CN108329875A - A kind of high temperature resistant two-component bonded adhesives - Google Patents
A kind of high temperature resistant two-component bonded adhesives Download PDFInfo
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- CN108329875A CN108329875A CN201810126977.6A CN201810126977A CN108329875A CN 108329875 A CN108329875 A CN 108329875A CN 201810126977 A CN201810126977 A CN 201810126977A CN 108329875 A CN108329875 A CN 108329875A
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- 239000000853 adhesive Substances 0.000 title claims abstract description 66
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 66
- -1 ethyl imidazol Chemical compound 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 44
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 44
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000004843 novolac epoxy resin Substances 0.000 claims abstract description 37
- 239000000843 powder Substances 0.000 claims abstract description 36
- 229910002012 Aerosil® Inorganic materials 0.000 claims abstract description 35
- 230000007935 neutral effect Effects 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 107
- 239000004615 ingredient Substances 0.000 claims description 28
- 239000003595 mist Substances 0.000 claims description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910021389 graphene Inorganic materials 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011863 silicon-based powder Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims 4
- 239000004593 Epoxy Substances 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 229920003986 novolac Polymers 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- VDGJOQCBCPGFFD-UHFFFAOYSA-N oxygen(2-) silicon(4+) titanium(4+) Chemical compound [Si+4].[O-2].[O-2].[Ti+4] VDGJOQCBCPGFFD-UHFFFAOYSA-N 0.000 claims 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000002994 raw material Substances 0.000 abstract description 4
- 230000032683 aging Effects 0.000 abstract description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 238000007711 solidification Methods 0.000 description 11
- 230000008023 solidification Effects 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A kind of high temperature resistant two-component bonded adhesives, which is characterized in that the high temperature resistant two-component bonded adhesives includes 80 aminoepoxy resins of AG, 51 novolac epoxy resins of F, 2 methyl, 4 ethyl imidazol(e), liquid carboxy nitrile rubber, heatproof neutral powder, aerosil.The adhesive is compared with similar adhesive, it is high with adhesive strength at 200 DEG C, 200 DEG C of shear strengths are not less than 6MPa, and after 250 DEG C of aging 1000h, shear strength is not less than 5MPa, and superior performance can be used for a long time at 60 DEG C under low temperature, it is not easy to come unglued during mechanical processing and use, raw material is easy to purchase, simple production process, and cost is relatively low.
Description
Technical field
The present invention relates to a kind of high temperature resistant two-component bonded adhesives, belong to adhesive area.
Background technology
Existing high temperature resistant two-component bonded adhesives, some high temperature bonding intensity is relatively low, and some room temperatures or the small brittleness of low temperature are too big,
It is unfavorable under rigor condition being to use, some production process control requires height, raw material to be not easy to purchase, and cost is higher, former
Because being that such glue is individually developed generally using a type of resin or curing system, or to improve its heat resistance merely
The curing agent of special kinds, formulation stability is poor, is hardly formed stable prod that can be market-oriented.
Invention content
The purpose of the present invention is developing a kind of two-component adhesive, using different types of heatproof epoxy resin, play not
Isoplastic complementary effect realizes that high temperature performance is stablized after solidification, adhesive strength is high, selects the curable epoxide of market-ripe
Agent, with conducive to mature and stable product, endurance quality is superior, while construction technology is simple, not high to ratio requirement, can fit simultaneously
The requirement for answering small lot and mass production, use manpower and material resources sparingly cost.
Technical scheme of the present invention：
A kind of high temperature resistant two-component bonded adhesives, the high temperature resistant two-component bonded adhesives include AG-80 aminoepoxy resins, F-
51 novolac epoxy resins, -4 ethyl imidazol(e) of 2- methyl, liquid carboxy nitrile rubber, heatproof neutral powder, aerosil；Its
In mass ratio shared by each ingredient：AG-80 aminoepoxy resins account for 25%~70%, F-51 novolac epoxy resins and account in A material
20%~50%, liquid carboxy nitrile rubber accounts for 3%~8%, alumina powder 10%~30%；- 4 ethyl miaow of 2- methyl in B material
Azoles accounts for 95%~98%, aerosil 2%~5%；The mass ratio that the A material are expected with the B is 10：1 to 10：Between 5；
The heatproof neutral powder is alumina powder or silicon powder.
