CN204989701U - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- CN204989701U CN204989701U CN201520565851.0U CN201520565851U CN204989701U CN 204989701 U CN204989701 U CN 204989701U CN 201520565851 U CN201520565851 U CN 201520565851U CN 204989701 U CN204989701 U CN 204989701U
- Authority
- CN
- China
- Prior art keywords
- backlight module
- guide plate
- light guide
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a backlight module, include: glue the frame, install reflection of light piece in gluing the frame, locate reflection of light piece top the light guide plate, locate the optics diaphragm group of light guide plate top and locate light guide plate one side and light guide plate complex backlight subassembly, the backlight subassembly includes: flexible line way board, the double faced adhesive tape of locating the LED lamp on the board of flexible line way and laminating flexible line way board and light guide plate mutually, be equipped with a plurality of through -holes on the board of flexible line way between the two adjacent LED lamps. The utility model discloses a be equipped with the through -hole between the LED lamp on the board of flexible line way, go out the heat transfer that the LED lamp produced fast through the through -hole, the surface coating of flexible line way board has the heat conduction material to and backboard face laminating in flexible line way has a heat dissipating pad, through through -hole and heat conduction material fast with heat transfer to heat dissipating pad, and distribute away the heat through heat dissipating pad, reduced backlight module's temperature effectively, make hi -lite backlight and cell -phone large screen enable.
Description
Technical field
The utility model relates to technical field of liquid crystal display, particularly relates to a kind of backlight module.
Background technology
Along with the development of liquid crystal display industry, liquid crystal display, liquid crystal display module are used widely in mobile phone products.But because liquid crystal itself is not luminous, see the splendid colorful picture that LCDs presents to allow user, LCDs generally all must and light source with the use of.Due to the characteristic of liquid crystal, this light source is generally placed in the back of LCDs, is referred to as backlight module in industry.The Main Function of LCD backlight module is to provide a planar light source that is uniform, stable, that have certain brightness, the core light source of its internal light source is generally light emitting diode (LED), and the uneven pointolite sent by LED light source through light guide plate and diffusion sheet is converted to uniform area source.
Refer to Fig. 1, the LED light source in the backlight module of existing mobile phone is all by FPC(flexible PCB) 100 to form with multiple LED 200, bondd by double faced adhesive tape 300 afterwards fixing.The position of the corresponding multiple LED 200 of this double faced adhesive tape 300 is provided with perforate 400, and as shown in Figure 2, when laminating, LED 200 is placed in those perforates 400, to reach best laminating.And the design that FPC is general is outermost material is PI(polyimide) film, fundamental purpose is insulation, but this can cause the phenomenon of thermal resistance.In addition, screen along with mobile phone is increasing and in order to product effect, the brightness of required backlight is also more and more higher, and the means improving back light source brightness improve rated current, backlight module is so just easily caused to produce high temperature, easily cause temperature ramps to 55-58 degree, cause end prod to design further.
Therefore, prior art existing defects, needs to improve.
Utility model content
The purpose of this utility model overcomes the deficiencies in the prior art, provides a kind of backlight module.
The technical solution of the utility model is as follows: the utility model provides a kind of backlight module, comprise: glue frame, the reflecting piece be installed in described glue frame, be located at light guide plate above described reflecting piece, be located at the optical diaphragm group above described light guide plate and be located at the backlight assembly that described light guide plate side coordinates with described light guide plate, described backlight assembly comprises: flexible circuit board, the double faced adhesive tape be located at the LED in described flexible circuit board and described flexible circuit board and light guide plate fitted, described flexible circuit board is provided with some through holes between adjacent two LED.
Described flexible circuit board surface is coated with Heat Conduction Material.
Described optical diaphragm group comprises: the upper brightening piece be located at the diffusion sheet above described light guide plate, be located at the lower brightening piece above described diffusion sheet and be located at above described lower brightening piece.
The quantity of the through hole that described flexible circuit board is provided with between adjacent two LED is 6, and described 6 through holes are 3 × 2 distributions.
Described through hole is pad hole.
Described backlight module also comprises a cooling pad, and described cooling pad is affixed on the back side of described flexible circuit board.
Described cooling pad is in " mouth " font, described cooling pad comprises: the first transverse part, the second transverse part, one end are connected with described first transverse part one end and the first vertical part of being connected with described second transverse part one end of the other end and one end are connected with the described first transverse part other end and the second vertical part of being connected with the described second transverse part other end of the other end, and described first transverse part aligns with described flexible circuit board.
