CN206422082U - A kind of uniform improved etching device of etching extent - Google Patents
A kind of uniform improved etching device of etching extent Download PDFInfo
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- CN206422082U CN206422082U CN201621377143.5U CN201621377143U CN206422082U CN 206422082 U CN206422082 U CN 206422082U CN 201621377143 U CN201621377143 U CN 201621377143U CN 206422082 U CN206422082 U CN 206422082U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
A kind of uniform improved etching device of etching extent, it is related to the etching device technical field of crystal silicon solar energy battery, including the texturing slot for taking up corrosive liquid, roller for transmitting silicon chip, texturing slot includes the etching tank and the reservoir below etching tank positioned at upper strata, etching tank top is provided with multiple rollers, woven hose provided with transfusion pumping and connection transfusion pumping inside reservoir, also include point liquid house steward of connection woven hose, liquid house steward is divided to be connected with for the corrosive liquid equipartition device toward uniform sprinkling corrosive liquid in etching tank, the other end of corrosive liquid equipartition device is connected with liquid back pipe, the upper end of liquid back pipe is located in etching tank, lower end is located in reservoir, liquid back pipe in reservoir is provided with back pump, transfusion pumping, return pump electrical connection pressure controller, the application, which provides one kind, can improve corrosive liquid and silicon chip reaction uniformity in etching device, so as to the uniform improved etching device of the etching extent for the uniformity effect for improving making herbs into wool face.
Description
Technical field
The utility model is related to the etching device technical field of crystal silicon solar energy battery, and specifically a kind of etching extent is uniform
Improved etching device.
Background technology
The production main flow of crystal silicon solar energy battery is usually：Making herbs into wool, diffusion, wet etching, PECVD depositions, silk
Wire mark brush and sintering, making herbs into wool are the first processes of manufacture of solar cells, and its purpose is mainly：1st, the machinery damage of silicon chip surface is removed
Hinder layer；2nd, silicon chip surface greasy dirt and metal impurities are removed；3rd, up-and-down matte is formed, increases extinction area, light is reduced
Reflectivity, improves short circuit current flow（Isc）, the final photoelectric transformation efficiency for improving battery, making herbs into wool its mainly pass through HNO3, HF system
The processing such as suede, flushing, the flushing of KOH burn intos, HF, HCl cleaning, etching device is chain circulation system, mostly four tracks to eight rails
Road, silicon chip is by the transmission of roller respectively through etching tank and rinse bath, and silicon chip enters from one end, and the other end unloads completion
Whole flow process, wherein the uniformity of the etching extent of each track is into a very important monitor control index on production line.
It is existing etching device as shown in Figure 1 and Figure 2, wherein 1 ˊ is reservoir, 2 ˊ are etching tank, and 3 ˊ are roller, and 4 ˊ are
Woven hose, 5 ˊ are pumping, and 6 ˊ are jet pipe, and 7 ˊ are spray orifice, and corrosive liquid is to be transported in reservoir by woven hose by pumping
Etching tank, is squeezed into etching tank by piece jet pipe vertical with silicon chip conduct direction of corrosion slot tail, and then overflow returns to liquid storage
Groove, but be due to that spray orifice on jet pipe is larger and afterbody positioned at etching tank, so that the solution flow rate of etching tank internal corrosion liquid
It is all uneven with temperature, cause the bad control of the uneven matte of etching extent of silicon chip reacted with corrosive liquid, in addition in reservoir
Corrosive liquid reason is stood etc. due to liquid deposition or long period, may have density variation of the corrosive liquid in liquid level and
Being directly pumped in etching tank is used for making herbs into wool, influences making herbs into wool effect.
Utility model content
The application offer is a kind of to improve corrosive liquid and silicon chip reaction uniformity in etching device, so as to improve making herbs into wool face
The uniform improved etching device of the etching extent of uniformity effect, its technical scheme is as follows：
A kind of uniform improved etching device of etching extent, including for taking up the texturing slot of corrosive liquid, for transmitting silicon chip
Roller, the texturing slot include positioned at upper strata etching tank and the reservoir below the etching tank, the etching tank
Top is provided with inside multiple rollers, reservoir the woven hose provided with transfusion pumping and the connection transfusion pumping, in addition to connection
Point liquid house steward of the woven hose, described point of liquid house steward is connected with equal for the corrosive liquid toward uniform sprinkling corrosive liquid in etching tank
Separating device, the corrosive liquid equipartition device is provided with tiny spray orifice, and the other end of the corrosive liquid equipartition device is connected with back liquid
Pipe, the upper end of the liquid back pipe is located in the etching tank, lower end is located in the reservoir, returning in the reservoir
Liquid pipe is provided with back pump, the transfusion pumping, time pump electrical connection pressure controller.
