CN107851638B - 功率模块 - Google Patents

功率模块 Download PDF

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Publication number
CN107851638B
CN107851638B CN201680044174.5A CN201680044174A CN107851638B CN 107851638 B CN107851638 B CN 107851638B CN 201680044174 A CN201680044174 A CN 201680044174A CN 107851638 B CN107851638 B CN 107851638B
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Prior art keywords
conductor
power module
intermediate conductor
voltage
plate
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CN107851638A (zh
Inventor
北条房郎
露野円丈
石井利昭
楠川顺平
松下晃
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Abstract

本发明的目的在于提供一种一方面满足高绝缘性、另一方面散热性优异的功率模块。本发明的功率模块具备:导体板(320),其连接着开关元件;散热板(307),其与导体板(320)相对配置;绝缘构件(900),其配置在导体板(320)与散热板(307)之间;以及导电性的中间导体(910),其以与导体板(320)及散热板(307)电性绝缘的状态配置在绝缘构件(900)中;中间导体(910)具有连通区域(1101),所述连通区域(1101)在相对于中间导体(910)而言配置在导体板(320)侧的绝缘构件(900)与相对于中间导体(910)而言配置在散热板(307)侧的绝缘构件(900)之间进行连通。

Description

功率模块
技术领域
本发明涉及一种将功率半导体元件模块化而成的功率模块,尤其涉及一种车辆搭载用的功率模块。
背景技术
基于功率半导体元件的开关的电力转换装置因转换效率高,所以在民生用、车载用、铁道用、变电设备等当中得到广泛利用。该功率半导体元件会因通电而发热,因此需要高散热性。通常,散热是使用具有散热片的金属制散热结构,为了电位的稳定化和防止触电而接地至地线(GND)。因此,配置在功率半导体元件与散热结构之间的绝缘材料需要优异的导热性。然而,在进行转换的电压较高的情况下,需要较厚地构成绝缘材料以提高绝缘性,从而导致散热性劣化。
作为提高散热性的方法,例如已知有专利文献1中展示那样的、在绝缘层与绝缘层之间夹入作为高导热性材料的导体的方法。
现有技术文献
专利文献
专利文献1:日本专利特开2012-244750号公报
发明内容
发明要解决的问题
专利文献1记载的功率模块在第1绝缘材料与第2绝缘材料之间设置金属制板,由此能够提高散热性,但并不能降低第1绝缘材料与第2绝缘材料加在一起的绝缘材料的总厚度。
本发明的课题在于提供一种一方面满足高绝缘性、另一方面散热性优异的功率模块。
解决问题的技术手段
本发明的功率模块的特征在于,具备:导体板,其连接有开关元件;散热板,其与所述导体板相对配置;绝缘构件,其配置在所述导体板与所述散热板之间;以及导电性的中间导体,其以与所述导体板及所述散热板电性绝缘的状态配置在所述绝缘构件中,所述中间导体具有连通区域,所述连通区域在相对于所述中间导体而言配置在所述导体板侧的所述绝缘构件与相对于所述中间导体而言配置在所述散热板侧的所述绝缘构件之间进行连通。
发明的效果
根据本发明,能够降低绝缘层的总厚度,从而能使功率模块高散热化,因此能使电力转换装置小型化。
附图说明
图1为实施例1的功率模块的电路图。
图2为实施例1的功率模块的俯视图。
图3为以A-B截面切割图2的功率模块而得的截面图。
图4为在绝缘层与电极间有空气层的情况下的电压分担的模型。
图5为帕邢定律下的局部放电发生电压与气压p·电极间距离d的关系。
图6为最小局部放电电压与绝缘层厚度的关系。
图7为考虑了由海拔引起的气压的变化的最小局部放电电压与绝缘层厚度的关系。
图8为考虑了由温度引起的粒子密度的变化的最小局部放电电压与绝缘层厚度的关系。
图9为最小局部放电电压与绝缘层厚度的关系。
图10为由功率模块的承受交流电压的绝缘层部分构成的实验系统的示意图。
图11为电压分担率与频率的关系。
图12为拥有具有贯通区域的中间导体的绝缘层的制作方法。
图13为热阻降低效果和局部放电开始电压相对于连通孔径的关系。
图14为实施例2的功率模块的俯视图。
图15为以C-D截面切割图14的功率模块而得的截面图。
图16(a)为实施例3的功率模块的立体图。
图16(b)为以E-F截面切割图16(a)的功率模块而得的截面图。
图17为以图16(a)的G-H截面进行切割时的截面的示意图。
