CN202361197U

CN202361197U - Improved LED backlight module

Info

Publication number: CN202361197U
Application number: CN2011204780771U
Authority: CN
Inventors: 陈灿荣
Original assignee: Shiding Enterprise Co ltd
Current assignee: SUZHOU SHIDING ELECTRONICS CO Ltd
Priority date: 2011-10-07
Filing date: 2011-11-22
Publication date: 2012-08-01
Anticipated expiration: 2021-11-22

Abstract

The utility model relates to an improvement type LED backlight module, it is installed on a backplate in a liquid crystal display device to include: the LED module comprises a carrier, a copper circuit layer, a plurality of LED elements, a plurality of extension heat conduction layers, a light guide plate and a bottom reflection sheet. In the utility model, the plurality of extension heat conduction layers are mainly connected to the plurality of welding points of the copper circuit layer, and most of the extension heat conduction layers are laid on the surface of the bottom plate of the back plate through insulating heat conduction glue; therefore, when the plurality of LED elements emit light, the heat generated by the LED elements is conducted to the extending heat conduction layer from the plurality of welding points, and then the heat can be distributed on the surface of the bottom plate through the extending heat conduction layer, so that the heat equalizing effect of the surface of the bottom plate is further caused, and the heat dissipation of the backlight module is facilitated; in addition, the copper circuit layer can be laid on the inner surface of the bearing body and can be extended to the outer surface of the bearing body; therefore, the circuit layout area of the circuit layer can be effectively increased.

Description

Modified form LED-backlit module

Technical field

The utility model relates to a kind of backlight module, particularly relates to a kind ofly having a plurality of extension heat-conducting layers and helping to cause a kind of modified form LED-backlit module of equal thermal effect of the backplate surface of backboard.

Background technology

In recent years, (Light-Emitting Diode LED) is applied on the lighting device of daily life light emitting diode widely.Because LED is easy to generate high heat when luminous, therefore, the existing LED lighting device of commonly using can assemble the material or the utensil of assisting heat radiation usually.

See also Fig. 1, a kind of side view of the existing LED-backlit module of commonly using.As shown in Figure 1; The LED-backlit module 200 ' that should existing commonly use is installed in the liquid crystal indicator; And be arranged on the back of the body framework 2 '; Wherein, the existing LED-backlit module of commonly using 200 ' has and comprises a LGP 210 ', a light source component 220 ', a cover body 230 ', an and top frame 240.This light source component 220 ' comprises a circuit board 222 ' and is arranged at a plurality of LED elements 224 ' on this circuit board 222 ' surface.In addition, LED-backlit module 200 ' more can comprise a reflector plate 212 ' to improve the light utilization ratio.

Above-mentioned this LED-backlit module 200 ' has advantage simple in structure and that be convenient to install, and therefore, this LED-backlit module 200 ' is applied within the various liquid crystal indicators widely, so that backlight source of liquid crystal display apparatus to be provided.Yet, along with the change of user's use habit, no matter be large scale or undersized liquid crystal indicator, all be asked to be made into the liquid crystal indicator of light and thin type.But; For the LED-backlit module that is applied to slim liquid crystal indicator, it must face a significant challenge, promptly; Must on the circuit board of limited size, print complicated and complete electronic circuit, possibly cause electronic circuit intactly to be printed to circuit board.In addition; For this LED-backlit module 200 ', because therefore this circuit board 222 ' is arranged in the cover body 230 '; When LED element 224 ' adstante febre, this heat energy will be passed to the circuit on circuit board 222 ' surface and be easy in cover body 230 ', produce the phenomenon of hot stack.

Therefore, the creator of the utility model is because the present LED-backlit module of commonly using still has many shortcomings with not enough, so do one's utmost in addition study and composition, a kind of modified form LED-backlit module of the utility model of research and development completion finally.

This shows that above-mentioned existing backlight module obviously still has inconvenience and defective, and demands urgently further improving in structure and use.In order to solve the problem that backlight module exists; Relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly; But do not see always that for a long time suitable design is developed completion, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found and a kind ofly have that volume is little, cost is low concurrently and can have the modified form LED-backlit module of the new structure of comprehensive adjustment function when using, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.

Summary of the invention

The purpose of the utility model is; Overcome the defective that existing backlight module exists; And a kind of modified form LED-backlit module of new structure is provided, technical problem to be solved is that a kind of modified form LED-backlit module is being provided, wherein; Mainly a plurality of extension heat-conducting layers are connected to a plurality of pads of copper wire layer, and most extension heat-conducting layer are layed in the backplate surface of backboard through insulating heat-conductive glue; So, the heat that the LED element is produced can conduct to the extension heat-conducting layer from these a plurality of pads, then; Can be through extending heat-conducting layer with the surface of heat distribution in base plate; And then cause the equal thermal effect of backplate surface, help the heat radiation of backlight module, thereby be suitable for practicality more.

Another purpose of the utility model is, a kind of modified form LED-backlit module is provided, and technical problem to be solved is that a kind of modified form LED-backlit module is being provided; Wherein, Mainly a plurality of extension heat-conducting layers are connected to a plurality of pads of copper wire layer, and most extension heat-conducting layer are layed in the backplate surface of backboard, so through insulating heat-conductive glue; Help to cause the equal thermal effect of backplate surface, and then increase the radiating effect of backlight module; In addition, more use these a plurality of extension heat-conducting layers of a supports support, avoid these a plurality of extension heat-conducting layers in assembling, to be fractureed, thereby be suitable for practicality more.

A purpose again of the utility model is, a kind of modified form LED-backlit module is provided, and technical problem to be solved is that a kind of modified form LED-backlit module is being provided; Wherein, Mainly a plurality of extension heat-conducting layers are connected to a plurality of pads of copper wire layer, and most extension heat-conducting layer are layed in the backplate surface of backboard, so through insulating heat-conductive glue; Help to cause the equal thermal effect of backplate surface, and then increase the radiating effect of backlight module; In addition, the main line of copper wire layer can be by the mode through the inner perforation of supporting body, and extends to the outer surface of supporting body by the inner surface of supporting body, increases the flexibility ratio that copper wire layer is used, thereby is suitable for practicality more.

An also purpose of the utility model is that a kind of modified form LED-backlit module is provided, and technical problem to be solved is that a kind of modified form LED-backlit module is being provided; Wherein, Mainly a plurality of extension heat-conducting layers are connected to a plurality of pads of copper wire layer, and most extension heat-conducting layer are layed in the backplate surface of backboard, so through insulating heat-conductive glue; Help to cause the equal thermal effect of backplate surface, and then increase the radiating effect of backlight module; In addition, more the bottom of reflector plate is provided with a cushion end of at, directly contacts this a plurality of extension heat-conducting layers to avoid end reflector plate, thereby is suitable for practicality more, and have the value on the industry.

The purpose of the utility model and to solve its technical problem be that technical scheme below adopting realizes.Its that proposes according to the utility model is installed on the backboard in the liquid crystal indicator, and this backboard has a base plate, and this modified form LED-backlit module comprises: (not having support member) supporting body has an inner surface and an outer surface; One copper wire layer is layed in this inner surface of this supporting body, and lays this outer surface to supporting body with extending by an insulating heat-conductive glue, wherein, this copper wire layer has many main lines, a plurality of pad and an electrical junction; A plurality of LED elements are arranged on this copper wire layer, and are welded in this a plurality of pads; A plurality of extension heat-conducting layers; Be connected with these a plurality of pads; Wherein, Few part this extensions heat-conducting layer is layed on the inner surface of supporting body by this insulating heat-conductive glue, and most of should the extension heat-conducting layer from the inner surface of supporting body and extension flatly, and be layed in this backplate surface of backboard through insulating heat-conductive glue; One LGP regards to this a plurality of LED elements with the one of which light entrance face, to receive the light that the LED element is launched; And an end reflector plate, be attached at the lower surface of this LGP, in order to prevent the lower surface escape of light by LGP; Wherein, when these a plurality of LED elements were luminous, heat that the LED element is produced can conduct to this a plurality of extension heat-conducting layers from this a plurality of pads, with through the extension heat-conducting layer with the surface of heat distribution in base plate, and then cause the equal thermal effect of backplate surface.

