CN107726271A - A kind of heat abstractor of great power LED module - Google Patents
A kind of heat abstractor of great power LED module Download PDFInfo
- Publication number
- CN107726271A CN107726271A CN201711114666.XA CN201711114666A CN107726271A CN 107726271 A CN107726271 A CN 107726271A CN 201711114666 A CN201711114666 A CN 201711114666A CN 107726271 A CN107726271 A CN 107726271A
- Authority
- CN
- China
- Prior art keywords
- thermal
- collecting tube
- heat abstractor
- lamp bead
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of heat abstractor of great power LED module, including radiator and lamp bead substrate, combine closely the lower surface of the lamp bead substrate and the radiator, the radiator includes thermal-collecting tube and fins set, the fins set is fixed on the thermal-collecting tube, and the lower surface of the thermal-collecting tube is combined with the lamp bead substrates into intimate.A kind of heat abstractor of great power LED module of the present invention is in the confined space, flat hot pipe is integrated to greatest extent, and in view of the manufacture craft and producing efficiency in production process, it is high to make thermal-arrest, area of dissipation, increase the number of fins of fins set, the dense degree of metal fin is improved, increases area of dissipation, improves the radiating efficiency of integral heat dissipation means；By collecting the cooperation of hot-zone and radiating area, the exchange of trip temperature is entered by low-boiling point liquid, so as to reduce the design of heat exchange interface, avoid to greatest extent in process of production heat exchange interface there is the probability of heat conduction failure, improve the reliability of integral heat dissipation means.
Description
Technical field
The invention belongs to technical field of semiconductor illumination, specifically, is related to a kind of radiating dress of great power LED module
Put.
Background technology
Great power LED is forth generation green light source, and its light efficiency is prominent, energy consumption is low, the environmentally friendly, long-life, is turned into instead of tradition
The ideal chose of road-light light-source, it is set to be used widely in road lighting field.Yet with semiconductor light-emitting-diode core
The limitation of chip technology, LED photoelectric transformation efficiency need to be improved.When great power LED works, most electric energy is converted
For heat energy, chip temperature is caused to rise, photoelectric properties decline.Therefore need to carry out radiating work, to ensure various great power LEDs
The normal work of module.
The patent of Patent No. 201520203679.4 discloses a kind of heat abstractor of LED street lamp heat pipe and pin post, bag
The first radiating part is included, fin structure has heat sinking function thereon, and the first radiating part bottom is equipped with the radiating part of lamp bead second, its
Upper to have heat-pipe radiator structure, the heat-pipe radiator is fixedly connected and is interspersed between fin with the first radiating part bottom
And the 3rd radiating part, it has a pin post heat spreader structures, and the 3rd radiating part is arranged at the top of the second radiating part and with the
Closely wherein, the 3rd radiating part is arranged on outside lampshade two radiating parts for connection.
But in the radiator entirety of above-mentioned heat abstractor, heat pipe design quantity is few, make its heat-transfer effect not high enough.Pin post
Design attitude some by heat pipe occupy-place, make its radiating effect not high enough.Two above combined factors cause its integral heat sink
Efficiency is relatively low, and with pin rod structure when welding is combined, precision is difficult to control heat pipe, inconvenience combination, can not easily be alignd, and
The careless slightly monomer that may destroy heat pipe and pin post, causes waste of material, devises lower thermally conductive sheet and upper thermally conductive sheet, uses
Thermally conductive sheet it is excessive, cause thermally-conductive interface excessive, be possible in process of production occur heat exchange interface radiating layer of paste materials have
The problem of difference, can increase the probability of the heat-conducting effect difference at heat exchange interface.
The content of the invention
The technical problem to be solved of the present invention is to provide one kind.
The present invention solve above-mentioned technical problem technical scheme be：
A kind of heat abstractor of great power LED module, including radiator and lamp bead substrate, the lamp bead substrate and the radiator
Lower surface combine closely, the radiator includes thermal-collecting tube and fins set, and the fins set is fixed on the thermal-collecting tube, institute
The lower surface for stating thermal-collecting tube is combined with the lamp bead substrates into intimate.
