CN107781722B

CN107781722B - Backlight module and display device

Info

Publication number: CN107781722B
Application number: CN201710887135.8A
Authority: CN
Inventors: 张亚东; 王冬; 王大威; 穆景飞
Original assignee: BOE Technology Group Co Ltd; Beijing BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Beijing BOE Optoelectronics Technology Co Ltd
Priority date: 2017-09-26
Filing date: 2017-09-26
Publication date: 2020-06-09
Anticipated expiration: 2037-09-26
Also published as: CN107781722A

Abstract

The embodiment of the invention provides a backlight module and a display device, relates to the technical field of display, and can solve the problem that the thickness of the backlight module is increased due to the fact that the heat conduction efficiency of a light bar formed by LED (light-emitting diode) lamp beads is improved. The method comprises the following steps: the lamp strip is arranged by a plurality of LED lamp beads to form a linear light source. The light guide plate comprises a light incident surface and a light emergent surface adjacent to the light incident surface, and the light emitting surface of the light bar faces the light incident surface of the light guide plate. Glue the frame, lamp strip and light guide plate setting still are provided with the holding portion in gluing the upper surface of frame in gluing the frame. The heat-conducting layer sets up in the holding portion, and the heat-conducting layer passes through holding portion and lamp strip contact, and the heat-conducting layer still includes that at least one extends to the end of drawing forth outside gluey frame.

Description

Backlight module and display device

Technical Field

The invention relates to the technical field of display, in particular to a backlight module and a display device.

Background

An LED (Light Emitting Diode), which is a kind of semiconductor Diode, is a photoelectric element that emits Light by means of unidirectional conductivity of a PN junction of a semiconductor, and when a forward voltage is applied to the Light Emitting Diode, holes injected from a P region to an N region and electrons injected from the N region to the P region recombine with the electrons of the N region and the holes of the P region within several micrometers near the PN junction, respectively, to generate fluorescence of spontaneous emission. The energy states of electrons and holes in different semiconductor materials are different, the energy released when the electrons and the holes are combined is different, and the more the energy released is, the shorter the wavelength of the emitted light is, so that the light-emitting color of the LED can be selected. White light LEDs are commonly used as backlights in backlight modules.

In the prior art, for example, a linear light source in a side-entry backlight module generally arranges a plurality of LED lamp beads on a circuit board in a linear manner to form a linear lamp strip, and then the linear lamp strip is disposed on a light incident surface of a light guide plate to form a surface-type backlight on the light incident surface of the light guide plate.

Because LED lamp pearl has advantages such as small, power consumption is low, long service life, luminance height, colour gamut are wide, more and more be applied to in display panel's the backlight. However, because the LED lamp beads can generate and gather large heat in the light emitting process, if the gathered heat cannot be evacuated or cooled in time, the service life of components in the backlight module is easily shortened due to aging of the components caused by overhigh internal temperature of the backlight source, and even the components may be burned down due to serious heat generation. In the prior art, the heat generated by the LED lamp beads in the light emitting process is generally dissipated or conducted out by using a heat dissipation structure or a heat conduction material, but the overall thickness of the backlight module is increased due to the additional connected heat dissipation structure, which is not beneficial to the thinning of the display device.

Disclosure of Invention

The embodiment of the invention provides a backlight module and a display device, which can solve the problem that the thickness of the backlight module is increased due to the fact that the heat conduction efficiency of a light bar formed by LED (light-emitting diode) lamp beads is improved.

In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:

in one aspect of the embodiments of the present invention, a backlight module is provided, which includes: the lamp strip is arranged by a plurality of LED lamp beads to form a linear light source. The light guide plate comprises a light incident surface and a light emergent surface adjacent to the light incident surface, and the light emitting surface of the light bar faces the light incident surface of the light guide plate. Glue the frame, lamp strip and light guide plate setting still are provided with the holding portion in gluing the upper surface of frame in gluing the frame. The heat-conducting layer sets up in the holding portion, and the heat-conducting layer passes through holding portion and lamp strip contact, and the heat-conducting layer still includes that at least one extends to the end of drawing forth outside gluey frame.

