CN208819863U - Power package structure - Google Patents
Power package structure Download PDFInfo
- Publication number
- CN208819863U CN208819863U CN201821207285.6U CN201821207285U CN208819863U CN 208819863 U CN208819863 U CN 208819863U CN 201821207285 U CN201821207285 U CN 201821207285U CN 208819863 U CN208819863 U CN 208819863U
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- Prior art keywords
- group
- pin
- package structure
- power package
- protruding portion
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
This application discloses power package structures.The lead frame includes: first group of pin, the first surface of first group of pin provides the first contact surface for internal electrical connection, and second group of pin, the first surface of second group of pin provides the second contact surface for internal electrical connection, the multiple protruding portion that second group of pin respectively includes conductive bar and extend at least one side of conductive bar, wherein, the width direction of the multiple protruding portion is parallel with the side of the conductive bar, also, the width of the multiple protruding portion changes with the distance between side with the conductive bar.Lead frame in the power package structure provides the contact surface being electrically connected with one group of conductive column using the protruding portion of pin, to improve current carrying capacity and reduce product size.
Description
Technical field
The utility model relates to integrated semiconductor technology fields, more particularly, to power package structure.
Background technique
In consumer electronics product, for example, function is widely used in the equipment such as charger, LCD TV, medical electronics
Rate encapsulating structure product, for example, high current DC-DC converter.The Specifeca tion speeification of power package infrastructure product includes big electricity
Stream and low-power consumption.In order to realize low-power consumption, it is desirable to which the internal resistance on current path is smaller.Power package infrastructure product it is interior
Portion's resistance not only includes the conducting resistance of the active component in chip, and the contact resistance including being introduced in encapsulating structure and
Routing resistance.Therefore, the encapsulating structure that power package infrastructure product uses is also the principal element for influencing performance parameter.
In the encapsulating structure for power package infrastructure product, using flip-chip (flip-chip) mode by chip
It is electrically connected to lead frame, to replace traditional bonding line connection type.Traditional bonding line connection can be used more neatly
General lead frame, but flip-chip is connected, it generally requires to develop corresponding lead frame for the pad layout of chip.Such as
Fruit is the sectional area for considering to increase current channel, then the area of the contact surface for the lead frame developed is bigger, to lead
Cause final products size bigger.
Therefore, it for power package infrastructure product, is needed it is expected that can provide and take into account high current, low-power consumption and miscellaneous goods size
The power package structure asked.
Utility model content
In view of the above problems, the purpose of this utility model is to provide a kind of power package seal structure, wherein lead frame is adopted
The contact surface being electrically connected with one group of conductive column is provided with the protruding portion of pin to improve current carrying capacity and reduce product size.
The utility model provides a kind of power package structure, comprising: lead frame, including first group of pin of different shapes
With second group of pin；Chip, including first group of weld pad corresponding with first group of pin and second group of pin shapes and second respectively
Group weld pad；The chip is fixed on the lead frame and is realized electrical connection between the two by multiple conductive columns, described to lead
The shape of electric column include with the matched cuboid of second group of pad shapes so that the conductive column and second group of weld pad
It comes into full contact with；And packaging body, for covering the lead frame, the chip and the multiple conductive column, wherein described first
The first surface of group pin provides the first contact surface being electrically connected with the bottom end of the multiple conductive column, second group of pin
First surface provides the second contact surface being electrically connected with the bottom end of the multiple conductive column, and second group of pin respectively includes leading
Electric item and the multiple protruding portion extended at least one side of the conductive bar, wherein the width side of the multiple protruding portion
To parallel with the side of the conductive bar, also, the width of the multiple protruding portion is between the side of the conductive bar
Distance and change.
Preferably, first group of pin is in finger-like；Second group of pin is in branch-like.
Preferably, one group of conductive column is provided on each protruding portion in the multiple protruding portion.
Preferably, the shape of second contact surface includes step shape.
Preferably, the order of the step shape is more than or equal to 2.
Preferably, the position of the conductive column and quantity are corresponding with the position of the step shape and quantity.
Preferably, the quantity of the corresponding conductive column of each step shape is greater than or equal to 2.