Specifically, the thermal-collecting tube includes collection hot-zone, radiating area and bonding pad, the bonding pad connection collection hot-zone with
Radiating area, the collection hot-zone lower surface are combined with the lamp bead substrates into intimate.
Specifically, the U-shaped structure of thermal-collecting tube.
Preferably, the radiating area is provided with concavo-convex band, and the concavo-convex band uniform fold is on the radiating area outer surface.
Formed specifically, the thermal-collecting tube is arranged side by side by some flat hot pipes.
Specifically, the flat hot pipe inner hollow, is sealed with low-boiling point liquid.
Specifically, the lamp bead substrate and the radiator inter-coat have one layer of radiating layer of paste, the radiating layer of paste with
The lamp bead substrate, the radiator are combined closely.
Specifically, the fins set includes some interlayer fins, the interlayer fin is uniformly arranged and fixed in the collection
The centre of heat pipe.
Specifically, the fins set also includes some upper strata fins, the upper strata fin is uniformly arranged and fixed described
The upper surface of thermal-collecting tube.
Preferably, the interlayer fin and the upper strata fin are sheet metal, are fixed by welding in the thermal-arrest
Guan Shang, the sheet metal are wavy three-dimensional thin slice.
The present invention's has the advantages that：The heat abstractor of the present invention integrates to greatest extent in the confined space
Flat hot pipe, and in view of the manufacture craft and producing efficiency in production process, thermal-arrest, area of dissipation height are made, and be easy to
The thermal-collecting tube of production and processing, the number of fins of fins set is increased, improve the dense degree of metal fin, increased area of dissipation, carry
The radiating efficiency of high integral heat dissipation means；By collecting the cooperation of hot-zone and radiating area, the friendship of trip temperature is entered by low-boiling point liquid
Change, so as to reduce the design of heat exchange interface, avoid to greatest extent in process of production heat exchange interface there is the general of heat conduction failure
Rate, improve the reliability of integral heat dissipation means.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the present invention；
Fig. 2 is the internal structure schematic diagram of the heat collector of the present invention；
Fig. 3 is the structural representation of the radiator of embodiments of the invention 1；
Fig. 4 is the structural representation of the radiator of embodiments of the invention 2；
The meaning that each sequence number represents in accompanying drawing is as follows：
1 thermal-collecting tube, 11 collection hot-zones, 12 radiating areas, 13 bonding pads, 14 concavo-convex bands, 15 flat hot pipes, 2 fins sets, 21 interlayer wings
Piece, 22 upper strata fins, 3 lamp bead substrates.
Embodiment
Fig. 1 is a kind of heat abstractor overall structure of great power LED module of the present invention, is the entirety of embodiment
Structure embodies, and 2 ~ 4 couples of present invention elaborate below in conjunction with the accompanying drawings.
Embodiment 1：
A kind of heat abstractor of great power LED module of the embodiment of the present invention 1 is as shown in Fig. 2 ~ 3, including radiator and lamp bead base
Plate 3, the lower surface of the lamp bead substrate 3 and the radiator are combined closely, and the radiator includes thermal-collecting tube 1 and fins set 2,
The fins set 2 is fixed on the thermal-collecting tube 1, and the lower surface of the thermal-collecting tube 1 is combined closely with the lamp bead substrate 3.Tool
Body, the lamp bead substrate 3 has one layer of radiating layer of paste with the radiator inter-coat（Do not indicated in figure）, the radiating layer of paste
Combined closely with the lamp bead substrate 3, the radiator.The lamp bead substrate 3 is sheet metal, and its lower surface is evenly distributed with
Large-power LED light bead, upper surface are combined closely with radiator by the layer of paste that radiates, fit together, and pass through the company for the layer of paste that radiates
Connect, enable LED lamp bead when working caused heat by the heat conduction of lamp bead substrate 3, be directed to the thermal-collecting tube 1 of radiator
In, heat exchange is formed, so as to which the amount of heat given out when LED lamp bead is worked is transmitted to the external world by radiator.