Preferably, the corrosive liquid equipartition device includes point liquid house steward described in that quantity corresponds to making herbs into wool track
On point liquid spout, described point of liquid spout be respectively connected with a point liquid branch pipe, described point of liquid branch pipe wall provided with multiple tiny spray orifices,
Described point of liquid branch pipe is arranged on below the roller.
Preferably, described point of liquid branch pipe is equidistantly arranged and bearing of trend is consistent with silicon chip conduct direction, described point of liquid branch
Pipe extends to rear end from corrosion front of the slot.
Preferably, also including multiple agitators for being used to stir corrosive liquid being distributed in the reservoir.
Preferably, the agitator includes agitator arm, the rotary shaft for the agitator arm to be fixedly mounted, it is described
Motor is connected with below rotary shaft, the motor is located at outside reservoir and is electrically connected with the control cabinet for controlling rotating speed.
According to above-mentioned technical proposal, the corrosive liquid equipartition device is provided with tiny spray orifice, sprayed everywhere into etching tank
Corrosive liquid, can effectively reduce flow velocity difference pair and react the influence caused with silicon chip, the pressure controller control corrosion rate liquid is equal
Separating device corrosion hydraulic coupling everywhere is simultaneously adjusted, and is dispensed positioned at transfusion pumping, the corrosive liquid returned between pump so as to realize
Put the flow velocity for spraying corrosive liquid everywhere toward in etching tank, temperature almost consistent, be evenly equipped with addition in the reservoir for stirring
The agitator of corrosive liquid, during can make it that corrosive liquid in reservoir is in constantly circulation, the corrosion allowed in reservoir
Liquid is more uniform, can solve the inconsistent harmful effect brought of corrosive liquid concentration itself.
Brief description of the drawings
The utility model is described in further detail below by embodiment combination accompanying drawing
Fig. 1 is the structural representation of etching device in the prior art；
Fig. 2 is nozzle structure schematic diagram in Fig. 1；
Fig. 3 is improved etching device structural representation of the invention；
Fig. 4 is corrosive liquid equipartition device structural representation in Fig. 3；
Fig. 5 is point liquid manifold structure schematic diagram in Fig. 4；
Fig. 6 is agitator schematic diagram in Fig. 3.
Wherein, 1 ˊ, reservoir；2 ˊ, etching tank；3 ˊ, roller；4 ˊ, woven hose；5 ˊ, pumping；6 ˊ, jet pipe；7 ˊ, spray orifice；1、
Reservoir；2nd, etching tank；3rd, roller；4th, transfusion pumping；5th, woven hose；6th, liquid house steward is divided；7th, corrosive liquid equipartition device；71st, divide
Liquid spout；72nd, liquid branch pipe is divided；73rd, spray orifice；8th, liquid back pipe；9th, pump is returned；10th, pressure controller；11st, agitator；111st, stir
Mix impeller；112nd, rotary shaft；113rd, motor；114th, control cabinet.
Embodiment
The utility model is described in further detail below by embodiment combination accompanying drawing.
As shown in figure 3, a kind of uniform improved etching device of etching extent, including for taking up the texturing slot of corrosive liquid, using
In the roller 3 of transmission silicon chip, the texturing slot includes the etching tank 2 and the liquid storage positioned at the lower section of etching tank 2 positioned at upper strata
Groove 1, the top of etching tank 2 is provided with multiple rollers 3, and the inside of reservoir 1 is provided with transfusion pumping 4 and connects the transfusion pumping 4
Woven hose 5, include point liquid house steward 6 of the connection woven hose 5, described point of liquid house steward 6 is connected with for toward in etching tank 2
The corrosive liquid equipartition device 7 of uniform sprinkling corrosive liquid, the corrosive liquid equipartition device is provided with tiny spray orifice 73, the corrosive liquid
The other end of equipartition device 7 is connected with liquid back pipe 8, and the upper end of the liquid back pipe 8 is located in the etching tank 2, lower end is located at institute
State in reservoir 1, the liquid back pipe 8 in the reservoir 1 is provided with back pump 9, the transfusion pumping 4, time pump 9
Electrically connect pressure controller 10.The corrosive liquid equipartition device 7 is provided with tiny spray orifice, the sprinkling corrosion everywhere into etching tank 2
Liquid, can effectively reduce the corrosive liquid flow velocity difference pair that quickly flowing or directed flow are caused and react the influence caused with silicon chip,
The other pressure controller 10 is by detecting transfusion pumping 4, time corresponding pressure value of pump 9 and being finely adjusted, so as to control
System, which is realized, is located at transfusion pumping 4, the corrosive liquid equipartition device 7 returned between pump 9 toward spraying corrosive liquid everywhere in etching tank 2
Flow velocity, temperature are almost consistent, realize that the etching extent difference of each silicon chip is substantially reduced, and difference is from original between the piece of silicon slice corrosion amount
10% drops to less than 3%, reaches that the effect in making herbs into wool face is more preferable.