Preferably, the accommodating part is located at a position opposite to the bottom surface of the light bar, wherein the bottom surface of the light bar is the surface of the light bar deviating from the light emitting surface.

Furthermore, the accommodating part is also arranged at the position opposite to the side surface of the LED lamp bead in the lamp strip.

Furthermore, a groove is formed in the edge, close to the light incident surface, of the light emergent surface of the light guide plate, and the heat conduction layer is filled in the groove. Wherein, the heat conduction layer filled in the groove is connected with the heat conduction layer arranged in the accommodating part.

Preferably, the depth of the receiving portion is equal to the thickness of the heat conductive layer.

Preferably, the light incident surface of the light guide plate includes a light incident surface and an inclined surface connected to the light incident surface and inclined toward the light exit surface, and the groove is disposed on the inclined surface.

Furthermore, the backlight module of the embodiment of the invention further comprises an adhesive layer, wherein the adhesive layer is arranged on the heat conduction layer and extends to the edge of the light-emitting surface of the light guide plate.

Preferably, the adhesive layer is a double-sided adhesive tape.

Further, the lamp strip still includes the flexible circuit board of being connected with LED lamp pearl, and the one side that the double faced adhesive tape deviates from the heat-conducting layer is connected with the flexible circuit board.

In another aspect of the embodiments of the present invention, a display device is provided, which includes any one of the above backlight modules.

The embodiment of the invention provides a backlight module and a display device, comprising: the lamp strip is arranged by a plurality of LED lamp beads to form a linear light source. The light guide plate comprises a light incident surface and a light emergent surface adjacent to the light incident surface, and the light emitting surface of the light bar faces the light incident surface of the light guide plate. Glue the frame, lamp strip and light guide plate setting still are provided with the holding portion in gluing the upper surface of frame in gluing the frame. The heat-conducting layer sets up in the holding portion, and the heat-conducting layer passes through holding portion and lamp strip contact, and the heat-conducting layer still includes that at least one extends to the end of drawing forth outside gluey frame. Through setting up the heat-conducting layer in the holding portion of gluing the frame and contacting with the lamp strip, when not increasing gluey frame self thickness, can derive the heat that the lamp strip produced when luminous to the heat-conducting layer through the mode of contact conduction, the heat-conducting layer still includes that at least one extends to the end of drawing forth outside gluing the frame, derive the heat on the heat-conducting layer can further be derived outside backlight unit, thereby under the prerequisite that does not increase backlight unit size, improve the heat-sinking capability of light emitting source, prolong the ageing time of components and parts, improve backlight unit's job stabilization nature and life.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a backlight module according to an embodiment of the present invention;

FIG. 2 is one of the cross-sectional views A-A of FIG. 1;

fig. 3 is a partial view of a second schematic structural diagram of a backlight module according to an embodiment of the invention;

fig. 4 is a partial view of a third schematic structural diagram of a backlight module according to an embodiment of the present invention;

FIG. 5 is a cross-sectional view B-B of FIG. 4;

FIG. 6 is a second cross-sectional view taken along line A-A of FIG. 1;

fig. 7 is a fourth schematic structural diagram of a backlight module according to an embodiment of the present invention;

fig. 8 is a fifth schematic structural view of a backlight module according to an embodiment of the present invention;

fig. 9 is a schematic structural view of a light bar in a backlight module according to an embodiment of the invention.

Reference numerals:

10-a light bar; 11-LED lamp beads; 12-a flexible circuit board; 20-a light guide plate; 21-a light incident surface; 22-a light-emitting surface; 23-a groove; 30-glue frame; 31-upper surface; 32-a locus of containment; 40-a thermally conductive layer; 41-leading-out terminal; 50-sticking an adhesive layer; h-thickness of the heat conducting layer; w-depth of locus of containment.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

