JP2008166304A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008166304A5 JP2008166304A5 JP2006350518A JP2006350518A JP2008166304A5 JP 2008166304 A5 JP2008166304 A5 JP 2008166304A5 JP 2006350518 A JP2006350518 A JP 2006350518A JP 2006350518 A JP2006350518 A JP 2006350518A JP 2008166304 A5 JP2008166304 A5 JP 2008166304A5
- Authority
- JP
- Japan
- Prior art keywords
- holding member
- light emitting
- wiring board
- transfer path
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive Effects 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000012212 insulator Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
Claims (5)
複数の発光ダイオード及び当該各発光ダイオードから発生する熱を伝導するための伝熱路を有する複数の配線基板と、
前記筐体へ固定されるとともに前記各配線基板を保持する金属製の保持部材と、
前記各配線基板と前記保持部材との間に設けられ、前記各配線基板の前記伝熱路から伝導された熱を前記保持部材へ伝導可能な粘着材と
を具備するバックライト装置。 A housing,
A plurality of wiring boards having a plurality of light emitting diodes and a heat transfer path for conducting heat generated from each of the light emitting diodes;
A metal holding member that is fixed to the housing and holds each wiring board;
Wherein provided between the holding member and the wiring board, comprising to Luba backlight device and a conductivity capable tacky material the is conducted from the heat transfer path of the wiring substrate heat to the holding member.
前記配線基板は樹脂製であり、
前記伝熱路は、前記配線基板を前記発光ダイオード側から前記保持部材側へ貫通するサーマルビアであり、
前記粘着材は絶縁体である
バックライト装置。 The backlight device according to claim 1,
The wiring board is made of resin,
The heat transfer path is a thermal via that penetrates the wiring board from the light emitting diode side to the holding member side,
The adhesive material is an insulator.
Backlight device.
前記配線基板を前記保持部材へ係止するための係止部材を更に具備するバックライト装置。 The backlight device according to claim 2,
Further comprising to Luba backlight device the locking member for locking the circuit board to the holding member.
前記発光ダイオードユニットから出射される光の透過率を変化させることで映像を表示可能な液晶パネルと
を具備する液晶表示装置。 A housing, a plurality of light emitting diodes and a plurality of wiring boards each having a heat transfer path for conducting heat generated from each of the light emitting diodes, and a metal fixed to the housing and holding each wiring board A backlight having a metal holding member and an adhesive material provided between the wiring boards and the holding member and capable of conducting heat conducted from the heat transfer path of the wiring boards to the holding member. Equipment,
The light emitting diode unit by changing the transmittance of light emitted from the to that the liquid crystal display device and a liquid crystal panel capable of displaying images in.
前記配線基板は樹脂製であり、
前記伝熱路は、前記配線基板を前記発光ダイオード側から前記保持部材側へ貫通するサーマルビアであり、
前記粘着材は絶縁体である
液晶表示装置。 The liquid crystal display device according to claim 4,
The wiring board is made of resin,
The heat transfer path is a thermal via that penetrates the wiring board from the light emitting diode side to the holding member side,
The adhesive material is an insulator.
Liquid crystal display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006350518A JP2008166304A (en) | 2006-12-26 | 2006-12-26 | Backlighting device and liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006350518A JP2008166304A (en) | 2006-12-26 | 2006-12-26 | Backlighting device and liquid crystal display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008166304A JP2008166304A (en) | 2008-07-17 |
| JP2008166304A5 true JP2008166304A5 (en) | 2010-02-18 |
Family
ID=39695442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006350518A Pending JP2008166304A (en) | 2006-12-26 | 2006-12-26 | Backlighting device and liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008166304A (en) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5607945B2 (en) * | 2009-02-12 | 2014-10-15 | エルジー イノテック カンパニー リミテッド | Backlight unit |
| CN201407526Y (en) * | 2009-05-10 | 2010-02-17 | 柯建锋 | LED straight lamp tube |
| BRPI1013531A2 (en) | 2009-06-15 | 2019-09-24 | Sharp Kk | lighting device, display device and television receiver |
| CN102449788A (en) * | 2009-06-15 | 2012-05-09 | 夏普株式会社 | Light emitting module, illuminating device, display device, and television receiver |
| WO2010146917A1 (en) * | 2009-06-15 | 2010-12-23 | シャープ株式会社 | Illumination device, display device, and television receiver |
| US8636382B2 (en) | 2009-06-25 | 2014-01-28 | Sharp Kabushiki Kaisha | Light source apparatus, image display apparatus and television receiving apparatus |