The mass ratio of each ingredient of high temperature resistant two-component bonded adhesives is respectively that AG-80 aminoepoxy resins account in A material
40%, F-51 novolac epoxy resin account for 30%, and liquid carboxy nitrile rubber accounts for 5%, alumina powder 25%；2- methyl -4 in B material
Ethyl imidazol(e) accounts for 95%, aerosil 5%；The mass ratio of the A material and B material is 10：2.
The mass ratio of each ingredient of hot setting high temperature resistant type bonded adhesives is respectively AG-80 aminoepoxy resins in A material
It accounts for 60%, F-51 novolac epoxy resins and accounts for 20%, liquid carboxy nitrile rubber accounts for 8%, alumina powder 12%；B expects 2- methyl -4
Ethyl imidazol(e) accounts for 98%, aerosil 2%；The mass ratio of the A material and B material is 10：1.
A kind of high temperature resistant two-component bonded adhesives, the high temperature resistant two-component bonded adhesives include AG-80 aminoepoxy resins, F-
51 novolac epoxy resins, -4 ethyl imidazol(e) of 2- methyl, liquid carboxy nitrile rubber, heatproof neutral powder, aerosil；Its
In mass ratio shared by each ingredient：AG-80 aminoepoxy resins account for 61%~80%, F-51 novolac epoxy resins and account for 5% in A material
~19%, liquid carboxy nitrile rubber accounts for 9%~32%, alumina powder 5%~9%；- 4 ethyl imidazol(e) of 2- methyl accounts in B material
60%~94%, aerosil 6%~35%；The mass ratio that the A material are expected with the B is 10：6 to 10：Between 10；Institute
It is graphene micro mist to state heatproof neutral powder.
The mass ratio of each ingredient of high temperature resistant two-component bonded adhesives is respectively that AG-80 aminoepoxy resins account in A material
64%, F-51 novolac epoxy resin account for 18%, and liquid carboxy nitrile rubber accounts for 10%, graphene micro mist 8%；2- methyl-in B material
4 ethyl imidazol(e)s account for 92%, aerosil 8%；The mass ratio of the A material and B material is 10：8.
The mass ratio of each ingredient of hot setting high temperature resistant type bonded adhesives is respectively AG-80 aminoepoxy resins in A material
It accounts for 77%, F-51 novolac epoxy resins and accounts for 6%, liquid carboxy nitrile rubber accounts for 8%, graphene micro mist 9%；B expects 2- methyl -4
Ethyl imidazol(e) accounts for 83%, aerosil 17%；The mass ratio of the A material and B material is 10：6.
The high temperature resistant two-component bonded adhesives includes AG-80 aminoepoxy resins, F-51 novolac epoxy resins, 2- methyl -4
Ethyl imidazol(e), liquid carboxy nitrile rubber, heatproof neutral powder, aerosil；Mass ratio shared by wherein each ingredient：A
AG-80 aminoepoxy resins account for 61%, F-51 novolac epoxy resins and account for 19% in material, and liquid carboxy nitrile rubber accounts for 15%, stone
Black alkene micro mist 5%；- 4 ethyl imidazol(e) of 2- methyl accounts for 65% in B material, aerosil 35%；The matter of the A material and B material
Measure ratio 1：1.
The high temperature resistant two-component bonded adhesives includes AG-80 aminoepoxy resins, F-51 novolac epoxy resins, 2- methyl -4
Ethyl imidazol(e), liquid carboxy nitrile rubber, heatproof neutral powder, aerosil；Mass ratio shared by wherein each ingredient：A
AG-80 aminoepoxy resins account for 70%, F-51 novolac epoxy resins and account for 5% in material, and liquid carboxy nitrile rubber accounts for 20%, graphite
Alkene micro mist 5%；- 4 ethyl imidazol(e) of 2- methyl accounts for 70% in B material, aerosil 30%；The quality of the A material and B material
Than 10：6.
The high temperature resistant two-component bonded adhesives includes AG-80 aminoepoxy resins, F-51 novolac epoxy resins, 2- methyl -4
Ethyl imidazol(e), liquid carboxy nitrile rubber, heatproof neutral powder, aerosil；Mass ratio shared by wherein each ingredient：A
AG-80 aminoepoxy resins account for 78%, F-51 novolac epoxy resins and account for 5% in material, and liquid carboxy nitrile rubber accounts for 12%, graphite
Alkene micro mist 5%；- 4 ethyl imidazol(e) of 2- methyl accounts for 78% in B material, aerosil 32%；The quality of the A material and B material
Than 10：7.
Process can be realized by common epoxide-resin glue processing technology.
