CN107771112B - 具有集成的光束位置传感器的扫描头以及用于离线校准的校准装置 - Google Patents

具有集成的光束位置传感器的扫描头以及用于离线校准的校准装置 Download PDF

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Publication number
CN107771112B
CN107771112B CN201680036408.1A CN201680036408A CN107771112B CN 107771112 B CN107771112 B CN 107771112B CN 201680036408 A CN201680036408 A CN 201680036408A CN 107771112 B CN107771112 B CN 107771112B
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China
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laser beam
calibration
calibration device
beam position
laser
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CN201680036408.1A
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English (en)
Chinese (zh)
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CN107771112A (zh
Inventor
C·松纳
M·拉伯
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Scanlab GmbH
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Scanlab GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201680036408.1A 2015-06-22 2016-06-03 具有集成的光束位置传感器的扫描头以及用于离线校准的校准装置 Active CN107771112B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015109984.5 2015-06-22
DE102015109984.5A DE102015109984A1 (de) 2015-06-22 2015-06-22 Scannerkopf mit integriertem Strahllagesensor sowie Justageanordnung zur Offline-Justage
PCT/EP2016/062577 WO2016206943A1 (de) 2015-06-22 2016-06-03 Scannerkopf mit integriertem strahllagesensor sowie justageanordnung zur offline-justage

Publications (2)

Publication Number Publication Date
CN107771112A CN107771112A (zh) 2018-03-06
CN107771112B true CN107771112B (zh) 2020-06-05

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CN201680036408.1A Active CN107771112B (zh) 2015-06-22 2016-06-03 具有集成的光束位置传感器的扫描头以及用于离线校准的校准装置

Country Status (7)

Country Link
US (1) US10773339B2 (https=)
EP (1) EP3310519B1 (https=)
JP (1) JP6821606B2 (https=)
KR (1) KR20180020207A (https=)
CN (1) CN107771112B (https=)
DE (1) DE102015109984A1 (https=)
WO (1) WO2016206943A1 (https=)

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JP6487413B2 (ja) * 2016-12-22 2019-03-20 ファナック株式会社 レーザ加工用ヘッドおよびそれを備えたレーザ加工システム
DE102017125120A1 (de) * 2017-10-26 2019-05-02 Scanlab Gmbh Steuerungsverfahren zur Bewegungsführung eines Laserstrahls mit Interpolation der Fokuslage und/oder Strahlrichtung
US10705327B2 (en) 2018-01-02 2020-07-07 Industrial Technology Research Institute Light emitting method and light emitting device
DE102018105877B3 (de) * 2018-03-14 2019-02-28 Precitec Gmbh & Co. Kg Vorrichtung für die Bestimmung einer Ausrichtung einer optischen Vorrichtung eines Kohärenztomographen, Kohärenztomograph und Laserbearbeitungssystem
KR102106068B1 (ko) * 2018-05-09 2020-05-04 (주)엔피에스 레이저 장치
BE1026484B1 (fr) * 2018-07-24 2020-02-25 Laser Eng Applications Méthode et dispositif optique pour fournir deux faisceaux laser décalés
JP2021533996A (ja) * 2018-08-09 2021-12-09 コーニング インコーポレイテッド レーザービームの機械内プロファイリングのためのシステム、方法および装置
DE102018219129B3 (de) 2018-11-09 2019-11-07 Trumpf Laser Gmbh Verfahren und Computerprogrammprodukt zur OCT-Messstrahljustierung
CN109483047B (zh) * 2018-11-15 2019-12-31 中国科学院西安光学精密机械研究所 一种激光光束终端指向检测与校正方法及激光加工装置
US11273520B2 (en) 2019-01-31 2022-03-15 General Electric Company System and method for automated laser ablation
DE102019115554A1 (de) * 2019-06-07 2020-12-10 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks
US11305377B2 (en) * 2019-12-23 2022-04-19 Precitec Gmbh & Co. Kg Add-on module for interposing between a control device and a laser machining head of a laser machining system
WO2021220477A1 (ja) 2020-04-30 2021-11-04 株式会社ニコン 加工システム
ES2912564T3 (es) * 2020-05-08 2022-05-26 Jeanologia Sl Dispositivo y procedimiento para el tratamiento de pantalones por láser que comprende dos pantaloneras
JPWO2022038682A1 (https=) 2020-08-18 2022-02-24
DE102020122319B4 (de) * 2020-08-26 2023-12-14 Jenoptik Optical Systems Gmbh Verfahren und Steuergerät zur Kalibrierung einer Laser-Scanner-Vorrichtung zur Materialbearbeitung sowie Computerprogramm und maschinenlesbares Speichermedium
JP2022065693A (ja) * 2020-10-16 2022-04-28 国立大学法人信州大学 光学ユニット、並びにレーザー加工装置、レーザー加工方法、及び三次元加工装置
JP7240774B2 (ja) * 2020-10-16 2023-03-16 国立大学法人信州大学 光学ユニット及びレーザー加工装置
DE102020214566B4 (de) 2020-11-19 2023-08-03 Robert Bosch Gesellschaft mit beschränkter Haftung Bestimmungsvorrichtung zur Bestimmung der Lage und Richtung eines Laserstrahls und System und Verfahren zum Einstellen der Lage und Richtung eines Laserstrahls
CN112846485B (zh) * 2020-12-31 2022-11-04 武汉华工激光工程有限责任公司 激光加工的监测方法、装置及激光加工设备
IL312370A (en) * 2021-10-25 2025-01-01 Trumpf Lasersystems Semiconductor Mfg Gmbh Deep ultraviolet light source if beam positioning device
JP7793339B2 (ja) * 2021-11-01 2026-01-05 キヤノン株式会社 検出装置、補正装置、加工装置、および、物品の製造方法
DE102021130944A1 (de) 2021-11-25 2023-05-25 Jenoptik Optical Systems Gmbh Vorrichtung und Verfahren zum Bestimmen eines Strahlverlaufs eines Strahls und Laseranlage
KR102728044B1 (ko) * 2022-07-18 2024-11-08 (주)알엔알랩 기판 처리 장치 및 방법
CN119115265B (zh) * 2024-11-14 2025-01-24 西南交通大学 一种激光切割材料板的方法
CN119566543A (zh) * 2024-12-20 2025-03-07 中国科学院西安光学精密机械研究所 一种用于复杂结构的激光三维体制造装置及方法

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JPH10137962A (ja) * 1996-11-07 1998-05-26 Matsushita Electric Ind Co Ltd レーザ光学系
DE10335501B4 (de) * 2002-07-31 2005-01-27 Kuka Schweissanlagen Gmbh Verfahren und Vorrichtung zum Schweißen oder Schneiden mit Laserstrahl
DE102010005896A1 (de) * 2010-01-27 2010-10-14 Daimler Ag Laserschweißroboter und -verfahren sowie damit hergestelltes Bauteil

Also Published As

Publication number Publication date
DE102015109984A1 (de) 2016-12-22
JP6821606B2 (ja) 2021-01-27
US20180169788A1 (en) 2018-06-21
US10773339B2 (en) 2020-09-15
WO2016206943A1 (de) 2016-12-29
EP3310519A1 (de) 2018-04-25
KR20180020207A (ko) 2018-02-27
EP3310519B1 (de) 2019-11-13
JP2018525227A (ja) 2018-09-06
CN107771112A (zh) 2018-03-06

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