CN107740052B - 一种TiSiTaN涂层刀具及其制备方法 - Google Patents

一种TiSiTaN涂层刀具及其制备方法 Download PDF

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CN107740052B
CN107740052B CN201710959302.5A CN201710959302A CN107740052B CN 107740052 B CN107740052 B CN 107740052B CN 201710959302 A CN201710959302 A CN 201710959302A CN 107740052 B CN107740052 B CN 107740052B
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邢佑强
高俊涛
吴泽
黄鹏
刘磊
张远明
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Abstract

本发明属于机械切削刀具制造技术领域，特别涉及一种TiSiTaN涂层刀具及其制备方法。该刀具基体材料为硬质合金或高速钢，采用多弧离子镀+中频磁控溅射的方法制备，其结构为多层结构，刀具表面为TiSiTaN涂层，TiSiTaN层与基体之间有TiSiN、TiN和Ti过渡层。该刀具表面的TiSiTaN涂层有着非常高的硬度和强度，Ta元素可以改善涂层的韧性，同时可以显著提高涂层的抗氧化性能和热稳定性能。切削过程中TiSiTaN涂层能够有效地提高刀具抗氧化和抗磨损能力，从而提高刀具寿命。该涂层刀具可广泛应用于干切削和难加工材料的切削加工。