The purpose of the utility model and solve its technical problem and can also adopt following technical measures to come further to realize.

Aforesaid modified form LED-backlit module; Wherein said its more comprises a reflecting layer; Be arranged on this copper wire layer with respect to these a plurality of LED elements, wherein this reflecting layer has a plurality of LED element perforation, uses so that a light emitting surface of these a plurality of LED elements passes.

Aforesaid modified form LED-backlit module, wherein said its more comprises a type extruding body, is arranged on this backboard and in order to ccontaining this supporting body, this copper wire layer and these a plurality of LED elements.

Aforesaid modified form LED-backlit module, the manufactured materials of wherein said this supporting body can be following any: metal and glass fibre.

Aforesaid modified form LED-backlit module, wherein said this supporting body can be following any: ㄇ type supporting body, L type supporting body and 1 font supporting body.

Aforesaid modified form LED-backlit module, this electrical junction of wherein said this copper wire layer is in order to be electrically connected to a circuit control unit that is installed within this liquid crystal indicator.

Aforesaid modified form LED-backlit module, wherein said this reflecting layer can be following any: ㄇ type reflecting layer, L type reflecting layer and 1 font reflecting layer.

Aforesaid modified form LED-backlit module, the main line of wherein said its this copper wire layer of part can be made into enamel-covered wire.

The purpose of the utility model and solve its technical problem and also adopt following technical scheme to realize.Its that proposes according to the utility model is installed on the backboard in the liquid crystal indicator, and this backboard has a base plate and a frame, and this modified form LED-backlit module comprises: (support member is arranged, and support member is descending) supporting body is arranged on this frame of backboard; One support member is arranged on this base plate of backboard and is connected in this supporting body, and has an inner surface and an outer surface at least; One copper wire layer is layed in this inner surface of this support member, and lays this outer surface to support member with extending by one first insulating heat-conductive glue, wherein, this copper wire layer has many main lines, a plurality of pad and an electrical junction; A plurality of LED elements are arranged on this copper wire layer, and are welded in this a plurality of pads; And a plurality of extension heat-conducting layers, be connected with these a plurality of pads, wherein, this extension heat-conducting layer is layed on the inner surface of support member by this insulating heat-conductive glue; One LGP regards to this a plurality of LED elements with the one of which light entrance face, to receive the light that the LED element is launched; And an end reflector plate, be attached at the lower surface of this LGP, in order to prevent the lower surface escape of light by LGP; Wherein, when these a plurality of LED elements were luminous, heat that the LED element is produced can conduct to this a plurality of extension heat-conducting layers from this a plurality of pads, passing through support member with the surface of heat distribution in base plate, and then caused the equal thermal effect of backplate surface.

Aforesaid modified form LED-backlit module, wherein said its more comprises a type extruding body, be arranged at this backboard and in order to ccontaining this supporting body, this support member, this copper wire layer, with these a plurality of LED elements.

Aforesaid modified form LED-backlit module, the manufactured materials of wherein said this support member can be following any: metal and plastics.

Aforesaid modified form LED-backlit module, when wherein said manufactured materials when this supporting body was glass fibre, this support member was connected with supporting body by a heat-conducting glue.

Aforesaid modified form LED-backlit module, when wherein said manufactured materials when this supporting body and this support member was all metal, support member was connected with supporting body by one second insulating heat-conductive glue.

Aforesaid modified form LED-backlit module, the main line of wherein said this copper wire layer of part can be made into enamel-covered wire.

The purpose of the utility model and solve the technical scheme of its technical problem below also adopting in addition and realize.Its that proposes according to the utility model is installed on the backboard in the liquid crystal indicator, and this backboard has a base plate, and this modified form LED-backlit module comprises: (support member last, flat support part) supporting body has an inner surface and an outer surface at least; One copper wire layer is layed in this inner surface of this supporting body, and lays this outer surface to supporting body with extending by an insulating heat-conductive glue, wherein, this copper wire layer has many main lines, a plurality of pad and an electrical junction; A plurality of LED elements are arranged on this copper wire layer, and are welded in this a plurality of pads; A plurality of extension heat-conducting layers; Be connected with these a plurality of pads; Wherein, Few part this extensions heat-conducting layer is layed on the inner surface of supporting body by this insulating heat-conductive glue, and most of should the extension heat-conducting layer from the inner surface of supporting body and extension flatly, and be layed in the surface of this base plate of backboard by insulating heat-conductive glue; One support member is connected to the extension heat-conducting layer, extends heat-conducting layer in order to support; One LGP regards to this a plurality of LED elements with the one of which light entrance face, to receive the light that the LED element is launched; And an end reflector plate, be attached at the lower surface of this LGP, in order to prevent the lower surface escape of light by LGP; Wherein, when these a plurality of LED elements were luminous, heat that the LED element is produced can conduct to this a plurality of extension heat-conducting layers from this a plurality of pads, with through the extension heat-conducting layer with the surface of heat distribution in base plate, and then cause the equal thermal effect of backplate surface.

Aforesaid modified form LED-backlit module, wherein said its more comprises a type extruding body, be arranged at this backboard and in order to ccontaining this supporting body, this copper wire layer, these a plurality of LED elements, with this support member.

Aforesaid modified form LED-backlit module, wherein said this support member is connected with the extension heat-conducting layer with the mode that is arranged at this extension heat-conducting layer top, and the manufactured materials of support member is plastics.

Aforesaid modified form LED-backlit module, wherein said this support member supports this extension heat-conducting layer with the mode that is arranged at this insulating heat-conductive glue below, and the manufactured materials of support member is a metal.

The purpose of the utility model and solve the technical scheme of its technical problem below adopting again in addition and realize.Its that proposes according to the utility model is installed on the backboard in the liquid crystal indicator; This backboard has a base plate; This modified form LED-backlit module comprises: a supporting body, have an inner surface, an outer surface, with a plurality of perforations that run through this inner surface and this outer surface; One copper wire layer; Be layed in this inner surface of this supporting body by an insulating heat-conductive glue; Wherein, this copper wire layer has many main lines, a plurality of pad and an electrical junction, and many main lines can be layed in this outer surface of supporting body via this perforation with extending; A plurality of LED elements are arranged on this copper wire layer, and are welded in this a plurality of pads; A plurality of extension heat-conducting layers; Be connected with these a plurality of pads; Wherein, Few part this extensions heat-conducting layer is layed on the inner surface of supporting body by this insulating heat-conductive glue, and most of should the extension heat-conducting layer from the inner surface of supporting body and extension flatly, and be layed in this backplate surface of backboard through insulating heat-conductive glue; One LGP regards to this a plurality of LED elements with the one of which light entrance face, to receive the light that the LED element is launched; And an end reflector plate, be attached at the lower surface of this LGP, in order to prevent the lower surface escape of light by LGP; Wherein, when these a plurality of LED elements were luminous, heat that the LED element is produced can conduct to this a plurality of extension heat-conducting layers from this a plurality of pads, with through the extension heat-conducting layer with the surface of heat distribution in base plate, and then cause the equal thermal effect of backplate surface.

Aforesaid modified form LED-backlit module, wherein said its more comprises a support member, is connected in this a plurality of extension heat-conducting layers through this insulating heat-conductive glue, in order to support these a plurality of extension heat-conducting layers.

Aforesaid modified form LED-backlit module, the process materials of wherein said this support member is a metal.