Preferably, the width of the multiple protruding portion subtracts as the distance between the side with the conductive bar increases
It is small.
Preferably, the diameter of conductive column increases with the distance between side with the conductive bar in one group of conductive column
Add and reduces.
Preferably, the width of the multiple protruding portion increases as the distance between the side with the conductive bar increases
Add.
Preferably, the diameter of conductive column increases with the distance between side with the conductive bar in one group of conductive column
Add and increases.
Preferably, first group of pin includes the second surface opposite with its first surface and from the second surface
Pin part outstanding；Second group of pin includes the second surface opposite with its first surface and from the second surface
Pin part outstanding.
Preferably, the surface of the pin part is exposed from the packaging body, for being electrically connected between external circuit
It connects.
Preferably, the multiple protruding portion of pin adjacent to each other is staggered in second group of pin.
Preferably, the minimum spacing in second group of pin between the multiple protruding portion of pin adjacent to each other is more than or equal to
500 microns.
Preferably, the angle of the cuboid includes fillet.
The power package seal structure of embodiment according to the present utility model, wherein first group of pin of lead frame provides big
The contact surface of rectangle is caused, the multiple protruding portion of second group of pin provides step-like contact surface respectively.Further, in contact surface
On can connect multiple conductive columns.The width of protruding portion changes with the distance between side with the conductive bar.With adopt
It is compared with the pin in rectangular contact face, bigger contact area can be provided using the pin of step-like contact surface.The contact surface
Allow to connect one group of conductive column, to increase the quantity of conductive column.Therefore, power package structure uses according to this embodiment
Lead frame can be improved current carrying capacity and reduce product size.
The power package structure of preferred embodiment according to the present utility model, wherein conductive using various sizes of one group
Column is connected on the contact surface of second group of pin, and compared with using one group of conductive column of single size, current path can be improved
Sectional area and package area between ratio.Therefore, the power package structure of the preferred embodiment and various sizes of conduction
Column combines, and can be further improved current carrying capacity and reduces product size.
The power package structure of preferred embodiment according to the present utility model, wherein conductive column shape is rounded cuboid,
Conductive column is matched with the shape of chip pad, and rounded cuboid conductive column can have more contacts area with weld pad, is increased
Conductive path.
Detailed description of the invention
By referring to the drawings to the description of the utility model embodiment, above-mentioned and other mesh of the utility model
, feature and advantage will be apparent from.
Fig. 1 shows the internal perspective view of the power package seal structure according to the utility model first embodiment.
Fig. 2 shows the top views of the lead frame in power package structure shown in Fig. 1.
Fig. 3 shows the bottom view of the chip in power package structure shown in Fig. 1.
Fig. 4 shows the sectional view of power package structure shown in Fig. 1.
Fig. 5 shows the top view of lead frame in power package structure according to the second embodiment.
Fig. 6 shows the bottom view of chip in power package structure according to the second embodiment.
Specific embodiment
Hereinafter reference will be made to the drawings is more fully described the utility model.In various figures, identical element is using similar
Appended drawing reference indicate.For the sake of clarity, the various pieces in attached drawing are not necessarily to scale.Furthermore, it is possible to be not shown
Certain well known parts.
Many specific details of the utility model, such as the structure of device, material, size, place are described hereinafter
Science and engineering skill and technology, to be more clearly understood that the utility model.But just as the skilled person will understand,
The utility model can not be realized according to these specific details.
The utility model can be presented in a variety of manners, some of them example explained below.
Fig. 1 shows the internal perspective view of the power package seal structure according to the utility model first embodiment.
As shown, power package structure 100 include lead frame 110, the chip 120 above lead frame 110 and
The conductive column 130 that the weld pad of chip 120 is electrically connected with lead frame 110.For the sake of clarity, covering lead is being not shown in the figure
The plastic-sealed body of frame 110 and chip 120, and lead frame 110 and the separation of chip 120 are shown.