Description

一种TiSiTaN涂层刀具及其制备方法
技术领域
本发明属于机械切削刀具制造领域，涉及了一种TiSiTaN涂层刀具及其制备方法。
背景技术
TiN涂层作为一种硬质涂层，已广泛应用于切削刀具、刃具及各种模具表面作为耐磨和耐腐蚀层。然而，作为刀具涂层，切削过程中，TiN涂层表现出了抗氧化温度低，热硬度低等缺点。为提高TiN涂层硬度和热稳定性等，进一步研制出TiSiN、TiCrN及TiAlN等多种刀具涂层。Ta元素作为一种过渡金属元素，其表面易形成稳定的氧化层，从而阻止表面进一步的氧化，因此Ta元素的添加能够显著提高涂层的耐腐蚀和抗氧化能力([1]Pfeiler M.,etal.Journal of Vacuum Science&Technology A:Vacuum,Surfaces,and Films,2009,27(3):554-560.[2]Rachbauer R.,et al.Surface and Coatings Technology,2012,211:98-103.)。
文献(Khetan V.,et al.ACS Applied Materials&Interfaces,2014,6(17):15403-15411.)报道了一种AlTiTaN涂层，该涂层与AlTiN涂层相比表现出较好的抗氧化和热稳定性能，该涂层非常适合干加工应用场合。文献(Rachbauer R.,et al.Surface andCoatings Technology,2012,211:98-103.)研究结果表明，Ta元素的添加能够明显提高TiAlN涂层的热稳定性能。TiSiN涂层作为一种硬质涂层，已广泛应用切削刀具、模具等，Ta元素的添加能够进一步提高其热稳定性能、抗磨损和耐腐蚀能力。目前国内外未见TiSiTaN涂层刀具的报道。
发明内容
技术问题：本发明的目的在于克服上述现有技术的不足，提供一种TiSiTaN涂层刀具及其制备方法。该涂层刀具既具有高的硬度和良好的韧性，又具有良好的热稳定性能、抗氧化性能、耐腐蚀性和抗磨损能力。干切削时，TiSiTaN涂层能够提高刀具抗氧化和抗磨损能力，从而提高刀具寿命。
技术方案：本发明的一种TiSiTaN涂层刀具通过以下方式实现：
刀具基体材料为高速钢或硬质合金，在所述刀具基体材料表面涂有多层涂层，从刀具基体材料表面向外依次为Ti、TiN、TiSiN过渡层和TiSiTaN涂层。
本发明的TiSiTaN涂层刀具的制备方法采用多弧离子镀+中频磁控溅射共沉积的方法在刀具表面制备Ti+TiN+TiSiN过渡层和TiSiTaN涂层，其具体制备步骤为：
1)前处理：将刀具基体材料研磨抛光至镜面，依次放入酒精和丙酮中超声清洗，去除表面油渍等污染物，采用真空干燥箱充分干燥后迅速放入镀膜机真空室，加热，保温；
2)离子清洗：通入Ar2，其压力为0.6-1.5Pa，开启偏压电源，电压800-900V，占空比0.2，辉光放电清洗20-30min；偏压降低至300-500V，开启离子源离子清洗20-30min，开启电弧源Ti靶，偏压500-600V，靶电流40-60A，离子轰击Ti靶1-2min；
3)沉积Ti：调整Ar2气压至0.4-0.6Pa，偏压降低至100-200V，电弧镀Ti 2-5min；
4)沉积TiN：调整工作气压为0.5-0.6Pa，偏压80-150V，Ti靶电流80-100A；开启N2，调整N2流量为150-200sccm，沉积温度为200-260℃，沉积2-10min；
5)沉积TiSiN：开启中频Si靶电弧电源，电流调至10-20A，电弧镀+中频磁控溅射沉积TiSiN 5-10min；
6)沉积TiSiTaN涂层：开启Ta靶电弧电源，电流调制10-20A，电弧镀+中频磁控溅射沉积TiSiTaN涂层50-60min；
7)后处理：关闭Si靶、Ti靶和Ta靶，关闭偏压电源、离子源及气体源，保温，涂层结束。
其中，所述放入酒精和丙酮中超声清洗，清洗的时间各为20-30min。
所述镀膜机真空室，其本底真空为7.0×10-3Pa，加热至200-240℃，保温时间30-40min。
所述后处理的保温时间为30-50min。
有益效果：本发明的刀具涂层为多层结构，刀具表面为TiSiTaN涂层，TiSiTaN涂层与基体之间有TiSiN、TiN和Ti过渡层。该刀具表面的TiSiTaN涂层有着非常高的硬度和强度，Ta元素可以改善涂层的韧性，同时可以显著提高涂层的抗氧化、抗腐蚀和抗磨损能力。该涂层刀具可广泛应用于干切削及难加工材料等切削温度较高的切削加工，具有广阔的应用前景。
具体实施方式
实例1：TiSiTaN涂层刀具及其制备方法，刀具基体材料为高速钢或硬质合金，涂层为多层结构，刀具表面为TiSiTaN涂层，TiSiTaN涂层与基体之间有TiSiN、TiN和Ti过渡层。TiSiTaN涂层刀具的制备方法是采用多弧离子镀+中频磁控溅射共沉积的方式。其具体制备步骤为：
1)前处理：将刀具基体材料研磨抛光至镜面，依次放入酒精和丙酮中超声清洗各20min，去除表面油渍等污染物，采用真空干燥箱充分干燥后迅速放入镀膜机真空室，真空室本底真空为7.0×10-3Pa，加热至200℃，保温时间30min；
2)离子清洗：通入Ar2气，其压力为0.8Pa，开启偏压电源，电压800V，占空比0.2，辉光放电清洗20min；偏压降低至300V，开启离子源离子清洗20min，开启电弧源Ti靶，偏压500V，靶电流40A，离子轰击Ti靶2min；
3)沉积Ti：调整Ar2气压至0.5Pa，偏压降低至100V，电弧镀Ti 2min；
4)沉积TiN：调整工作气压为0.5Pa，偏压100V，Ti靶电流90A；开启N2，调整N2流量为150sccm，沉积温度为220℃，沉积5min；
5)沉积TiSiN：开启中频Si靶电弧电源，电流调至12A，电弧镀+中频磁控溅射沉积TiSiN 5min；
6)沉积TiSiTaN涂层：开启Ta靶电弧电源，电流调制12A，电弧镀+中频磁控溅射沉积TiSiTaN涂层50min；
7)后处理：关闭Si靶、Ti靶和Ta靶，关闭偏压电源、离子源及气体源，保温30min，涂层结束。
实例2：TiSiTaN涂层刀具及其制备方法，刀具基体材料为高速钢或硬质合金，涂层为多层结构，刀具表面为TiSiTaN涂层，TiSiTaN涂层与基体之间有TiSiN、TiN和Ti过渡层。TiSiTaN涂层刀具的制备方法是采用多弧离子镀+中频磁控溅射共沉积的方式。其具体制备步骤为：
1)前处理：将刀具基体材料研磨抛光至镜面，依次放入酒精和丙酮中超声清洗各30min，去除表面油渍等污染物，采用真空干燥箱充分干燥后迅速放入镀膜机真空室，真空室本底真空为7.0×10-3Pa，加热至220℃，保温时间40min；
2)离子清洗：通入Ar2气，其压力为1.5Pa，开启偏压电源，电压850V，占空比0.2，辉光放电清洗30min；偏压降低至450V，开启离子源离子清洗30min，开启电弧源Ti靶，偏压600V，靶电流60A，离子轰击Ti靶2min；
3)沉积Ti：调整Ar2气压至0.5Pa，偏压降低至150V，电弧镀Ti 3min；
4)沉积TiN：调整工作气压为0.6Pa，偏压130V，Ti靶电流90A；开启N2，调整N2流量为180sccm，沉积温度为250℃，沉积6min；
5)沉积TiSiN：开启中频Si靶电弧电源，电流调至18A，电弧镀+中频磁控溅射沉积TiSiN 6min；
6)沉积TiSiTaN涂层：开启Ta靶电弧电源，电流调制18A，电弧镀+中频磁控溅射沉积TiSiTaN涂层60min；
7)后处理：关闭Si靶、Ti靶和Ta靶，关闭偏压电源、离子源及气体源，保温40min，涂层结束。