图18为表示实施例3的功率模块中的中间导体的配置的展开图。
图19为功率模块及其周边的电路图。
图20(a)为表示低电感化的说明图的电路图。
图20(b)为表示低电感化的说明图的功率模块的展开图。
图21为实施例4的功率模块的截面图。
图22为电力转换装置的电路图。
图23为表示电力转换装置的外观的立体图。
图24为混合动力汽车的控制框图。
具体实施方式
下面,参考附图,对本发明的功率模块的实施方式进行说明。再者,各图中,对同一要素标注同一符号,并省略重复的说明。
首先,使用图1至图3,对第1实施方式的功率模块的构成进行说明。
图1为本实施例的功率模块300的电路构成图。功率模块300由构成上桥臂电路的IGBT 328及二极管156和构成下桥臂电路的IGBT 330及二极管166构成。此处,所谓IGBT,是绝缘栅双极型晶体管的简称。与电池的正极侧连接、通过功率半导体元件的开关来制作交流波形的电路为上桥臂电路,与电池的负极侧或GND侧连接、制作交流波形的电路为下桥臂电路。在进行中性点接地的情况下,下桥臂电路与电容器的负极侧连接而不是与GND连接。
功率模块300具备导体板315、318、320及319。导体板315与上桥臂侧的IGBT 328的集电极侧连接。导体板318与上桥臂侧的IGBT 328的发射极侧连接。导体板320与下桥臂侧的IGBT 330的集电极侧连接。导体板319与下桥臂侧的IGBT 330的发射极侧连接。
功率模块300具备端子315B、319B、320B、325U及325L。端子315B与导体板315连接。端子315B与直流电池或平滑电容器的正极侧连接。端子319B与导体板319连接。端子319B与直流电池或平滑电容器的负极侧或地线(GND)连接。端子320B与导体板320连接。端子320B与马达连接。端子325U为上桥臂侧的IGBT 328的控制端子。端子325L为下桥臂侧的IGBT330的控制端子。
与端子315B连接的导体板315传输直流电流。与端子319B连接的导体板319传输直流电流。与端子320B连接的导体板320传输交流电流。
图2为表示本实施例的功率模块300的结构的俯视图。IGBT 328及IGBT 330被配置成各自的发射极面朝向相同方向。
图3为以A-B截面切割图2的功率模块300时的截面图。功率模块300具有形成有散热用的散热片的散热面307。散热面307隔着导体板320及导体板315配置在IGBT 328、330、二极管156、166的相反侧。散热面307由导电性构件形成,并接地至GND,以实现电压的稳定化。
此外,功率模块300具有中间导体910及中间导体911。中间导体910配置在导体板320与散热面307之间。中间导体911配置在导体板315与散热面307之间。在中间导体910与导体板320之间、中间导体910与散热面307之间、中间导体911与导体板315之间、以及中间导体911与散热面307之间形成绝缘层900。本实施方式中的特征部分之一在于,如图3的局部放大图所示,中间导体910及911中的某一方或两方形成有连通区域1101。连通区域的构成等将于后文叙述。
在本实施例的功率模块中,在沿导体板320和中间导体910的排列方向进行投影的情况下,中间导体910形成为导体板320的投影部包含该中间导体910的投影部。此外,在沿导体板315和中间导体911的排列方向进行投影的情况下,中间导体911形成为导体板319的投影部包含该中间导体911的投影部。
将像本实施例的功率模块这样将上桥臂电路和下桥臂电路这2个桥臂电路模块化成一体的结构称为2in1结构。与针对每1个桥臂电路加以模块化的1in1结构相比,2in1结构能够减少输出端子的数量。本实施例展示的是2in1结构的例子,但可以设为3in1结构、4in1结构或6in1结构等,由此进一步减少端子数。在2in1结构的功率模块中,通过将上桥臂电路与下桥臂电路并排,并隔着绝缘层与金属平板相对配置,可以借助磁场抵消效应来降低电路的电感。
本实施例的功率模块通过设置中间导体910而使导体板320与中间导体910之间和中间导体910与散热面307之间分担导体板320与散热面307之间的电压。由此,本实施例的功率模块一方面能够满足绝缘性,另一方面能够降低绝缘层厚度。下面,使用图4至图13,对其原理进行说明。
图4为表示在绝缘层与电极间有空气层的情况下的电压分担的模型的图。在电极间形成有空气层850和绝缘层851。若将施加至整个电极间的交流电压设为V,将施加至其中的空气层的电压设为V1,则电压V以下式表示。其中,Ce表示空气层的电容,Cf表示绝缘层的电容,ε0表示真空的介电常数,ε表示绝缘层的相对介电常数,S表示电极面积,de表示空气层的厚度,df表示绝缘层的厚度。
(数式1)V=V1·(Ce+Cf)/Cf=V1·(df/(ε·de)+1)
(数式2)Ce=ε0·S/de
(数式3)Cf=ε0·ε·S/df
若电极与绝缘层之间或者绝缘层内部因空隙或剥离而产生空气层,则在对电极施加有高电压时会发生局部放电。若绝缘层经常暴露在局部放电的环境中,则会被放电的火花侵蚀,从而导致耐久时间明显降低。尤其是树脂制绝缘体,其耐热性比陶瓷低,这一影响较为明显。要提高绝缘性,较为有效的是在不会局部放电的条件下使用。
