CN107825005A - A kind of low temperature solder(ing) paste and preparation method thereof - Google Patents
A kind of low temperature solder(ing) paste and preparation method thereof Download PDFInfo
- Publication number
- CN107825005A CN107825005A CN201711320557.3A CN201711320557A CN107825005A CN 107825005 A CN107825005 A CN 107825005A CN 201711320557 A CN201711320557 A CN 201711320557A CN 107825005 A CN107825005 A CN 107825005A
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- ing
- paste
- weld
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of low temperature solder(ing) paste and preparation method thereof, the solder(ing) paste is made up of SnBiAgSb X-alloys powder and weld-aiding cream, and wherein X is the one or more in Ge, In, Co, Ni, P；The weight of SnBiAgSb X-alloys powder and weld-aiding cream ratio is 87 90：10‑13；The component and mass percent of the weld-aiding cream be：25 35% resin H130,10 20% Resin A X 80,0.5 2% IRG245 antioxidant, 3 5% BHT antioxidant, 5 7% thixotropic agent, 8 13% activating agent, 30 45% solvent.The solder(ing) paste of the present invention is applied in electronic product welding, can reduce welding temperature, improves soldering reliability, and effectively solve the problems, such as that solder joint periphery has black circle and pad tin sweat(ing) excessive.
Description
Technical field
The present invention relates to low-temperature welding solder(ing) paste technical field.
Background technology
Existing solder(ing) paste is the leadless soldering tin paste that Sn-Ag-Cu alloyed powders form with weld-aiding cream stirring mostly, and this is a series of
Solder(ing) paste belong to medium temperature solder(ing) paste.The deadly defect of Sn-Ag-Cu systems solder(ing) paste is alloy melting point height, causes to assemble in temperature
Rise, Sn-Ag-Cu systems eutectic temperature is 217 DEG C, and the reflux temperature for welding device is higher than 240 DEG C, and this means that sets to welding
Heat resistance of standby, welding procedure, electronic component and baseplate material etc. is proposed higher requirement.And LED, LCD, radiating
The thermo-responsive electronic components such as device, tuner, lightning protection component, fire alarm, temperature control element, air-conditioning protector, flexible board
In welding process, heating-up temperature all should not too high, multi-level multicompartment substep welding be also required to use low temperature solder(ing) paste.Cause
This, exploitation low temperature solder(ing) paste has turned into the active demand in market.
The content of the invention
Present invention aims to solve the deficiencies of the prior art, and provides a kind of a kind of low temperature solder(ing) paste.
The purpose of the present invention is achieved through the following technical solutions：
A kind of low temperature solder(ing) paste, solder(ing) paste are made up of SnBiAgSb-X alloyed powders and weld-aiding cream, wherein X be Ge, In, Co,
One or more in Ni, P；The weight of SnBiAgSb-X alloyed powders and weld-aiding cream ratio is 87-90：10-13；The weld-aiding cream
Component and mass percent are：The IRG245 antioxygens of 25-35% resin H130,10-20% Resin A X-80,0.5-2%
Agent, 3-5% BHT antioxidant, 5-7% thixotropic agent, 8-13% activating agent, 30-45% solvent；The SnBiAgSb-X
Alloyed powder is the alloy powder prepared by centrifugal atomizing after being configured to alloy in proportion by Sn, Bi, Ag, Sb and micro X,
Sn, Bi, Ag, Sb, X quality proportioning are Bi30-60%, Ag0.1-3.5%, Sb0.1-2%, X0-0.5%, surplus Sn.
Thixotropic agent of the present invention is by 6500 thixotropic agent and PLUS thixotropic agent 2-3 in mass ratio:3-4 is formed.The activity
Agent union diacid, adipic acid, salicylic acid mixing composition.The solvent is by butyl and dipropylene mixing group
Into.
Compared with prior art, low temperature solder(ing) paste of the invention at least has advantages below：
1.SnBiAgSb-X low temperature solder(ing) pastes welding temperature is less than 180 DEG C, the minimum weldering with Sn-Ag-Cu leadless soldering tin pastes
Jointing temp (240 DEG C) is compared, more energy efficient more economical.
Its weldability of 2.SnBiAgSb-X low temperature solder(ing) paste is better than Sn42Bi58 and tin bismuth silver, the scolding tin of Sn-Bi-Cu system row
Cream, performance of the welding spot reliability close to Sn-Ag-Cu leadless soldering tin pastes.
3. the solder(ing) paste of the present invention is applied in electronic product welding, tin bismuth low temperature tin cream solder joint week can be also efficiently solved
While have black circle, the excessive phenomenon of tin sweat(ing).