Aforesaid modified form LED-backlit module, wherein said its more comprises a support member, is arranged at the top of these a plurality of extension heat-conducting layers, extends the heat-conducting layer support force in order to provide.

Aforesaid modified form LED-backlit module, the process materials of wherein said this support member is plastics.

The purpose of the utility model and solve the technical scheme of its technical problem below also adopting in addition and realize.Its that proposes according to the utility model is installed on the backboard in the liquid crystal indicator, and this backboard has a base plate, and this modified form LED-backlit module comprises: (not having support member) metal sheet is arranged on the backboard; One supporting body is arranged on this metal sheet and has an inner surface and an outer surface; One copper wire layer is layed in this inner surface of this supporting body, and lays this outer surface of part to supporting body with extending by an insulating heat-conductive glue, wherein, this copper wire layer has many main lines and a plurality of pad; A plurality of LED elements are arranged on this copper wire layer, and are welded in this a plurality of pads; A plurality of extension heat-conducting layers; Be connected with these a plurality of pads; Wherein, Few part this extensions heat-conducting layer is layed on the inner surface of supporting body by this insulating heat-conductive glue, and most of should the extension heat-conducting layer from the inner surface of supporting body and extension flatly, and be layed in this backplate surface of backboard through insulating heat-conductive glue; One LGP regards to this a plurality of LED elements with the one of which light entrance face, to receive the light that the LED element is launched; One end reflector plate is attached at the lower surface of this LGP, in order to prevent the lower surface escape of light by LGP; And a cushion, be arranged at the bottom of this end reflector plate, to improve the height of LGP and end reflector plate.

Aforesaid modified form LED-backlit module, wherein said its more can comprise a support member, is arranged at the top of these a plurality of extension heat-conducting layers, extends the heat-conducting layer support force in order to provide.

The utility model by the utility model by a plurality of the multiple multiple multiple multiple multiple elements borrowed from the plurality of elements of the elements through a plurality of elements elements of many more through the utility novel of the utility model of borrowing by a plurality of multiple multiple multiple multiple multiple components of a plurality of elements borrowed elements from the plurality of elements elements of many more through to the utility model structure borrowed from the structure of the multiple multiple multiple multiple multiple multiple components of the borrowed by a plurality of elements borrowed elements from the plurality of elements elements of many more through the utility model of the utility model Multiple borrowed by a plurality of multiple multiple multiple devices multiple multiple multiple borrowed from the the adoption of multiple components elements of the plurality of components Component several more through the present utility model of the borrow from the utility's multiple multiple multiple multiple multiple multiple elements borrowed from the adoption of the multiple components of the elements of the present utility model compared with the prior art has obvious advantages and beneficial effects .By technique scheme, the utility model modified form LED-backlit module can reach suitable technological progress property and practicality, and has the extensive value on the industry, and it has advantage at least:

1, mainly a plurality of extension heat-conducting layers is connected to a plurality of pads of copper wire layer, and most extension heat-conducting layer is layed in the backplate surface of backboard through insulating heat-conductive glue; So, the heat that the LED element is produced can conduct to the extension heat-conducting layer from this a plurality of pads, then, and can be through the extension heat-conducting layer with the surface of heat distribution in base plate, and then cause the equal thermal effect of backplate surface, help the heat radiation of backlight module.

2, mainly a plurality of extension heat-conducting layers are connected to a plurality of pads of copper wire layer; And through insulating heat-conductive glue most extension heat-conducting layer is layed in the backplate surface of backboard; So, help to cause the equal thermal effect of backplate surface, and then increase the radiating effect of backlight module; In addition, more use these a plurality of extension heat-conducting layers of a supports support, avoid these a plurality of extension heat-conducting layers in assembling, to be fractureed.

3, mainly a plurality of extension heat-conducting layers are connected to a plurality of pads of copper wire layer; And through insulating heat-conductive glue most extension heat-conducting layer is layed in the backplate surface of backboard; So, help to cause the equal thermal effect of backplate surface, and then increase the radiating effect of backlight module; In addition, the main line of copper wire layer can be by the mode through the inner perforation of supporting body, and extends to the outer surface of supporting body by the inner surface of supporting body, increases the flexibility ratio that copper wire layer is used.

4, mainly a plurality of extension heat-conducting layers are connected to a plurality of pads of copper wire layer; And through insulating heat-conductive glue most extension heat-conducting layer is layed in the backplate surface of backboard; So, help to cause the equal thermal effect of backplate surface, and then increase the radiating effect of backlight module; In addition, more the bottom of reflector plate is provided with a cushion end of at, directly contacts this a plurality of extension heat-conducting layers to avoid end reflector plate.

Above-mentioned explanation only is the general introduction of the utility model technical scheme; In order more to know the technological means of understanding the utility model; And can implement according to the content of specification, and for let the above-mentioned of the utility model with other purpose, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.

Description of drawings

The side view of a kind of existing LED-backlit module of commonly using of Fig. 1.

The side view of first embodiment of a kind of modified form LED-backlit module of Fig. 2 the utility model.

The exploded perspective view of first embodiment of Fig. 3 modified form LED-backlit module.

Second side view of first embodiment of Fig. 4 modified form LED-backlit module.

The 3rd side view of first embodiment of Fig. 5 modified form LED-backlit module.

The side view of second embodiment of a kind of modified form LED-backlit module of Fig. 6 the utility model.

The side view of the 3rd embodiment of a kind of modified form LED-backlit module of Fig. 7 the utility model.

The exploded perspective view of the 3rd embodiment of Fig. 8 modified form LED-backlit module.

Second side view of the 3rd embodiment of Fig. 9 modified form LED-backlit module.

The side view of the 4th embodiment of a kind of modified form LED-backlit module of Figure 10 the utility model.

The side view of the 5th embodiment of a kind of modified form LED-backlit module of Figure 11 the utility model.

The exploded perspective view of the 5th embodiment of Figure 12 modified form LED-backlit module.

Second side view of the 5th embodiment of Figure 13 modified form LED-backlit module.

The side view of the 6th embodiment of the modified form LED-backlit module of Figure 14 the utility model.

The side view of the 7th embodiment of the modified form LED-backlit module of Figure 15 the utility model.

The top view of one supporting body, a copper wire layer and a plurality of extension heat-conducting layers of Figure 16 modified form LED-backlit module.

Second side view of the 7th embodiment of Figure 17 modified form LED-backlit module.

The side view of the 8th embodiment of a kind of modified form LED-backlit module of Figure 18 the utility model.

The stereogram of the 8th embodiment of Figure 19 modified form LED-backlit module.

Second side view of the 8th embodiment of Figure 20 modified form LED-backlit module.

1: modified form LED-backlit module 2: backboard

21: base plate 22: frame

11: supporting body 12: copper wire layer

18: insulating heat-conductive glue 121: main line

122: pad 123: electrical junction

13:LED element 17: extend heat-conducting layer

15: LGP 16: end reflector plate

14: the perforation of reflecting layer 141:LED element

10: type extruding body 11a: supporting body

12a: copper wire layer 19a: support member

18a ': the second insulating heat-conductive glue 18a: the first insulating heat-conductive glue

121a: main line 122a: pad

123a: electrical junction 13a:LED element

17a: extend heat-conducting layer 15a: LGP

16a: end reflector plate 14a: reflecting layer

141a:LED element perforation 10a: type extruding body

11b: supporting body 12b: copper wire layer

18b: insulating heat-conductive glue 121b: main line

122b: pad 123b: electrical junction

13b:LED element 17b: extend heat-conducting layer

15b: LGP 16b: end reflector plate

14b: reflecting layer 141b:LED element perforation

10b: type extruding body 19b: support member

11c: supporting body 12c: copper wire layer

18c: insulating heat-conductive glue 121c: main line

122c: pad 123c: electrical junction

13c:LED element 17c: extend heat-conducting layer

15c: LGP 16c: end reflector plate

14c: reflecting layer 141c:LED element perforation

10c: type extruding body 111c: perforation

19c: support member 11d: supporting body

12d: copper wire layer 18d: insulating heat-conductive glue

121d: main line 122d: pad

17d: extend heat-conducting layer 13d:LED element

16d: end reflector plate 15d: LGP

141d:LED element perforation 14d: reflecting layer

1Ad: cushion 10d: metal sheet

19d: support member 200 ': LED-backlit module

210 ': LGP 220 ': light source component

230 ': cover body 240: top frame

222 ': circuit board 224 ': the LED element

212 ': reflector plate 2 ': back of the body framework

The specific embodiment

For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked; Below in conjunction with accompanying drawing and preferred embodiment; To its specific embodiment of modified form LED-backlit module, structure, characteristic and the effect thereof that proposes according to the utility model, specify as after.