Beneficial effects of the present invention：
1) the invention bonding agent can improve product high temperature bonding intensity, convenient for mechanical processing, to the machinery of generally existing
Occur coming unglued in processing and applied at elevated temperature, breakage has and particularly evident must improve；
2) the long pot life at room temperature of finished product Storage period is no less than 3 years, and general similar product Storage period is or so half a year, Gu
Change the time and proportional region is wide；
3) use is simple for process, further declines to the use ratio of raw material of high cost, cost of material further decreases.
4) the bonded adhesives primary solidification time that inventive formulation is prepared is 60 DEG C, 10min or so, and it is 80 DEG C to be fully cured,
1h, room temperature shear strength are not less than 30MPa, and 200 DEG C of shear strengths are not less than 18MPa, and -60 DEG C of shear strengths are not less than 25MPa.
Room temperature extension elongation greatly improves, while solidification temperature and time are greatly reduced, and further reduced the time of cured in place
And cost.
5) it is high temperature resistant two-component bonded adhesives that the present invention is a kind of, is mainly used for the bonding of metal-metal, metal-non-metal,
And other similar bonding, embeddings etc., if with good anti-corrosion when reliably bonding is as surface protective glue between realizing each component
Effect, main component are epoxy resin, curing agent, toughener, filler etc..Graphene micro mist, the glue is added in the viscose glue of the present invention
Stick is compared with similar adhesive, and adhesive strength is high when having 200 DEG C, 200 DEG C of shear strength height, and 250 DEG C of aging 1000h
Afterwards, shear strength is not less than 10MPa, and superior performance can be used for a long time at -60 DEG C under low temperature, is machined and uses process
In be not easy to come unglued, raw material is easy buying, and simple production process, cost is relatively low.
Specific implementation mode
With reference to embodiment, the present invention will be further described.
Cardinal principle of the present invention is using two-component system, for two distinct types of heatproof epoxy resin in using A to expect
Appropriate toughening component is added while heat-resistant filler is added, B material are made of imidazole curing agent and appropriate auxiliary rheological agents.
By adjusting adhesive formulation, it is tested for the property according to corresponding national standard, filter out being capable of mechanically and electrically property
It can meet the requirements, and meet the adhesive of use environment requirement, and its processing performance is checked and rated.
A material process for preparation be each component is heated in proportion reaction kettle be heated to 120 DEG C heat preservation 2h, it is cold after vacuum defoamation
But it dispenses.A expects that process for preparation is that directly room temperature dispenses after mixing in proportion by component.
Embodiment 1.
A kind of mass ratio of each ingredient of high temperature resistant two-component bonded adhesives is respectively that AG-80 aminoepoxy resins account in A material
40%, F-51 novolac epoxy resin account for 30%, and liquid carboxy nitrile rubber accounts for 5%, alumina powder 25%；2- methyl -4 in B material
Ethyl imidazol(e) accounts for 95%, aerosil 5%；The mass ratio of the A material and B material is 10：2；The heatproof neutrality powder
End is alumina powder.
The bonded adhesives primary solidification time that the formula is prepared is 100 DEG C, 30min or so, and it is 160 DEG C, 4h to be fully cured, room
Warm shear strength is not less than 20MPa, and 200 DEG C of shear strengths are not less than 6MPa, and -60 DEG C of shear strengths are not less than 10MPa.
Embodiment 2.
A kind of mass ratio of each ingredient of hot setting high temperature resistant type bonded adhesives is respectively AG-80 aminoepoxy resins in A material
It accounts for 60%, F-51 novolac epoxy resins and accounts for 20%, liquid carboxy nitrile rubber accounts for 8%, alumina powder 12%；B expects 2- methyl -4
Ethyl imidazol(e) accounts for 98%, aerosil 2%；The mass ratio of the A material and B material is 10：1；The heatproof neutrality powder
End is silicon powder.
The bonded adhesives primary solidification time that formula is prepared is 100 DEG C, 30min or so, and it is 160 DEG C, 4h to be fully cured, room temperature
Shear strength is not less than 20MPa, and 200 DEG C of shear strengths are not less than 6MPa.
Embodiment 3.
A kind of mass ratio of each ingredient of high temperature resistant two-component bonded adhesives is respectively that AG-80 aminoepoxy resins account in A material
64%, F-51 novolac epoxy resin account for 18%, and liquid carboxy nitrile rubber accounts for 10%, graphene micro mist 8%；2- methyl-in B material
4 ethyl imidazol(e)s account for 92%, aerosil 8%；The mass ratio of the A material and B material is 10：8.
