CN107731987A - Expand brilliant machine - Google Patents

Expand brilliant machine Download PDF

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Publication number
CN107731987A
CN107731987A CN201711145160.5A CN201711145160A CN107731987A CN 107731987 A CN107731987 A CN 107731987A CN 201711145160 A CN201711145160 A CN 201711145160A CN 107731987 A CN107731987 A CN 107731987A
Authority
CN
China
Prior art keywords
brilliant
lower platen
pedestal
disk
top board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201711145160.5A
Other languages
Chinese (zh)
Inventor
吴雪光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGMEN PENGJIANG AREA JINGHUI ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd
Original Assignee
JIANGMEN PENGJIANG AREA JINGHUI ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGMEN PENGJIANG AREA JINGHUI ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd filed Critical JIANGMEN PENGJIANG AREA JINGHUI ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd
Priority to CN201711145160.5A priority Critical patent/CN107731987A/en
Publication of CN107731987A publication Critical patent/CN107731987A/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses expand brilliant machine, including pedestal, interior trim ring, outer trim ring and position-limit mechanism, the upper end of pedestal is provided with lower platen, the edge of lower platen is hinged with top board, retaining mechanism is provided between lower platen and top board, circular hole is correspondingly arranged in the middle part of top board and lower platen, the brilliant disk of circle expansion that may pass through circular hole is provided with pedestal, the lower surface for expanding brilliant disk is connected with cylinder and drives its up and down motion by cylinder, expand brilliant disk and be internally provided with heater, the edge for expanding brilliant disk upper surface is surrounded with ladder, the inner ring of interior trim ring is engaged with ladder, the inner ring of outer trim ring is engaged with the outer ring of interior trim ring, position-limit mechanism includes the support bar being vertically arranged on pedestal, and the horizontal limiting plate for being rotatably provided in supporting bar top.The expansion crystalline substance machine of the present invention, there is the advantages that simple in construction, can be precisely controlled chip expansion degree.