The utlity model has many group embodiment, see also Fig. 2 and Fig. 3, side view and its exploded perspective view of first embodiment of a kind of modified form LED-backlit module of the utility model.Like Fig. 2 and shown in Figure 3, this modified form LED-backlit module 1 is installed on the backboard 2 in the liquid crystal indicator (not icon), and wherein, this backboard 2 has a base plate 21 and at least one frame 22.This modified form LED-backlit module 1 comprises a supporting body 11, a copper wire layer 12, a plurality of LED element 13, a reflecting layer 14, a plurality of extension heat-conducting layer 17, a LGP 15 and an end reflector plate 16.

This supporting body 11 can be processed by metal or glass fibre, and supporting body 11 is one 1 font supporting bodies and has an inner surface and an outer surface.Copper wire layer 12 is layed in the inner surface of supporting body 11 by an insulating heat-conductive glue 18, and lays the part outer surface to supporting body 11 with extending.Copper wire layer 12 has many main lines 121, a plurality of pad 122 and an electrical junction 123.These 13 of a plurality of LED elements are arranged on this copper wire layer 12, and are welded in this a plurality of pads 122.Wherein the electrical junction 123 of copper wire layer 12 is in order to being electrically connected to a circuit control unit that is installed within this liquid crystal indicator, and so, it is luminous that this circuit control unit then can be controlled this a plurality of LED element 13.

These a plurality of extension heat-conducting layers 17 are connected with these a plurality of pads 122; And; Few this extension heat-conducting layer 17 of part is layed on the inner surface of supporting body 11 by this insulating heat-conductive glue 18; Most extension heat-conducting layer 17 then flatly extends from the inner surface of supporting body 11, and is layed in base plate 21 surfaces of backboard 2 through insulating heat-conductive glue 18.This reflecting layer 14 is arranged on the copper wire layer 12 with respect to these a plurality of LED elements 13, and wherein reflecting layer 14 is one 1 font reflecting layer and has a plurality of LED element perforation 141, uses so that a light emitting surface of these a plurality of LED elements 13 passes.In addition, LGP 15 regards to this a plurality of LED elements 13 with the one of which light entrance face, to receive the light that LED element 13 is launched; Reflector plate 16 lower surface that are attached at LGP 15 in the end are in order to prevent the lower surface escape of light by LGP 15.

In addition, what must specify is for these many main lines 121 of facility are layed on the surface of supporting body 11, can the main line 121 of part be processed enamel-covered wire, and enamel-covered wire is layed in the surface of supporting body 11; Afterwards, when copper wire layer 12 was arranged at supporting body 11 surperficial, the mode through the high pressure electric smelting again was with the main line that engages the enamel-covered wire structure 121 other main line 121 with copper wire layer 12.

Via above-mentioned, the basic framework of first embodiment of the modified form LED-backlit module 1 of the utility model clearly discloses.Wherein, the characteristic and the advantage of the modified form LED-backlit module 1 of the utility model are:

1. among the utility model, should be connected to this a plurality of pads 122 by a plurality of extension heat-conducting layers 17, and most extension heat-conducting layer 17 was layed in base plate 21 surfaces of backboard 2 through insulating heat-conductive glue 18; So; When this a plurality of LED element 13 is luminous; The heat that LED element 13 is produced can conduct to from these a plurality of pads 122 extends heat-conducting layer 17, then, and can be through extending heat-conducting layer 17 with the surface of heat distribution in base plate 21; And then cause the equal thermal effect on base plate 21 surfaces, and help the heat radiation of backlight module.

And, this copper wire layer 12 can be layed in the inner surface of supporting body 11, and extensible the laying to the outer surface of supporting body 11; Increase the circuit layout area of circuit layer so, effectively.

Please consult Fig. 4 and Fig. 5 in addition, second side view of first embodiment of modified form LED-backlit module and the 3rd side view.What must specify is, among first embodiment of the modified form LED-backlit module 1 of the utility model, this supporting body 11 also can be ㄇ type supporting body or L type supporting body.Like Fig. 4 and modified form LED-backlit module 1 shown in Figure 5, have the supporting body 11 of L type and the supporting body 11 of ㄇ type respectively.Simultaneously, with respect to the supporting body 11 of L type and the supporting body 11 of ㄇ type, reflecting layer 14 also can be L type reflecting layer and ㄇ type reflecting layer.

The modified form LED-backlit module of the utility model more comprises one second embodiment, sees also Fig. 6, the side view of second embodiment of the modified form LED-backlit module of the utility model.As shown in Figure 6, second embodiment of this modified form LED-backlit module 1 comprises: a supporting body 11, a copper wire layer 12, a plurality of LED element 13, a reflecting layer 14, a plurality of extension heat-conducting layer 17, a LGP 15, an end reflector plate 16 and a type extruding body 10.The supporting body 11 of second embodiment of this modified form LED-backlit module 1, copper wire layer 12, LED element 13, reflecting layer 14, extend heat-conducting layer 17, LGP 15, with end reflector plate 16 be same as aforementioned first embodiment supporting body 11, copper wire layer 12, LED element 13, reflecting layer 14, extend heat-conducting layer 17, LGP 15, with end reflector plate 16.

What be different from aforementioned first embodiment is, second embodiment of this modified form LED-backlit module 1 has this type extruding body 10, and wherein, type extruding body 10 is arranged on this backboard 2 and in order to ccontaining this supporting body 11, this copper wire layer 12 and these a plurality of LED elements 13.Type extruding body 10 can be protected supporting body 11, copper wire layer 12 and LED element 13 effectively, destroys supporting body 11, copper wire layer 12 and LED element 13 to avoid external force this modified form LED-backlit module 1 of collision.

In addition, the utility model more provides one the 3rd embodiment of modified form LED-backlit module, sees also Fig. 7 and Fig. 8, side view and its exploded perspective view of the 3rd embodiment of a kind of modified form LED-backlit module of the utility model.Like Fig. 7 and shown in Figure 8; This modified form LED-backlit module 1 is installed on the backboard 2 in the liquid crystal indicator (not icon); Wherein, This backboard 2 has a base plate 21 and at least one frame 22; And this modified form LED-backlit module 1 comprises: a supporting body 11a, a support member 19a, a copper wire layer 12a, a plurality of LED element 13a, a reflecting layer 14a, a plurality of extension heat-conducting layer 17a, a LGP 15a and an end reflector plate 16a, wherein this supporting body 11a is one 1 font supporting bodies and is arranged on the frame 22 of backboard 2.

This support member 19a is arranged on the base plate 21 of backboard 2 and is connected in this supporting body 11a, and wherein, support member 19a has an inner surface and an outer surface.Copper wire layer 12a is layed in the inner surface of support member 19a by one first insulating heat-conductive glue 18a, and lays to the outer surface of support member 19a with extending, and copper wire layer 12a has many main line 121a, a plurality of pad 122a and an electrical junction 123a.These a plurality of LED element 13a then are arranged on this copper wire layer 12a, and are welded in this a plurality of pad 122a.Wherein, the electrical junction 123a of copper wire layer 12a is in order to be electrically connected to a circuit control unit that is installed within this liquid crystal indicator.

