CN107794504A - TiZrTaN涂层刀具及其制备方法 - Google Patents

TiZrTaN涂层刀具及其制备方法 Download PDF

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CN107794504A
CN107794504A CN201711082930.6A CN201711082930A CN107794504A CN 107794504 A CN107794504 A CN 107794504A CN 201711082930 A CN201711082930 A CN 201711082930A CN 107794504 A CN107794504 A CN 107794504A
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matrix material
coated cutting
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coatings
tizrtan
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邢佑强
高俊涛
吴泽
黄鹏
刘磊
李晓
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Southeast University
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation

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Abstract

本发明公开了一种TiZrTaN涂层刀具及其制备方法，涂层刀具包括基体材料，所述基体材料表面沉积TiZrTaN涂层。制备方法包括步骤：(1)将研磨处理后的刀具基体材料在真空为7.0×10‑3Pa条件下加热至200‑240℃保温；(2)在刀具基体材料表面采用电弧镀和中频磁控溅射方式沉积TiZrTaN涂层，得到所述涂层刀具。本发明的涂层刀具为多层结构，具有较好的硬度和抗磨损能力，且热稳定性、抗氧化性和抗腐蚀性好；制备方法简单、易操作，条件温和，具有广阔的应用前景。

Description

TiZrTaN涂层刀具及其制备方法
技术领域
本发明属于机械切削刀具制造领域，尤其涉及一种TiZrTaN涂层刀具及其制备方法。
背景技术
TiN涂层作为一种硬质涂层，已广泛应用于切削刀具、刃具及各种模具表面作为耐磨和耐腐蚀层。然而，作为刀具涂层，切削过程中，TiN涂层表现出了抗氧化温度低，热硬度低等缺点。通过在TiN中添加Zr元素可以进一步提高TiN涂层耐磨性能等，从而研制出TiZrN涂层刀具。
中国专利ZL200910014862.9报道了一种TiZrN涂层刀具及其制备方法，该刀具表面涂层具有较高的硬度和强度，该涂层能够达到减小刀具磨损目的，但是抗氧化温度低，热硬度低。文献(KhetanV.,et al.ACS Applied Materials&Interfaces,2014,6(17):15403-15411.)报道了一种AlTiTaN涂层，该涂层与AlTiN涂层相比表现出较好的抗氧化和热稳定性能，该涂层非常适合干加工应用场合。文献(Rachbauer R.,et al.Surface andCoatings Technology,2012,211:98-103.)表明，Ta元素的添加能够明显提高TiAlN涂层的热稳定性能。目前国内外未见TiZrTaN涂层刀具的报道。
发明内容
发明目的：本发明提供了一种TiZrTaN涂层刀具及其制备方法，该涂层刀具既具有极高的硬度，又具有良好的热稳定性能、抗氧化性能、耐腐蚀性和抗磨损能力，解决了现有技术中的刀具抗氧化和热稳定性能与硬度和耐腐蚀性能不能兼具的问题；该制备方法简单、易操作，条件温和、易实现。
技术方案：本发明的TiZrTaN涂层刀具，包括基体材料，所述基体材料表面沉积TiZrTaN涂层。Ta元素作为一种过渡金属元素，具有良好的热稳定性、抗氧化能力和耐腐蚀能力，Ta元素的添加能够进一步提高TiZrN涂层刀具的热稳定性、抗氧化能力和耐腐蚀能力。
其中，所述基体材料为高速钢或硬质合金，所述基体材料和TiZrTaN涂层之间还依次沉积Ti过渡层和TiZrN过渡层。通过Ti过渡层和TiZrN过渡层进一步提高了基体材料与TiZrTaN涂层之间结合力，减小了内应力。
上述涂层刀具的制备方法包括以下步骤：
(1)将研磨抛光后的刀具基体材料放入酒精和丙酮中进行超声清洗，干燥后放入真空镀膜室，在真空为7.0×10-3Pa条件下加热至200-240℃保温，得到预处理刀具基体材料。
(2)在步骤(1)中得到的预处理刀具基体材料表面采用电弧镀和中频磁控溅射方式沉积TiZrTaN涂层，得到所述涂层刀具。
其中，步骤(2)中，沉积TiZrTaN涂层前还包括依次沉积Ti过渡层和TiZrN过渡层的步骤。