Description

Expand brilliant machine
Technical field
The present invention relates to a kind of LED production fields, more particularly to a kind of brilliant machine of expansion.
Background technology
In the prior art, in the production process of LED wafer, the detection of LED grain with sorting be together with it is highly important Process, for ease of the detection and sorting to LED grain, it is necessary to the carrier of LED wafer --- wafer film is expanded so that The crystal grain uniform expansion of well cutting in wafer film is attached to, LED, which expands brilliant machine, should need and give birth to.
Wafer expanding device is the part that composition expands brilliant machine, and existing wafer expanding device includes upper pressuring diaphragm, pushes diaphragm plate, circle Expand brilliant disk and gland, wherein upper mould plate has mutual corresponding circular window with pushing diaphragm plate.When expanding brilliant, filled by driving Put the brilliant disk of driving expansion to move upwards, so as to stretch wafer film so that the chip expansion in wafer film, drive device generally use gas Cylinder, and manually control button carries out the movement travel regulation to cylinder, when this to expand brilliant every time, the movement travel of cylinder Can not be consistent so that the degree of chip expansion is inconsistent, so as to the detection to crystal grain and sorting cause it is certain Influence.
The content of the invention
Present invention seek to address that above-mentioned mentioned technical problem, there is provided it is a kind of simple in construction, chip can be precisely controlled The expansion crystalline substance machine of degrees of expansion.
The present invention is realized by following technical scheme:Expand brilliant machine, including pedestal, interior trim ring, outer trim ring and spacing Mechanism, the upper end of pedestal are provided with lower platen, and the edge of lower platen is hinged with top board, is provided between lower platen and top board Circular hole is correspondingly arranged in the middle part of retaining mechanism, top board and lower platen, the circular expansion crystalline substance that may pass through circular hole is provided with pedestal Disk, the lower surface for expanding brilliant disk are connected with cylinder and drive its up and down motion by cylinder, expand brilliant disk and be internally provided with heater, The edge for expanding brilliant disk upper surface is surrounded with ladder, and the inner ring of interior trim ring is engaged with ladder, the inner ring and internal pressure of outer trim ring The outer ring of circle is engaged, and position-limit mechanism includes the support bar being vertically arranged on pedestal, and level is rotatably provided in support The limiting plate on bar top.
Preferably, the edge of the ladder is provided with rounding.
Preferably, the pedestal is fixedly connected with lower platen by connecting pole.
Preferably, the lower platen is square setting, and connecting pole is provided with four, respectively with four of lower platen lower surface Diagonal angle is fixedly connected.
Preferably, the support bar is the telescopically adjustable body of rod.
Preferably, described expand in the middle part of brilliant disk lower surface is provided with boss, and threaded connection hole, cylinder are provided with the middle part of boss The piston rod being slidably matched including cylinder body and with cylinder body, piston rod is provided with one end that the brilliant disk of expansion is connected and threaded connection hole The threaded joints of cooperation.
Preferably, it is tiltedly installed with the pedestal and spacing support column is supported to top board.
Preferably, expansion brilliant disk, top board and the lower platen are that stainless steel is made.
Beneficial effect is:Compared with prior art, expansion crystalline substance machine of the invention is entered wafer film by top board and lower platen After row is fixed, rotary spacing plate to the surface for expanding brilliant disk, when the brilliant disk of expansion, which moves up to, to be contacted with limiting plate, it is brilliant to stop expansion The motion of disk, so that when expanding brilliant disk and expand brilliant operation, it can be ensured that it is identical to the level of stretch of wafer film every time, so as to Ensure that the degree of chip expansion is consistent, and limiting plate can turn to the sidepiece for expanding brilliant disk after the completion of positioning, so that will not Influence the clamping of wafer film in the brilliant operation of expansion next time.
Brief description of the drawings
The embodiment of the present invention is described in further detail below in conjunction with accompanying drawing, wherein:
Fig. 1 is the structural representation of the brilliant machine of expansion of the present invention.
Embodiment
As shown in figure 1, expand brilliant machine, including pedestal 1, interior trim ring 2, outer trim ring 3 and position-limit mechanism 4, the upper end of pedestal 1 are set There is lower platen 5, the edge of lower platen 5 is hinged with top board 6, retaining mechanism, upper pressure are provided between lower platen 5 and top board 6 The middle part of plate 6 and lower platen 5 is correspondingly arranged on circular hole 7, and the brilliant disk 8 of circle expansion that may pass through circular hole 7 is provided with pedestal 1, is expanded brilliant The lower surface of disk 8 is connected with cylinder 9 and drives its up and down motion by cylinder 9, expands brilliant disk 8 and is internally provided with heater, expands The edge of the brilliant upper surface of disk 8 is surrounded with ladder 10, and the inner ring of interior trim ring 2 is engaged with ladder 10, the inner ring of outer trim ring 3 with The outer ring of interior trim ring 2 is engaged, and position-limit mechanism 4 includes the support bar 11 being vertically arranged on pedestal 1, and level is rotatably set Put the limiting plate 12 on the top of support bar 11.When in use, first interior trim ring 2 is preset in and expanded on the ladder 10 of brilliant disk 8, driving is expanded Brilliant disk 8 is moved in the circular hole 7 of lower platen 5, and then wafer film is laid on lower platen 5, and the upper surface for now expanding brilliant disk 8 can To be played a supporting role to wafer film, so that wafer film is more smooth in laying, after laying, by top board 6 with pushing Plate 5 is covered and locked, and so as to realize that the clamping of wafer film is fixed, then rotary spacing plate 12 works as gas to the surface for expanding brilliant disk 8 The driving of cylinder 9 is expanded brilliant disk 8 and moved up to when being contacted with limiting plate 12, and control cylinder 9 makes the stop motion of expansion crystalline substance disk 8, so that When expanding brilliant disk 8 and expand brilliant operation, it can be ensured that it is identical to the level of stretch of wafer film every time, so as to ensure the journey of chip expansion Degree is consistent, and limiting plate 12 can turn to the sidepiece for expanding brilliant disk 8 after the completion of positioning, is then sleeved on outer trim ring 3 interior On trim ring 2, finally wafer film is cut from the edge of outer trim ring 3 with cutter, you can remove the unnecessary edge of wafer film, Ran Houzai The clamping of wafer film next time is carried out, limiting plate 12 can carry out 360 degree of rotations, the operation of worker will not be caused to stop.
The edge of ladder 10 can be provided with rounding 13, can so prevent that wafer film is caused to damage.
Pedestal 1 can be fixedly connected with lower platen 5 by connecting pole 14.Further, lower platen 5 can be square and set Put, connecting pole 14 is provided with four, is fixedly connected respectively with four diagonal angles of the lower surface of lower platen 5, under can so causing The installation of pressing plate 5 is more stable, and is configured to install the gap of cylinder 9, installation between lower platen 5 and pedestal 1 Structure setting is more reasonable, compact-sized.
Support bar 11 can be the telescopically adjustable body of rod, can so adjust the height of the setting of limiting plate 12, realization pair Expand the spacing of the brilliant different height of disk 8, so as to realize to the different processing for expanding brilliant degree of wafer film.
Boss 15 can be provided with by expanding the middle part of the brilliant lower surface of disk 8, and the middle part of boss 15 is provided with threaded connection hole, cylinder 9 The piston rod being slidably matched including cylinder body and with cylinder body, piston rod are provided with being threadedly coupled with expanding one end that brilliant disk 8 is connected The threaded joints that hole coordinates, by the way of threaded connection so that the dismounting for expanding brilliant disk 8 is more convenient.
It can be tiltedly installed with pedestal 1 and spacing support column 16 is supported to top board 6, the setting of support column 16 can With cause top board 6 open when, play a part of support to top board 6, and top board 6 is played it is spacing, prevent top board 6 after It is continuous to be rotated around pin joint.
It can be that stainless steel is made to expand brilliant disk 8, top board 6 and lower platen 5, can so avoid corroding, so as to Its service life is improved, and using brilliant disk 8 is expanded made of stainless steel, heat conduction efficiency can be improved.
The above embodiments are merely illustrative of the technical solutions of the present invention and is not limited, all without departing from the present invention Any modification of spirit and scope or equivalent substitution, it all should cover in the range of technical solution of the present invention.