Specifically, the thermal-collecting tube 1 includes collection hot-zone 11, radiating area 12 and bonding pad 13, the bonding pad 13 connects institute
Collection hot-zone 11 and radiating area 12 are stated, the collection lower surface of hot-zone 11 is combined closely with the lamp bead substrate 3.Collect hot-zone 11 and radiating
Area 12 is linear pattern, and bonding pad 13 is arcuate structure, arc both ends connection collection hot-zone 11 and the radiating area 12 of bonding pad 13, is made whole
1 U-shaped structure of body thermal-collecting tube.Preferably, the radiating area 12 is provided with concavo-convex band 14, and the concavo-convex uniform fold of band 14 is in institute
State on the outer surface of radiating area 12.Concavo-convex band 14 is integrally formed with radiating area 12, is specifically distributed in the upper surface of radiating area 12, makes to dissipate
The upper surface of hot-zone 12 and the surface area of contacting external air increase, and increase the area of dissipation of radiating area 12, make dissipating for radiator
Thermal velocity is faster.
The thermal-collecting tube 1 is integrally formed, and is arranged side by side and formed by some U-shaped flat hot pipes 15, specially parallel
Row, whole thermal-collecting tube 1 is formed U-shaped banding, make production and processing more convenient while increasing area of dissipation.Specifically, institute
The inner hollow of flat hot pipe 15 is stated, is sealed with low-boiling point liquid, when LED lamp bead is non-lit up, low-boiling point liquid stops in liquid
In the flat hot pipe 15 of collection hot-zone 11, when LED lamp bead normal work, because the heat that LED lamp bead is distributed passes through lamp bead base
The conduction of plate 3 integrates the outer wall of hot-zone 11 as made of metal, can play a part of heat exchange into collection hot-zone 11, but more
Heat sinking function is embodied in the low-boiling point liquid inside flat hot pipe 15 by after thermal evaporation, and gas rises, and passes through bonding pad 13, transmission
To radiating area 12, liquefied after the cooling of radiating area 12, stream assembles hot-zone 11 again, forms quick heat exchange reaction, and existing
Technology is different by the way of large number of thermally conductive sheet, and which is radiated using low-boiling point liquid, will not be because excessive
The connection of thermally conductive sheet, because of the difference or other reasonses of the layer of paste that radiates, the problem of causing radiating effect difference, in addition, using low boiling
Point liquid, on the basis of existing for enough area of dissipations, can ensure that the bulk temperature of radiator maintains low-boiling point liquid
Boiling point below, can cross ensure LED lamp bead radiating efficiency, ensure the normal work of LED lamp bead, and extend LED lamp bead
Service life.
Specifically, the fins set 2 includes some interlayer fins 21, the interlayer fin 21 is uniformly arranged and fixed in institute
The centre of thermal-collecting tube 1 is stated, the interlayer fin 21 is sheet metal, is fixed by welding on the thermal-collecting tube 1, the metal
Thin slice is wavy three-dimensional thin slice.Interlayer fin 21 is welded on the U-shaped hollow space of thermal-collecting tube 1, specifically interlayer fin 21
A side be welded on the lower surface of radiating area 12, ensure that interlayer fin 21 can keep good heat exchange with radiating area 12,
The heat of radiating area 12 is set to be dispersed into the external world by the outer surface of interlayer fin 21, interlayer fin 21 preferably has wave
The three-dimensional thin slice of shape, uniform, parallel and compact distribution is large number of, enable the outer surface of interlayer fin 21 preferably with
Air is in contact, and distributes heat to the external world faster.
Embodiment 2：
The present embodiment is substantially the same manner as Example 1, and difference part is：As shown in figure 4, the fins set 2 also include it is some
Upper strata fin 22, the upper strata fin 22 are uniformly arranged and fixed in the upper surface of the thermal-collecting tube 1.The upper strata fin 22 is gold
Belong to thin slice, be fixed by welding on the thermal-collecting tube 1, the sheet metal is wavy three-dimensional thin slice.The upper strata wing
The arrangement mode of piece 22 is preferably identical with the arrangement mode of the interlayer fin 21, large number of.Upper strata fin 22 is welded on scattered
The upper surface of hot-zone 12, i.e., on concavo-convex band 14, on the premise of concavo-convex band 14 increases radiating contact area, radiating area 12 can be made
Heat be synchronously transmitted to upper strata fin 22, by the abundant contact with air so as to be dispersed into the external world, improve radiating efficiency.
