CN107815687A - Copper chloride corrosive liquid regenerating unit - Google Patents
Copper chloride corrosive liquid regenerating unit Download PDFInfo
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- CN107815687A CN107815687A CN201710965052.6A CN201710965052A CN107815687A CN 107815687 A CN107815687 A CN 107815687A CN 201710965052 A CN201710965052 A CN 201710965052A CN 107815687 A CN107815687 A CN 107815687A
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- Prior art keywords
- corrosive liquid
- copper chloride
- regenerating unit
- control module
- pump
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The copper chloride corrosive liquid regenerating unit of the present invention, frame top installation etching groove, lower section installation reservoir, reservoir are connected to etching groove by pump；Etching groove connects reservoir by pipeline connecting detection station inlet, measuring station liquid outlet by pipeline, and measuring station is connected to pump control system controlling pump running status by communicating link control module, control module by communication；By automatic control etching solution proportion, acidity value, redox ability and temperature, hydrochloric acid and the sodium chlorate liquid as oxidant are effectively added automatically, carries out corrosive liquid regenerative response, so as to reach the effect that circulating repetition utilizes etching solution；Optimal etchant concentration is controlled by oxidant sensor, insufficient section of the etching solution by oxygen recovery is supplied using minimum oxidant, while maintains stable etch-rate, reduce labor intensity of operating staff, product quality is improved, reduces discharge, saves production cost expense；It is proven, 70% production cost can be saved.
Description
Technical field
The present invention relates to copper chloride corrosive liquid regenerating unit.
Background technology
Need to corrode manufacture intaglio plate by making a plate in the light carved art for industry of making a plate, conventional graphic arts corrosion process typically uses three
Iron chloride corrosive liquid is etched to copper roller pattern, is often corroded all corresponding discharge part ferric chloride solution of a copper roller, is caused to lose
Liquid level declines in cutting；Ferric trichloride corrosive liquid Baume degrees is generally artificial Timing measurement, during less than standard value by manually from
Liquid case removal waste fluid, then supplement equivalent stoste manually, discharging of waste liquid processing cost is high, and environment is polluted, and stoste consumption is big,
Energy waste, cost input are high；Need to carry out multiple artificial detection in every copper roller etching process, need to wash by water during artificial detection
The space of a whole page is cleaned, rinse water can enter corrosion liquid case, reduce tank liquor effective percentage, influence etch-rate, stability is poor, and raw material disappear
Consumption is more, and labor intensity of operating staff is high, adds production run cost.
The content of the invention
The technical problem to be solved by the invention is to provide one kind to recycle, and reduces discharge, cost-effective chlorine
Change copper corrosion liquid regenerating unit.
The copper chloride corrosive liquid regenerating unit of the present invention, including organic frame, frame top are provided with etching groove, and its feature exists
In：The reservoir for holding etching solution is installed below frame, reservoir is connected to etching groove by pump；Etching groove is connected by pipeline
The measuring station inlet of etching solution effective component content in etching groove can be detected by being connected to, and measuring station liquid outlet is connected by pipeline
To reservoir；Measuring station is connected with the control module that can receive measuring station detection signal by communication, and control module passes through logical
News are connected to pump control system, and pump control system electrically connects controlling pump running status with pump；Reservoir is also connected with benefit by pump
Fill composition adding trough；
The measuring station includes level sensor, hydrochloric acid sensor and oxidant sensor；
The level sensor detects etching solution proportion by ball float, and controls running water addition by control module；
The hydrochloric acid sensor detects concentration of hydrochloric acid in etching solution by electric induction principle, and controls salt by control module
Sour addition；
The control module operating temperature range is -10~50 DEG C；
Each detection parameters, the display of preset value can be shown by being provided with the control module panel, and adjustment is default
The adjusting key of value, and the control button of each active ingredient addition is controlled, the phase of corresponding each detector is additionally provided with panel
Answer indicator lamp；
The region that can hold running water, hydrochloric acid, hydrogen peroxide is respectively arranged with the supplement composition adding trough；
The chemical equation of the etching groove reaction principle is：CuCl2+Cu→2CuCl
The chemical equation of regenerative response principle is：2CuCl+2HCl+H2O2→2CuCl2+2H2O；
The control module also has automatic alarm circuit.