Embodiment
Embodiment 1
A kind of low temperature solder(ing) paste, is made up of SnBiAgSbGe alloyed powders and weld-aiding cream, SnBiAgSbGe alloyed powders and helps weldering
The weight ratio of cream is 87：13.The component and mass percent of weld-aiding cream be：25% resin H130,15% Resin A X-80,
1% IRG245 antioxidant, 5% BHT antioxidant, 3% 6500 thixotropic agent, 2% PLUS thixotropic agent, 2% azelaic acid,
3% adipic acid, 5% salicylic acid, 20% butyl, 19% dipropylene.
The SnBiAgSbGe alloyed powders are after being configured to alloy in proportion by Sn, Bi, Ag, Sb and micro Ge, to pass through
Alloy powder prepared by centrifugal atomizing, Sn, Bi, Ag, Sb, Ge quality proportioning is Bi40%, Ag 2.5%, Sb 0.1%,
Ge0.5%, surplus Sn.
The preparation method of low temperature solder(ing) paste is as follows：
(1) weld-aiding cream is prepared：By resin H130, Resin A X-80, butyl, dipropylene, 6500 thixotropings
Heating stirring dissolves together for agent, PLUS thixotropic agent, stops heating until completely dissolved, then adds IRG245 antioxidant and BHT
Antioxidant, azelaic acid, adipic acid, salicylic acid are added, stirring is poured into container and sealed to after being completely dissolved, and natural cooling is coagulated
Gu weld-aiding cream is become after, can be used after 24 hours；
(2) solder(ing) paste is prepared：The weld-aiding cream of preparation and SnBiAgSbGe alloyed powders are placed in tin cream agitated kettle, first 20-
30rpm atmospheric agitation 15min, then 20-30rpm bear 0.2-0.4MPa and are stirred under vacuum 10min, that is, obtain glossy fine and smooth scolding tin
Cream.Solder(ing) paste is placed in into 0-10 DEG C of condition to preserve.
Embodiment 2
A kind of low temperature solder(ing) paste, is made up of SnBiAgSbIn alloyed powders and weld-aiding cream, SnBiAgSbIn alloyed powders and helps weldering
The weight ratio of cream is 89：11.The component and mass percent of weld-aiding cream be：25% resin H130,12% Resin A X-80,
1.5% IRG245 antioxidant, 4% BHT antioxidant, 3% 6500 thixotropic agent, 4% PLUS thixotropic agent, 4% nonyl two
Acid, 3.5% adipic acid, 5% salicylic acid, 25% butyl, 13% dipropylene.
The SnBiAgSbIn alloyed powders are after being configured to alloy in proportion by Sn, Bi, Ag, Sb and micro In, to pass through
Alloy powder prepared by centrifugal atomizing, Sn, Bi, Ag, Sb, In quality proportioning is Bi30%, Ag 2.0%, Sb 1%,
In0.3%, surplus Sn.
The preparation method of low temperature solder(ing) paste is in addition to alloyed powder is SnBiAgSbIn alloyed powders, and method and step is the same as embodiment 1.
Embodiment 3
A kind of low temperature solder(ing) paste, is made up of SnBiAgSbCo alloyed powders and weld-aiding cream, SnBiAgSbCo alloyed powders and helps weldering
The weight ratio of cream is 89.5：10.5.The component and mass percent of weld-aiding cream be：28% resin H130,10% Resin A X-
80th, 1% IRG245 antioxidant, 5% BHT antioxidant, 3% 6500 thixotropic agent, 3% PLUS thixotropic agent, 3% nonyl two
Acid, 2% adipic acid, 5% salicylic acid, 28% butyl, 12% dipropylene.
The SnBiAgSbCo alloyed powders are after being configured to alloy in proportion by Sn, Bi, Ag, Sb and micro Co, to pass through
Alloy powder prepared by centrifugal atomizing, Sn, Bi, Ag, Sb, Co quality proportioning is Bi60%, Ag 0.1%, Sb 0.5%,
Co0.1%, surplus Sn.
The preparation method of low temperature solder(ing) paste is in addition to alloyed powder is SnBiAgSbCo alloyed powders, and method and step is the same as embodiment 1.
Embodiment 4
A kind of low temperature solder(ing) paste, is made up of SnBiAgSbGeCo alloyed powders and weld-aiding cream, SnBiAgSbGeCo alloyed powders and
The weight ratio of weld-aiding cream is 90：10.The component and mass percent of weld-aiding cream be：35% resin H130,11% Resin A X-
80th, 2% IRG245 antioxidant, 3% BHT antioxidant, 3% 6500 thixotropic agent, 4% PLUS thixotropic agent, 2% nonyl two
Acid, 4% adipic acid, 2% salicylic acid, 20% butyl, 14% dipropylene.