In actual product, as shown by arrows, the upper end of the weld pad contact conductive column 130 of chip 120, lead frame 110
Contact face contact conductive column 130 lower end, so that chip 120 is mounted on lead frame 110 by the method using flip-chip,
And realize electrical connection between the two.Conductive column 130 is the weld pad utilization plating or chemical plating method growth shape in chip 120
At column.The lower end of conductive column 130 is fixed on the contact surface of lead frame 110 using reflow soldering.Finally, passing through plastic packaging
The lead frame 110 being combined, chip 120 and conductive column 130 are all encapsulated by body, to form power package structure 100.
The packaging appearance of power package structure 100 is usually QFN, DFN.
Lead frame 110 includes first group of pin 111 and second group of pin 112 and 113.First group of pin 111 and second
Group pin 112 and 113 is made of metal respectively, such as copper.Pin in first group of pin 111 and second group of pin 112 and 113
Such as respectively include the multiple portions of different-thickness.For example, the pin includes opposite first surface and second surface, the first table
Face is flat surface, and for providing the contact surface being connected with conductive column 130, pin portion outstanding is formed on second surface
Point.After packaging is accomplished, the main part of pin is located in plastic-sealed body, and only pin part can be exposed to outside plastic-sealed body, is used for
It is connected with external circuit.
In this embodiment, the thickness of the main part of pin is less than the thickness of pin part, so as to promote product
Reliability weaker with plastic-sealed body binding force because pin part is exposed to outside plastic-sealed body, the more binding forces of expose portion are more
Difference, encapsulating structure are easy for by moist influence.Therefore, in addition to for other than providing area necessary to pin, pin it is big
Area should be used for main part.
In this embodiment, first group of pin 111 provides substantially rectangular contact surface, second group of pin 112 and 113 it is more
A protrusion, which you can well imagine, supplies step-like contact surface.Further, multiple conductive columns 130 be can connect on the contact surface.Protruding portion
Width change with the distance between side with the conductive bar.Compared with using the pin in rectangular contact face, use
The pin of step-like contact surface can provide bigger contact area.The step-like contact surface allows to connect multiple conductive columns, adopts
The quantity of conductive column can be increased with multiple conductive columns 130.Therefore, the lead that power package structure uses according to this embodiment
Frame can be improved current carrying capacity and reduce product size.
In this embodiment, the width of protruding portion reduces as the distance between the side with conductive bar increases, multiple
The diameter of conductive column 130 reduces as the distance between the side with conductive bar increases.In alternate embodiments, protruding portion
Width increase as the distance between side with the conductive bar increases, the diameters of multiple conductive columns 130 with lead
The distance between side of electric item increases and increases.In a preferred embodiment, the diameter of multiple conductive columns 130 and protruding portion
Change width is consistent.
In this embodiment, the contact surface of protruding portion offer is step-like, and the width of protruding portion is with the side with conductive bar
The distance between side and Spline smoothing.In alternate embodiments, the contact surface that protruding portion provides is trapezoidal, the width of protruding portion
With the distance between side with conductive bar and consecutive variations.
According to the power package structure of preferred embodiment, wherein be connected to second using various sizes of multiple conductive columns
On the contact surface of group pin, compared with using multiple conductive columns of single size, the sectional area and envelope of current path can be improved
Fill the ratio between area.Therefore, the lead frame and various sizes of conduction that the power package structure of the preferred embodiment uses
Column combines, and can be further improved current carrying capacity and reduces product size.
Fig. 2 shows the top views of the lead frame in power package structure shown in Fig. 1.Plastic packaging is shown with dotted line frame in figure
Body 150.
As shown, lead frame 110 includes first group of pin 111 and second group of pin 112 and 113.First group is drawn
111, second groups of pins 112 and 113 of foot respectively include each other relative first surface and second surface, and first surface is smooth
Surface, for providing the contact surface of internal electrical connection, be formed on second surface pin part 111p, 112p outstanding and
113p, for being electrically connected with external circuit.