An embodiment of the present invention provides a backlight module, as shown in fig. 1, including: the light bar 10 is a linear light source formed by arranging a plurality of LED lamp beads 11. The light guide plate 20 includes a light incident surface 21 and a light emitting surface 22 adjacent to the light incident surface 21, and a light emitting surface of the light bar 10 faces the light incident surface 21 of the light guide plate 20. The plastic frame 30, the light bar 10 and the light guide plate 20 are disposed in the plastic frame 30, and as shown in fig. 2, a receiving portion 32 is further disposed on an upper surface 31 of the plastic frame 30. As shown in fig. 1, the heat conductive layer 40 is disposed in the accommodating portion 32, the heat conductive layer 40 contacts the light bar 10 through the accommodating portion 32, and the heat conductive layer 40 further includes at least one terminal 41 extending to the outside of the plastic frame 30.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "inside", "outside", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

It should be noted that, in the backlight module according to the embodiment of the present invention, the light bar 10 is used for entering a linear light source into the light guide plate 20, and since the LED lamp has advantages of small volume, low power consumption, long service life, high brightness, wide color gamut, and the like, for example, as shown in fig. 1, a plurality of LED lamp beads are generally linearly arranged to emit light together, so that the formed light bar 10 is used as a linear light source. The plurality of LED beads 11 forming the light bar 10 need to emit light into the light guide plate 20, and therefore the light emitting surfaces of the LED beads 11 face the light incident surface 21 of the light guide plate 20.

Second, the light incident surface 21 and the light emitting surface 22 of the light guide plate 20 are adjacent to each other, which means that the light incident mode of the backlight module of the embodiment of the invention is a side-in type. For example, as shown in fig. 1, the linear light source is incident from the light incident surface 21 on the side surface of the light guide plate 20, and is fully scattered inside the light guide plate 20 due to the total reflection, and uniformly exits from the light exiting surface 22 due to the scattering effect of the dots on the bottom surface of the light guide plate 20.

Third, the plastic frame 30 is used for accommodating the relative position between the fixed light bar 10 and the light guide plate 20. Under the effect of the rubber frame 30, the light emitting surface of the light bar 10 is close to the light incident surface 21 of the light guide plate 20 and is attached to the light incident surface, so that light rays emitted by the light bar 10 can be incident into the light guide plate 20 as much as possible, and light leakage loss is reduced. Wherein, the upper surface 31 of the rubber frame 30 is provided with a receiving part 32. The shape of the accommodating portion 32 in the embodiment of the present invention is not particularly limited, and may be, for example, a groove processed on the upper surface 31 of the rubber frame 30. As shown in fig. 2, a strip-shaped receiving portion 32 is formed on an upper surface 31 of the rubber frame 30. Since the heat conduction layer 40 is disposed in the accommodating portion 32 and contacts with the light bar 10 through the accommodating portion 32, the longer the strip-shaped accommodating portion 32 is disposed, the more the area of the light bar 10 is included, and the stronger the heat dissipation effect thereof is.

Fourthly, as shown in fig. 1, the heat conductive layer 40 is disposed in the accommodating portion 32, and the heat conductive layer 40 can contact with the light bar 10 through the accommodating portion 32, and the heat conductive layer 40 in the embodiment of the present invention is disposed in the accommodating portion 32, including the case where the heat conductive layer 40 is completely included in the accommodating portion 32, and in addition, the case where the heat conductive layer 40 is partially exposed out of the accommodating portion 32 is also included. The heat conduction layer 40 that contacts with lamp strip 10 conducts the heat that produces in the luminous process of lamp strip 10 to on the heat conduction layer 40 to further draw forth through extending to the leading-out terminal 41 outside gluey frame 30 on the heat conduction layer 40, generally, draw out terminal 41 and extend to outside the backplate of whole backlight unit, thereby draw out the heat outside whole backlight unit, improve the thermal diffusivity. In order to improve the heat dissipation efficiency, a person skilled in the art may set one or more terminals 41 distributed according to the actual needs of the backlight module.

Preferably, as shown in fig. 1, the accommodating portion 32 is located opposite to a bottom surface of the light bar 10, wherein the bottom surface of the light bar 10 is a surface of the light bar 10 facing away from the light emitting surface.