此外,放电现象在直流电压和交流电压下不一样。在直流电压下,在电极间有绝缘层的情况下,即便是发生局部放电的条件,在1次放电之后,绝缘层也会带电而使得空间的电场降低,因此放电会停止。因而,仅仅只会进行1次电压放电,所以放电对绝缘层的劣化的影响较小。另一方面,在交流电压下,施加至绝缘层的电压随着时间经过会反转,因此会反复进行放电。因此,放电对绝缘层的劣化的影响较大。进而,在通过功率半导体元件的开关来制作交流波形的情况下,浪涌电压会重叠在交流波形中,因此比额定电压高的电压会施加至绝缘层。
因此,承受交流电压的绝缘层避免暴露在发生局部放电的环境中尤为重要。为了抑制局部放电,考虑如下任一种方法:以利用绝缘体将电极间完全填满的方式进行制造,以避免电极间存在空气层,而且即便在承受温度变化的使用环境下也能维持该状态,或者,设置即便因剥离等而产生空气层也不会局部放电这样的绝缘层的厚度。本实施方式的功率模块采用后一种方法。
使用图5,对发生局部放电的电压进行说明。在电极间有空隙的情况下,开始局部放电的电压能以气压与电极间的空隙长度的函数表示,这一内容由帕邢揭示出来,其后被许多研究者通过理论、实验的方式确认过。图5为以气压p与电极间距离d的积的关系表示在气压p下对电极间距离d的电极施加有电压时发生局部放电的电压的曲线图。图5是在20℃下测定而得。如图5所示,局部放电发生电压在气压与电极间距离的积p·d为某一值时具有最小值。也就是说,在超过作为局部放电发生电压的最小值的该电压的电压施加至电极间的空隙时,根据p·d积的值,会发生局部放电。
帕邢定律下的压力可以换算为气体的粒子密度,因此,可以使用气体的状态方程来求任意温度、压力下的局部放电开始电压。若将如此求出的局部放电开始电压代入至数式(1)中的V1,则可以利用气压p与空气层的厚度de的关系来算出发生放电的电极间电压V的最小值。对应于绝缘层的厚度df来绘制如此算出的最小局部放电电压的值而得的曲线图示于图6至图8。
图6展示25℃、1atm下的最小局部放电电压与绝缘层厚度df的关系。当绝缘层厚度df变厚时,相对于电压V而绝缘层851所分担的电压升高,因此空气层850所分担的电压V1变小。因此,绝缘层厚度df越大,最小局部放电开始电压越高。
此处要注意的是,最小局部放电电压相对于绝缘层厚度df的关系不成比例。即,绝缘层厚度df较小的区域内的曲线图的斜率比绝缘层厚度df较大的区域内的曲线图的斜率大。通过利用该特征,可以像后文叙述那样一方面确保绝缘性、一方面实现绝缘层厚度的降低。此外,根据图6得知,在相同最小局部放电电压下,绝缘层851的介电常数越低,越能减小其厚度df
图7展示25℃、绝缘层的相对介电常数6下的最小局部放电电压与绝缘层厚度df的关系。根据图7得知,要得到相同最小局部放电电压,海拔越高,即,气压越低,越需要增厚绝缘层厚度。尤其是从超过4000m左右起,该影响变得明显。
图8展示1atm、绝缘层的相对介电常数6下的最小局部放电电压与绝缘层厚度df的关系。根据图8得知,要得到相同最小局部放电电压,温度越高,越需要增厚绝缘层厚度df。尤其是从超过50℃左右起,该影响变得明显。
图9展示25℃、1atm、相对介电常数6下的最小局部放电电压与绝缘层厚度df的关系。使用图9,对一方面抑制局部放电、另一方面降低绝缘层851的总厚度df的原理进行说明。
例如,考虑对电极间施加最大1.6kVp的电压的情况。图9中,绝缘层厚度df为330μm时的最小局部放电电压为1.6kVp,因此,即便因剥离等而产生空隙,只要绝缘层形成得比330μm厚,便不会发生局部放电。
另一方面,在施加至电极间的电压为0.8kVp时,只要绝缘层比80μm厚,便不会发生局部放电。如前文所述,最小局部放电电压与绝缘层厚度df的关系并非比例关系,绝缘层厚度df较小的区域内的斜率较大,随着绝缘层厚度df增大,斜率变小。
因此,即便是1.6kVp的电压,通过将该电压二分为0.8kVp和0.8kVp,只要分别设置比80μm厚的绝缘层,便能抑制放电。由此,能将只有1层时需要330μm的绝缘层的总厚度降低至160μm。此处例示的是2层的例子,但显然,通过设为3层以上,能够进一步薄壁化。若能使绝缘层薄壁化,则相应地热阻会降低,因此散热性提高。进而,有材料成本能够与绝缘层薄壁化的程度相应地降低的效果。接着,使用图10至图13,对关于用以分割施加至功率模块的绝缘层的电压的结构的模型进行说明。
图10为对具有中间导体的绝缘层部分施加交流电压的实验系统的示意图。如上所述,在图3的功率模块中,直流电流流至导体板319,而交流电流流至导体板320。图10展示了承受交流电压的功率模块的绝缘层的电压分担模型。图10的电极800对应于图3的导体板320,图10的中间导体801对应于图3的中间导体910,图10的电极802对应于图3的散热面307,图10的绝缘层810及811对应于图3的绝缘层900。
电极800及802连接至发送器1001。中间导体801配置在电极800与电极802之间。绝缘层810配置在电极800与中间导体801之间。绝缘层811配置在电极802与中间导体801之间。电极802接地至GND。若将中间导体801与电极802之间的电压设为V2,将电极800与电极802之间的电压设为V3,则施加有交流电压的情况下的电容电路的电压分担能利用以下的数式算出。