Further, multiple pins in first group of pin 111 are respectively finger-like, and contact surface is substantially rectangular, Duo Geyin
Foot is parallel to each other or is arranged side by side.Multiple pins in second group of pin 112 and 113 are respectively branch-like.Second group of pin 112
The multiple protruding portion 112b that a side including conductive bar 112a and on conductive bar 112a extends.Second group of pin 113
The multiple protruding portion 113b and 113c that two relative sides including conductive bar 113a and on conductive bar 113a extend.The
The multiple protruding portion 113b of the multiple protruding portion 112b of two groups of pins 112 and second group of adjacent pin 113 is relative to each other and hands over
Mistake arrangement.
The minimum spacing d between different pins in first group of pin, 111, second groups of pins 112 and 113 is at least 500
Micron.This encapsulating structure is used on power package infrastructure product, when this kind of product is applied different pin often some
Be high pressure pin, some be low pressure pin, it is therefore desirable to there are some spacing to avoid high-voltage breakdown.
In this embodiment, the protruding portion of second group of pin 112 and 113 provides two layers of step-like contact surface.The protrusion
The width direction in portion and the side of conductive bar be parallel, also, the width of the protruding portion between the side of conductive bar away from
From increase and reduce.It is described referring to Fig.1, it can connect two or more conductive columns 130 on the contact surface.Preferred real
Apply in example, the diameter of multiple conductive columns 130 is corresponding with the change width of protruding portion, for example, with the side with conductive bar it
Between distance increase and reduce.
Fig. 3 shows the bottom view of the chip in power package structure shown in Fig. 1.Plastic-sealed body is shown with dotted line frame in figure
150。
As shown, being formed with first group of weld pad 121 and second on the surface opposite with leadframe 110 of chip 120
Group weld pad 122 and 123.
In power package structure, the inside of chip 120 includes control module and power module, wherein control module can
To use the lesser first group of weld pad 121 of size, larger-size second group of weld pad 122 and 123 is can be used in power module.
First group of weld pad 121 includes multiple weld pads, and the multiple weld pad is respectively bulk, and contact surface is substantially rectangular, more
A weld pad is parallel to each other or is arranged side by side.Second group of weld pad 123 is strip, including conductive bar 123a and conductive bar 123a's
The protruding portion 123b and 123c that end extends.The protruding portion 123b and 123c and lead frame of second group of weld pad 123 in chip 120
The protruding portion 113b and 113c of second group of pin 113 in 110 are corresponding.Second group of weld pad 122 surrounds second group of weld pad 123,
And it is complementary with the shape of second group of weld pad 123, to include complementary protruding portion 122a.
Conductive column 131 is grown on each weld pad in first group of weld pad 121, in second group of weld pad 122 and 123
Multiple conductive columns 132 and 133 on each weld pad.Conductive column shape is rounded cuboid.Its advantage is that with second group of weld pad of chip
The matching of 122 and 123 shapes, rounded cuboid conductive column can have more contacts area with weld pad, increase conductive path.It leads
Electric column 131,132 and 133 is for example made of copper.
In this embodiment, the protruding portion of second group of weld pad 122 and 123 provides the contact surface for the step shape that order is 2.
The width direction of the protruding portion and the side of conductive bar are parallel, also, the width of the protruding portion with the side with conductive bar it
Between distance increase and reduce.It is described referring to Fig.1, it can connect two or more conductive columns on the contact surface.Preferred
Embodiment in, the diameter of multiple conductive columns and the change width of protruding portion are corresponding, for example, with the side with conductive bar it
Between distance increase and reduce.However the first embodiment of the utility model is not limited to this, those skilled in the art can root
According to the other settings of order progress for needing the shape to conductive column, step shape.
Fig. 4 shows the sectional view of power package structure shown in Fig. 1.The sectional view is intercepted along the line AA in Fig. 2.In figure
Plastic-sealed body 150 is shown with dotted line frame.
As shown, chip 120 is mounted on lead frame 110 by the method using flip-chip, and realize the two
Between electrical connection.
Lead frame 110 includes first group of pin 111 and second group of pin 112 and 113.First group of pin 111, second
Group pin 112 and 113 respectively includes each other relative first surface and second surface, and first surface is even curface, is used for
The internal contact surface being electrically connected is provided, is formed with pin part 111p, 112p and 113p outstanding on second surface, for it is outer
The electrical connection of portion's circuit.
