CN107731769A - A kind of package module of pin crimping - Google Patents
A kind of package module of pin crimping Download PDFInfo
- Publication number
- CN107731769A CN107731769A CN201710890022.3A CN201710890022A CN107731769A CN 107731769 A CN107731769 A CN 107731769A CN 201710890022 A CN201710890022 A CN 201710890022A CN 107731769 A CN107731769 A CN 107731769A
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- Prior art keywords
- pin
- electrode
- package module
- chip
- crimping
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- 238000002788 crimping Methods 0.000 title claims abstract description 21
- 238000005452 bending Methods 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 4
- 239000007769 metal material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 230000002146 bilateral effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
Abstract
The invention discloses a kind of package module of pin crimping, is thereon that can crimp cladded type structure with pin, the end of the pin.Thus the package module with pin crimping function is formed, the module can be on the premise of most of production equipment and technique be continued to use, with identical production cost, and obtain the product of high reliability, in the application process of product, the use of sleeve pipe need not be cold-pressed, you can realize highly reliable electrical property cold pressing connection.
Description
Technical field
The present invention relates to integrated antenna package technology, and in particular to intelligent chip package module.
Background technology
With the continuous progress of integrated antenna package technology, the integrated level of integrated circuit increasingly improves, and function is more and more richer
It is rich.For the new opplication demand of emergence, it is desirable to which integrated antenna package enterprise can design new packing forms to coordinate
New demand.
At present, traditional chip package is after pin breaks muscle punching, and the mode of PCB pad progress soldering is answered
With this is more in some parts usages, is generally by the way of in the case that product space is abundant.But in some cores
Piece is independently operated, or lacked welding condition, reliability requirement height, in the case of particularly resistance to temperature requirement is extra high, soldering
Technique just can be not necessarily realized, it is necessary to replace soldering process to realize using compression joint technique.
Equally it is compression joint technique, it is common practice to realize packaged chip by being cold-pressed the form of sleeve pipe.Adopt
The pin of chip and outside lead are pressed with cold pressing sleeve pipe, it is possible to achieve highly reliable electrical property connection.But increase after all
One sleeve pipe, cost can also be lifted, if by automated production, production efficiency also can be relatively low.
The content of the invention
For the problems of existing chip-packaging structure, it is necessary to which a kind of new chip package scheme realizes crimping work
Skill.
Therefore, the technical problems to be solved by the invention are to provide a kind of package module of pin crimping, it can be not
Need to be cold-pressed under sleeve, be directly realized by highly reliable electrical property cold pressing connection.
In order to solve the above-mentioned technical problem, the package module of pin provided by the invention crimping, have on the package module
There is pin, the end of the pin is that can crimp cladded type structure.
Further, the cladded type structure that crimps is a flat structure, on pin extending direction
There is provided some square structures to unilateral extension.
Further, the cladded type structure that crimps is a flat structure, right on pin extending direction is fallen in
What is claimed is provided with some square structures extended to both sides.
Further, the cladded type structure that crimps is a flat structure, right on pin extending direction is fallen in
Some square structures being provided with to both sides extension of title, and the end of square structure laciniation there is provided corresponding to, two
Laciniation on square structure can be mutually twisted after bending.
Further, the cladded type structure that crimps is a flat structure, the phase on pin extending direction is fallen in
What is mutually misplaced is provided with some square structures extended to both sides.
Further, the package module includes:
Chip, the chip have some pads available for lead, and it is fixedly mounted on the chip bearing region of carrier band；
For carrying the carrier band of chip, the carrier band sets chip bearing area and some pins, chip bearing area periphery
Pin end is provided with pad, and pad is conducted by way of lead welding on the pad and chip；
Molded packages body；The molded packages body is to be coated on the protective outside chip and carrier band, and molded packages body
Both ends draw two pins.
Further, the multi-unit structure that the carrier band is arranged using continuous regular.
The present invention provides a kind of package module with pin crimping function, and the module can be set continuing to use most of production
On the premise of standby and technique, with identical production cost, and the product of high reliability is obtained, in the application process of product, be not required to
It is cold-pressed the use of sleeve pipe, you can realize highly reliable electrical property cold pressing connection.