Described cooling pad is a graphite flake.
Described double faced adhesive tape is pectination, and described double faced adhesive tape comprises: comb body portion and the some comb be located in described comb body portion.
Described some comb equidistantly distribute.
Adopting such scheme, backlight module of the present utility model, by being provided with through hole between LED in flexible circuit board, fast the heat that LED produces being passed by through hole; Further, the surface of flexible circuit board is coated with Heat Conduction Material, and flexible circuitry back is fitted with cooling pad, fast heat is passed to cooling pad by through hole and Heat Conduction Material, and by cooling pad, heat is distributed, significantly reduce the temperature of backlight module, make high brightness backlights source and mobile phone giant-screen change into as possibility; In addition, double sided adhesive tape structure carries out clearance position design, in pectination, reduces thickness increase and sticks area, and allows luminous energy try one's best importing light guide plate, is conducive to promoting backlight module brightness, reduces the waste of thickness.
Accompanying drawing explanation
Fig. 1 is the structural representation of flexible circuit board and LED in prior art.
Fig. 2 is the structural representation of double faced adhesive tape in prior art.
Fig. 3 is the structural representation of the utility model backlight module.
Fig. 4 is the structural representation of flexible circuit board and LED in the utility model.
Fig. 5 is the enlarged diagram at A place in Fig. 4.
Fig. 6 is the structural representation of double faced adhesive tape in the utility model.
Fig. 7 is the structural representation of cooling pad in the utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Refer to Fig. 3 to Fig. 5, the utility model provides a kind of backlight module, can be distributed by heat fast, efficiently solves the conduction of heat and the problem of heat radiation in the backlight module of prior art.It specifically comprises: glue frame 2, the reflecting piece be installed in described glue frame 2, be located at light guide plate above described reflecting piece, be located at the optical diaphragm group 4 above described light guide plate and be located at the backlight assembly 6 that described light guide plate side coordinates with described light guide plate, and described optical diaphragm group 4 comprises: the upper brightening piece be located at the diffusion sheet above described light guide plate, be located at the lower brightening piece above described diffusion sheet and be located at above described lower brightening piece.Described backlight assembly 6 comprises: flexible circuit board 62, the double faced adhesive tape 66 be located at the LED 64 in described flexible circuit board 62 and described flexible circuit board 62 fitted with light guide plate, described flexible circuit board 62 is provided with some through holes 68 between adjacent two LED 64, fast the heat that LED 64 produces is passed by this some through hole 68.
In the present embodiment, described through hole 68 can be pad hole, like this, this some through hole 68 just can with flexible circuit board 62 on be used for the pad hole of welding lead specially and formed simultaneously, without the need to processing separately in addition again, manufacture craft is simple, is conducive to the management and control of cost.
In the present embodiment, the quantity of the through hole 68 that described flexible circuit board 62 is provided with between adjacent two LED 64 is 6, and preferably, described 6 through holes 68 are in 3 × 2 distributions.
Should be noted that: described backlight module also comprises a cooling pad 8, described cooling pad 8 is affixed on the back side of described flexible circuit board 62, and LED 64 is welded in the front of described flexible circuit board 62.The heat that LED 64 sends is passed on cooling pad 8 through this some through hole 68, utilizes this cooling pad 8 to be gone out by heat Quick diffusing, significantly reduces the temperature of backlight module, and high brightness backlights source and mobile phone giant-screen are changed into as possibility.
Should be noted that: in the present embodiment, described cooling pad 8 is preferably " mouth " font, as shown in Figure 7.Concrete, described cooling pad 8 comprises: the first transverse part 82, second transverse part 84, one end are connected with described first transverse part 82 one end and the first vertical part 86 of being connected with described second transverse part 84 one end of the other end and one end are connected with described first transverse part 82 other end and the second vertical part 88 of being connected with described second transverse part 84 other end of the other end, described first transverse part 82 aligns with described flexible circuit board 62, that is to say cooling pad 8 to only have the first transverse part 82 fit with flexible circuit board 62.Should further illustrate: in the present embodiment, described cooling pad 8 is a graphite flake.
Further, refer to Fig. 6, described double faced adhesive tape 66 is in pectination, and described double faced adhesive tape 66 comprises: comb body portion 63 and the some comb 65 be located in described comb body portion 63.The utility model adopts double faced adhesive tape to carry out clearance position design, in pectination, reduces thickness increase and sticks area, and allows luminous energy try one's best importing light guide plate, is conducive to promoting backlight module brightness, reduces the waste of thickness.Preferably, described some comb 65 equidistantly distribute.