(数式4)V2=V3·Ca/(Ca+Cb)
(数式5)Ca=ε0·εa·Sa/da
(数式6)Cb=ε0·εb·Sb/db
其中,Ca表示电极800与中间导体801之间的电容,Cb表示中间导体801与电极802之间的电容,ε0表示真空的介电常数,εa表示绝缘层810的相对介电常数,εb表示绝缘层811的相对介电常数,Sa表示电极800与中间导体801的配置方向上的投影面相重合的面积,Sb表示中间导体801与电极802的配置方向上的投影面相重合的面积,da表示绝缘层810的厚度,db表示绝缘层811的厚度。
此处,调整电压分担模型的结构和绝缘层的材质,设为εa=εb、da=db、Sa=Sb,由此,Ca=Cb。此时,根据式(4),V2除以V3而得的电压分担率为50%。本模型中,设定Ca=Cb
(数式7)V2/V3=50%
图11为表示改变图10的发送器1001的频率时的电压分担率V2/V3的曲线图。电压分担率是通过利用波形记录器(カーブトレーサ)1000测定中间导体801及电极802间的电压V2和电极800及电极802间的电压V3而求出。
根据图11,发现如下倾向:随着施加至电极800及电极802间的电压的频率升高,电压分担率接近50%。当频率超过100Hz时,电压分担率大致达到50%。这种倾向在正弦波及矩形波下都是一样的。
根据本模型的结果得知,通过在承受100Hz以上的交流电压的电极间的绝缘层中设置中间导体,能够根据电容来分担施加至绝缘层的电压。
再者,此处为了进行模型评价而从中间导体801输出有电流,但在实际的功率模块中,无须从中间导体导出电流。因此,可以将中间导体埋设在绝缘层内。若将中间导体埋设在绝缘层内,则可以防止中间导体的端面接近电极,从而能够防止来自端面的放电。
在将中间导体埋设在绝缘层内的情况下,若中间导体的上下层使用相同材质的绝缘层,并使中间导体的外形尺寸与相对的某一电极的尺寸一致,则即便尺寸与另一电极不一样,也能使中间导体的两侧的电容相等。在该情况下,使尺寸完全相等实质上较为困难,因此,较理想为考虑位置对准和尺寸公差而使中间导体比面积较小一侧的电极大一些。其原因在于,若中间导体较小,则会产生电压得不到分担的部分,从而存在因剥离而导致局部放电的情况。本实施方式的功率模块具有面积比导体板320及315的面积略大的中间导体910及911。
再者,直流侧的中间导体911因后文叙述的理由而不受导体板315的尺寸制约,可比导体板大,也可比导体板小。此外,也可以省略。
图12为表示具有中间导体的绝缘层的制作顺序的图。但图12所示为一例,制作的顺序也可不为以下方法。(1)准备绝缘片。(2)通过在中间导体形成部形成导体图案的掩蔽,借助铝蒸镀在绝缘片上形成厚度0.1μm的铝膜导体图案,所述导体图案是具有孔径(构成网眼的孔的对角线的长度)10μm的网眼状的连通孔的图案。以通过蒸镀形成的铝膜处于内部的方式压盖未进行图案形成的绝缘片。此处展示的是铝膜的例子,但只要是导电性材料,便无特别限定。此外,展示的是蒸镀的例子,但只要是能以掩蔽的方式形成的形成方法即可,可以是转印、蒸镀、印刷、镀敷等方法。(3)设定利用模具进行冲裁的位置。(4)利用模具来冲裁在内部具有中间导体的绝缘片。通过如此进行制作,能够形成较薄的中间导体。通过制成具有较薄的中间导体层的绝缘片,有如下效果,即,能够减少压接绝缘片时因中间导体的阶差所引起的压接压力的不均匀的发生,从而形成均匀的压接面。
如上所述,本实施方式的功率模块的特征在于,中间导体具有网眼状的连通孔的图案。下面,对该特征部分进行详细说明。
功率模块是通过对树脂制绝缘构件、导体板及散热板进行压接而形成。树脂性绝缘构件与导体板及散热板的粘接是通过如下操作形成:绝缘构件所使用的树脂因压接时的热和压力而流动至导体板及散热板表面的凹凸并硬化。此时,绝缘构件的形成所使用的树脂的量较多时,对导体板及散热板表面的凸凹的追随性较佳,使得粘接性较佳。例如,在绝缘构件使用树脂片的情况下,树脂片的膜厚越厚,粘接性越好。这在使用树脂中含有填料的树脂片来形成模块的情况下较为明显。即,含有填料的树脂片中所含的树脂量减少以及含有填料所引起的粘度增加导致压接时的流动性降低。因此,通过使用膜厚更厚的片材来增加流动的树脂量较为有效。
然而,在绝缘构件内配备中间导体来分担施加至绝缘层的电压的情况下,在使用没有连通区域的中间导体(例如金属箔等)时,绝缘构件所使用的树脂材料或树脂/填料复合材料会因中间导体而导致流动受到阻碍。例如,在绝缘构件内的中心设置有一层中间导体层的情况下,绝缘构件中的树脂或树脂/填料的流动性会降低到与具有1/2膜厚的绝缘构件的树脂或树脂/填料的流动性相同的程度。因此,绝缘构件与导体板及散热板的粘接性降低,热阻增大。
相对于此,在像本实施方式这样使用具有连通区域的中间导体的情况下,树脂或树脂/填料可以经由连通区域而流动,与没有连通区域的中间导体相比,绝缘构件与导体板及散热板的粘接性提高,热阻减小。