The bonded adhesives primary solidification time that formula is prepared is 100 DEG C, 30min or so, and it is 160 DEG C, 4h to be fully cured, room temperature
Shear strength is not less than 20MPa, and 200 DEG C of shear strengths are not less than 8MPa, and -60 DEG C of shear strengths are not less than 15MPa.
Embodiment 4.
A kind of mass ratio of each ingredient of hot setting high temperature resistant type bonded adhesives is respectively AG-80 aminoepoxy resins in A material
It accounts for 77%, F-51 novolac epoxy resins and accounts for 6%, liquid carboxy nitrile rubber accounts for 8%, graphene micro mist 9%；B expects 2- methyl -4
Ethyl imidazol(e) accounts for 83%, aerosil 17%；The mass ratio of the A material and B material is 10：6.
The bonded adhesives primary solidification time that formula is prepared is 100 DEG C, 30min or so, and it is 160 DEG C, 4h to be fully cured, room temperature
Shear strength is not less than 20MPa, and 200 DEG C of shear strengths are not less than 8MPa, and -60 DEG C of shear strengths are not less than 15MPa.
Embodiment 5.
A kind of high temperature resistant two-component bonded adhesives includes AG-80 aminoepoxy resins, F-51 novolac epoxy resins, 2- methyl -4
Ethyl imidazol(e), liquid carboxy nitrile rubber, heatproof neutral powder, aerosil；Mass ratio shared by wherein each ingredient：A
AG-80 aminoepoxy resins account for 61%, F-51 novolac epoxy resins and account for 19% in material, and liquid carboxy nitrile rubber accounts for 15%, stone
Black alkene micro mist 5%；- 4 ethyl imidazol(e) of 2- methyl accounts for 65% in B material, aerosil 35%；The matter of the A material and B material
Measure ratio 1：1.
The bonded adhesives primary solidification time that formula is prepared is 60 DEG C, 10min or so, and it is 80 DEG C to be fully cured, and 1h, room temperature is cut
Shearing stress is not less than 30MPa, and 200 DEG C of shear strengths are not less than 18MPa, and -60 DEG C of shear strengths are not less than 25MPa.
Embodiment 6.
A kind of high temperature resistant two-component bonded adhesives includes AG-80 aminoepoxy resins, F-51 novolac epoxy resins, 2- methyl -4
Ethyl imidazol(e), liquid carboxy nitrile rubber, heatproof neutral powder, aerosil；Mass ratio shared by wherein each ingredient：A
AG-80 aminoepoxy resins account for 70%, F-51 novolac epoxy resins and account for 5% in material, and liquid carboxy nitrile rubber accounts for 20%, graphite
Alkene micro mist 5%；- 4 ethyl imidazol(e) of 2- methyl accounts for 70% in B material, aerosil 30%；The quality of the A material and B material
Than 10：6.
The bonded adhesives primary solidification time that formula is prepared is 60 DEG C, 10min or so, and it is 80 DEG C to be fully cured, and 1h, room temperature is cut
Shearing stress is not less than 30MPa, and 200 DEG C of shear strengths are not less than 18MPa, and -60 DEG C of shear strengths are not less than 25MPa.
Embodiment 7.
A kind of high temperature resistant two-component bonded adhesives includes AG-80 aminoepoxy resins, F-51 novolac epoxy resins, 2- methyl -4
Ethyl imidazol(e), liquid carboxy nitrile rubber, heatproof neutral powder, aerosil；Mass ratio shared by wherein each ingredient：A
AG-80 aminoepoxy resins account for 78%, F-51 novolac epoxy resins and account for 5% in material, and liquid carboxy nitrile rubber accounts for 12%, graphite
Alkene micro mist 5%；- 4 ethyl imidazol(e) of 2- methyl accounts for 78% in B material, aerosil 32%；The quality of the A material and B material
Than 10：7.
The bonded adhesives primary solidification time that formula is prepared is 60 DEG C, 10min or so, and it is 80 DEG C to be fully cured, and 1h, room temperature is cut
Shearing stress is not less than 30MPa, and 200 DEG C of shear strengths are not less than 18MPa, and -60 DEG C of shear strengths are not less than 25MPa.
The bonded adhesives primary solidification time that formula is prepared is 100 DEG C, 30min or so, and it is 160 DEG C, 4h to be fully cured, room temperature
Shear strength is not less than 20MPa, and 200 DEG C of shear strengths are not less than 8MPa, and -60 DEG C of shear strengths are not less than 15MPa.