First group of pin 111 provides substantially rectangular contact surface, and second group of pin 112 and 113 provides step-like contact surface.
Conductive column 131 is connected on the contact surface of first group of pin 111.Two layers of protruding portion offer of second group of pin 112 and 113 is step-like
Contact surface, can connect two or more conductive columns 132 and 133 on the contact surface.In a preferred embodiment, multiple to lead
The diameter of electric column 132 and 133 is corresponding with the change width of protruding portion, for example, with the distance between the side with conductive bar
Increase and reduce.As shown, 133 diameter of conductive column is less than the diameter of conductive column 132.
Fig. 5 shows the top view of lead frame in power package structure according to the second embodiment, and Fig. 6 is shown according to second
The bottom view of chip in the power package structure of embodiment.
Plastic-sealed body 150 is shown with dotted line frame in Fig. 5, Fig. 6.
As shown in figure 5, lead frame 210 includes first group of pin 211 and second group of pin 212 and 213.First group is drawn
211, second groups of pins 212 and 213 of foot respectively include each other relative first surface and second surface, and first surface is smooth
Surface, for providing the contact surface of internal electrical connection, be formed on second surface pin part 211p, 212p outstanding and
213p, for being electrically connected with external circuit.
Multiple pins in first group of pin 211 are respectively finger-like, and contact surface is substantially rectangular, and multiple pins are parallel to each other
Or it is arranged side by side.Multiple pins in second group of pin 212 and 213 are respectively branch-like.Second group of pin 212 includes conductive bar
The multiple protruding portion 212b that 212a and a side on conductive bar 212a extend.Second group of pin 213 includes conductive bar
The multiple protruding portion 213b and 213c that 213a and two relative sides on conductive bar 213a extend.Second group of pin 212
The multiple protruding portion 213b of multiple protruding portion 212b and second group of pin 213 opposite to each other and be staggered.
As shown in fig. 6, being formed with first group of weld pad 221 and second on the surface opposite with leadframe 210 of chip 220
Group weld pad 222 and 223.
In power package structure, the inside of chip 220 includes control module and power module, wherein control module can
To use the lesser first group of weld pad 221 of size, larger-size second group of weld pad 222 and 223 is can be used in power module.
First group of weld pad 221 includes multiple weld pads, and the multiple weld pad is respectively bulk, and contact surface is substantially rectangular, more
A weld pad is parallel to each other or is arranged side by side.Second group of weld pad 223 is strip, including conductive bar 223a and conductive bar 223a's
The protruding portion 223b and 223c that end extends.The protruding portion 223b and 223c and lead frame of second group of weld pad 223 in chip 220
The protruding portion 213b and 213c of second group of pin 213 in 210 are corresponding.Second group of weld pad 222 surrounds second group of weld pad 223,
And it is complementary with the shape of second group of weld pad 223, to include complementary protruding portion 222a.
Conductive column 231 is grown on each weld pad in first group of weld pad 221, in second group of weld pad 222 and 223
Multiple conductive columns 232 and 233 on each weld pad.Conductive column shape is rounded cuboid.Its advantage is that with second group of weld pad of chip
The matching of 222 and 223 shapes, rounded cuboid conductive column can have more contacts area with weld pad, increase conductive path.It leads
Electric column 231,232 and 233 is for example made of copper.
Lead frame in power package structure according to the second embodiment is different from the first embodiment in contact surface
Shape.
In this embodiment, the protruding portion of second group of pin 212 and 213 provides the contact surface for the step shape that order is 3.
The width direction of the protruding portion and the side of conductive bar are parallel, also, the width of the protruding portion with the side with conductive bar it
Between distance increase and reduce.It is described referring to Fig.1, it can connect three or more conductive columns on the contact surface.Preferred
Embodiment in, the diameter of multiple conductive columns and the change width of protruding portion are corresponding, for example, with the side with conductive bar it
Between distance increase and reduce.However the second embodiment of the utility model is not limited to this, those skilled in the art can root
According to the other settings of order progress for needing the shape to conductive column, step shape.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
It is as described above according to the embodiments of the present invention, these embodiments details all there is no detailed descriptionthe,
Also not limiting the utility model is only the specific embodiment.Obviously, as described above, many modification and change can be made
Change, the including but not limited to change to the local structure of circuit, the replacement of the type to component or model.This specification is chosen
And these embodiments are specifically described, it is in order to preferably explain the principles of the present invention and practical application, to make affiliated skill
Art field technical staff can be used using the utility model and modification on the basis of the utility model well.This is practical new
Type is limited only by the claims and their full scope and equivalents.