These a plurality of extension heat-conducting layer 17a are connected with these a plurality of pad 122a, and this extension heat-conducting layer 17a is layed on the inner surface of support member 19a by this first insulating heat-conductive glue 18a.This reflecting layer 14a then is arranged on the copper wire layer 12a with respect to these a plurality of LED element 13a, and wherein reflecting layer 14a is one 1 font reflecting layer and has a plurality of LED element perforation 141a, uses so that the light emitting surface of these a plurality of LED element 13a passes.In addition, this LGP 15a regards to this a plurality of LED element 13a with the one of which light entrance face, to receive the light that LED element 13a is launched; Reflector plate 16a then is attached at the lower surface of LGP 15a at the end, in order to prevent the lower surface escape of light by LGP 15a.

In the 3rd embodiment of modified form LED-backlit module 1, the manufactured materials of supporting body 11a can be metal and glass fibre; Likewise, the manufactured materials of support member 19a also can be metal and plastics.As shown in Figure 7, when the manufactured materials of supporting body 11a and support member 19a was all metal, this support member 19a was connected with supporting body 11a by one second insulating heat-conductive glue 18a '; In addition, when the manufactured materials of supporting body 11a was glass fibre, support member 19a then can be connected with supporting body 11a by a heat-conducting glue.

Via above-mentioned, the basic framework of the 3rd embodiment of the modified form LED-backlit module 1 of the utility model clearly discloses, and wherein, characteristic and the advantage of the 3rd embodiment of the modified form LED-backlit module 1 of the utility model are:

A. among the 3rd embodiment, likewise should be connected to this a plurality of pad 122a by a plurality of extension heat-conducting layer 17a, and most extension heat-conducting layer 17a was layed in base plate 21 surfaces of backboard 2 through the first insulating heat-conductive glue 18a; So; When these a plurality of LED element 13a are luminous; Heat that LED element 13a is produced can conduct to this a plurality of extension heat-conducting layer 17a from this a plurality of pad 122a, with through support member 19a with the surface of heat distribution in base plate 21, and then cause the surperficial equal thermal effect of base plate 21.

B. hold above-mentioned the 1st point, support member 19a can support this a plurality of extension heat-conducting layer 17a, is fractureed in assembling to avoid these a plurality of extension heat-conducting layer 17a.

C. and, this copper wire layer 12a can be layed in the inner surface of support member 19a, and extensible the laying to the outer surface of support member 19a; Increase the circuit layout area of circuit layer so, effectively.

Please consult Fig. 9 in addition, second side view of the 3rd embodiment of modified form LED-backlit module.What must specify is, among the 3rd embodiment of the modified form LED-backlit module 1 of the utility model, this supporting body 11a also can be ㄇ type supporting body or L type supporting body.Modified form LED-backlit module 1 as shown in Figure 9, the supporting body 11 with L type.Simultaneously, with respect to the supporting body 11a of L type and the supporting body 11a of ㄇ type, reflecting layer 14a also can be L type reflecting layer and ㄇ type reflecting layer.

The modified form LED-backlit module of the utility model more comprises one the 4th embodiment, sees also Figure 10, the side view of the 4th embodiment of the modified form LED-backlit module of the utility model.Shown in figure 10, the 4th embodiment of this modified form LED-backlit module 1 comprises: a supporting body 11a, a support member 19a, a copper wire layer 12a, a plurality of LED element 13a, a reflecting layer 14a, a plurality of extension heat-conducting layer 17a, a LGP 15a, an end reflector plate 16a and a type extruding body 10a.The supporting body 11a of the 4th embodiment of this modified form LED-backlit module 1, support member 19a, copper wire layer 12a, a plurality of LED element 13a, reflecting layer 14a, a plurality of extension heat-conducting layer 17a, LGP 15a, with end reflector plate 16a be same as aforementioned the 3rd embodiment supporting body 11a, support member 19a, copper wire layer 12a, a plurality of LED element 13a, reflecting layer 14a, a plurality of extension heat-conducting layer 17a, LGP 15a, with end reflector plate 16a.

What be different from aforementioned the 3rd embodiment is; The 4th embodiment of this modified form LED-backlit module 1 has this type extruding body 10a; Wherein, type extruding body 10a be arranged on this backboard 2 and in order to ccontaining this supporting body 11a, support member 19a, this copper wire layer 12a, with these a plurality of LED element 13a.Type extruding body 10a can protect effectively supporting body 11a, support member 19a, copper wire layer 12a, with LED element 13a, destroy to avoid external force this modified form LED-backlit module 1 of collision supporting body 11a, support member 19a, copper wire layer 12a, with LED element 13a.

And the utility model more provides one the 5th embodiment of modified form LED-backlit module, sees also Figure 11 and Figure 12, side view and its exploded perspective view of the 5th embodiment of a kind of modified form LED-backlit module of the utility model.Like Figure 11 and shown in Figure 12; This modified form LED-backlit module 1 is installed on the backboard 2 in the liquid crystal indicator (not icon); Wherein, this backboard 2 has a base plate 21 and at least one frame 22, and; This modified form LED-backlit module 1 comprises: a supporting body 11b, a copper wire layer 12b, a plurality of LED element 13b, a reflecting layer 14b, a plurality of extension heat-conducting layer 17b, a support member 19b, a LGP 15b and an end reflector plate 16b; Wherein this supporting body 11b can process one 1 font supporting bodies by metal or glass fibre, and supporting body 11b has an inner surface and an outer surface, and is arranged on the frame 22 of backboard 2.

This copper wire layer 12b is layed in the inner surface of supporting body 11b by an insulating heat-conductive glue 18b, and lays to the outer surface of supporting body 11b with extending.Copper wire layer 12b has many main line 121b, a plurality of pad 122b and an electrical junction 123b, and wherein this electrical junction 123b is in order to be electrically connected to a circuit control unit that is installed within this liquid crystal indicator.These a plurality of LED element 13b then are arranged on this copper wire layer 12b, and are welded in this a plurality of pad 122b.In addition, this reflecting layer 14b is arranged on the copper wire layer 12b with respect to these a plurality of LED element 13b, and wherein reflecting layer 14b is one 1 font reflecting layer, and has a plurality of LED element perforation 141b, uses so that the light emitting surface of these a plurality of LED element 13b passes.

These a plurality of extension heat-conducting layer 17b are connected with these a plurality of pad 122b; Wherein, The extension heat-conducting layer 17b of few part is layed on the inner surface of supporting body 11b by insulating heat-conductive glue 18b; And most extension heat-conducting layer 17b flatly extends from the inner surface of supporting body 11b, and is layed in base plate 21 surfaces of backboard 2 by insulating heat-conductive glue 18b.In addition, support member 19b with the mode that is arranged at this extension heat-conducting layer 17b top with extend heat-conducting layer 17b and be connected, and the manufactured materials of support member 19b is plastics, can provide and extend heat-conducting layer 17b support force, avoids extending heat-conducting layer 17b and when assembling, ruptures.So; When these a plurality of LED element 13b are luminous; Heat that LED element 13b is produced can conduct to this a plurality of extension heat-conducting layer 17b from this a plurality of pad 122b, with through extending heat-conducting layer 17b with the surface of heat distribution in base plate 21, and then causes the surperficial equal thermal effect of base plate 21.