Claims (3)

1.一种TiSiTaN涂层刀具的制备方法，刀具基体材料为高速钢或硬质合金，其特征在于采用多弧离子镀+中频磁控溅射共沉积的方法在刀具表面制备Ti+TiN+TiSiN过渡层和TiSiTaN涂层，其具体制备步骤为：
1)前处理：将刀具基体材料研磨抛光至镜面，依次放入酒精和丙酮中超声清洗，去除表面油渍污染物，采用真空干燥箱充分干燥后迅速放入镀膜机真空室，加热，保温；
2)离子清洗：通入Ar2，其压力为0.6-1.5Pa，开启偏压电源，电压800-900V，占空比0.2，辉光放电清洗20-30min；偏压降低至300-500V，开启离子源离子清洗20-30min，开启电弧源Ti靶，偏压500-600V，靶电流40-60A，离子轰击Ti靶1-2min；
3)沉积Ti：调整Ar2气压至0.4-0.6Pa，偏压降低至100-200V，电弧镀Ti 2-5min；
4)沉积TiN：调整工作气压为0.5-0.6Pa，偏压80-150V，Ti靶电流80-100A；开启N2，调整N2流量为150-200sccm，沉积温度为200-260℃，沉积2-10min；
5)沉积TiSiN：开启中频Si靶电弧电源，电流调至10-20A，电弧镀+中频磁控溅射沉积TiSiN 5-10min；
6)沉积TiSiTaN涂层：开启Ta靶电弧电源，电流调制10-20A，本底真空为7.0×10-3Pa，加热至200-240℃，电弧镀+中频磁控溅射沉积TiSiTaN涂层50-60min；保温时间30-40min；
7)后处理：关闭Si靶、Ti靶和Ta靶，关闭偏压电源、离子源及气体源，保温，涂层结束。
2.根据权利要求1所述的TiSiTaN涂层刀具的制备方法，其特征在于所述放入酒精和丙酮中超声清洗，清洗的时间各为20-30min。
3.根据权利要求1所述的TiSiTaN涂层刀具的制备方法，其特征在于所述后处理的保温时间为30-50min。
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