步骤(2)中，沉积TiZrTaN涂层时，在工作气压0.5-0.6Pa、偏压80-150V、Ti靶电弧电流80-100A、N2流量150-200sccm、中频Zr靶电弧电流80-100A、Ta靶电弧电流10-30A的条件下沉积50-60min。
沉积Ti过渡层时，在工作气压0.4-0.6Pa、偏压100-200V、Ti靶电弧电流50-80A的条件下采用电弧镀沉积2-4min。
沉积TiZrN过渡层时，在工作气压0.5-0.6Pa、偏压80-150V、Ti靶电弧电流80-100A、N2流量为150-200sccm、中频Zr靶电弧电流80-100A的条件下采用电弧镀和中频磁控溅射沉积5-10min。
上述涂层刀具的具体制备方法包括以下步骤：
(1)前处理：将刀具基体材料研磨抛光至镜面，依次放入酒精和丙酮中超声清洗各20-30min，去除表面油渍等污染物，采用真空干燥箱充分干燥后迅速放入镀膜机真空室，真空室本底真空为7.0×10-3Pa，加热至200-240℃，保温时间30-40min.
(2)离子清洗：通入工作气体Ar2，其压力为0.6-1.5Pa，开启偏压电源，电压800-900V，占空比0.2，辉光放电清洗10-30min；偏压降低至300-500V，开启离子源离子清洗10-30min，开启电弧源Ti靶，偏压500-700V，靶电流50-80A，离子轰击Ti靶1-2min。
(3)沉积Ti过渡层：调整Ar2气压至0.4-0.6Pa，偏压降低至100-200V，电弧镀Ti 2-4min。
(4)沉积TiZrN过渡层：调整工作气压为0.5-0.6Pa，偏压80-150V，Ti靶电流80-100A；开启N2，调整N2流量为150-200sccm，开启中频Zr靶电弧电源，电流调至80-100A，电弧镀+中频磁控溅射沉积TiZrN 5-10min。
(5)沉积TiZrTaN涂层：开启Ta靶电弧电源，电流调制10-30A，电弧镀+中频磁控溅射沉积TiZrTaN涂层50-60min。
(6)后处理：关闭Zr靶、Ti靶和Ta靶，关闭偏压电源、离子源及气体源，保温30-50min，涂层结束。
有益效果：1、本发明的涂层刀具为多层结构；2、具有较好的硬度和抗磨损能力，且热稳定性、抗氧化性和抗腐蚀性好；3、制备方法简单、易操作；4、条件温和、易实现；5、刀具使用寿命长；6、可广泛应用于干切削及难加工材料等切削温度较高的切削加工，具有广阔的应用前景。
附图说明
图1是本发明的结构示意图。
具体实施方式
参见图1，本发明一实施例所述的TiZrTaN涂层刀具，包括基体材料1，基体材料1为高速钢或硬质合金，基体表面依次沉积Ti过渡层3、TiZrN过渡层4和TiZrTaN涂层2。TiZrTaN涂层刀具的制备方法是采用多弧离子镀+中频磁控溅射共沉积的方式。
实施例1
上述TiZrTaN涂层刀具的制备方法包括以下步骤：
(1)前处理：将高速钢材料研磨抛光至镜面，依次放入酒精和丙酮中超声清洗各20min，去除表面油渍等污染物，采用真空干燥箱充分干燥后迅速放入镀膜机真空室，真空室本底真空为7.0×10-3Pa，加热至200℃，保温30min；
(2)离子清洗：通入工作气体Ar2，其压力为0.8Pa，开启偏压电源，电压800V，占空比0.2，辉光放电清洗20min；偏压降低至350V，开启离子源离子清洗20min，开启电弧源Ti靶，偏压500V，靶电流50A，离子轰击Ti靶2min；
3)沉积Ti：调整Ar2气压至0.5Pa，偏压降低至120V，电弧镀Ti 2min；
4)沉积TiZrN：调整工作气压为0.5Pa，偏压90V，Ti靶电流80A；开启N2，调整N2流量为160sccm，开启中频Zr靶电弧电源，电流调至80A，电弧镀+中频磁控溅射沉积TiZrN6min；；
5)沉积TiZrTaN涂层：开启Ta靶电弧电源，电流调制15A，电弧镀+中频磁控溅射沉积TiZrTaN涂层50min；
6)后处理：关闭Zr靶、Ti靶和Ta靶，关闭偏压电源、离子源及气体源，保温30min，涂层结束，得到以高速钢为基体材料的涂层刀具。
实例2
上述TiZrTaN涂层刀具的制备方法包括以下步骤：
(1)前处理：将硬质合金材料研磨抛光至镜面，依次放入酒精和丙酮中超声清洗各30min，去除表面油渍等污染物，采用真空干燥箱充分干燥后迅速放入镀膜机真空室，真空室本底真空为7.0×10-3Pa，加热至230℃，保温时间40min；
(2)离子清洗：通入工作气体Ar2，其压力为1.5Pa，开启偏压电源，电压850V，占空比0.2，辉光放电清洗30min；偏压降低至480V，开启离子源离子清洗30min，开启电弧源Ti靶，偏压600V，靶电流70A，离子轰击Ti靶2min；
(3)沉积Ti：调整Ar2气压至0.5Pa，偏压降低至150V，电弧镀Ti 3min；
(4)沉积TiZrN：调整工作气压为0.6Pa，偏压100V，Ti靶电流90A；开启N2，调整N2流量为180sccm，开启中频Zr靶电弧电源，电流调至90A，电弧镀+中频磁控溅射沉积TiZrN8min；；
(5)沉积TiZrTaN涂层：开启Ta靶电弧电源，电流调制20A，电弧镀+中频磁控溅射沉积TiZrTaN涂层60min；
(6)后处理：关闭Zr靶、Ti靶和Ta靶，关闭偏压电源、离子源及气体源，保温40min，涂层结束，得到以硬质合金为基体材料的涂层刀具。