According to existing technological achievement, the thermal conductivity factor of aluminium alloy is about 200 W/ (m K), and the thermal conductivity factor of copper is about
390 W/ (m K), because of the presence of low-boiling point liquid, the thermal conductivity factor of the flat hot pipe 15 used in the present invention is up to 3
In the range of 000 ~ 10 000 W/ (m K), coefficient of heat transfer is higher.Aluminium alloy or copper etc. can be used in the main body of the radiator of the present invention
The metal of excellent heat conductivity is made, and coordinates the interior flat hot pipe 15 provided with low-boiling point liquid to ensure overall radiating efficiency.
Therefore, the horizontal heat transfer rate of U-shaped integrated thermal tubular construction will be much larger than using pure wing made of aluminium alloy or copper
Longitudinal heat transfer structure of chip architecture.
Therefore, U-shaped integrated form heat-pipe radiator structure is added to single fin radiator structure, can be by heat more rapidly
Ground is delivered to the middle part of pure fin structure, the top half of pure fin is received amount of heat ahead of time and is radiated.
In the present invention, the surface area heat dissipation design parameter of each part, it can be tried to achieve by Fourier's law,
WhereinFor the thermal conductivity factor of part, s is the heat transfer surface area of part, and t is the Excess temperature of part, and x is the seat on thermal conductive surface
Mark.Thus formula designs the surface area of thermal-collecting tube 1, and the parameter such as the length proportioning of fins set 2, surface curvature.By this
Formula, the structure radiating effect that can clearly embody the present invention are substantially better than the radiating effect of prior art.
Above content is to combine the further description that specific preferred embodiment is done to the present invention, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, some simple deduction or replace can also be made, should all be considered as belonging to the present invention's
Protection domain.
Claims (10)
1. a kind of heat abstractor of great power LED module, including radiator and lamp bead substrate（3）, the lamp bead substrate（3）With institute
Combine closely the lower surface for stating radiator, it is characterised in that：The radiator includes thermal-collecting tube（1）With fins set（2）, the wing
Piece group（2）It is fixed on the thermal-collecting tube（1）On, the thermal-collecting tube（1）Lower surface and the lamp bead substrate（3）Combine closely.
2. heat abstractor according to claim 1, it is characterised in that：The thermal-collecting tube（1）Including collecting hot-zone（11）, radiating
Area（12）With bonding pad（13）, the bonding pad（13）Connect the collection hot-zone（11）With radiating area（12）, the collection hot-zone
（11）Lower surface and the lamp bead substrate（3）Combine closely.
3. heat abstractor according to claim 2, it is characterised in that：The thermal-collecting tube（1）U-shaped structure.
4. heat abstractor according to claim 2, it is characterised in that：The radiating area（12）It is provided with concavo-convex band（14）,
The concavo-convex band（14）Uniform fold is in the radiating area（12）On outer surface.
5. heat abstractor according to claim 1, it is characterised in that：The thermal-collecting tube（1）By some flat hot pipes
（15）Be arranged side by side composition.
6. heat abstractor according to claim 5, it is characterised in that：The flat hot pipe（15）Inner hollow, it is sealed with
Low-boiling point liquid.
7. according to the heat abstractor described in claim 1-6 any one, it is characterised in that：The lamp bead substrate（3）With it is described
Radiator inter-coat has one layer of radiating layer of paste, the radiating layer of paste and the lamp bead substrate（3）, the radiator closely ties
Close.
8. according to the heat abstractor described in claim 1-6 any one, it is characterised in that：The fins set（2）If include
Dry interlayer fin（21）, the interlayer fin（21）It is uniformly arranged and fixed in the thermal-collecting tube（1）Centre.
9. heat abstractor according to claim 8, it is characterised in that：The fins set（2）Also include some upper strata wings
Piece（22）, the upper strata fin（22）It is uniformly arranged and fixed in the thermal-collecting tube（1）Upper surface.