| JP5477895B2 (en) * | 2009-07-15 | 2014-04-23 | 神保電器株式会社 | LED lighting device |
| CN102221161B (en) * | 2010-04-19 | 2013-01-16 | 群康科技(深圳)有限公司 | Method and equipment for manufacturing backlight source |
| JP2011238367A (en) | 2010-05-06 | 2011-11-24 | Funai Electric Co Ltd | Light source mounting structure of plane light-emitting device |
| WO2011142145A1 (en) * | 2010-05-10 | 2011-11-17 | シャープ株式会社 | Light source, light source device, and display device |
| JP5426481B2 (en) * | 2010-05-26 | 2014-02-26 | 株式会社東芝 | Light emitting device |
| WO2012002321A1 (en) | 2010-06-30 | 2012-01-05 | パナソニック液晶ディスプレイ株式会社 | Liquid crystal display device |
| US9127814B2 (en) | 2010-09-06 | 2015-09-08 | Sharp Kabushiki Kaisha | Lighting device, display device, and television device |
| KR101775671B1 (en) * | 2010-09-29 | 2017-09-20 | 삼성디스플레이 주식회사 | Backlight assembly having light emitting diode package and display apparatus having the same |
| KR101771557B1 (en) | 2011-01-05 | 2017-08-25 | 엘지전자 주식회사 | Display Apparatus |
| JP6416662B2 (en) * | 2015-03-03 | 2018-10-31 | 東芝映像ソリューション株式会社 | Electronics |
| KR102297912B1 (en) * | 2015-04-29 | 2021-09-02 | 엘지전자 주식회사 | Display apparatus |
| EP3346322B1 (en) | 2015-09-01 | 2020-09-30 | Panasonic Intellectual Property Management Co., Ltd. | Video display device |
| US10643556B2 (en) | 2015-09-01 | 2020-05-05 | Panasonic Intellectual Property Management Co., Ltd. | Video display device |
| WO2017038080A1 (en) | 2015-09-01 | 2017-03-09 | パナソニックＩｐマネジメント株式会社 | Video display device |
| WO2017038084A1 (en) | 2015-09-01 | 2017-03-09 | パナソニックＩｐマネジメント株式会社 | Video display device |
| WO2017038083A1 (en) | 2015-09-01 | 2017-03-09 | パナソニックＩｐマネジメント株式会社 | Image display device |
| WO2017038085A1 (en) | 2015-09-01 | 2017-03-09 | パナソニックＩｐマネジメント株式会社 | Image display device |
| KR102131666B1 (en) * | 2019-11-08 | 2020-07-08 | 주식회사 위드플러스 | Method of forming foaming ink reflector on printed circuit board by printing process |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4067802B2 (en) * | 2001-09-18 | 2008-03-26 | 松下電器産業株式会社 | Lighting device |
| JP4610312B2 (en) * | 2004-11-26 | 2011-01-12 | 京セラ株式会社 | Light source device and display device having the same |
| JP4697533B2 (en) * | 2005-06-08 | 2011-06-08 | ミネベア株式会社 | Surface lighting device |
-
2006
- 2006-12-26 JP JP2006350518A patent/JP2008166304A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008166304A5 (en) | ||
| US9279933B2 (en) | Dual-sided display device and its backlight module | |
| TWI402577B (en) | Backlight module and display device with two-sided light emitting structure | |
| EP2086294A3 (en) | Printed circuit board, backlight unit having the printed circuit board, and liquid crystal display device having said printed circuit board | |
| JP2007080522A5 (en) | ||
| US20130051067A1 (en) | Backlight Module with Connecting Circuits | |
| RU2009134481A (en) | ILLUMINATION DEVICE AND FLAT DISPLAY DEVICE USING IT | |
| JP2012204370A5 (en) | ||
| US9304353B2 (en) | Direct backlight module | |
| DK1780584T3 (en) | LED backlight for flat and non-flat display systems | |
| EP2346309A3 (en) | Light emitting module, backlight unit, and display apparatus | |
| CN203204952U (en) | Display device and television | |
| US9229155B2 (en) | Side-edge backlight module | |
| JP2013182076A (en) | Video display device and light emission device | |
| CN100388092C (en) | Heat radiation structure of backlight module | |
| JP2012253213A (en) | Connection structure of wiring bodies, wiring body, electronic apparatus, and manufacturing method of electronic apparatus | |
| US8363179B2 (en) | Liquid crystal display device | |
| US20080265781A1 (en) | Light source module | |
| US20160349436A1 (en) | Light source modules and the backlight modules with the light source module | |
| KR102127341B1 (en) | Printed circuit board | |
| US20150167951A1 (en) | Electronic Device With Light-Emitting Diode Array | |
| TW200720753A (en) | Anisotropic conductive film and flat panel display using the same, and method for manufacturing the same | |
| KR20130053873A (en) | Printed circuit board for backlight unit and manufacturing method therefor | |
| JP2015133189A (en) | Backlight and display device including the same | |
| CN103925518A (en) | Backlight module and liquid crystal display device |