As shown in Figure 4, Figure 5, preferably, the corrosive liquid equipartition device 7 includes the peace that quantity corresponds to making herbs into wool track
Point liquid spout 71 on described point of liquid house steward 6, described point of liquid spout 71 is respectively connected with a point liquid branch pipe 72, described point of liquid branch pipe
72 tube walls are provided with multiple tiny spray orifices 73, and described point of liquid branch pipe 72 is arranged on the lower section of roller 3.In actual design, respectively
Spray orifice on individual point of liquid branch pipe 72 accordingly carries out various sizes of design according to corrosion flow quantity and pressure gap so that each position
The corrosive liquid ejection flow velocity put is almost consistent, reaches that the corrosive liquid for circulating to come up from reservoir 1 can be in the same time in corrosion
Each spray orifice of groove 2 is sprayed, it is ensured that all silicon chips are all carried out in each position with flow velocity, temperature all highly uniform corrosive liquids
Reaction.
As shown in figure 4, preferably, the equidistantly arrangement of described point of liquid branch pipe 72 and bearing of trend and silicon chip conduct direction one
Cause, described point of liquid branch pipe 72 extends to rear end from the front end of etching tank 2.Before the one end for entering silicon chip in general acquiescence etching tank 2 is
Hold, the other end for silicon chip of going out is rear end, after being extended to by the equidistantly arrangement of setting point liquid branch pipe 72 and from the front end of etching tank 2
End, it is ensured that silicon chip more uniform contact corrosion liquid everywhere in etching tank 2.
As shown in figure 3, preferably, also include it is multiple be distributed in the reservoir 1 be used for stir stirring for corrosive liquid
Mix device 11.By setting agitator 11, during can make it that corrosive liquid in reservoir 1 is in constantly circulation, liquid storage is allowed
Corrosive liquid in groove 1 is more uniform.
As shown in fig. 6, preferably, the agitator 11 includes agitator arm 111, for the paddle to be fixedly mounted
The rotary shaft 112 of wheel 111, the lower section of the rotary shaft 112 is connected with motor 113, the motor 113 be located at the outside of reservoir 1 and
It is electrically connected with the control cabinet 114 for controlling rotating speed.The time laid according to the liquid level of the internal corrosion liquid of reservoir 1 or standing
Or the actual conditions such as whether etching device in running order, the rotating speed of the corresponding adjustment rotary shaft 112 of control cabinet 114, to realize
The even concentration of corrosive liquid is consistent in reservoir 1, it is ensured that pile effects are more preferably during follow-up silicon wafer wool making.
A kind of embodiment of the present utility model is as follows：
The conveying silicon chip of roller 3 enters etching tank 2, and motor 113 is stirred in reservoir 1 under the certain rotating speed adjusted
Corrosive liquid, transfusion pumping 4, time pump 9 carry out conveying, the reflux cycle of corrosive liquid respectively under the setting data of controller 10
Work, wherein transfusion pumping 4 is divided corrosive liquid feeding in liquid house steward 6 by woven hose 5, divides liquid house steward 6 and then through a point liquid spout
71 are equably arranged to each point of shunting conveying corrosive liquid of liquid branch pipe 72, corrosive liquid by several spray orifices on point tube wall of liquid branch pipe 72
Enter to contact with silicon chip in etching tank 2 and chemically reacted.
Use above specific case is illustrated to the utility model, is only intended to help and is understood the utility model, and
Not to limit the utility model.For the utility model person of ordinary skill in the field, think according to of the present utility model
Think, some simple deductions, deformation can also be made or replaced.