As shown in fig. 1, the accommodating portion 32 is opposite to the bottom surface of the light bar 10, and the heat conducting layer 40 disposed in the accommodating portion 32 can contact with the light bar 10 through the bottom surface of the light bar 10, so as to conduct heat of the light bar 10 through the bottom surface of the light bar 10. In addition, since the accommodating portion 32 is a groove that is thinned or provided with a certain depth to the whole layer of the upper surface 31 of the plastic frame 30, and the plastic frame 30 is not penetrated through, the plastic frame 30 provided with the accommodating portion 32 can be fixed to the side surface and the bottom surface of the light bar 10 through other positions, so as to fix the relative position between the light bar 10 and the light guide plate 20.

It should be noted that, in the embodiment of the present invention, the setting depth of the accommodating portion 32 is not specifically limited, and a person skilled in the art may set the depth of the accommodating portion 32 according to needs in actual work, and when the accommodating portion 32 is a groove processed on the rubber frame 30, the width of the groove is not specifically limited, for example, in the embodiment of the present invention, it is preferable that the width of the groove is set within a range of 0.3 to 0.35mm, and the depth is set within a range of 0.05 to 0.1 mm. If the area of the accommodating portion 32 is smaller than the lower limit of the above range, the heat conducting layer 40 may be too small, thereby affecting the heat dissipation effect.

Further, as shown in fig. 3, the accommodating portion 32 is also disposed at a position opposite to the side surface of the LED lamp bead 11 in the lamp strip 10.

Since the heat conduction layer 40 disposed in the accommodating portion 32 conducts heat of the light bar 10 in a contact manner, the larger the contact area between the heat conduction layer 40 and the light bar 10 is, the stronger the heat conduction effect is. Based on this, as shown in fig. 3, for example, the accommodating portion 32 is also provided on the side surface of the LED bead 11 on the plastic frame 30, at a position where any two adjacent LED beads 11 are opposite to each other. In this way, the heat conduction layer 40 disposed in the accommodating portion 32 can surround the bottom surface and the side surface of each LED lamp bead 11 on the lamp strip 10, so as to uniformly conduct the heat of each LED lamp bead 11 out.

Further, as shown in fig. 4, a groove 23 is disposed at an edge of the light exit surface 22 of the light guide plate 20 close to the light entrance surface 21, and as shown in fig. 5, the groove 23 is filled with a heat conductive layer 40. As shown in fig. 4, the heat conductive layer 40 filled in the groove 23 is connected to the heat conductive layer 40 disposed in the accommodating portion 32.

As shown in fig. 4, a groove 23 is formed at the edge of the light exit surface 22 of the light guide plate 20 close to the light entrance surface 21, and as shown in fig. 5, the heat conduction layer 40 is filled in the groove 23, so that the light bar 10 is fixed by the rubber frame 30 and attached to the light entrance surface 21 of the light guide plate 20, and the heat conduction layer 40 filled in the groove 23 can also contact with the light bar 10, thereby conducting heat of the light bar 10. Moreover, as shown in fig. 4, the heat conducting layer 40 filled in the groove 23 contacts the heat conducting layer 40 disposed in the accommodating portion 32 through the region between the LED beads 11 in the accommodating portion 32, i.e. an annular groove-shaped structure surrounding the LED beads 11 is formed, the heat conducting layer 40 disposed on the light guide plate 20 does not need to separately provide the leading end 41, the heat conducting layer 40 in the groove 23 of the light guide plate 20 transfers the LED heat to the heat conducting layer 40 in the accommodating portion 32, and further leads the heat out of the backlight module through the leading end 41 provided on the heat conducting layer 40 in the accommodating portion 32. Thus, the heat conduction layer 40 arranged in the accommodating portion 32 and the heat conduction layer 40 arranged in the groove 23 form an annular shape connected with each other, the annular heat conduction layer 40 surrounds the LED lamp beads 11, the contact area between the heat conduction layer 40 and the lamp strip 10 can be further increased, and the heat conduction efficiency of the lamp strip 10 is further increased.

Preferably, as shown in fig. 6, the depth W of the receiving portion 32 is equal to the thickness H of the heat conductive layer 40.

