CN107787514B - 半导体器件中的电感器结构 - Google Patents

半导体器件中的电感器结构 Download PDF

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Publication number
CN107787514B
CN107787514B CN201680036575.6A CN201680036575A CN107787514B CN 107787514 B CN107787514 B CN 107787514B CN 201680036575 A CN201680036575 A CN 201680036575A CN 107787514 B CN107787514 B CN 107787514B
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China
Prior art keywords
traces
trace
subset
inductor
layer
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Active
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CN201680036575.6A
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English (en)
Chinese (zh)
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CN107787514A (zh
Inventor
U-M·乔
Y·K·宋
J-H·李
J·H·永恩
S·崔
X·张
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Qualcomm Inc
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Qualcomm Inc
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Publication of CN107787514A publication Critical patent/CN107787514A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Filters And Equalizers (AREA)
  • Coils Of Transformers For General Uses (AREA)
CN201680036575.6A 2015-06-22 2016-06-06 半导体器件中的电感器结构 Active CN107787514B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/746,652 2015-06-22
US14/746,652 US9576718B2 (en) 2015-06-22 2015-06-22 Inductor structure in a semiconductor device
PCT/US2016/036079 WO2016209602A1 (en) 2015-06-22 2016-06-06 Inductor structure in a semiconductor device

Publications (2)

Publication Number Publication Date
CN107787514A CN107787514A (zh) 2018-03-09
CN107787514B true CN107787514B (zh) 2020-03-13

Family

ID=56137580

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680036575.6A Active CN107787514B (zh) 2015-06-22 2016-06-06 半导体器件中的电感器结构

Country Status (6)

Country Link
US (1) US9576718B2 (https=)
EP (1) EP3311389B1 (https=)
JP (1) JP6832873B2 (https=)
KR (1) KR102454404B1 (https=)
CN (1) CN107787514B (https=)
WO (1) WO2016209602A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111934070B (zh) * 2020-06-24 2021-10-22 西安理工大学 一种应用于6g通信的三维发夹滤波器
CN112103048A (zh) * 2020-08-04 2020-12-18 西安理工大学 一种基于tsv的嵌套式变压器
US11728293B2 (en) * 2021-02-03 2023-08-15 Qualcomm Incorporated Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101180924A (zh) * 2005-04-11 2008-05-14 英特尔公司 电感器
CN102084439A (zh) * 2008-05-29 2011-06-01 意法爱立信有限公司 8字形射频平衡变换器
CN104584446A (zh) * 2012-08-31 2015-04-29 高通股份有限公司 用于解耦多个无线充电发射器的系统和方法

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US6549112B1 (en) 1996-08-29 2003-04-15 Raytheon Company Embedded vertical solenoid inductors for RF high power application
US6291872B1 (en) 1999-11-04 2001-09-18 Taiwan Semiconductor Manufacturing Co., Ltd. Three-dimensional type inductor for mixed mode radio frequency device
US6535098B1 (en) * 2000-03-06 2003-03-18 Chartered Semiconductor Manufacturing Ltd. Integrated helix coil inductor on silicon
TWI226647B (en) * 2003-06-11 2005-01-11 Via Tech Inc Inductor formed between two layout layers
KR100688858B1 (ko) * 2004-12-30 2007-03-02 삼성전기주식회사 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법
US7088215B1 (en) * 2005-02-07 2006-08-08 Northrop Grumman Corporation Embedded duo-planar printed inductor
KR100723032B1 (ko) 2005-10-19 2007-05-30 삼성전자주식회사 고효율 인덕터, 인덕터의 제조방법 및 인덕터를 이용한패키징 구조
TWI264021B (en) 2005-10-20 2006-10-11 Via Tech Inc Embedded inductor and the application thereof
US7498918B2 (en) 2006-04-04 2009-03-03 United Microelectronics Corp. Inductor structure
US8368501B2 (en) * 2006-06-29 2013-02-05 Intel Corporation Integrated inductors
TWI347616B (en) * 2007-03-22 2011-08-21 Ind Tech Res Inst Inductor devices
US7884452B2 (en) * 2007-11-23 2011-02-08 Alpha And Omega Semiconductor Incorporated Semiconductor power device package having a lead frame-based integrated inductor
US7948346B2 (en) 2008-06-30 2011-05-24 Alpha & Omega Semiconductor, Ltd Planar grooved power inductor structure and method
TWI442422B (zh) 2012-01-19 2014-06-21 Ind Tech Res Inst 電感結構
US9196414B2 (en) * 2012-10-17 2015-11-24 Covidien Lp Planar transformers having reduced termination losses
US20150371764A1 (en) * 2014-06-20 2015-12-24 International Business Machines Corporation Nested helical inductor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101180924A (zh) * 2005-04-11 2008-05-14 英特尔公司 电感器
CN102084439A (zh) * 2008-05-29 2011-06-01 意法爱立信有限公司 8字形射频平衡变换器
CN104584446A (zh) * 2012-08-31 2015-04-29 高通股份有限公司 用于解耦多个无线充电发射器的系统和方法

Also Published As

Publication number Publication date
CN107787514A (zh) 2018-03-09
EP3311389A1 (en) 2018-04-25
US9576718B2 (en) 2017-02-21
JP2018529216A (ja) 2018-10-04
KR20180020160A (ko) 2018-02-27
US20160372253A1 (en) 2016-12-22
JP6832873B2 (ja) 2021-02-24
WO2016209602A1 (en) 2016-12-29
KR102454404B1 (ko) 2022-10-12
EP3311389B1 (en) 2020-02-19

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