Claims (16)
1. a kind of power package structure characterized by comprising
Lead frame, including first group of pin of different shapes and second group of pin；
Chip, including first group of weld pad corresponding with first group of pin and second group of pin shapes and second group of weld pad respectively；
The chip is fixed on the lead frame and is realized electrical connection between the two, the conduction by multiple conductive columns
The shape of column include with the matched cuboid of second group of pad shapes so that the conductive column is filled with second group of weld pad
Tap touching；And
Packaging body, for covering the lead frame, the chip and the multiple conductive column,
Wherein, the first surface of first group of pin is provided contacts with the first of the electrical connection of the bottom end of the multiple conductive column
Face,
The first surface of second group of pin provides the second contact surface being electrically connected with the bottom end of the multiple conductive column, described
The multiple protruding portion that second group of pin respectively includes conductive bar and extend at least one side of the conductive bar,
Wherein, the width direction of the multiple protruding portion is parallel with the side of the conductive bar, also, the multiple protruding portion
Width changes with the distance between side with the conductive bar.
2. power package structure according to claim 1, which is characterized in that first group of pin is in finger-like；
Second group of pin is in branch-like.
3. power package structure according to claim 1, which is characterized in that each protruding portion in the multiple protruding portion
On be provided with one group of conductive column.
4. power package structure according to claim 3, which is characterized in that the shape of second contact surface includes step
Shape.
5. power package structure according to claim 4, which is characterized in that the order of the step shape is more than or equal to 2.
6. power package structure according to claim 5, which is characterized in that the position of the conductive column and quantity with it is described
The position of step shape and quantity are corresponding.
7. power package structure according to claim 6, which is characterized in that led described in each step shape is corresponding
The quantity of electric column is greater than or equal to 2.
8. power package structure according to claim 3, which is characterized in that the width of the multiple protruding portion with institute
The distance between side of conductive bar is stated to increase and reduce.
9. power package structure according to claim 8, which is characterized in that the diameter of conductive column in one group of conductive column
As the distance between the side with the conductive bar increases and reduce.
10. power package structure according to claim 3, which is characterized in that the width of the multiple protruding portion with
The distance between side of the conductive bar increases and increases.
11. power package structure according to claim 3, which is characterized in that conductive column is straight in one group of conductive column
Diameter increases as the distance between the side with the conductive bar increases.
12. power package structure according to claim 1, which is characterized in that first group of pin include with its first
The opposite second surface in surface and from second surface pin part outstanding；
Second group of pin includes the second surface opposite with its first surface and from second surface pin outstanding
Part.
13. power package structure according to claim 12, which is characterized in that the surface of the pin part is from the envelope
Expose in dress body, for being electrically connected between external circuit.
14. power package structure according to claim 1, which is characterized in that draw adjacent to each other in second group of pin
The multiple protruding portion of foot is staggered.
15. power package structure according to claim 14, which is characterized in that draw adjacent to each other in second group of pin
Minimum spacing between the multiple protruding portion of foot is more than or equal to 500 microns.
16. -15 any power package structure according to claim 1, which is characterized in that the angle of the cuboid includes circle
Angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821207285.6U CN208819863U (en) | 2018-07-27 | 2018-07-27 | Power package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821207285.6U CN208819863U (en) | 2018-07-27 | 2018-07-27 | Power package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208819863U true CN208819863U (en) | 2019-05-03 |
Family
ID=66271787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821207285.6U Active CN208819863U (en) | 2018-07-27 | 2018-07-27 | Power package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208819863U (en) |
-
2018
- 2018-07-27 CN CN201821207285.6U patent/CN208819863U/en active Active
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