此外,在使用含有填料的树脂片和没有连通区域的中间导体的情况下,树脂及填料无法在中间导体中连通。因此,填料与作为中间导体的金属表面接触,通过树脂而粘接在金属表面。为了提高树脂片的导热率,填料在树脂片内形成有连续结构较为有效,若该填料的连续结构被中间导体阻碍,则也会导致树脂片的导热率降低。
相对于此,在本实施方式中,由于中间导体具有连通区域,因此填料的连续结构得以无切断地形成。由此,与使用没有连通区域的中间导体的情况相比,能够减小树脂片的导热率降低。
此外,在树脂使用的是具有规则结构的液晶性树脂等的情况下,通常规则结构容易在填料表面形成而形成于填料间,或者设计成形成于填料间,从而有在金属箔表面难以形成规则结构的情况,或者即便形成规则结构,规则结构的方向也不一样的情况。在这种情况下,在金属箔表面,树脂的规则结构紊乱,相较于填料间的树脂而言,金属箔表面的树脂的导热率会降低。
相对于此,本实施方式使用的是具有连通区域的中间导体,因此,填料及树脂经由连通区域而具有连续结构,所以能够抑制金属箔表面的规则结构紊乱,从而能够减少树脂的导热的降低。作为基质的树脂的导热率的些许差异会对作为复合材料的含有填料的树脂片的导热率产生较大影响。此外,在填充有大量填料的复合材料的情况下,作为基质的树脂的导热率的变化会对复合材料的导热率产生较大影响。因此,在使用由具有规则结构的树脂和填料构成的树脂片的情况下,使用具有连通孔的中间导体对于减少由中间导体引起的树脂片的导热率的降低较为有效。
为形成连通区域而形成的中间导体的连通孔的形状无特别限制。作为例子,展示的是图12的(a)和(b),但从中间导体的俯视图观察到的连通孔的形状可为圆形、四边形、椭圆形、长方形、网眼状等。此外,也可包含形状不同的连通孔。这些连通孔较理想为具有多个并均匀地配置在中间导体内。此外,也可在导热的降低较大的部位集中性地配置连通孔。
此外,也可以通过连结大量具有粒子、鳞片状、薄片、平板等形状的导体来形成具有导体的连续结构的层,并在该具有导体的连续结构的层上设置连通孔,由此制成中间导体。中间导体上形成的连通孔只要是树脂和填料能够在孔路内流动的连结孔即可,在中间导体内部,孔路可直线前进,也可弯曲。
关于连通孔的大小,连通孔的孔径优选为300μm以下。此处,所谓孔径,是指形成连通孔的孔形状中隔得最开的部位的长度。若连通孔的大小为300μm以上,则树脂及填料的流动性提高,能够降低热阻,但中间导体的电压分担的效果会减小或消失,因此容易发生局部放电。因此,连通孔的孔径较理想为300μm以下,更理想为100μm以下,这时,中间导体的电压分担的效果不会消失,从而较佳。
树脂或者树脂和填料在中间导体所具有的连通孔内流动,由此与没有连通孔的中间导体相比,能够降低热阻。因此,连通孔的孔径为至少树脂能够流动的孔径即可,较理想为优选具有树脂及填料能够流动的孔径。若连通孔的孔径为0.1μm以下,则树脂的流动性降低,因此热阻增大。此外,若连通孔的孔径为填料粒径以下,则树脂及填料的流动性降低,因此热阻增大。此外,此处,所谓填料的粒径是指,树脂片中包含具有一定的粒度分布的单个或多个填料组,而具有一定的粒度分布的填料组中粒径最小的填料组的粒度分布(个数分布)中的平均粒径。
形成中间导体的材料为导电体即可,例如可以使用铜、铝等。作为具有连结孔的中间导体的形成方法,有如下方法等:通过转印、蒸镀、印刷、镀敷等方法在由树脂和填料构成的绝缘片上形成具有连通孔的金属的薄膜,之后压接绝缘片的方法,或者,将具有小片状、鳞片状、薄片、平板等形状的导体片、导体粉或导体粒子以形成连通孔的方式喷雾、散布在树脂片上等,由此形成具有连通孔的导体层,之后压接绝缘片的方法等。
图13为表示用以对使用具有连通孔的中间导体的情况下的热阻降低的效果和绝缘性能进行说明的实验结果的曲线图。为了确认使用具有连通孔的中间导体的情况下的热阻降低的效果,制作以下所示的试样。在厚度2mm的150mm见方的Al板上放置150mm见方的含有填料的树脂绝缘片,通过在树脂绝缘片上形成导体图案的掩蔽,借助铝蒸镀在绝缘片上形成厚度0.1μm的铝膜导体图案,该导体图案是具有孔径(构成网眼的孔的对角线的长度)2μm~500μm、连结孔间的间隔为50μm的网眼状的连通孔的图案。以通过蒸镀形成的铝膜处于内部的方式放置未进行图案形成的150mm见方的含有填料的树脂绝缘片,进而放置厚度2mm、100mm见方的Al板,之后进行加热、压接而形成试样,并测定热阻及局部放电开始电压。
图13的横轴为连通孔的孔径,纵轴为将使用没有连通孔的中间导体的情况下的试样的热阻设为1的归一化热阻及归一化局部放电开始电压。如图13所示,与没有连通孔的中间导体相比,通过在中间导体上形成连通孔,能够降低热阻。通过增大连通孔的孔径,即便在2μm以下的孔径下,热阻也会逐渐降低。相对于此,当增大连通孔的大小时,在100μm以上,局部放电开始电压开始见到较大的降低。由此得知,若控制连通孔的孔径,则能够降低热阻而不会降低局部放电开始电压。
同样地,通过在树脂绝缘片上形成孔径(构成网眼的孔的直径)10μm的、从中间导体的俯视图观察到的连通孔的形状为圆形、连结孔间的间隔为30μm的导体图案的掩蔽,借助铝蒸镀在绝缘片上形成厚度0.1μm的铝膜导体图案。以通过蒸镀形成的铝膜处于内部的方式放置未进行图案形成的150mm见方的含有填料的树脂绝缘片,进而放置厚度2mm、100mm见方的Al板,之后进行压接而形成试样,并测定热阻及局部放电开始电压。该情况下的归一化热阻为0.83,归一化局部放电开始电压为1.0。如此,即便使用具有圆形的连通孔的中间导体,也能获得同样的效果。