The lateral dimension that the production of Changzhou carbon wiener rice Science and Technology Ltd. may be used in graphene micro mist is 2 μm, specific surface
Product is the black alkene micro mist of 800 ㎡/g.
Comparative example 1.
A kind of mass ratio of each ingredient of bonded adhesives is respectively that AG-80 aminoepoxy resins account for 40%, F-51 phenolic aldehyde in A material
Epoxy resin accounts for 30%, and liquid carboxy nitrile rubber accounts for 5%, alumina powder 25%；- 4 ethyl imidazol(e) of 2- methyl accounts in B material
95%, aerosil 5%；The mass ratio of the A material and B material is 10：2.
Comparative example 2.
A kind of mass ratio of each ingredient of bonded adhesives is respectively that AG-80 aminoepoxy resins account for 60%, F-51 phenolic aldehyde in A material
Epoxy resin accounts for 20%, and liquid carboxy nitrile rubber accounts for 8%, alumina powder 12%；- 4 ethyl imidazol(e) of B material 2- methyl accounts for 98%,
Aerosil 2%；The mass ratio of the A material and B material is 10：1.
Comparative example 3.
A kind of mass ratio of each ingredient of bonded adhesives is respectively that AG-80 aminoepoxy resins account for 70%, F-51 phenolic aldehyde in A material
Epoxy resin accounts for 20%, and liquid carboxy nitrile rubber accounts for 5%, alumina powder 5%；- 4 ethyl imidazol(e) of B material 2- methyl accounts for 99%, gas
Aerosil 1%；The mass ratio of the A material and B material is 10：1.
1 is shown in Table to 1~7 prepared bonded adhesives performance measurement result of above-described embodiment
Table 1
1 is shown in Table to prepared bonded adhesives performance measurement result in above-mentioned comparative example 1~3
Table 2
As can be seen from Table 1 and Table 2, bonded adhesives provided by the present invention, the shear at high temperature intensity of bonded adhesives, room are utilized
Warm shear strength is better than comparative example, liquid carboxy nitrile rubber can improve the low temperature cutting performance of the bonded adhesives, while liquid
The room temperature that body carboxy nitrile rubber can improve bonded adhesives breaks elongation percentage.Above-mentioned formula further saves cost, compared to existing
There is technical costs to save 10% -80%.
The above technical solution provided by the present invention is described in detail.It is right in specific implementation to be applied in this specification
The principle of the present invention is expounded, for those skilled in the art, according to the thought of the present invention in specific implementation mode and
It may can be changed in implementation process in application range.Therefore the content that this specification tree is recorded should not be construed as to the present invention
Limitation.
Claims (9)
1. a kind of high temperature resistant two-component bonded adhesives, which is characterized in that the high temperature resistant two-component bonded adhesives includes AG-80 amino rings
Oxygen resin, F-51 novolac epoxy resins, -4 ethyl imidazol(e) of 2- methyl, liquid carboxy nitrile rubber, heatproof neutral powder, gas phase two
Silica；Mass ratio shared by wherein each ingredient：AG-80 aminoepoxy resins account for 25%~70%, F-51 epoxy novolacs in A material
Resin accounts for 20%~50%, and liquid carboxy nitrile rubber accounts for 3%~8%, alumina powder 10%~30%；2- methyl -4 in B material
Ethyl imidazol(e) accounts for 95%~98%, aerosil 2%~5%；The mass ratio that the A material are expected with the B is 10：1 to 10：
Between 5；The heatproof neutral powder is alumina powder or silicon powder.
2. a kind of high temperature resistant two-component bonded adhesives according to claim 1, it is characterised in that：The high temperature resistant two-component is viscous
The mass ratio for connecing each ingredient of glue is respectively that AG-80 aminoepoxy resins account for 40%, F-51 novolac epoxy resins and account for 30% in A material,
Liquid carboxy nitrile rubber accounts for 5%, alumina powder 25%；- 4 ethyl imidazol(e) of 2- methyl accounts for 95% in B material, aerosil
5%；The mass ratio of the A material and B material is 10：2.
3. a kind of high temperature resistant two-component bonded adhesives according to claim 1, it is characterised in that：The hot setting high temperature resistant
The mass ratio of each ingredient of type bonded adhesives is respectively that AG-80 aminoepoxy resins account for 60%, F-51 novolac epoxy resins and account in A material
20%, liquid carboxy nitrile rubber accounts for 8%, alumina powder 12%；- 4 ethyl imidazol(e) of B material 2- methyl accounts for 98%, gas phase titanium dioxide
Silicon 2%；The mass ratio of the A material and B material is 10：1.