As alternative, in order to promote the heat-transfer rate of this backlight module further, described flexible circuit board surface can be coated with Heat Conduction Material.Coordinated with through hole by Heat Conduction Material, heat transmission speed can promote further, ensures that the heat that LED produces passes fast.
In sum, the utility model provides a kind of backlight module, by being provided with through hole between LED in flexible circuit board, is passed by the heat that LED produces fast by through hole; Further, the surface of flexible circuit board is coated with Heat Conduction Material, and flexible circuitry back is fitted with cooling pad, fast heat is passed to cooling pad by through hole and Heat Conduction Material, and by cooling pad, heat is distributed, significantly reduce the temperature of backlight module, make high brightness backlights source and mobile phone giant-screen change into as possibility; In addition, double sided adhesive tape structure carries out clearance position design, in pectination, reduces thickness increase and sticks area, and allows luminous energy try one's best importing light guide plate, is conducive to promoting backlight module brightness, reduces the waste of thickness.
These are only preferred embodiment of the present utility model, be not limited to the utility model, all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection domain of the present utility model.
Claims (10)
1. a backlight module, it is characterized in that, comprise: glue frame, the reflecting piece be installed in described glue frame, be located at light guide plate above described reflecting piece, be located at the optical diaphragm group above described light guide plate and be located at the backlight assembly that described light guide plate side coordinates with described light guide plate, described backlight assembly comprises: flexible circuit board, the double faced adhesive tape be located at the LED in described flexible circuit board and described flexible circuit board and light guide plate fitted, described flexible circuit board is provided with some through holes between adjacent two LED.
2. backlight module according to claim 1, is characterized in that, described flexible circuit board surface is coated with Heat Conduction Material.
3. backlight module according to claim 1, is characterized in that, described optical diaphragm group comprises: the upper brightening piece be located at the diffusion sheet above described light guide plate, be located at the lower brightening piece above described diffusion sheet and be located at above described lower brightening piece.
4. backlight module according to claim 1, is characterized in that, the quantity of the through hole that described flexible circuit board is provided with between adjacent two LED is 6, and described 6 through holes are 3 × 2 distributions.
5. backlight module according to claim 1, is characterized in that, described through hole is pad hole.
6. the backlight module according to any one of claim 1 to 5, is characterized in that, also comprises a cooling pad, and described cooling pad is affixed on the back side of described flexible circuit board.
7. backlight module according to claim 6, it is characterized in that, described cooling pad is in " mouth " font, described cooling pad comprises: the first transverse part, the second transverse part, one end are connected with described first transverse part one end and the first vertical part of being connected with described second transverse part one end of the other end and one end are connected with the described first transverse part other end and the second vertical part of being connected with the described second transverse part other end of the other end, and described first transverse part aligns with described flexible circuit board.
8. backlight module according to claim 6, is characterized in that, described cooling pad is a graphite flake.
9. the backlight module according to any one of claim 1 to 5, is characterized in that, described double faced adhesive tape is pectination, and described double faced adhesive tape comprises: comb body portion and the some comb be located in described comb body portion.
10. backlight module according to claim 9, is characterized in that, described some comb equidistantly distribute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520565851.0U CN204989701U (en) | 2015-07-31 | 2015-07-31 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520565851.0U CN204989701U (en) | 2015-07-31 | 2015-07-31 | Backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204989701U true CN204989701U (en) | 2016-01-20 |
Family
ID=55124054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520565851.0U Expired - Fee Related CN204989701U (en) | 2015-07-31 | 2015-07-31 | Backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204989701U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105068311A (en) * | 2015-07-31 | 2015-11-18 | 深圳科利盟电子有限公司 | Backlight module group |
-
2015
- 2015-07-31 CN CN201520565851.0U patent/CN204989701U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105068311A (en) * | 2015-07-31 | 2015-11-18 | 深圳科利盟电子有限公司 | Backlight module group |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171208 Address after: Guangdong province Dongguan City Chashan town 523000 Zengbu village Dongcheng Huimei Technology Park A Building 2 floor C-2 Patentee after: Dongguan East power fly Electronics Co. Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Shiyan street community. The new stone Acer Jia Terry hi tech Park original Hong Long High-tech Industrial Park No. 4 Building 4 building four floor West Patentee before: SHENZHEN KELIMENG ELECTRONICS CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160120 Termination date: 20190731 |