使用图14及图15,对第2实施方式的功率模块进行说明。实施例2的功率模块展示实施例1的功率模块的变形例。图14为俯视图,图15为以图14的C-D截面切割而得的截面图。
在本实施方式中,利用金属线来连接功率半导体元件的发射极侧的电极。并且,与下桥臂侧IGBT 330的集电极侧连接的导体板320和上桥臂侧IGBT 328的发射极面经由中间电极390而连接。中间电极390与导体板320及315一样,以隔着绝缘层900与散热面307相对的方式配置。在中间电极390与散热面307之间配置中间导体912。中间导体912与中间导体910及911一样埋设在绝缘层900中。
中间电极390与导体板320一样承受交流电压,因此可以通过中间导体912来进行电压分担。
使用图16至图20,对第3实施方式的功率模块进行说明。
图16(a)为本实施方式的功率模块的立体图,图16(b)为以图16(a)中的E-F截面进行切割时的截面图。本实施方式的功率模块300是在作为CAN型冷却器的冷却体304中收纳有功率半导体元件的两面冷却结构。冷却体304具有形成散热片305的第一散热面307A及第二散热面307B、连接散热面与框体的薄壁部304A、以及凸缘部304B。从形成为有底筒型形状的冷却体304的插入口306插入由功率半导体元件和导体板构成的电路体,利用密封材料351加以密封而形成功率模块300。由于功率半导体元件从第一散热面307A及第二散热面307B两面得到冷却,因此本实施方式的功率模块的散热性优异。
图17为以图16(a)的G-H截面进行切割时的剖面的示意图。本实施方式的功率模块300在配置在功率半导体元件的一侧的绝缘层中具有中间导体910及911。并且,功率模块300在配置在功率半导体元件的所述一侧的相反侧即另一侧的绝缘层中具有中间导体913及914。中间导体910配置在承受交流电压的导体板320与散热面307A之间。中间导体911配置在承受直流电压的导体板315与散热面307A之间。中间导体913配置在承受交流电压的导体板318与散热面307B之间。中间导体914配置在承受直流电压的导体板319与散热面307B之间。
并且,各中间导体形成电容电路C1至C8。电容C1是导体板315与中间导体911之间的电容。电容C2是中间导体911与散热面307A之间的电容。电容C3是导体板318与中间导体913之间的电容。电容C4是中间导体913与散热面307B之间的电容。电容C5是导体板320与中间导体910之间的电容。电容C6是中间导体910与散热面307A之间的电容。电容C7是导体板319与中间导体914之间的电容。电容C8是中间导体914与散热面307B之间的电容。其中,承受直流电压的导体板315与散热面307A之间的电容C1、C2以及导体板319与散热面307B之间的C7、C8仅在直流电压发生变化时形成电容电路。
图18为用以说明本实施方式的功率模块中的中间导体的配置的展开图。为了进行说明,图中仅展示了一部分构成。
图19为将电容C1至C8示于功率模块的电路图中的图。电容C1、C2、C8及C7是承受直流电压的部分。因此,该部分的中间导体911及914可以省略。电容C3、C4、C5及C6是承受交流电压的部分。因此,该部分的中间导体910及913能够分担施加至绝缘层的电压。
本实施方式的功率模块是冷却性优异的两面冷却结构的功率模块,通过在绝缘层中设置中间导体结构,绝缘层能够薄壁化,从而能够获得散热性更优异的高耐压的功率模块。
使用图20(a)及图20(b),对本实施方式的功率模块中的电感降低进行说明。图20(a)为本实施方式的功率模块300的电路图。图20(b)为功率模块300的展开图。
设为下桥臂侧的二极管166在正向偏压状态下导通的状态。在该状态下,当上桥臂侧的IGBT 328变为ON状态时,下桥臂侧的二极管166变为逆向偏压,载流子迁移所引起的恢复电流贯通上下桥臂。此时,图20(b)所示的恢复电流360流至各导体板315、318、320及319。恢复电流360流过与直流负极端子319B相对配置的直流正极端子315B。然后,流过由各导体板315、318、320、319形成的回路形状的路径。继而,流过直流负极端子319B。
电流在回路形状路径中流通,由此在冷却器304的第1散热面307A及第2散热面307B流通涡电流361。在该涡电流361的电流路径中等效电路362所产生的磁场抵消效应使得回路形状路径中的布线电感363降低。再者,恢复电流360的电流路径越接近回路形状,电感降低作用越是增大。通过像这样设为将上桥臂电路和下桥臂电路模块化为1组而成的2in1结构,可以借助磁场抵消效应来降低电感。即便增加为4in1、6in1,也能具有相同效果。
使用图21,对第4实施方式的功率模块进行说明。
图21为本实施方式的功率模块的截面图。相当于关于实施例3的功率模块的图17。与实施例3的不同点在于增加了中间导体的数量。