10. heat abstractor according to claim 9, it is characterised in that：The interlayer fin（21）With the upper strata fin
（22）It is sheet metal, is fixed by welding in the thermal-collecting tube（1）On, the sheet metal is that wavy solid is thin
Piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711114666.XA CN107726271A (en) | 2017-11-13 | 2017-11-13 | A kind of heat abstractor of great power LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711114666.XA CN107726271A (en) | 2017-11-13 | 2017-11-13 | A kind of heat abstractor of great power LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107726271A true CN107726271A (en) | 2018-02-23 |
Family
ID=61214480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711114666.XA Pending CN107726271A (en) | 2017-11-13 | 2017-11-13 | A kind of heat abstractor of great power LED module |
Country Status (1)
| Country | Link |
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| CN (1) | CN107726271A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109798504A (en) * | 2019-04-09 | 2019-05-24 | 广州爱奇实业有限公司 | A kind of radiator for high-powered LED lamp |
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| CN201652263U (en) * | 2009-11-23 | 2010-11-24 | 四川新力光源有限公司 | Heat radiating device of light-emitting diode (LED) illuminating lamp |
| CN201697088U (en) * | 2010-06-25 | 2011-01-05 | 陕西流金数码光电科技有限公司 | Superconducting heat radiator of heat pipes used for illumination of high-power semiconductor |
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| CN102109155A (en) * | 2009-12-24 | 2011-06-29 | 谢庆生 | High-power LED (light emitting diode) field lamp heat dissipation device of heat pipe heat conduction type |
| CN204494340U (en) * | 2015-04-07 | 2015-07-22 | 吉林大学 | The heat abstractor of a kind of LED street lamp heat pipe and pin post |
| CN206540101U (en) * | 2017-02-17 | 2017-10-03 | 中山市久能光电科技有限公司 | A kind of radiator applied to LED |
| CN207394786U (en) * | 2017-11-13 | 2018-05-22 | 广东金源照明科技股份有限公司 | A kind of radiator of great power LED module |
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Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201074794Y (en) * | 2007-05-30 | 2008-06-18 | 黄成功 | Cooling device of LED lamp |
| CN201129677Y (en) * | 2007-11-12 | 2008-10-08 | 廖钦彬 | Lamp fitting structure |
| CN201652263U (en) * | 2009-11-23 | 2010-11-24 | 四川新力光源有限公司 | Heat radiating device of light-emitting diode (LED) illuminating lamp |
| CN102109155A (en) * | 2009-12-24 | 2011-06-29 | 谢庆生 | High-power LED (light emitting diode) field lamp heat dissipation device of heat pipe heat conduction type |
| CN201697088U (en) * | 2010-06-25 | 2011-01-05 | 陕西流金数码光电科技有限公司 | Superconducting heat radiator of heat pipes used for illumination of high-power semiconductor |
| CN201819173U (en) * | 2010-09-16 | 2011-05-04 | 保定华之澳光电有限公司 | Circulation heat tube radiator for LED lamp |
| CN204494340U (en) * | 2015-04-07 | 2015-07-22 | 吉林大学 | The heat abstractor of a kind of LED street lamp heat pipe and pin post |
| CN206540101U (en) * | 2017-02-17 | 2017-10-03 | 中山市久能光电科技有限公司 | A kind of radiator applied to LED |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109798504A (en) * | 2019-04-09 | 2019-05-24 | 广州爱奇实业有限公司 | A kind of radiator for high-powered LED lamp |
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 521011 factory building (1-3), plot d5-8-3, Beizhan West Road, Chaozhou Economic Development Experimental Zone, Chaozhou City, Guangdong Province Applicant after: Guangdong Jinyuan solar energy Co.,Ltd. Address before: 521011 factory building (1-3), plot d5-8-3, Beizhan West Road, Chaozhou Economic Development Experimental Zone, Chaozhou City, Guangdong Province Applicant before: GUANGDONG JINYUAN LIGHTING TECHNOLOGY Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180223 |
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| RJ01 | Rejection of invention patent application after publication |