Brief description of the drawings
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Fig. 1 be present example 1 in package module square structure schematic diagram from pin to bilateral extension；
Fig. 2 is the pin and outside lead mounting structure schematic diagram of package module in present example 1；
Fig. 3 is the cross-sectional view after pin and the outside lead crimping of package module in present example 1；
Fig. 4 be present example 2 in package module square structure schematic diagram from pin to unilateral extension；
Fig. 5 is the zigzag square structure schematic diagram that the pin of package module in present example 3 extends to both sides；
Fig. 6 is that the square structure that the pin of package module in present example 4 extends to both sides shifts to install schematic diagram.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, tie below
Conjunction is specifically illustrating, and the present invention is expanded on further.
This programme provides a kind of package module with pin crimping function, has corresponding pin on the package module,
And the end of the pin is that can crimp cladded type structure.Thus the package module can be in the case where that need not be cold-pressed sleeve, directly
Connect and realize highly reliable electrical property cold pressing connection, can so substantially reduce use cost and improve production efficiency.
Illustrate for the program below by way of some specific examples.
Example 1
What this example provided has the package module of pin crimping function, and it includes chip, the carrier band for carrying chip
And molded packages body three parts.
The chip has 2 pads that can be used for lead, is fixedly mounted on the chip bearing region of carrier band；Welded for chip
The quantity of disk is not limited to 2, according to the model of actual chips or package module function needs, can also have the weldering of other quantity
Disk.
Carry for carrying chip, it is process by foil by etching or Sheet Metal Forming Technology, and each carrier band is set
One chip bearing area and two pins (for the quantity of pin, it corresponds specifically to the quantity of chip bonding pad)；Carry simultaneously
Take and be provided with pad, the pad and placement and the weldering on the chip in chip bearing area close to the pin end in chip bearing area
Disk is conducted by way of lead welding.
In practical operation, the multi-unit structure of the preferred continuous regular arrangement of the carrier band, can so be adapted to produce in enormous quantities.
Molded packages body is to be coated on the protective outside chip and carrier band, and this example is preferably rectangular parallelepiped structure, simultaneously
Two pins are drawn at the both ends of molded packages body, are used to electrically connect outside lead, such as antenna as module electrodes.For this
The concrete structure of molded packages body is not limited to this, can use other structures according to the actual requirements.
Electrical property cold pressing in order to be directly realized by highly reliable connects, and the end of package module pin uses in this example
Cladded type structure can be crimped.
Referring to Fig. 1, the cladded type structure that crimps that the pin end of package module 100 uses in this example is specially a flat board
Type structure, it is provided with symmetrical on pin extending direction to bilateral while extension some sides in the flat structure
Shape structure.
Specifically, as seen from the figure, package module 100 is overall preferably square in this example, and its both ends is symmetrically outwards drawn
Go out corresponding pin 101 and 102, as corresponding connection electrode.
Wherein, set to both sides the bearing of trend of first electrode (both sides relative to) and prolong on the top of first electrode 101
The wrap sheet 103 and 105 stretched.Wrap sheet 103 and 105 using can the metal material of cold upsetting deformation be made, this example is preferably by electricity
The body of pole 101 directs out extension and formed, and wrap sheet 103 and 105 is specially square plate structure, is symmetrically distributed in first electrode
The both sides of 101 bearing of trends, package structure can be formed at first electrode 101 in cold upsetting deformation.
Bag to both sides the bearing of trend of second electrode (both sides relative to) extension is set on the top of second electrode 102
Wrap up in piece 104 and 106.Wrap sheet 104 and 106 using can the metal material of cold upsetting deformation be made, this example is preferably by 102, electrode
Body directs out extension and formed, and wrap sheet 104 and 106 is specially square plate structure, is symmetrically distributed in second electrode 102 and extends
The both sides in direction, package structure can be formed at second electrode 102 in cold upsetting deformation.
The package module 100 formed accordingly can crimp the electrode (i.e. pin) of cladded type structure by being formed at its both ends.Such as
The package module 100 of this structure directly can directly carry out pressing with antenna electrode and be connected.