The SnBiAgSbGeCo alloyed powders are after being configured to alloy in proportion by Sn, Bi, Ag, Sb and micro Ge, Co,
The alloy powder prepared by centrifugal atomizing, Sn, Bi, Ag, Sb, Ge, Co quality proportioning are Bi40%, Ag 3.5%, Sb
0.2%th, Ge0.2%, Co0.1%, surplus Sn.
The preparation method of low temperature solder(ing) paste is in addition to alloyed powder is SnBiAgSbGeCo alloyed powders, and method and step is the same as embodiment 1.
Embodiment 5
A kind of low temperature solder(ing) paste, is made up of SnBiAgSbNi alloyed powders and weld-aiding cream, SnBiAgSbNi alloyed powders and helps weldering
The weight ratio of cream is 90：10.The component and mass percent of weld-aiding cream be：28% resin H130,20% Resin A X-80,
0.5% IRG245 antioxidant, 3.5% BHT antioxidant, 2% 6500 thixotropic agent, 3% PLUS thixotropic agent, 5% nonyl
Diacid, 5% adipic acid, 3% salicylic acid, 20% butyl, 10% dipropylene.
The SnBiAgSbNi alloyed powders are after being configured to alloy in proportion by Sn, Bi, Ag, Sb and micro Ni, to pass through
Alloy powder prepared by centrifugal atomizing, Sn, Bi, Ag, Sb, Ni quality proportioning is Bi50%, Ag 3%, Sb 2%,
Ni0.1%, surplus Sn.
The preparation method of low temperature solder(ing) paste is in addition to alloyed powder is SnBiAgSbNi alloyed powders, and method and step is the same as embodiment 1.
Embodiment 6
A kind of low temperature solder(ing) paste, is made up of SnBiAgSbNiP alloyed powders and weld-aiding cream, SnBiAgSbNiP alloyed powders and helps
The weight ratio of soldering paste is 88：12.The component and mass percent of weld-aiding cream be：25% resin H130,11% Resin A X-
80th, 1.5% IRG245 antioxidant, 4.5% BHT antioxidant, 2% 6500 thixotropic agent, 3% PLUS thixotropic agent, 3%
Azelaic acid, 3% adipic acid, 2% salicylic acid, 25% butyl, 20% dipropylene.
The SnBiAgSbNiP alloyed powders are after being configured to alloy in proportion by Sn, Bi, Ag, Sb and micro Ni, P, are led to
Cross the alloy powder of centrifugal atomizing preparation, Sn, Bi, Ag, Sb, Ni, P quality proportioning is Bi55%, Ag1%, Sb1%,
Ni0.2%, P0.1%, surplus Sn.
The preparation method of low temperature solder(ing) paste is in addition to alloyed powder is SnBiAgSbNiP alloyed powders, and method and step is the same as embodiment 1.
Verify after tested, SnBiAgSb-X solder(ing) pastes of the invention have good wettability and weldability, are ensureing eutectic welding
While connecing technological requirement, fundamentally solve poor conventional solder welding spot reliability at present, solder joint easy fracture, solder joint week
The problems such as side blacks and tin sweat(ing) is excessive, is a kind of solder(ing) paste of energy-conserving and environment-protective.
The present invention it is raw materials used as resin H130, Resin A X-80, IRG245 antioxidant, BHT antioxidant, 6500 thixotropic agent,
PLUS thixotropic agent, azelaic acid, adipic acid, salicylic acid, butyl, dipropylene etc. are commercially available.SnBiAgSb-
X-alloy powder can also be prepared voluntarily with purchased in market.
Claims (5)
1. a kind of low temperature solder(ing) paste, it is characterised in that for solder(ing) paste by being formed with weld-aiding cream, wherein X is in Ge, In, Co, Ni, P
It is one or more of；The weight of SnBiAgSb-X alloyed powders and weld-aiding cream ratio is 87-90：10-13；The component and matter of the weld-aiding cream
Measuring percentage is：The IRG245 antioxidant of 25-35% resin H130,10-20% Resin A X-80,0.5-2%, 3-5%
BHT antioxidant, 5-7% thixotropic agent, 8-13% activating agent, 30-45% solvent；The SnBiAgSb-X alloyed powders be by
After Sn, Bi, Ag, Sb and micro X are configured to alloy in proportion, by centrifugal atomizing prepare alloy powder, Sn, Bi, Ag,
Sb, X quality proportioning are Bi30-60%, Ag0.1-3.5%, Sb0.1-2%, X0-0.5%, surplus Sn.