中间导体910a及910b配置在承受交流电压的导体板320与散热面307A之间。中间导体911a及911b配置在承受直流电压的导体板315与散热面307A之间。中间导体913a及913b配置在承受交流电压的导体板318与散热面307B之间。中间导体914a及914b配置在承受直流电压的导体板319与散热面307B之间。
并且,各中间导体形成电容电路C1至C12。电容C1是导体板315与中间导体911a之间的电容。电容C2是中间导体911a与中间导体911b之间的电容。电容C3是中间导体911b与散热面307A之间的电容。电容C4是导体板318与中间导体913a之间的电容。电容C5是中间导体913a与中间导体913b之间的电容。电容C6是中间导体913b与散热面307B之间的电容。电容C7是导体板320与中间导体910a之间的电容。电容C8是中间导体910a与中间导体910b之间的电容。电容C9是中间导体910b与散热面307A之间的电容。电容C10是导体板319与中间导体914a之间的电容。电容C11是中间导体914a与中间导体914b之间的电容。电容C12是中间导体914b与散热面307B之间的电容。其中,承受直流电压的导体板315与散热面307A之间的电容C1、C2、C3以及导体板319与散热面307B之间的C10、C11、C12仅在直流电压发生变化时形成电容电路。
在本实施例的功率模块中,可以将施加至绝缘层的电压分担为3份,因此能够进一步减薄绝缘层的总厚度。
使用图22至图24,对引入本发明的功率模块的电力转换装置及车辆系统的构成例进行说明。图22展示电力转换装置的电路图。
电力转换装置200具备换流器电路部140、142、辅助用换流器电路部43以及电容器模块500。换流器电路部140及142具备多个功率模块300,通过对它们进行连接而构成了3相电桥电路。在电流容量较大的情况下,通过进一步并联功率模块300并对应于3相换流器电路的各相来进行这些并联,能够应对电流容量的增大。此外,也可以通过并联功率模块300中内置的功率半导体元件来应对电流容量的增大。
换流器电路部140和换流器电路部142的基本电路构成相同,控制方法和动作也基本相同。此处,作为代表,以换流器电路部140为例进行说明。换流器电路部140具备3相电桥电路作为基本构成。具体而言,作为U相(以符号U1表示)、V相(以符号V1表示)、W相(以符号W1表示)进行动作的各个桥臂电路分别与输送直流电的正极侧及负极侧的导体并联在一起。再者,与换流器电路部140的情况一样,以符号U2、V2及W2表示换流器电路部142的作为U相、V相及W相进行动作的各个桥臂电路。
各相的桥臂电路由上桥臂电路与下桥臂电路串联而成的上下桥臂串联电路构成。各相的上桥臂电路分别与正极侧的导体连接在一起,各相的下桥臂电路分别与负极侧的导体连接在一起。在上桥臂电路与下桥臂电路的连接部分别产生交流电。各上下桥臂串联电路的上桥臂电路与下桥臂电路的连接部与各功率模块300的交流端子320B连接。各功率模块300的交流端子320B分别与电力转换装置200的交流输出端子连接,产生的交流电被供给至电动发电机192或194的定子绕组。各相的各功率模块300基本上是相同结构,动作也基本相同,因此,作为代表,对功率模块300的U相(U1)进行说明。
上桥臂电路具备上桥臂用IGBT 328和上桥臂用二极管156作为开关用功率半导体元件。此外,下桥臂电路具备下桥臂用IGBT 330和下桥臂用二极管166作为开关用功率半导体元件。各上下桥臂串联电路的直流正极端子315B及直流负极端子319B分别与电容器模块500的电容器连接用直流端子连接。从交流端子320B输出的交流电被供给至电动发电机192、194。
IGBT 328、330接收从构成驱动电路174的2个驱动电路中的一方或另一方输出的驱动信号而进行开关动作,将从电池136供给的直流电转换为三相交流电。转换后的电力被供给至电动发电机192的定子绕组。再者,V相及W相的电路构成与U相大致相同,因此,省略了符号328、330、156、166的显示。换流器电路部142的功率模块300的构成与换流器电路部140的情况相同,此外,辅助用换流器电路部43具有与换流器电路部142相同的构成,此处省略说明。
使用上桥臂用IGBT 328及下桥臂用IGBT 330,对开关用功率半导体元件进行说明。上桥臂用IGBT 328、下桥臂用IGBT 330具备集电极、发射极(信号用发射极端子)及栅极(栅极端子)。在上桥臂用IGBT 328、下桥臂用IGBT 330的集电极与发射极之间,像图示那样电性连接有上桥臂用二极管156、下桥臂用二极管166。
上桥臂用二极管156、下桥臂用二极管166具备阴极电极及阳极电极2个电极。以从上桥臂用IGBT 328、下桥臂用IGBT 330的发射极去往集电极的方向成为正向的方式将二极管156、166的阴极电极与IGBT 328、330的集电极电性连接在一起,将阳极电极与IGBT328、330的发射极电性连接在一起。再者,作为功率半导体元件,也可使用MOSFET(金氧半场效晶体管),在该情况下,不需要上桥臂用二极管156、下桥臂用二极管166。