The copper chloride corrosive liquid regenerating unit of the present invention, by automatic control etching solution proportion, acidity value, oxidation also
Proper energy power and temperature, hydrochloric acid and the sodium chlorate liquid as oxidant are effectively added automatically, carry out corrosive liquid regenerative response, so as to
Reach the effect that circulating repetition utilizes etching solution；Optimal etchant concentration is controlled by oxidant sensor, using minimum
Oxidant supply insufficient section of the etching solution by oxygen recovery, while maintain stable etch-rate, reduce operating personnel
Labor intensity, product quality is improved, reduce discharge, save production cost expense；It is proven, 70% can be saved and be produced into
This.
Brief description of the drawings
Fig. 1 is the copper chloride corrosive liquid regenerating unit planar structure schematic diagram of the embodiment of the present invention；
Fig. 2 is the copper chloride corrosive liquid regenerating unit of the embodiment of the present invention according to the regeneration principle schematic of hydrochloric acid；
Fig. 3 is that the copper chloride corrosive liquid regenerating unit hydrogen peroxide of the embodiment of the present invention produces the mode principle of regenerative response
Schematic diagram.
Embodiment
As illustrated, a kind of copper chloride corrosive liquid regenerating unit, copper chloride corrosive liquid regenerating unit of the invention, include
Frame, frame top are provided with etching groove, it is characterised in that：The reservoir for holding etching solution, reservoir are installed below frame
Etching groove is connected to by pump；Etching groove is connected to the inspection that can detect etching solution effective component content in etching groove by pipeline
Survey station inlet, measuring station liquid outlet are connected to reservoir by pipeline；Measuring station is connected with by communication can receive detection
The control module for detection signal of standing, control module are connected to pump control system by communication, and pump control system electrically connects control with pump
Pump operation state processed；Reservoir is also connected with supplement composition adding trough by pump；
The measuring station includes level sensor, hydrochloric acid sensor and oxidant sensor；
The level sensor detects etching solution proportion by ball float, and controls running water addition by control module；
The hydrochloric acid sensor detects concentration of hydrochloric acid in etching solution by electric induction principle, and controls salt by control module
Sour addition；
The control module operating temperature range is -10~50 DEG C；
Each detection parameters, the display of preset value can be shown by being provided with the control module panel, and adjustment is default
The adjusting key of value, and the control button of each active ingredient addition is controlled, the phase of corresponding each detector is additionally provided with panel
Answer indicator lamp；
The region that can hold running water, hydrochloric acid, hydrogen peroxide is respectively arranged with the supplement composition adding trough；
The chemical equation of the etching groove reaction principle is：CuCl2+Cu→2CuCl
The chemical equation of regenerative response principle is：2CuCl+2HCl+H2O2→2CuCl2+2H2O；
The control module also has automatic alarm circuit.
The copper chloride corrosive liquid regenerating unit of the present invention, by automatic control etching solution proportion, acidity value, oxidation also
Proper energy power and temperature, hydrochloric acid and the sodium chlorate liquid as oxidant are effectively added automatically, carry out corrosive liquid regenerative response, so as to
Reach the effect that circulating repetition utilizes etching solution；Measuring station has chlorination copper etchant solution on-line checking function, complementary element addition
Groove has the two kinds of liquid functionals of sodium chloride and hydrochloric acid added automatically as oxidant, and control module has etching solution proportion, oxygen
Change reduction potential, acidity, temperature parameter display function, can storing data automatically, facilitate data management, and with complete
Auto-alarm function.
Optimal etchant concentration is controlled by oxidant sensor, using minimum oxidant come supply etching solution by
The insufficient section of oxygen recovery, while stable etch-rate is maintained, labor intensity of operating staff is reduced, improves product quality,
Discharge is reduced, saves production cost expense；It is proven, 70% production cost can be saved.
Specifically, increase buoyancy according to decoction proportion also to increase, proportion reduces the principle that buoyancy also reduces, when copper in decoction
When ion concentration increaseds or decreases, the buoyancy of decoction can also become big therewith or reduce, and the change of buoyancy makes the certain ball float of weight
Rise or fall, change in location can occur for the lifting of ball float, and the level sensor of measuring station becomes the potential energy of ball float change in location
Change amount is converted to electric signal and passes to control module, and control module judges the size of decoction proportion according to electric signal, carries out originally
Water is added to control proportion.