Similarly, in the case where the groove 23 is also provided in the light guide plate 20, the depth of the groove 23 provided in the light guide plate 20 is also equal to the thickness of the heat conductive layer 40 provided in the groove 23. Thus, on the one hand, the heat conduction layer 40 is completely disposed in the accommodating portion 32 of the plastic frame 30, so that the thickness of the plastic frame 30 is not increased due to the heat conduction layer 40, and similarly, the heat conduction layer 40 can also be completely disposed in the groove 23 of the light guide plate 20, so that the thickness of the light guide plate 20 is not increased due to the heat conduction layer 40, and the increase of the whole thickness of the whole backlight module is avoided. On the other hand, can also guarantee the surface smoothness of gluey frame 30 and light guide plate 20, avoid gluey frame 30 and light guide plate 20 surperficial height uneven and can not zonulae occludens between with other mounting structure, lead to backlight unit to take place the problem of light leak.

Preferably, as shown in fig. 7, the light incident surface 21 of the light guide plate 20 includes a light incident surface 211 and an inclined surface 212 connected to the light incident surface 211 and inclined toward the light emitting surface 22, and the groove 23 is disposed on the inclined surface 212.

Thus, as shown in fig. 7, light emitted from the light bar 10 is incident through the light incident surface 211 of the light incident surface 21, the groove 23 is disposed on the inclined surface 212, and the heat conduction layer 40 is disposed in the groove 23, so as to avoid shielding the light incident efficiency of the light bar 10 while conducting heat emitted from the light bar 10.

Further, as shown in fig. 8, the backlight module according to the embodiment of the invention further includes an adhesive layer 50, and the adhesive layer 50 is disposed on the heat conducting layer 40 and extends to the edge of the light-emitting surface 22 of the light guide plate 20.

As shown in fig. 8, in order to further improve the connection and fixation among the components in the backlight module, an adhesive layer 50 is further disposed in the backlight module, the adhesive layer 50 is disposed among the adhesive frame 30, the light bar 10 and the light guide plate 20, and is adhered and fixed to the three, and when the accommodating portion 32 is disposed on the adhesive frame 30, the adhesive layer 50 is adhered and fixed to the heat conduction layer 40 in the accommodating portion 32. On this basis, since the thickness H of the heat conduction layer 40 is equal to the depth W of the accommodating portion 32, the adhesive layer 50 can further reduce the occurrence of the light leakage problem at the edge of the light bar 10 by adhering to the heat conduction layer 40, the light bar 10, and the edge of the light guide plate 20.

Preferably, the adhesive layer 50 is a double-sided tape.

The double-sided adhesive tape is an adhesive layer which consists of a base material, an adhesive, release paper (film) or silicone oil paper and can realize double-sided adhesion. Double-sided adhesive tape is selected as the adhesive layer 50 to adhere the edges of the heat conduction layer 40, the light bar 10 and the light guide plate 20, so that on one hand, the double-sided adhesive tape has good adhesion performance and can achieve good adhesion effect; on the other hand, since the front and back surfaces of the double-sided tape have the adhesive function, when the double-sided tape is used as the adhesive layer 50, the heat conduction layer 40, the light bar 10, and the light guide plate 20 can be adhered and fixed to the frame, the back plate, and other structures of the backlight module through the double-sided tape.

Further, as shown in fig. 9, the light bar 10 further includes a flexible circuit board 12 connected to the LED lamp bead 11, and one side of the double-sided adhesive tape facing away from the heat conducting layer 40 is connected to the flexible circuit board 12 by adhesion.

As shown in fig. 9, the light bar 10 is composed of a plurality of LED beads 11 electrically connected to the flexible circuit board 12, and each LED bead 11 emits light through a current signal provided by the flexible circuit board 12. The LED lamp bead 11 can be directly connected to the flexible circuit board 12 as shown in fig. 9, specifically, as will be known to those skilled in the art, the LED lamp bead 11 is usually soldered to the flexible circuit board 12 by reflow soldering. Under the condition that the light bar 10 further comprises a flexible circuit board 12, the double-sided adhesive tape is arranged below the flexible circuit board 12, namely, one surface of the double-sided adhesive tape is embedded with the LED lamp beads 11 and is pasted and connected, the other surface of the double-sided adhesive tape is used for pasting and fixing the flexible circuit board 12, and the double-sided adhesive tape is not arranged on the part welded between the flexible circuit board 12 and the LED lamp beads 11.