Referring to Fig. 2, when carrying out antenna electrode and chip electrode crimps, by the electrode 202 of first antenna 201 close to encapsulation
Module 100 is placed on the surface of first electrode 101 of slab construction, and the projected position of diagram is formed with first electrode 101,
By press equipment by two wrap sheets 103 and 105 that the top both sides of first electrode 101 of module are distributed towards antenna electrode
202 bendings are simultaneously coated on the surface of antenna electrode 202, then the wrap sheet 103,105 for making to be overlying on the surface of antenna electrode 202 by pressurization
Tightly pressed together with antenna electrode 202.
Similarly, the electrode 204 of the second antenna 203 is placed in the upper of the surface of module second electrode 102 close to module 100,
And form the projected position of diagram, module second electrode top both sides are distributed by press equipment two with module electrodes 102
Individual wrap sheet 104 and 106 is towards the bending of antenna electrode 204 and is coated on the surface of antenna electrode 204, then makes to be overlying on day by pressurization
The wrap sheet 104,106 and antenna electrode 204 on the surface of line electrode 204 tightly press together.
Referring finally to Fig. 3, the wrap sheet 103 and 105 of first electrode is by first antenna electrode 202 from tightly coating surrounding
Come, realize highly reliable direct electrical property cold pressing connection.
Example 2
The scheme for the package module and example 1 with pin crimping function that this example provides is essentially identical, difference
Structure in the package module pin end in this example.
Referring to Fig. 4, in this example the end use of package module pin can crimp cladded type structure, it is specially a flat board
Type structure, and some square structures to unilateral extension are being provided with pin extending direction in the flat structure.
Specifically, as seen from the figure, package module 100 is overall preferably square in this example, and its both ends is symmetrically outwards drawn
Go out corresponding pin 101 and 102, as corresponding connection electrode.
Wherein, set on the top of first electrode 101 to downside (downside relative to the bearing of trend of first electrode and
Speech) extension wrap sheet 103.The wrap sheet 103 using can the metal material of cold upsetting deformation be made, this example is preferably by electrode
101 bodies extend composition directly down, and wrap sheet 103 is specially square plate structure, and vertical distribution extends in first electrode 101
The downside in direction, package structure can be formed at first electrode 101 in cold upsetting deformation.
It is corresponding, this example set on the top of second electrode 102 to upside (upside relative to second electrode extension
For direction) extension wrap sheet 104.The wrap sheet 104 using can the metal material of cold upsetting deformation be made, this example preferably by
The body of electrode 102 extends composition directly up, and wrap sheet 104 is specially square plate structure, and vertical distribution is in second electrode 102
The upside of bearing of trend, package structure can be formed at second electrode 102 in cold upsetting deformation.
The package module 100 formed accordingly can crimp the electrode (i.e. pin) of cladded type structure by being formed at its both ends.Such as
The package module 100 of this structure directly can directly carry out pressing with antenna electrode and be connected.
When carrying out antenna electrode and chip electrode crimps, the electrode of first antenna is placed in first electrode close to module
On 101 surface, and overlapping projected position is formed with module first electrode, by press equipment by module first electrode 101
Wrap sheet 103 towards first antenna electrode bending and be coated on first antenna electrode surface, then by pressurization make to be coated on
The wrap sheet and first antenna electrode of first antenna electrode surface tightly press together.
Similarly, the electrode of the second antenna is placed on the surface of second electrode 102 close to module, and it is electric with module second
Pole 102 forms overlapping projected position, by press equipment by the wrap sheet 104 of module second electrode 102 towards the second antenna
Electrode bending and be coated on the second antenna electrode surface, then the wrap sheet that is coated on the second antenna electrode surface is made by pressurization
104 and second antenna electrode tightly press together.
It can divide from there through the wrap sheet 103 and 104 in first electrode and second electrode in direct cold pressing package module 100
First antenna electrode and the second antenna electrode are not coated tightly from surrounding, realize that highly reliable direct electrical property cold pressing connects
Connect.
Example 3
The scheme for the package module and example 1 with pin crimping function that this example provides is essentially identical, difference
Structure in the package module pin end in this example.