Each pipeline junction of etching groove is connected with flow control valve, can adjust the flow of etching solution；Etch under groove sidewall
Portion is provided with overflow pipe and is connected to liquid reserve tank, and etching solution overflows to liquid reserve tank by overflow pipe.
Measuring station accesses the etching solution in etching groove by sampling box, and sampling box has to the liquid level of etching solution strictly will
Ask, level sensor is housed in sampling box, and be connected with liquid level inductive switch, if liquid level does not reach the work of liquid level inductive switch
It is required that addition can not be normally carried out；Liquid-level switch height can be adjusted；Level sensor bottom is particularly configured as in liquid level
Below 20mm, it is impossible to immerse excessive, immersion will excessively cause copper rod consumption too fast, be not used in cost control, and ball float shakes
Dynamic big, specific gravity test is inaccurate, flow just to cover liquid level meter height of baffle plate 4/5 at be optimal.
Hydrochloric acid sensor (HCl SENSOR) is electromagnetic type sensor, and principle is electric energy+kinetic energy → electric energy；According to electromagnetism sense
Principle is answered, when electric current is by sensor coil, flux (magnetic line of force) can be produced, the flux can be dense according to the ion of hydrochloric acid in decoction
Spend and produce certain proportion electric current, then current change quantity is digitized, and be converted to electric signal and be transmitted to control module, control
Module judges whether the ion concentration of hydrochloric acid in decoction is normal according to electric signal, so as to control hydrochloric acid to add.
Oxidant sensor (NaCLO3SENSOU) electrolytic principle is electric energy → electric energy；
H2O2The measuring principle of hydrogen peroxide sensor：
Platinum point anti-Ying Time in etching solution, concentration and etch capabilities (etching speed) according to decoction can produce the quantity of electric charge
Change；Hydrogen peroxide sensor will detect that the quantity of electric charge occurred (output), and be sent to " NaCLO3" controller.
“NaCLO3" related data of controller half hydrogen peroxide concentration and etching speed etc. again enters power；Going out obtained by hydrogen peroxide sensor
Power is calculated and be shown on the controller；Its unit is not MOL/L (concentration) but represented with MV Come.
H2O2The characteristic and measuring principle of hydrogen peroxide or sodium chlorate：
The oxidisability of hydrogen peroxide is very strong, during stannous chloride is oxidized to copper chloride, can increase the speed of etching, just
For regenerative agent, it plays critically important role；Although the oxygen in air can also produce regenerative response, once output
During increase, the reproduction speed of oxygen just has little time, so in order to promote etching speed, hydrogen peroxide or sodium chlorate as oxidant are
Can not.Oxidant sensor, it is the accelerator by oxidant as etching solution regenerative response, under minimum demand, control
Optimal etchant concentration, because of the stabilization of etching speed and the reduction of usage amount, product quality can be greatly improved, is reduced into
This；It is that decoction quality is managed with the hydrogen peroxide of minimum demand, as reference quantity, thus is not management oxidant, and
It is the etch capabilities for detecting to etch decoction, is on the one hand supplied with minimum oxidant in etching solution by oxygen O2Regeneration is not
Foot point, on the one hand maintain the stability of etching production.
Its change for oily definite value of the content of univalent copper ion and bivalent cupric ion is as follows：
When When substrate Tong Copper (Cu) are dissolved in etching decoction (CuCl2) in, cupric can be changed into monovalence copper.(with
The dissolving of copper, both ORP value can decline potential value).Monovalence copper and HCl can be because of the O in air2And produce regenerative response.It is but raw
When yield is big, the O of air2Come just needs H not as good as the part of regeneration2O2Make oxidant.
When monovalence copper one increases, ORP value will decline, and the monovalence copper in etching solution is regenerated as Er Jia Tong Time, ORP values
It will rise.