Claims (8)

1.一种TiZrTaN涂层刀具，其特征在于：包括基体材料(1)，所述基体材料(1)表面有TiZrTaN涂层(2)。
2.根据权利要求1所述的涂层刀具，其特征在于：所述基体材料(1)和TiZrTaN涂层(2)之间依次设有Ti过渡层(3)和TiZrN过渡层(4)。
3.根据权利要求1所述的涂层刀具，其特征在于：所述基体材料(1)为高速钢或硬质合金。
4.如权利要求1所述的涂层刀具的制备方法，其特征在于，包括以下步骤：
(1)将研磨抛光后的刀具基体材料放入酒精和丙酮中进行超声清洗，干燥后放入真空镀膜室，在真空为7.0×10-3Pa条件下加热至200-240℃保温，得到预处理刀具基体材料；
(2)在步骤(1)中得到的预处理刀具基体材料表面采用电弧镀和中频磁控溅射方式沉积TiZrTaN涂层，得到所述涂层刀具。
5.根据权利要求4所述的制备方法，其特征在于：步骤(2)中，沉积TiZrTaN涂层前还包括依次沉积Ti过渡层和TiZrN过渡层的步骤。
6.根据权利要求3所述的制备方法，其特征在于：步骤(2)中，沉积TiZrTaN涂层时，在工作气压0.5-0.6Pa、偏压80-150V、Ti靶电弧电流80-100A、N2流量150-200sccm、中频Zr靶电弧电流80-100A、Ta靶电弧电流10-30A的条件下沉积50-60min。
7.根据权利要求5所述的制备方法，其特征在于：沉积Ti过渡层时，在工作气压0.4-0.6Pa、偏压100-200V、Ti靶电弧电流50-80A的条件下采用电弧镀沉积2-4min。
8.根据权利要求5所述的制备方法，其特征在于：沉积TiZrN过渡层时，在工作气压0.5-0.6Pa、偏压80-150V、Ti靶电弧电流80-100A、N2流量为150-200sccm、中频Zr靶电弧电流80-100A的条件下采用电弧镀和中频磁控溅射沉积5-10min。
CN201711082930.6A 2017-11-07 2017-11-07 TiZrTaN涂层刀具及其制备方法 Pending CN107794504A (zh)

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