A kind of 2. low temperature solder(ing) paste according to claim 1, it is characterised in that the thixotropic agent by 6500 thixotropic agent and
PLUS thixotropic agent 2-3 in mass ratio:3-4 is formed.
A kind of 3. low temperature solder(ing) paste according to claim 1 or 2, it is characterised in that the activating agent union diacid, oneself two
Acid, salicylic acid mixing composition.
4. a kind of low temperature solder(ing) paste according to claim 1 or 2, it is characterised in that the solvent is by butyl
Mix and form with dipropylene.
5. the preparation method of a kind of low temperature solder(ing) paste as described in any one of claim 1-4, it is characterised in that method is such as
Under：
(1) weld-aiding cream is prepared：Resin H130, Resin A X-80, solvent and thixotropic agent together heating stirring are dissolved, treated completely molten
Stop heating after solution, then add IRG245 antioxidant and BHT antioxidant, add activating agent, stirring is fallen to after being completely dissolved
Enter in container and seal, weld-aiding cream is become after natural cooling solidification；
(2) solder(ing) paste is prepared：The weld-aiding cream of preparation and SnBiAgSb-X alloyed powders are pressed into 87-90：10-13 ratio weighs juxtaposition
In tin cream agitated kettle, first 20-30rpm atmospheric agitations 15min, then 20-30rpm bear 0.2-0.4MPa and are stirred under vacuum 10min, i.e.,
Obtain glossy fine and smooth solder(ing) paste.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108381056A (en) * | 2018-03-29 | 2018-08-10 | 苏州国通科技有限公司 | A kind of solder(ing) paste and preparation method thereof |
| CN108941967A (en) * | 2018-08-09 | 2018-12-07 | 重庆源晶电子材料有限公司 | A kind of low temperature has core solder stick and preparation method thereof |
| CN109158794A (en) * | 2018-10-12 | 2019-01-08 | 苏州优诺电子材料科技有限公司 | A kind of bismuth-containing system alloy tin composite cream |
| CN109158795A (en) * | 2018-10-12 | 2019-01-08 | 苏州优诺电子材料科技有限公司 | A kind of low-temperature solder alloy powder and preparation method thereof |
| CN110682021A (en) * | 2019-11-11 | 2020-01-14 | 重庆理工大学 | Preparation method of micro welding spot for inhibiting growth of interface IMC |
| CN112372177A (en) * | 2020-11-03 | 2021-02-19 | 哈尔滨理工大学 | High-wettability brazing filler metal and preparation method thereof |
| CN112643241A (en) * | 2020-12-10 | 2021-04-13 | 昆明理工大学 | Sn-Bi-Cu-Ag-Ni-Sb low-temperature high-mechanical-property lead-free solder alloy |
| CN115156756A (en) * | 2022-08-25 | 2022-10-11 | 深圳市鑫富锦新材料有限公司 | Environment-friendly low-temperature residue-free solder paste |
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| CN108941967A (en) * | 2018-08-09 | 2018-12-07 | 重庆源晶电子材料有限公司 | A kind of low temperature has core solder stick and preparation method thereof |
| CN109158794B (en) * | 2018-10-12 | 2021-04-30 | 苏州优诺电子材料科技有限公司 | Bismuth-containing alloy solder paste composition |
| CN109158794A (en) * | 2018-10-12 | 2019-01-08 | 苏州优诺电子材料科技有限公司 | A kind of bismuth-containing system alloy tin composite cream |
| CN109158795A (en) * | 2018-10-12 | 2019-01-08 | 苏州优诺电子材料科技有限公司 | A kind of low-temperature solder alloy powder and preparation method thereof |
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| CN110682021B (en) * | 2019-11-11 | 2021-08-03 | 重庆理工大学 | Preparation method of micro welding spot for inhibiting growth of interface IMC |
| CN110682021A (en) * | 2019-11-11 | 2020-01-14 | 重庆理工大学 | Preparation method of micro welding spot for inhibiting growth of interface IMC |
| CN112372177A (en) * | 2020-11-03 | 2021-02-19 | 哈尔滨理工大学 | High-wettability brazing filler metal and preparation method thereof |
| CN112643241A (en) * | 2020-12-10 | 2021-04-13 | 昆明理工大学 | Sn-Bi-Cu-Ag-Ni-Sb low-temperature high-mechanical-property lead-free solder alloy |
| CN115156756A (en) * | 2022-08-25 | 2022-10-11 | 深圳市鑫富锦新材料有限公司 | Environment-friendly low-temperature residue-free solder paste |
| CN115156756B (en) * | 2022-08-25 | 2023-08-15 | 深圳市鑫富锦新材料有限公司 | Environment-friendly low-temperature residue-free solder paste |
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Application publication date: 20180323 |