CUCl2Regenerate detector operation principle
| PV (actual value) | 0.668 | 580 | 1.305 | 33.2℃ |
| SV (standard value) | 0.85 | 580 | 1.28 | 40.0℃ |
| HCL | NACLO3 | SG (proportion) | Temperature |
Claims (9)
1. a kind of copper chloride corrosive liquid regenerating unit, including organic frame, frame top is provided with etching groove, it is characterised in that：Machine
The reservoir for holding etching solution is installed below frame, reservoir is connected to etching groove by pump；Etching groove is connected to by pipeline
The measuring station inlet of etching solution effective component content in etching groove can be detected, measuring station liquid outlet is connected to storage by pipeline
Liquid bath；Measuring station is connected with the control module that can receive measuring station detection signal by communication, and control module passes through the company of communicating
Pump control system is connected to, pump control system electrically connects controlling pump running status with pump；Reservoir also by pump be connected with supplement into
Part adding trough.
2. copper chloride corrosive liquid regenerating unit according to claim 1, it is characterised in that：The measuring station senses including liquid level
Device, hydrochloric acid sensor and oxidant sensor.
3. copper chloride corrosive liquid regenerating unit according to claim 2, it is characterised in that：The level sensor passes through ball float
Etching solution proportion is detected, and running water addition is controlled by control module.
4. copper chloride corrosive liquid regenerating unit according to claim 2, it is characterised in that：The hydrochloric acid sensor passes through inductance
Concentration of hydrochloric acid in principle detection etching solution is answered, and hydrochloric acid addition is controlled by control module.
5. copper chloride corrosive liquid regenerating unit according to claim 1, it is characterised in that：The control module operating temperature model
Enclose for -10~50 DEG C.
6. copper chloride corrosive liquid regenerating unit according to claim 1, it is characterised in that：Set on the control module panel
Each detection parameters, the display of preset value can be shown by having, and the adjusting key of adjustment preset value, and each active ingredient of control adds
The control button of dosage, the corresponding indicator lamp of corresponding each detector is additionally provided with panel.
7. copper chloride corrosive liquid regenerating unit according to claim 1, it is characterised in that：Divide in the supplement composition adding trough
The region of running water, hydrochloric acid, hydrogen peroxide can be held by not being provided with.
8. copper chloride corrosive liquid regenerating unit according to claim 1, it is characterised in that：The etching groove is anti-Answer principle
Chemical equation is：CuCl2+Cu 2CuCl；The chemical reaction side of regenerative response principleFormula is： 2CuCl+2HCl
+H2O2 2CuCl2+2H2O。
9. copper chloride corrosive liquid regenerating unit according to claim 1, it is characterised in that：The control module also has automatic
Warning circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710965052.6A CN107815687B (en) | 2017-10-17 | 2017-10-17 | Copper chloride corrosive liquid regenerating unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710965052.6A CN107815687B (en) | 2017-10-17 | 2017-10-17 | Copper chloride corrosive liquid regenerating unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107815687A true CN107815687A (en) | 2018-03-20 |
| CN107815687B CN107815687B (en) | 2019-05-31 |
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ID=61608321
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710965052.6A Active CN107815687B (en) | 2017-10-17 | 2017-10-17 | Copper chloride corrosive liquid regenerating unit |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108585023A (en) * | 2018-05-03 | 2018-09-28 | 东莞运城制版有限公司 | A kind of unmanned control method in copper chloride corrosive liquid production |
| CN110565097A (en) * | 2019-08-29 | 2019-12-13 | 深圳市祺鑫天正环保科技有限公司 | Regenerated liquid processing method and regenerated liquid processing device |