4. a kind of high temperature resistant two-component bonded adhesives, which is characterized in that the high temperature resistant two-component bonded adhesives includes AG-80 amino rings
Oxygen resin, F-51 novolac epoxy resins, -4 ethyl imidazol(e) of 2- methyl, liquid carboxy nitrile rubber, heatproof neutral powder, gas phase two
Silica；Mass ratio shared by wherein each ingredient：AG-80 aminoepoxy resins account for 61%~80%, F-51 epoxy novolacs in A material
Resin accounts for 5%~19%, and liquid carboxy nitrile rubber accounts for 9%~32%, alumina powder 5%~9%；- 4 second of 2- methyl in B material
Base imidazoles accounts for 60%~94%, aerosil 6%~35%；The mass ratio that the A material are expected with the B is 10：6 to 10：
Between 10；The heatproof neutral powder is graphene micro mist.
5. a kind of high temperature resistant two-component bonded adhesives according to claim 4, it is characterised in that：The high temperature resistant two-component is viscous
The mass ratio for connecing each ingredient of glue is respectively that AG-80 aminoepoxy resins account for 64%, F-51 novolac epoxy resins and account for 18% in A material,
Liquid carboxy nitrile rubber accounts for 10%, graphene micro mist 8%；- 4 ethyl imidazol(e) of 2- methyl accounts for 92% in B material, aerosil
8%；The mass ratio of the A material and B material is 10：8.
6. a kind of high temperature resistant two-component bonded adhesives according to claim 4, it is characterised in that：The hot setting high temperature resistant
The mass ratio of each ingredient of type bonded adhesives is respectively that AG-80 aminoepoxy resins account for 77%, F-51 novolac epoxy resins and account in A material
6%, liquid carboxy nitrile rubber accounts for 8%, graphene micro mist 9%；- 4 ethyl imidazol(e) of B material 2- methyl accounts for 83%, gas phase titanium dioxide
Silicon 17%；The mass ratio of the A material and B material is 10：6.
7. a kind of high temperature resistant two-component bonded adhesives according to claim 4, it is characterised in that：The high temperature resistant two-component is viscous
Connect glue include AG-80 aminoepoxy resins, F-51 novolac epoxy resins, -4 ethyl imidazol(e) of 2- methyl, liquid carboxy nitrile rubber,
Heatproof neutral powder, aerosil；Mass ratio shared by wherein each ingredient：AG-80 aminoepoxy resins account in A material
61%, F-51 novolac epoxy resin account for 19%, and liquid carboxy nitrile rubber accounts for 15%, graphene micro mist 5%；2- methyl-in B material
4 ethyl imidazol(e)s account for 65%, aerosil 35%；The mass ratio 1 of the A material and B material：1.
8. a kind of high temperature resistant two-component bonded adhesives according to claim 4, it is characterised in that：The high temperature resistant two-component is viscous
Connect glue include AG-80 aminoepoxy resins, F-51 novolac epoxy resins, -4 ethyl imidazol(e) of 2- methyl, liquid carboxy nitrile rubber,
Heatproof neutral powder, aerosil；Mass ratio shared by wherein each ingredient：AG-80 aminoepoxy resins account in A material
70%, F-51 novolac epoxy resin account for 5%, and liquid carboxy nitrile rubber accounts for 20%, graphene micro mist 5%；2- methyl -4 in B material
Ethyl imidazol(e) accounts for 70%, aerosil 30%；The mass ratio 10 of the A material and B material：6.
9. a kind of high temperature resistant two-component bonded adhesives according to claim 4, it is characterised in that：The high temperature resistant two-component is viscous
Connect glue include AG-80 aminoepoxy resins, F-51 novolac epoxy resins, -4 ethyl imidazol(e) of 2- methyl, liquid carboxy nitrile rubber,
Heatproof neutral powder, aerosil；Mass ratio shared by wherein each ingredient：AG-80 aminoepoxy resins account in A material
78%, F-51 novolac epoxy resin account for 5%, and liquid carboxy nitrile rubber accounts for 12%, graphene micro mist 5%；2- methyl -4 in B material
Ethyl imidazol(e) accounts for 78%, aerosil 32%；The mass ratio that the A material are expected with the B is 10：7.
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