Preferably, the material of the heat conductive layer 40 includes at least one of graphite, copper foil, and aluminum foil.

The heat conduction layer 40 is arranged to contact with the light bar 10 so as to conduct heat out of the light bar 10 in a contact type conduction mode, and therefore, the material of the heat conduction layer 40 needs to be a material with high heat conductivity. Preferably, the heat conductivity of heat conduction graphite, heat conduction copper foil and heat conduction aluminium foil is all stronger, and stable in structure, regard as the material of heat conduction layer 40 with at least one in heat conduction graphite, heat conduction copper foil and the heat conduction aluminium foil, can guarantee heat conduction layer 40's heat-conduction ability effectively, improve the radiating effect of lamp strip 10. For example, the heat conductive graphite as a heat conductive and dissipating material has unique crystal grain orientation, can conduct heat uniformly in two directions, has strong heat conduction capability, has good adaptability to the arrangement surface of the heat conductive graphite with a thin layer structure, is soft in texture, is convenient to cut and can bear repeated bending due to strong plasticity of the heat conductive graphite, is convenient to manufacture and has good adhesion property when being arranged in the accommodating part 32 or the groove 23. Moreover, the heat-conducting graphite can be made into a sheet with the thickness of 0.025-0.1mm without influencing the heat-conducting effect, and the surface of the heat-conducting graphite can be combined with other materials such as metal, plastic, viscose and the like to meet the actual requirement.

The display device of the embodiment of the invention comprises any one of the backlight modules, the accommodating part 32 is arranged on the rubber frame 30 on the premise of not increasing the thickness of the backlight module, the heat conducting layer 40 is arranged in the accommodating part 32, the heat conducting layer 40 further comprises the leading-out end 41, and the heat of the light bar 10 conducted by the heat conducting layer 40 of the leading-out end 41 is further led out of the backlight module, so that the heat dissipation capacity of the whole display device is effectively improved on the premise of not changing the thickness, and the operation efficiency of the display device is further improved.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A backlight module, comprising:

the lamp strip is a linear light source formed by arranging a plurality of LED lamp beads;

the light guide plate comprises a light incident surface and a light emergent surface adjacent to the light incident surface, and the light emitting surface of the light bar faces the light incident surface of the light guide plate;

the light bar and the light guide plate are arranged in the rubber frame, and the upper surface of the rubber frame is also provided with a containing part;

the heat conduction layer is arranged in the accommodating part and is in contact with the lamp strip through the accommodating part, and the heat conduction layer further comprises at least one leading-out end extending out of the rubber frame;

the accommodating part is positioned opposite to the bottom surface of the light bar, and the bottom surface of the light bar is the surface of the light bar, which is far away from the light emitting surface;

the accommodating part is also arranged at a position opposite to the side surface of the LED lamp bead in the lamp strip;

a groove is formed in the edge, close to the light incident surface, of the light emergent surface of the light guide plate, and the heat conduction layer is filled in the groove;

wherein the heat conducting layer filled in the groove is connected with the heat conducting layer arranged in the accommodating part.

2. The backlight module as claimed in claim 1, wherein the depth of the accommodating portion is equal to the thickness of the heat conductive layer.

3. The backlight module as claimed in claim 1, wherein the light incident surface of the light guide plate includes a light incident surface and an inclined surface connected to the light incident surface and inclined toward the light incident surface, and the groove is disposed on the inclined surface.

4. The backlight module according to any one of claims 1-3, further comprising a bonding adhesive layer disposed on the heat conductive layer and extending to an edge of the light-emitting surface of the light guide plate.

5. The backlight module as claimed in claim 4, wherein the adhesive layer is a double-sided tape.

6. The backlight module of claim 5, wherein the light bar further comprises a flexible circuit board connected with the LED lamp beads, and one side of the double-sided adhesive tape, which faces away from the heat conducting layer, is connected with the flexible circuit board.

7. A display device comprising the backlight module according to any one of claims 1 to 6.