| CN111809184A (en) * | 2020-07-15 | 2020-10-23 | 深圳市祺鑫环保科技有限公司 | Method for recycling regenerated seed liquid |
| CN111885839A (en) * | 2020-09-01 | 2020-11-03 | 陈圆圆 | Etching machine is used in integrated circuit board processing |
| CN111926334A (en) * | 2020-09-08 | 2020-11-13 | 深圳市志凌伟业光电有限公司 | Regeneration system and regeneration method for acidic copper chloride etching solution |
| CN114351147A (en) * | 2021-12-30 | 2022-04-15 | 广东臻鼎环境科技有限公司 | Full-automatic safe and efficient acid etching solution regeneration system for chlorine |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101140374A (en) * | 2006-09-08 | 2008-03-12 | 三星电子株式会社 | Etching liquid supply device, etching device and etching method |
| CN201220974Y (en) * | 2008-06-10 | 2009-04-15 | 耐博检测技术(上海)有限公司 | Double-groove macrostructure electrolysis etching apparatus |
| CN102569015A (en) * | 2010-12-23 | 2012-07-11 | 无锡尚德太阳能电力有限公司 | Etching liquid replenishing device, etching liquid replenishing method and wet etching equipment with etching liquid replenishing device |
| CN104020099A (en) * | 2014-05-27 | 2014-09-03 | 中国科学院金属研究所 | Periodic soaking accelerated corrosion test system for metal material and metal protective coating and application thereof |
| CN104087941A (en) * | 2014-07-17 | 2014-10-08 | 深圳市卓力达电子有限公司 | Etching method and equipment of etching stainless steel by ferric chloride |
| CN104409396A (en) * | 2014-11-26 | 2015-03-11 | 太极能源科技（昆山）有限公司 | Wet etching method and device for solar cells |
| CN205062183U (en) * | 2015-10-30 | 2016-03-02 | 兰州大学 | Control by temperature change etch apparatus |
| CN105479965A (en) * | 2015-12-16 | 2016-04-13 | 东莞运城制版有限公司 | Copper chloride corrosion device and method for printing roller |
| CN206422082U (en) * | 2016-12-15 | 2017-08-18 | 苏州库睿斯自动化设备有限公司 | A kind of uniform improved etching device of etching extent |
-
2017
- 2017-10-17 CN CN201710965052.6A patent/CN107815687B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101140374A (en) * | 2006-09-08 | 2008-03-12 | 三星电子株式会社 | Etching liquid supply device, etching device and etching method |
| CN201220974Y (en) * | 2008-06-10 | 2009-04-15 | 耐博检测技术(上海)有限公司 | Double-groove macrostructure electrolysis etching apparatus |
| CN102569015A (en) * | 2010-12-23 | 2012-07-11 | 无锡尚德太阳能电力有限公司 | Etching liquid replenishing device, etching liquid replenishing method and wet etching equipment with etching liquid replenishing device |
| CN104020099A (en) * | 2014-05-27 | 2014-09-03 | 中国科学院金属研究所 | Periodic soaking accelerated corrosion test system for metal material and metal protective coating and application thereof |
| CN104087941A (en) * | 2014-07-17 | 2014-10-08 | 深圳市卓力达电子有限公司 | Etching method and equipment of etching stainless steel by ferric chloride |
| CN104409396A (en) * | 2014-11-26 | 2015-03-11 | 太极能源科技（昆山）有限公司 | Wet etching method and device for solar cells |
| CN205062183U (en) * | 2015-10-30 | 2016-03-02 | 兰州大学 | Control by temperature change etch apparatus |
| CN105479965A (en) * | 2015-12-16 | 2016-04-13 | 东莞运城制版有限公司 | Copper chloride corrosion device and method for printing roller |
| CN206422082U (en) * | 2016-12-15 | 2017-08-18 | 苏州库睿斯自动化设备有限公司 | A kind of uniform improved etching device of etching extent |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108585023A (en) * | 2018-05-03 | 2018-09-28 | 东莞运城制版有限公司 | A kind of unmanned control method in copper chloride corrosive liquid production |
| CN110565097A (en) * | 2019-08-29 | 2019-12-13 | 深圳市祺鑫天正环保科技有限公司 | Regenerated liquid processing method and regenerated liquid processing device |
| CN111809184A (en) * | 2020-07-15 | 2020-10-23 | 深圳市祺鑫环保科技有限公司 | Method for recycling regenerated seed liquid |
| CN111885839A (en) * | 2020-09-01 | 2020-11-03 | 陈圆圆 | Etching machine is used in integrated circuit board processing |
| CN111885839B (en) * | 2020-09-01 | 2021-11-26 | 宏华胜精密电子(烟台)有限公司 | Etching machine is used in integrated circuit board processing |
| CN111926334A (en) * | 2020-09-08 | 2020-11-13 | 深圳市志凌伟业光电有限公司 | Regeneration system and regeneration method for acidic copper chloride etching solution |
| CN114351147A (en) * | 2021-12-30 | 2022-04-15 | 广东臻鼎环境科技有限公司 | Full-automatic safe and efficient acid etching solution regeneration system for chlorine |
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