Claims (5)
1. a kind of uniform improved etching device of etching extent, including for taking up the texturing slot of corrosive liquid, for transmitting silicon chip
Roller, the texturing slot is included on the etching tank and the reservoir below the etching tank positioned at upper strata, the etching tank
Portion is provided with inside multiple rollers, reservoir the woven hose provided with transfusion pumping and the connection transfusion pumping, it is characterised in that also
Include point liquid house steward of the connection woven hose, described point of liquid house steward is connected with for toward uniformly spraying corrosive liquid in etching tank
Corrosive liquid equipartition device, the corrosive liquid equipartition device is provided with tiny spray orifice, and the other end of the corrosive liquid equipartition device connects
It is connected to liquid back pipe, the upper end of the liquid back pipe is located in the etching tank, lower end is located in the reservoir, positioned at the liquid storage
Liquid back pipe in groove is provided with back pump, the transfusion pumping, time pump electrical connection pressure controller.
2. the uniform improved etching device of a kind of etching extent as claimed in claim 1, it is characterised in that the corrosive liquid is divided equally
Device includes point liquid spout being arranged on described point of liquid house steward that quantity corresponds to making herbs into wool track, and described point of liquid spout is respectively connected
There is a point liquid branch pipe, described point of liquid branch pipe wall is provided with multiple tiny spray orifices, and described point of liquid branch pipe is arranged on below the roller.
3. a kind of uniform improved etching device of etching extent as claimed in claim 2, it is characterised in that described point of liquid branch pipe etc.
Away from arrangement and bearing of trend is consistent with silicon chip conduct direction, described point of liquid branch pipe from corrode front of the slot extend to rear end.
4. the uniform improved etching device of a kind of etching extent as claimed in claim 1, it is characterised in that also including multiple uniform
The agitator of corrosive liquid is stirred in being used in the reservoir.
5. the uniform improved etching device of a kind of etching extent as claimed in claim 4, it is characterised in that the agitator includes
Motor, the motor position are connected with below agitator arm, the rotary shaft for the agitator arm to be fixedly mounted, the rotary shaft
Outside the reservoir and it is electrically connected with the control cabinet for controlling rotating speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621377143.5U CN206422082U (en) | 2016-12-15 | 2016-12-15 | A kind of uniform improved etching device of etching extent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621377143.5U CN206422082U (en) | 2016-12-15 | 2016-12-15 | A kind of uniform improved etching device of etching extent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206422082U true CN206422082U (en) | 2017-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621377143.5U Active CN206422082U (en) | 2016-12-15 | 2016-12-15 | A kind of uniform improved etching device of etching extent |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107815687A (en) * | 2017-10-17 | 2018-03-20 | 江苏沪运制版有限公司 | Copper chloride corrosive liquid regenerating unit |
| CN108109946A (en) * | 2018-01-16 | 2018-06-01 | 昆山成功环保科技有限公司 | A kind of etching apparatus |
| CN108376663A (en) * | 2018-04-25 | 2018-08-07 | 通威太阳能（安徽）有限公司 | A kind of uniform pumping equipment of RENA etching devices multiple exit formula |
| CN108963033A (en) * | 2018-07-13 | 2018-12-07 | 宁波尤利卡太阳能科技发展有限公司 | Polycrystalline silicon texturing device and method |
-
2016
- 2016-12-15 CN CN201621377143.5U patent/CN206422082U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107815687A (en) * | 2017-10-17 | 2018-03-20 | 江苏沪运制版有限公司 | Copper chloride corrosive liquid regenerating unit |
| CN108109946A (en) * | 2018-01-16 | 2018-06-01 | 昆山成功环保科技有限公司 | A kind of etching apparatus |
| CN108376663A (en) * | 2018-04-25 | 2018-08-07 | 通威太阳能（安徽）有限公司 | A kind of uniform pumping equipment of RENA etching devices multiple exit formula |
| CN108376663B (en) * | 2018-04-25 | 2023-07-25 | 通威太阳能（安徽）有限公司 | Multi-outlet type uniform liquid discharge device of RENA (red, green and blue) texturing equipment |
| CN108963033A (en) * | 2018-07-13 | 2018-12-07 | 宁波尤利卡太阳能科技发展有限公司 | Polycrystalline silicon texturing device and method |
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