Moreover, be same as previous embodiment, among the 5th embodiment of modified form LED-backlit module 1, this LGP 15b regards to this a plurality of LED element 13b with the one of which light entrance face, to receive the light that LED element 13b is launched; Reflector plate 16b then is attached at the lower surface of LGP 15b at the end, is leaked by the lower surface choosing of LGP 15b in order to prevent light.Please consult Figure 13 in addition, second side view of the 5th embodiment of modified form LED-backlit module, shown in figure 13; Support member 19b also can be set at this insulating heat-conductive glue 18b below; And, being arranged at the support member 19b of insulating heat-conductive glue 18b below, its manufactured materials is a metal; So, support member 19b can conduct to the heat that LED element 13b is produced on the base plate 21 of whole back plate 2.

In addition; What must specify is; Its length of support member 19b that is arranged at insulating heat-conductive glue 18b below can be identical with the length of extending heat-conducting layer 17b, and in other words, the length of support member 19b can be shorter than the length of extending heat-conducting layer 17b; So, extending heat-conducting layer 17b and support member 19b can be pasted on the base plate 21 of backboard 2 simultaneously.Moreover what must specify is, the material that above-mentioned explanation limits support member 19b is metal or plastics, only provides preferable enforcement upright for your guidance, is not that material to support member 19b limits; When the 5th embodiment of the modified form LED-backlit module of implementing the utility model, the implementer still can select the material of support member 19b arbitrarily.

Likewise; Be same as previous embodiment; Among the 5th embodiment of modified form LED-backlit module, this supporting body 11b also can be ㄇ type supporting body or L type supporting body, simultaneously; With respect to the supporting body 11b of L type and the supporting body 11b of ㄇ type, reflecting layer 14b also can be L type reflecting layer and ㄇ type reflecting layer.Moreover these many main line 121b are layed on the surface of supporting body 11b for facility, can the main line 121b of part be processed enamel-covered wire, and enamel-covered wire is layed in the surface of supporting body 11b; Afterwards, when copper wire layer 12b was arranged at supporting body 11b surperficial, the mode through the high pressure electric smelting again was with the main line 121b that engages the enamel-covered wire structure and other main line 121b of copper wire layer 12b.

At last, the modified form LED-backlit module of the utility model more comprises one the 6th embodiment, sees also Figure 14, the side view of the 6th embodiment of the modified form LED-backlit module of the utility model.Shown in figure 14, the 6th embodiment of this modified form LED-backlit module 1 comprises: a supporting body 11b, a copper wire layer 12b, a plurality of LED element 13b, a reflecting layer 14b, a plurality of extension heat-conducting layer 17b, a support member 19b, a LGP 15b, an end reflector plate 16b and a type extruding body 10b.The supporting body 11b of the 6th embodiment of this modified form LED-backlit module 1, copper wire layer 12b, a plurality of LED element 13b, reflecting layer 14b, a plurality of extension heat-conducting layer 17b, support member 19b, a LGP 15b, with an end reflector plate 16b be same as aforementioned the 5th embodiment supporting body 11b, copper wire layer 12b, a plurality of LED element 13b, reflecting layer 14b, a plurality of extension heat-conducting layer 17b, support member 19b, LGP 15b, with end reflector plate 16b.

What be different from aforementioned the 5th embodiment is; The 6th embodiment of this modified form LED-backlit module 1 has this type extruding body 10b; Wherein, type extruding body 10b be arranged on the backboard 2 and in order to ccontaining this supporting body 11b, support member 19b, this copper wire layer 12b, with these a plurality of LED element 13b.Type extruding body 10b can protect effectively supporting body 11b, support member 19b, copper wire layer 12b, with LED element 13b, destroy to avoid external force this modified form LED-backlit module 1 of collision supporting body 11b, support member 19b, copper wire layer 12b, with LED element 13b.

Moreover the utility model more provides one the 7th embodiment of this modified form LED-backlit module, sees also Figure 15, the side view of the 7th embodiment of the modified form LED-backlit module of the utility model.Shown in figure 15, the 7th embodiment of this modified form LED-backlit module 1 comprises: a supporting body 11c, a copper wire layer 12c, a plurality of LED element 13c, a plurality of extension heat-conducting layer 17c, a reflecting layer 14c, a LGP 15c and an end reflector plate 16c.

Please consult Figure 16 simultaneously, the top view of this supporting body, this copper wire layer and these a plurality of extension heat-conducting layers.Like Figure 15 and shown in Figure 16, this supporting body 11c can be processed by metal or glass fibre, and supporting body 11c be one 1 font supporting bodies and have an inner surface, an outer surface, with a plurality of perforation 111c that run through this inner surface and this outer surface.This copper wire layer 12c is layed in this inner surface of this supporting body 11c by an insulating heat-conductive glue 18c; Copper wire layer 12c has many main line 121c, a plurality of pad 122c and an electrical junction 123c; Wherein, These many main line 121c can be layed in this outer surface of supporting body 11c via this perforation 111c with extending, and this electrical junction 123c is then in order to be electrically connected to a circuit control unit that is installed within this liquid crystal indicator.

These a plurality of LED element 13c are arranged on the copper wire layer 12c, and are welded in this a plurality of pad 122c.This reflecting layer 14c is one 1 font reflecting layer, and it is arranged on the copper wire layer 12c with respect to these a plurality of LED element 13c, and reflecting layer 14c has a plurality of LED elements perforation 141c and can make the light emitting surface of these a plurality of LED element 13c pass.In addition, this LGP 15c regards to this a plurality of LED element 13c with the one of which light entrance face, to receive the light that LED element 13c is launched; Reflector plate 16c then is attached at the lower surface of LGP 15c at this end, in order to prevent the lower surface escape of light by LGP 15c.

Likewise; Be same as previous embodiment; Among the 7th embodiment of modified form LED-backlit module, this supporting body 11c also can be ㄇ type supporting body or L type supporting body, simultaneously; With respect to the supporting body 11c of L type and the supporting body 11c of ㄇ type, reflecting layer 14c also can be L type reflecting layer and ㄇ type reflecting layer.In addition, see also Figure 17, second side view of the 7th embodiment of the modified form LED-backlit module of the utility model.Shown in figure 17, also can add a support member 19c in the framework of the 7th embodiment of modified form LED-backlit module, wherein, this support member 19c is connected with extension heat-conducting layer 17c with the mode that is arranged at this insulating heat-conductive glue 18c below.The manufactured materials of this support member 19c is a metal, in order to support these a plurality of extension heat-conducting layer 17c, avoids extending heat-conducting layer 17c fracture when assembling.In addition; Support member 19c also can be arranged at the mode of this extension heat-conducting layer 17c top and be connected with extension heat-conducting layer 17c; And the manufactured materials of support member 19c is plastics, and it likewise can provide and extend heat-conducting layer 17c support force, avoids extending heat-conducting layer 17c fracture when assembling.

At last, one the 8th embodiment that the utility model more provides this modified form LED-backlit module please consults Figure 18 and Figure 19 simultaneously, side view and its exploded perspective view of the 8th embodiment of a kind of modified form LED-backlit module of the utility model.Like Figure 18 and shown in Figure 19, the 8th embodiment of the modified form LED-backlit module of the utility model comprises: a metal sheet 10d, a supporting body 11d, a copper wire layer 12d, a plurality of LED element 13d, a plurality of extension heat-conducting layer 17d, a LGP 15d, an end reflector plate 16d, a cushion 1Ad and a reflecting layer 14d.Wherein, metal sheet 10d is arranged on the backboard 2, and this supporting body 11d can process a ㄇ type supporting body, L type supporting body or 1 font supporting body by metal or glass fibre; Wherein Figure 18 and supporting body 11d shown in Figure 19 be shaped as 1 font, it is arranged at metal sheet 10d and goes up and have an inner surface and an outer surface.