上下桥臂串联电路的温度信息从设置在上下桥臂串联电路上的温度传感器(未图示)被输入至微型计算机。此外,上下桥臂串联电路的直流正极侧的电压信息被输入至微型计算机。微型计算机根据这些信息来进行过温度检测及过电压检测,在检测到过温度或过电压的情况下,停止所有上桥臂用IGBT 328、下桥臂用IGBT 330的开关动作,保护上下桥臂串联电路免受过温度或过电压的影响。
图23为表示电力转换装置200的外观的立体图。本实施方式的电力变化装置200的外观是将壳体12、上部罩10及下部罩16固定而形成的,所述壳体12的上表面或底面为大致长方形,所述上部罩10设置在壳体12的短边侧的一外周,所述下部罩16用以堵住壳体12的下部开口。通过将壳体12的仰视图或俯视图的形状设为大致长方形,在车辆中的安装变得容易,而且容易生产。
图24展示搭载有电力转换装置的混合动力汽车的控制框图。混合动力汽车(HEV)110配备有两套车辆驱动用系统。一套是以发动机120为动力源的发动机驱动系统,另一套是以电动发电机192、194为动力源的旋转电机驱动系统。本发明的电力转换装置200在电池136、电动发电机192、194、辅助用马达195之间进行直流、交流的电力转换,根据车辆的行驶状态而最佳地控制对马达的驱动电力的供给、来自马达的电力再生,有助于燃油效率的提高。
符号说明
10 上部罩
12 壳体
16 下部罩
18 交流端子
43 换流器电路
110 混合动力汽车
120 发动机
136 电池
138 直流接头
140 换流器电路
142 换流器电路
156 二极管
166 二极管
172 控制电路
174 驱动电路
180 电流传感器
192 电动发电机
194 电动发电机
195 马达
200 电力转换装置
300 功率模块
304 冷却体
304A 冷却体的薄壁部
304B 凸缘
305 散热片
306 插入口
307 散热面
307A 第一散热面
307B 第二散热面
315 直流正极导体板
315B 直流正极端子
319 直流负极导体板
319B 直流负极端子
318 导体板
320B 交流端子
328 IGBT
330 IGBT
333 绝缘片
348 第一密封材料
351 第二密封材料
500 电容器模块
800 电极
801 中间导体
802 电极
810 绝缘层
811 绝缘层
850 空气层
851 绝缘层
900 绝缘层
910 交流侧中间导体
911 直流侧中间导体
912 交流侧中间导体
913 交流侧中间导体
914 直流侧中间导体
1000 波形记录器
1001 发送器
1100 导体
1101 连通区域(连通孔)。

Claims (12)

1.一种功率模块,其特征在于,具备:
导体板,其连接着开关元件;
散热板,其与所述导体板相对配置;
绝缘构件,其配置在所述导体板与所述散热板之间;以及
导电性的中间导体,其以与所述导体板及所述散热板电性绝缘的状态配置在所述绝缘构件中,
所述中间导体具有连通区域,所述连通区域在相对于所述中间导体而言配置在所述导体板侧的所述绝缘构件与相对于所述中间导体而言配置在所述散热板侧的所述绝缘构件之间进行连通,
所述连通区域形成为100μm以下的直径。
2.根据权利要求1所述的功率模块,其特征在于,
所述绝缘构件由具有规则结构的树脂形成。
3.根据权利要求1所述的功率模块,其特征在于,
所述绝缘构件由含有填料的树脂形成。
4.根据权利要求2所述的功率模块,其特征在于,
所述绝缘构件由含有填料的树脂形成。
5.根据权利要求3所述的功率模块,其特征在于,
所述连通区域形成得比所述填料的粒径大。
6.根据权利要求1至5中任一项所述的功率模块,其特征在于,
所述中间导体是形成有多个所述连通区域的格子状的导体。
7.根据权利要求1至5中任一项所述的功率模块,其特征在于,
所述导体板传输交流电流。
8.根据权利要求6所述的功率模块,其特征在于,
所述导体板传输交流电流。
9.根据权利要求1至5中任一项所述的功率模块,其特征在于,
所述中间导体形成为:与所述导体板和所述散热板的排列方向垂直的方向上的该中间导体的宽度比该方向上的所述导体板的宽度大。
10.根据权利要求6所述的功率模块,其特征在于,
所述中间导体形成为:与所述导体板和所述散热板的排列方向垂直的方向上的该中间导体的宽度比该方向上的所述导体板的宽度大。
11.根据权利要求7所述的功率模块,其特征在于,
所述中间导体形成为:与所述导体板和所述散热板的排列方向垂直的方向上的该中间导体的宽度比该方向上的所述导体板的宽度大。
12.根据权利要求8所述的功率模块,其特征在于,
所述中间导体形成为:与所述导体板和所述散热板的排列方向垂直的方向上的该中间导体的宽度比该方向上的所述导体板的宽度大。
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CN107851638A (zh) 2018-03-27
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JP6557540B2 (ja) 2019-08-07
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