Referring to Fig. 5, in this example the end use of package module pin can crimp cladded type structure, it is specially a flat board
Type structure, and be provided with the flat structure symmetrical on pin extending direction to some square of both sides extension
Structure, while laciniation is provided with the end of square structure, the sawtooth on two sides can be mutually twisted after bending.
Specifically, as seen from the figure, package module 100 is overall preferably square in this example, and its both ends is symmetrically outwards drawn
Go out corresponding pin 101 and 102, as corresponding connection electrode.
Wherein, set to both sides the bearing of trend of first electrode (both sides relative to) and prolong on the top of first electrode 101
The wrap sheet 103 and 105 for the band dislocation broached-tooth design stretched.Wrap sheet 103 and 105 using can cold upsetting deformation metal material system
Into, this example preferably directs out extension by the body of electrode 101 and formed, and wrap sheet 103 and 105 is specially square plate structure,
Both tops are respectively arranged with corresponding broached-tooth design.Wrap sheet 103 and 105 is symmetrically distributed in the side of extension of first electrode 101
To both sides, the broached-tooth design on its top just mutual dislocation.The wrap sheet 103 and 105 of such structure can be in cold upsetting deformation
When package structure is formed at first electrode 101, and both top mutual dislocation laciniations are just mutual after bending
Occlusion, improve the reliability of package structure.
It is also provided with the top of second electrode 102 to both sides the bearing of trend of second electrode (both sides relative to) extension
Wrap sheet 104 and 106 with dislocation broached-tooth design.Wrap sheet 104 and 106 using can the metal material of cold upsetting deformation be made, this
Example preferably directs out extension by the body of electrode 102 and formed, and wrap sheet 104 and 106 is specially square plate structure, both
Top is respectively arranged with corresponding broached-tooth design.Wrap sheet 104 and 106 is symmetrically distributed in the two of the bearing of trend of second electrode 102
Side, the broached-tooth design on its top just mutual dislocation.The wrap sheet 104 and 106 of such structure can be in cold upsetting deformation the
Package structure is formed at two electrodes 102, and both top mutual dislocation laciniations are just mutually twisted after bending, are carried
The reliability of high package structure.
The package module 100 formed accordingly can crimp the electrode (i.e. pin) of cladded type structure by being formed at its both ends.Such as
The package module 100 of this structure directly can directly carry out pressing with antenna electrode and be connected.
Specifically, when carrying out antenna electrode and chip electrode crimps, by the electrode of first antenna close to package module 100
It is placed on the surface of first electrode 101 of slab construction, and overlapping projected position is formed with first electrode 101, passes through pressure
Equipment is closed by two wrap sheets 103 and 105 that the top both sides of first electrode 101 of module are distributed towards first antenna electrode bending
And be coated on first antenna electrode surface, now the top mutual dislocation laciniation of wrap sheet 103 and 105 after bending just
It is mutually twisted well；The wrap sheet 103,105 and first antenna electrode for making to be overlying on first antenna electrode surface by pressurization again are tightly
Press together, and the laciniation by being mutually twisted improves the reliability of pressing connection.
Similarly, the electrode of the second antenna is placed in the upper of the surface of module second electrode 102, and and mould close to module 100
Block electrode 102 forms overlapping projected position, two parcels for being distributed module second electrode top both sides by press equipment
Piece 104 and 106 is towards the second antenna electrode bending and is coated on the second antenna electrode surface, now the top of wrap sheet 104 and 106
Mutual dislocation laciniation is just mutually twisted after bending；Make the bag for being overlying on the second antenna electrode surface by pressurization again
Wrap up in the antenna electrode of piece 104,106 and the second tightly to press together, and the laciniation by being mutually twisted improves pressing and connected
The reliability connect.
Can be respectively by first from there through the wrap sheet being directly cold-pressed in package module 100 in first electrode and second electrode
Antenna electrode and the second antenna electrode tightly coat from surrounding, realize highly reliable direct electrical property cold pressing connection, simultaneously
The reliability of pressing connection is can further improve by the laciniation being mutually twisted on wrap sheet.