Claims (8)

1. expand brilliant machine, it is characterised in that including pedestal (1), interior trim ring (2), outer trim ring (3) and position-limit mechanism (4), pedestal (1) Upper end be provided with lower platen (5), the edge of lower platen (5) is hinged with top board (6), between lower platen (5) and top board (6) Retaining mechanism is provided with, for top board (6) with being correspondingly arranged on circular hole (7) in the middle part of lower platen (5), being provided with pedestal (1) can Circle through circular hole (7) expands brilliant disk (8), and the lower surface for expanding brilliant disk (8) is connected with cylinder (9) and drives it by cylinder (9) Moving up and down, expand brilliant disk (8) and be internally provided with heater, the edge for expanding brilliant disk (8) upper surface is surrounded with ladder (10), The inner ring of interior trim ring (2) is engaged with ladder (10), and the inner ring of outer trim ring (3) is engaged with the outer ring of interior trim ring (2), position restrainer Structure (4) includes the support bar (11) being vertically arranged on pedestal (1), and level is rotatably provided in support bar (11) top Limiting plate (12).
2. according to claim 1 expand brilliant machine, it is characterised in that the edge of the ladder (10) is provided with rounding (13)。
3. according to claim 1 expand brilliant machine, it is characterised in that the pedestal (1) passes through connecting pole with lower platen (5) (14) it is fixedly connected.
4. according to claim 3 expand brilliant machine, it is characterised in that the lower platen (5) is square setting, connecting pole (14) Four are provided with, four diagonal angles with lower platen (5) lower surface are fixedly connected respectively.
5. according to claim 1 expand brilliant machine, it is characterised in that the support bar (11) is the telescopically adjustable body of rod.
6. according to claim 1 expand brilliant machine, it is characterised in that is provided with the middle part of brilliant disk (8) lower surface of expansion convex Platform (15), boss (15) middle part are provided with threaded connection hole, and cylinder (9) includes cylinder body and the piston being slidably matched with cylinder body Bar, piston rod are provided with the threaded joints coordinated with threaded connection hole with expanding one end that brilliant disk (8) is connected.
7. according to claim 1 expand brilliant machine, it is characterised in that is tiltedly installed with the pedestal (1) to top board (6) It is supported spacing support column (16).
8. according to claim 1 expand brilliant machine, it is characterised in that described to expand brilliant disk (8), top board (6) and lower platen (5) It is that stainless steel is made.
CN201711145160.5A 2017-11-17 2017-11-17 Expand brilliant machine Withdrawn CN107731987A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711145160.5A CN107731987A (en) 2017-11-17 2017-11-17 Expand brilliant machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711145160.5A CN107731987A (en) 2017-11-17 2017-11-17 Expand brilliant machine

Publications (1)

Publication Number Publication Date
CN107731987A true CN107731987A (en) 2018-02-23

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ID=61216287

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711145160.5A Withdrawn CN107731987A (en) 2017-11-17 2017-11-17 Expand brilliant machine

Country Status (1)

Country Link
CN (1) CN107731987A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109920746A (en) * 2018-12-26 2019-06-21 广东欧美亚智能装备有限公司 A kind of brilliant machine of full-automatic expansion

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080462A (en) * 2008-09-23 2010-04-08 Hitachi High-Tech Instruments Co Ltd Component mounting apparatus
CN203895484U (en) * 2014-06-04 2014-10-22 深圳市晶台股份有限公司 Film cutting device of LED chip expanding machine
KR101559043B1 (en) * 2014-04-15 2015-10-08 팸텍주식회사 Wafer die expanding device
CN205376555U (en) * 2016-01-29 2016-07-06 江门市亮美电子有限公司 LED expands brilliant machine
WO2017135518A1 (en) * 2016-02-05 2017-08-10 주식회사 이오테크닉스 Wafer alignment apparatus and wafer transfer apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080462A (en) * 2008-09-23 2010-04-08 Hitachi High-Tech Instruments Co Ltd Component mounting apparatus
KR101559043B1 (en) * 2014-04-15 2015-10-08 팸텍주식회사 Wafer die expanding device
CN203895484U (en) * 2014-06-04 2014-10-22 深圳市晶台股份有限公司 Film cutting device of LED chip expanding machine
CN205376555U (en) * 2016-01-29 2016-07-06 江门市亮美电子有限公司 LED expands brilliant machine
WO2017135518A1 (en) * 2016-02-05 2017-08-10 주식회사 이오테크닉스 Wafer alignment apparatus and wafer transfer apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109920746A (en) * 2018-12-26 2019-06-21 广东欧美亚智能装备有限公司 A kind of brilliant machine of full-automatic expansion

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SE01 Entry into force of request for substantive examination
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Application publication date: 20180223