CN1077733C - 带过热保护器的半导体集成电路器件和保护方法 - Google Patents
带过热保护器的半导体集成电路器件和保护方法 Download PDFInfo
- Publication number
- CN1077733C CN1077733C CN97117965A CN97117965A CN1077733C CN 1077733 C CN1077733 C CN 1077733C CN 97117965 A CN97117965 A CN 97117965A CN 97117965 A CN97117965 A CN 97117965A CN 1077733 C CN1077733 C CN 1077733C
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- semiconductor integrated
- temperature
- threshold value
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
- H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP196306/1996 | 1996-07-25 | ||
JP19630696 | 1996-07-25 | ||
JP196306/96 | 1996-07-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1178406A CN1178406A (zh) | 1998-04-08 |
CN1077733C true CN1077733C (zh) | 2002-01-09 |
Family
ID=16355622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97117965A Expired - Fee Related CN1077733C (zh) | 1996-07-25 | 1997-07-25 | 带过热保护器的半导体集成电路器件和保护方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5870267A (zh) |
EP (1) | EP0821459B1 (zh) |
CN (1) | CN1077733C (zh) |
DE (1) | DE69712274T2 (zh) |
TW (1) | TW345732B (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7216064B1 (en) * | 1993-09-21 | 2007-05-08 | Intel Corporation | Method and apparatus for programmable thermal sensor for an integrated circuit |
DE19942430A1 (de) | 1999-09-06 | 2001-03-08 | Sperling Axel | Betriebsumgebungs-Kontrolleinrichtung für Computer mit Bauelementen-spezifischer Überwachung und Ansteuerung |
US6198245B1 (en) * | 1999-09-20 | 2001-03-06 | O2 Micro International Ltd. | Look-ahead closed-loop thermal management |
JP4039163B2 (ja) | 2002-08-01 | 2008-01-30 | ソニー株式会社 | マルチチップモジュール、マルチチップモジュールのシャットダウン方法 |
KR100935574B1 (ko) * | 2002-11-04 | 2010-01-07 | 삼성전자주식회사 | Cpu 과열방지시스템 |
ATE504446T1 (de) * | 2002-12-02 | 2011-04-15 | Silverbrook Res Pty Ltd | Totdüsenausgleich |
CN100446374C (zh) * | 2003-07-05 | 2008-12-24 | 华为技术有限公司 | 一种过热保护方法 |
JP4052221B2 (ja) * | 2003-10-09 | 2008-02-27 | 株式会社デンソー | 冷却システム |
DE60315047D1 (de) * | 2003-12-19 | 2007-08-30 | Sgs Thomson Microelectronics | Halbleiterschaltung zur Begrenzung von Datenzugang |
JP2005190091A (ja) * | 2003-12-25 | 2005-07-14 | Matsushita Electric Ind Co Ltd | 冷却装置およびこれを備えた電子機器 |
JP2006140192A (ja) * | 2004-11-10 | 2006-06-01 | Matsushita Electric Ind Co Ltd | 電子回路装置 |
JP2007082365A (ja) * | 2005-09-16 | 2007-03-29 | Rohm Co Ltd | 温度保護回路、電源装置、電子機器 |
US20090061987A1 (en) * | 2006-03-14 | 2009-03-05 | Wms Gaming Inc | Thermal management in a wagering game machine |
US20080091974A1 (en) * | 2006-10-11 | 2008-04-17 | Denso Corporation | Device for controlling a multi-core CPU for mobile body, and operating system for the same |
WO2008057400A2 (en) * | 2006-11-02 | 2008-05-15 | Wms Gaming Inc. | Wagering game machine fan control and monitoring |
WO2008060444A2 (en) * | 2006-11-09 | 2008-05-22 | Wms Gaming Inc. | Gaming apparatus with cooling of certain components |
US8192287B2 (en) * | 2006-11-17 | 2012-06-05 | Nintendo Co., Ltd. | Game apparatus and storage medium storing a game program for conducting data communications with a network |
JP4825789B2 (ja) * | 2007-12-27 | 2011-11-30 | 株式会社東芝 | 情報処理装置及び不揮発性半導体メモリドライブ |
WO2011031175A1 (en) * | 2009-09-14 | 2011-03-17 | Akademia Gorniczo-Hutnicza Im. Stanislawa Staszica | Method of power control in microprocessor structures and a power control system in microprocessor structures |
CN102025533B (zh) * | 2010-11-04 | 2015-11-25 | 华为终端有限公司 | 一种主控单元、网络处理单元、过热保护系统和方法 |
JP2013044066A (ja) * | 2011-08-24 | 2013-03-04 | Murata Mach Ltd | 繊維機械及び繊維機械の情報伝達システム |