Example 4
The scheme for the package module and example 1 with pin crimping function that this example provides is essentially identical, difference
Structure in the package module pin end in this example.
Referring to Fig. 6, in this example the end use of package module pin can crimp cladded type structure, it is specially a flat board
Type structure, and be provided with the flat structure on the direction vertical with pin extending direction to some square of both sides extension
Structure, some square structures shift to install on the extending direction of pin so that will not be interfered after bending.
Specifically, as seen from the figure, package module 100 is overall preferably square in this example, and its both ends is symmetrically outwards drawn
Go out corresponding pin 101 and 102, as corresponding connection electrode.
Wherein, set to both sides the bearing of trend of first electrode (both sides relative to) and prolong on the top of first electrode 101
Stretch and the wrap sheet of mutual dislocation 103 and 105.Wrap sheet 103 and 105 using can the metal material of cold upsetting deformation be made, this reality
Example preferably directs out extension by the body of electrode 101 and formed, and wrap sheet 103 and 105 is specially square plate structure, and both are mutual
The both sides for being distributed in the bearing of trend of first electrode 101 of dislocation, thus both can be in cold upsetting deformation independently from both sides
Package structure is formed at first electrode 101, i.e., the independent parcel knot of two mutually to stagger is formed at first electrode 101
Structure, greatly improve the reliability of package structure.
Set on the top of second electrode 102 to both sides the bearing of trend of second electrode (both sides relative to) extension and phase
The wrap sheet 104 and 106 mutually to misplace.Wrap sheet 104 and 106 using can the metal material of cold upsetting deformation be made, this example is preferred
Extension is directed out by the body of electrode 102 to form, wrap sheet 104 and 106 is specially square plate structure, both mutual dislocations
The both sides of the bearing of trend of second electrode 102 are distributed in, thus both can be in cold upsetting deformation independently from both sides second
Package structure is formed at electrode 102, i.e., the two independent package structures mutually to stagger are formed at second electrode 102, significantly
Improve the reliability of package structure.
The package module 100 formed accordingly can crimp the electrode (i.e. pin) of cladded type structure by being formed at its both ends.Such as
The package module 100 of this structure directly can directly carry out pressing with antenna electrode and be connected.
Specifically, when carrying out antenna electrode and chip electrode crimps, by the electrode of first antenna close to package module 100
It is placed on the surface of first electrode 101 of slab construction, and overlapping projected position is formed with first electrode 101, passes through pressure
Two wrap sheets 103 and 105 that the top both sides of first electrode 101 of module are dislocatedly distributed by conjunction equipment are respectively for first antenna
Electrode bending is simultaneously respectively coated by the surface of first antenna electrode, then makes to be overlying on first antenna electrode surface respectively by pressurization
Wrap sheet 103,105 and first antenna electrode tightly press together, thus two dislocation of formation on first antenna electrode
Wrap up attachment structure.
Similarly, the electrode of the second antenna is placed in the surface of the second electrode 102 of slab construction close to package module 100
On, and overlapping projected position is formed with first electrode 102, by press equipment by the top both sides of second electrode 102 of module
Two wrap sheets 104 and 106 being dislocatedly distributed are respectively for the second antenna electrode bending and are respectively coated by the second antenna electrode
Surface, then make to be overlying on the antenna electrode of wrap sheet 104,106 and the second on the second antenna electrode surface respectively tightly by pressurization
Press together, the parcel attachment structure of two dislocation is thus formed on the second antenna electrode.
The parcel set from there through the mutual dislocation being directly cold-pressed in package module 100 in first electrode and second electrode
Piece respectively can tightly coat first antenna electrode and the second antenna electrode from surrounding, realize highly reliable direct electrical property
Cold pressing connection, while the wrap sheet set by mutual dislocation can form two parcels to misplace between antenna electrode and be connected
Structure, further improve the reliability of pressing connection.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the simply explanation described in above-described embodiment and specification is originally
The principle of invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (7)
1. the package module of pin crimping, has pin on the package module, it is characterised in that the end of the pin is can
Crimp cladded type structure.
