 1 for silicon nitride antenna house, it is characterised in that described epoxy
Resin includes：Bisphenol A type epoxy resin.
3. the high temperature resistant adhesive according to claim 2 for silicon nitride antenna house, it is characterised in that described bis-phenol
A types epoxy resin is EP01441-310 bisphenol A type epoxy resins.
4. a kind of purposes of high temperature resistant adhesive, it is characterised in that the high temperature resistant adhesive is as any one in claim 1-3
The high temperature resistant adhesive for silicon nitride antenna house described in, it is used for bonding between metal and nonmetallic materials.
5. the purposes of high temperature resistant adhesive according to claim 4, it is characterised in that described high temperature resistant adhesive is used for
The silicon nitride antenna house of aerospace field is bonding with metal connection ring.
6. the purposes of high temperature resistant adhesive according to claim 5, it is characterised in that described high temperature resistant adhesive is answered
It it is -40 DEG C~200 DEG C with temperature.
A kind of 7. bonding of the high temperature resistant adhesive for silicon nitride antenna house in 1-3 according to claim described in any one
Method, it is characterised in that this method includes：Antenna house is polished, it is solid after the completion of bonding gap painting glue sticking, bonding
Change.
8. the adhering method of the high temperature resistant adhesive according to claim 7 for silicon nitride antenna house, it is characterised in that
Described polishing uses the white fused alumina sand paper of 80 mesh.
9. the adhering method of the high temperature resistant adhesive according to claim 7 for silicon nitride antenna house, it is characterised in that
Described bonding gap is 0.15~0.30mm.
10. the adhering method of the high temperature resistant adhesive for silicon nitride antenna house according to claim 8 or claim 9, its feature
It is, the temperature of described solidification is 100 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711217284.XA CN107892892A (en) | 2017-11-28 | 2017-11-28 | A kind of high temperature resistant adhesive for silicon nitride antenna house and application thereof and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711217284.XA CN107892892A (en) | 2017-11-28 | 2017-11-28 | A kind of high temperature resistant adhesive for silicon nitride antenna house and application thereof and method |
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| Publication Number | Publication Date |
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| CN107892892A true CN107892892A (en) | 2018-04-10 |
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| CN201711217284.XA Pending CN107892892A (en) | 2017-11-28 | 2017-11-28 | A kind of high temperature resistant adhesive for silicon nitride antenna house and application thereof and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110982422A (en) * | 2019-11-25 | 2020-04-10 | 上海无线电设备研究所 | Porous silicon nitride radome moisture-proof coating and application and spraying method thereof |
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|---|---|---|---|---|
| JP2003238929A (en) * | 2002-02-15 | 2003-08-27 | Mitsubishi Electric Corp | Epoxy type adhesive and radome for flying body using the same |
| CN104449509A (en) * | 2014-11-28 | 2015-03-25 | 中国航空工业集团公司金城南京机电液压工程研究中心 | High temperature resistant adhesive |
| CN105255427A (en) * | 2015-11-30 | 2016-01-20 | 贵州航天风华精密设备有限公司 | High-strength adhesive and preparation method thereof |
-
2017
- 2017-11-28 CN CN201711217284.XA patent/CN107892892A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003238929A (en) * | 2002-02-15 | 2003-08-27 | Mitsubishi Electric Corp | Epoxy type adhesive and radome for flying body using the same |
| CN104449509A (en) * | 2014-11-28 | 2015-03-25 | 中国航空工业集团公司金城南京机电液压工程研究中心 | High temperature resistant adhesive |
| CN105255427A (en) * | 2015-11-30 | 2016-01-20 | 贵州航天风华精密设备有限公司 | High-strength adhesive and preparation method thereof |
Non-Patent Citations (1)
| Title |
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| 常功: "《精细化工生产入门》", 31 January 1994, 湖南科学技术出版社 * |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110982422A (en) * | 2019-11-25 | 2020-04-10 | 上海无线电设备研究所 | Porous silicon nitride radome moisture-proof coating and application and spraying method thereof |
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Application publication date: 20180410 |