This copper wire layer 12d is layed in the inner surface of supporting body 11d by an insulating heat-conductive glue 18d, and lays the part outer surface to supporting body 11d with extending, and wherein, this copper wire layer 12d has many main line 121d and a plurality of pad 122d; And especially, the main line 121d of this copper wire layer of part 12d can be made into enamel-covered wire, and can be layed in the inner surface of supporting body 11 in advance; Afterwards, when copper wire layer 12 was arranged at supporting body 11 surperficial, the mode through the high pressure electric smelting again was with the main line that engages the enamel-covered wire structure 121 other main line 121 with copper wire layer 12.

These a plurality of LED element 13d are arranged on the copper wire layer 12d, and are welded in this a plurality of pad 122d.This reflecting layer 14d can be ㄇ type reflecting layer, L type reflecting layer or 1 font reflecting layer, and wherein, Figure 18 and reflecting layer 14d shown in Figure 19 are shaped as 1 font.Reflecting layer 14d is arranged on the copper wire layer 12d with respect to these a plurality of LED element 13d, and reflecting layer 14d has a plurality of LED elements perforation 141d, with so that the light emitting surface of these a plurality of LED element 13d passes.This LGP 15d regards to this a plurality of LED element 13d with the one of which light entrance face, to receive the light that LED element 13d is launched; Reflector plate 16d then is attached at the lower surface of this LGP 15d at this end, in order to prevent the lower surface escape of light by LGP 15d.

In addition, what be different from aforementioned other embodiment is, the 8th embodiment of the modified form LED-backlit module 1 of the utility model more comprises a cushion 1Ad, and it is arranged at the bottom of this end reflector plate 16d, to improve the height of LGP 15d and end reflector plate 16d; So, can make the light entrance face of LGP 15d obtain preferable light-receiving angle by the height of adjustment cushion 1Ad; Perhaps, cushion also can place insulating heat-conductive glue 18d and extend heat-conducting layer 17d bottom (not shown), can reach the effect of adjustment LGP 15d height equally.

The 8th embodiment of the modified form LED-backlit module 1 of the utility model also can comprise a support member.See also Figure 20, second side view of the 8th embodiment of this modified form LED-backlit module.Among Figure 20, a support member 19d is arranged at this extension heat-conducting layer 17d and this insulating heat-conductive glue 18d below, extends heat-conducting layer 17d one support force to provide, yet embodiment shown in Figure 20 is not in order to limit the utility model.When the 8th embodiment of the modified form LED-backlit module of implementing the utility model, this support member 19d also can place insulating heat-conductive glue 18d and extend on the heat-conducting layer 17d, and can reach equally provides the effect of extending heat-conducting layer 17d support force; And, being same as aforementioned the 5th embodiment, the material of the support member 19d of the 8th embodiment is not defined as metal or plastics, and the implementer can select it arbitrarily.

The above; It only is the preferred embodiment of the utility model; Not being that the utility model is done any pro forma restriction, though the utility model with the preferred embodiment exposure as above, yet is not in order to limit the utility model; Anyly be familiar with the professional and technical personnel; In not breaking away from the utility model technical scheme scope, make a little change or be modified to the equivalent embodiment of equivalent variations when the technology contents of above-mentioned announcement capable of using, be the content that does not break away from the utility model technical scheme in every case;, all still belong in the scope of the utility model technical scheme any simple modification, equivalent variations and modification that above embodiment did according to the technical spirit of the utility model.

Claims

1. a modified form LED-backlit module is characterized in that it is installed on the backboard in the liquid crystal indicator, and this backboard has a base plate, and this modified form LED-backlit module comprises:

One supporting body has an inner surface and an outer surface;

One copper wire layer is layed in this inner surface of this supporting body, and lays this outer surface to supporting body with extending by an insulating heat-conductive glue, wherein, this copper wire layer has many main lines, a plurality of pad and an electrical junction;

A plurality of LED elements are arranged on this copper wire layer, and are welded in this a plurality of pads;

A plurality of extension heat-conducting layers; Be connected with these a plurality of pads; Wherein, Few part this extensions heat-conducting layer is layed on the inner surface of supporting body by this insulating heat-conductive glue, and most of should the extension heat-conducting layer from the inner surface of supporting body and extension flatly, and be layed in this backplate surface of backboard through insulating heat-conductive glue;

One LGP regards to this a plurality of LED elements with the one of which light entrance face, to receive the light that the LED element is launched; And

One end reflector plate is attached at the lower surface of this LGP, in order to prevent the lower surface escape of light by LGP;

Wherein, when these a plurality of LED elements were luminous, heat that the LED element is produced can conduct to this a plurality of extension heat-conducting layers from this a plurality of pads, with through the extension heat-conducting layer with the surface of heat distribution in base plate, and then cause the equal thermal effect of backplate surface.

2. modified form LED-backlit module according to claim 1; It is characterized in that it more comprises a reflecting layer; Be arranged on this copper wire layer with respect to these a plurality of LED elements, wherein this reflecting layer has a plurality of LED element perforation, uses so that a light emitting surface of these a plurality of LED elements passes.

3. modified form LED-backlit module according to claim 2 is characterized in that it more comprises a type extruding body, is arranged on this backboard and in order to ccontaining this supporting body, this copper wire layer and these a plurality of LED elements.

4. modified form LED-backlit module according to claim 1, the manufactured materials that it is characterized in that this supporting body be following any: metal and glass fibre.

5. modified form LED-backlit module according to claim 4, it is characterized in that this supporting body be following any: ㄇ type supporting body, L type supporting body and 1 font supporting body.

6. modified form LED-backlit module according to claim 1, this electrical junction that it is characterized in that this copper wire layer is in order to be electrically connected to an interior circuit control unit that is installed on this liquid crystal indicator.

7. modified form LED-backlit module according to claim 2, it is characterized in that this reflecting layer be following any: ㄇ type reflecting layer, L type reflecting layer and 1 font reflecting layer.

8. modified form LED-backlit module according to claim 1 is characterized in that the main line of its this copper wire layer of part can be made into enamel-covered wire.

9. a modified form LED-backlit module is characterized in that it is installed on the backboard in the liquid crystal indicator, and this backboard has a base plate and a frame, and this modified form LED-backlit module comprises

One supporting body is arranged on this frame of backboard;

One support member is arranged on this base plate of backboard and is connected in this supporting body, and has an inner surface and an outer surface at least;

One copper wire layer is layed in this inner surface of this support member, and lays this outer surface to support member with extending by one first insulating heat-conductive glue, wherein, this copper wire layer has many main lines, a plurality of pad and an electrical junction;

A plurality of LED elements are arranged on this copper wire layer, and are welded in this a plurality of pads; And

A plurality of extension heat-conducting layers are connected with these a plurality of pads, and wherein, this extension heat-conducting layer is layed on the inner surface of support member by this insulating heat-conductive glue;

Wherein, when these a plurality of LED elements were luminous, heat that the LED element is produced can conduct to this a plurality of extension heat-conducting layers from this a plurality of pads, passing through support member with the surface of heat distribution in base plate, and then caused the equal thermal effect of backplate surface.

10. modified form LED-backlit module according to claim 9; It is characterized in that it more comprises a reflecting layer; Be arranged on this copper wire layer with respect to these a plurality of LED elements; Wherein this reflecting layer has a plurality of LED element perforation, uses so that a light emitting surface of these a plurality of LED elements passes.

11. modified form LED-backlit module according to claim 10 is characterized in that it more comprises a type extruding body, be arranged at this backboard and in order to ccontaining this supporting body, this support member, this copper wire layer, with these a plurality of LED elements.

12. modified form LED-backlit module according to claim 9, the manufactured materials that it is characterized in that this supporting body be following any: metal and glass fibre.

13. modified form LED-backlit module according to claim 12, the manufactured materials that it is characterized in that this support member be following any: metal and plastics.

14. modified form LED-backlit module according to claim 13 is characterized in that this support member is connected with supporting body by a heat-conducting glue when the manufactured materials of this supporting body is glass fibre.