2. the package module of pin according to claim 1 crimping, it is characterised in that the cladded type structure that crimps is
One flat structure, some square structures to unilateral extension are being provided with pin extending direction.
3. the package module of pin according to claim 1 crimping, it is characterised in that the cladded type structure that crimps is
One flat structure, it is symmetrical on pin extending direction is fallen in be provided with some square structures extended to both sides.
4. the package module of pin according to claim 1 crimping, it is characterised in that the cladded type structure that crimps is
One flat structure, it is symmetrical on pin extending direction is fallen in be provided with some square structures extended to both sides, and side
The end of shape structure is provided with corresponding laciniation, and the laciniation on two square structures is can be mutual after bending
Occlusion.
5. the package module of pin according to claim 1 crimping, it is characterised in that the cladded type structure that crimps is
One flat structure, mutual dislocation is provided with some square structures extended to both sides on pin extending direction is fallen in.
6. the package module of pin crimping according to claim 1, it is characterised in that the package module includes：
Chip, the chip have some pads available for lead, and it is fixedly mounted on the chip bearing region of carrier band；
For carrying the carrier band of chip, the carrier band sets chip bearing area and some pins, the pin on chip bearing area periphery
End is provided with pad, and pad is conducted by way of lead welding on the pad and chip；
Molded packages body；The molded packages body is to be coated on the protective outside chip and carrier band, and the two of molded packages body
Draw two pins in end.
7. the package module of pin crimping according to claim 6, it is characterised in that the carrier band is arranged using continuous regular
The multi-unit structure of row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710890022.3A CN107731769A (en) | 2017-09-27 | 2017-09-27 | A kind of package module of pin crimping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710890022.3A CN107731769A (en) | 2017-09-27 | 2017-09-27 | A kind of package module of pin crimping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107731769A true CN107731769A (en) | 2018-02-23 |
Family
ID=61208148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710890022.3A Pending CN107731769A (en) | 2017-09-27 | 2017-09-27 | A kind of package module of pin crimping |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107731769A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4519660A (en) * | 1983-03-17 | 1985-05-28 | Japan Aviation Electronics Industry, Limited | Electrical connectors with quasi-terminal pins |
| DE19741921A1 (en) * | 1997-09-23 | 1999-02-25 | Siemens Ag | Carrier element for semiconductor chip card data type carrier |
| DE102004014476A1 (en) * | 2004-03-24 | 2005-10-20 | Robert Virant | HF connecting part used in automotive applications comprises an inner conducting end section with an inner conductor crimp to which a soldering tag is molded and an outer conducting end section with an outer conductor crimp |
| CN104995801A (en) * | 2012-11-27 | 2015-10-21 | 莫列斯公司 | Wire to board terminal |
| WO2016019758A1 (en) * | 2014-08-04 | 2016-02-11 | 软控股份有限公司 | Rfid device used within rubber type, and installation method for rfid device |
| CN207909863U (en) * | 2017-09-27 | 2018-09-25 | 上海仪电智能电子有限公司 | A kind of package module of pin crimping |
-
2017
- 2017-09-27 CN CN201710890022.3A patent/CN107731769A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4519660A (en) * | 1983-03-17 | 1985-05-28 | Japan Aviation Electronics Industry, Limited | Electrical connectors with quasi-terminal pins |
| DE19741921A1 (en) * | 1997-09-23 | 1999-02-25 | Siemens Ag | Carrier element for semiconductor chip card data type carrier |
| DE102004014476A1 (en) * | 2004-03-24 | 2005-10-20 | Robert Virant | HF connecting part used in automotive applications comprises an inner conducting end section with an inner conductor crimp to which a soldering tag is molded and an outer conducting end section with an outer conductor crimp |
| CN104995801A (en) * | 2012-11-27 | 2015-10-21 | 莫列斯公司 | Wire to board terminal |
| WO2016019758A1 (en) * | 2014-08-04 | 2016-02-11 | 软控股份有限公司 | Rfid device used within rubber type, and installation method for rfid device |
| CN207909863U (en) * | 2017-09-27 | 2018-09-25 | 上海仪电智能电子有限公司 | A kind of package module of pin crimping |
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