US9621330B2 (en) * | 2011-11-30 | 2017-04-11 | Maxlinear Asia Singapore Private Limited | Split microwave backhaul transceiver architecture with coaxial interconnect |
CN103543765B (zh) * | 2012-07-13 | 2017-02-08 | 中兴通讯股份有限公司 | 一种以太网供电系统温度控制方法与装置 |
US9098280B2 (en) * | 2012-12-28 | 2015-08-04 | Intel Corporation | Staged power distribution control |
US9992916B2 (en) | 2014-01-21 | 2018-06-05 | Stmicroelectronics S.R.L. | Thermal control process for a multi-junction electronic power device and corresponding electronic power device |
CN108557096A (zh) * | 2018-05-15 | 2018-09-21 | 陈永兵 | 一种采用有机电致发光器件的无人机雷达 |
US10853547B2 (en) * | 2018-10-26 | 2020-12-01 | Dell Products, L.P. | System and method to identify critical FPGA card sensors |
CN109556747A (zh) * | 2018-12-14 | 2019-04-02 | 广东浪潮大数据研究有限公司 | 一种温度感测装置及设备 |
TWI722741B (zh) * | 2019-11-21 | 2021-03-21 | 新唐科技股份有限公司 | 單晶片之內建溫度偵測裝置及其保護方法 |
CN111883516A (zh) * | 2020-07-24 | 2020-11-03 | 青岛歌尔智能传感器有限公司 | 集成模组的封装结构及其封装方法、以及电子设备 |
US11450585B2 (en) * | 2020-11-02 | 2022-09-20 | Innogrit Technologies Co., Ltd. | On-die thermal management for VLSI applications |
DE102023001336A1 (de) | 2022-04-19 | 2023-10-19 | Sew-Eurodrive Gmbh & Co Kg | Verfahren zum Betrieb einer Schaltungseinheit und Schaltungseinheit |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5451892A (en) * | 1994-10-03 | 1995-09-19 | Advanced Micro Devices | Clock control technique and system for a microprocessor including a thermal sensor |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05503181A (ja) * | 1990-11-26 | 1993-05-27 | アダプティブ・ソリューションズ・インコーポレーテッド | 集積回路のための温度感知制御システム及び方法 |
EP0651314A1 (en) * | 1993-10-27 | 1995-05-03 | International Business Machines Corporation | An apparatus and method for thermally protecting a processing device |
DE9401645U1 (de) * | 1994-02-01 | 1994-06-30 | Siemens AG, 80333 München | Rechner |
US5483102A (en) * | 1994-05-12 | 1996-01-09 | Intel Corporation | Employing on die temperature sensors and fan-heatsink failure signals to control power dissipation |
-
1997
- 1997-07-23 US US08/899,034 patent/US5870267A/en not_active Expired - Lifetime
- 1997-07-24 TW TW086110552A patent/TW345732B/zh active
- 1997-07-25 EP EP97112862A patent/EP0821459B1/en not_active Expired - Lifetime
- 1997-07-25 CN CN97117965A patent/CN1077733C/zh not_active Expired - Fee Related
- 1997-07-25 DE DE69712274T patent/DE69712274T2/de not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5451892A (en) * | 1994-10-03 | 1995-09-19 | Advanced Micro Devices | Clock control technique and system for a microprocessor including a thermal sensor |
Also Published As
Publication number | Publication date |
---|---|
CN1178406A (zh) | 1998-04-08 |
DE69712274D1 (de) | 2002-06-06 |
TW345732B (en) | 1998-11-21 |
EP0821459A3 (en) | 1999-01-27 |
EP0821459A2 (en) | 1998-01-28 |
US5870267A (en) | 1999-02-09 |
DE69712274T2 (de) | 2003-09-11 |
EP0821459B1 (en) | 2002-05-02 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Tokyo, Japan Patentee after: Konami Co.,Ltd. Address before: Hyogo Patentee before: Konami Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20081212 Address after: Tokyo, Japan Patentee after: KONAMI DIGITAL ENTERTAINMENT Co.,Ltd. Address before: Tokyo, Japan Patentee before: Konami Co.,Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: KONAMI DIGITAL ENTERTAIMENT CO., LTD. Free format text: FORMER OWNER: KONAMI CO., LTD. Effective date: 20081212 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20020109 Termination date: 20150725 |
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EXPY | Termination of patent right or utility model |