15. modified form LED-backlit module according to claim 13 is characterized in that when the manufactured materials of this supporting body and this support member is all metal support member is connected with supporting body by one second insulating heat-conductive glue.

16. modified form LED-backlit module according to claim 9, it is characterized in that this supporting body be following any: ㄇ type supporting body, L type supporting body and 1 font supporting body.

17. modified form LED-backlit module according to claim 9, this electrical junction that it is characterized in that this copper wire layer is in order to be electrically connected to an interior circuit control unit that is installed on this liquid crystal indicator.

18. modified form LED-backlit module according to claim 10, it is characterized in that this reflecting layer be following any: ㄇ type reflecting layer, L type reflecting layer and 1 font reflecting layer.

19. modified form LED-backlit module according to claim 9 is characterized in that the main line of this copper wire layer of part can be made into enamel-covered wire.

20. a modified form LED-backlit module is characterized in that it is installed on the backboard in the liquid crystal indicator, this backboard has a base plate, and this modified form LED-backlit module comprises:

One supporting body has an inner surface and an outer surface at least;

A plurality of extension heat-conducting layers; Be connected with these a plurality of pads; Wherein, Few part this extensions heat-conducting layer is layed on the inner surface of supporting body by this insulating heat-conductive glue, and most of should the extension heat-conducting layer from the inner surface of supporting body and extension flatly, and be layed in the surface of this base plate of backboard by insulating heat-conductive glue;

One support member is connected to the extension heat-conducting layer, extends heat-conducting layer in order to support;

21. modified form LED-backlit module according to claim 20; It is characterized in that it more comprises a reflecting layer; Be arranged on this copper wire layer with respect to these a plurality of LED elements; Wherein this reflecting layer has a plurality of LED element perforation, uses so that a light emitting surface of these a plurality of LED elements passes.

22. modified form LED-backlit module according to claim 21 is characterized in that it more comprises a type extruding body, be arranged at this backboard and in order to ccontaining this supporting body, this copper wire layer, these a plurality of LED elements, with this support member.

23. modified form LED-backlit module according to claim 20, the manufactured materials that it is characterized in that this supporting body be following any: metal and glass fibre.

24. modified form LED-backlit module according to claim 23, it is characterized in that this supporting body be following any: ㄇ type supporting body, L type supporting body and 1 font supporting body.

25. modified form LED-backlit module according to claim 20, this electrical junction that it is characterized in that this copper wire layer is in order to be electrically connected to a circuit control unit that is installed within this liquid crystal indicator.

26. modified form LED-backlit module according to claim 21, it is characterized in that this reflecting layer be following any: ㄇ type reflecting layer, L type reflecting layer and 1 font reflecting layer.

27. modified form LED-backlit module according to claim 20 it is characterized in that this support member is connected with the extension heat-conducting layer with the mode that is arranged at this extension heat-conducting layer top, and the manufactured materials of support member is plastics.

28. modified form LED-backlit module according to claim 20 it is characterized in that this support member supports this extension heat-conducting layer with the mode that is arranged at this insulating heat-conductive glue below, and the manufactured materials of support member is a metal.

29. modified form LED-backlit module according to claim 20 is characterized in that the main line of this copper wire layer of part can be made into enamel-covered wire.

30. a modified form LED-backlit module is characterized in that it is installed on the backboard in the liquid crystal indicator, this backboard has a base plate, and this modified form LED-backlit module comprises:

One supporting body, have an inner surface, an outer surface, with a plurality of perforations that run through this inner surface and this outer surface;

One copper wire layer; Be layed in this inner surface of this supporting body by an insulating heat-conductive glue; Wherein, this copper wire layer has many main lines, a plurality of pad and an electrical junction, and many main lines can be layed in this outer surface of supporting body via this perforation with extending;

31. modified form LED-backlit module according to claim 30; It is characterized in that it more comprises a reflecting layer; Be arranged on this copper wire layer with respect to these a plurality of LED elements; Wherein this reflecting layer has a plurality of LED element perforation, uses so that a light emitting surface of these a plurality of LED elements passes.

32. modified form LED-backlit module according to claim 31 is characterized in that it more comprises a type extruding body, is arranged on this backboard and in order to ccontaining this supporting body, this copper wire layer and these a plurality of LED elements.

33. modified form LED-backlit module according to claim 30, the manufactured materials that it is characterized in that this supporting body be following any: metal and glass fibre.

34. modified form LED-backlit module according to claim 33, it is characterized in that this supporting body be following any: ㄇ type supporting body, L type supporting body and 1 font supporting body.

35. modified form LED-backlit module according to claim 30, this electrical junction that it is characterized in that this copper wire layer is in order to be electrically connected to a circuit control unit that is installed within this liquid crystal indicator.

36. modified form LED-backlit module according to claim 31, it is characterized in that this reflecting layer be following any: ㄇ type reflecting layer, L type reflecting layer and 1 font reflecting layer.

37. modified form LED-backlit module according to claim 31 is characterized in that it more comprises a support member, is connected in this a plurality of extension heat-conducting layers through this insulating heat-conductive glue, in order to support these a plurality of extension heat-conducting layers.

38. according to the described modified form LED-backlit of claim 37 module, the process materials that it is characterized in that this support member is a metal.

39. modified form LED-backlit module according to claim 31 is characterized in that it more comprises a support member, is arranged at the top of these a plurality of extension heat-conducting layers, extends the heat-conducting layer support force in order to provide.

40., it is characterized in that the main line of its this copper wire layer of part can be made into enamel-covered wire according to the described modified form LED-backlit of claim 39 module.

41. modified form LED-backlit module according to claim 30, the process materials that it is characterized in that this support member is plastics.

42. a modified form LED-backlit module is characterized in that it is installed on the backboard in the liquid crystal indicator, this backboard has a base plate, and this modified form LED-backlit module comprises:

One metal sheet is arranged on the backboard;

One supporting body is arranged on this metal sheet and has an inner surface and an outer surface;

One copper wire layer is layed in this inner surface of this supporting body, and lays this outer surface of part to supporting body with extending by an insulating heat-conductive glue, wherein, this copper wire layer has many main lines and a plurality of pad;

One LGP regards to this a plurality of LED elements with the one of which light entrance face, to receive the light that the LED element is launched;

One end reflector plate is attached at the lower surface of this LGP, in order to prevent the lower surface escape of light by LGP; And

One cushion is arranged at the bottom of this end reflector plate, to improve the height of LGP and end reflector plate.

43. according to the described modified form LED-backlit of claim 42 module; It is characterized in that it more comprises a reflecting layer; Be arranged on this copper wire layer with respect to these a plurality of LED elements; Wherein this reflecting layer has a plurality of LED element perforation, uses so that a light emitting surface of these a plurality of LED elements passes.

44. according to the described modified form LED-backlit of claim 42 module, the manufactured materials that it is characterized in that this supporting body be following any: metal and glass fibre.

45. according to the described modified form LED-backlit of claim 44 module, it is characterized in that this supporting body be following any: ㄇ type supporting body, L type supporting body and 1 font supporting body.

46. according to the described modified form LED-backlit of claim 43 module, it is characterized in that this reflecting layer be following any: ㄇ type reflecting layer, L type reflecting layer and 1 font reflecting layer.

47., it is characterized in that the main line of this copper wire layer of part can be made into enamel-covered wire according to the described modified form LED-backlit of claim 42 module.

48., it is characterized in that it more can comprise a support member according to the described modified form LED-backlit of claim 42 module, be arranged at the top of these a plurality of extension heat-conducting layers, extend the heat-conducting layer support force in order to provide.

49., it is characterized in that it more comprises a support member, be connected in this a plurality of extension heat-conducting layers through this insulating heat-conductive glue, in order to support these a plurality of extension heat-conducting layers according to the described modified form LED-backlit of claim 42 module.