CN107722851A - The mucigel of acid and alkali-resistance electric adhesive tape - Google Patents

The mucigel of acid and alkali-resistance electric adhesive tape Download PDF

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Publication number
CN107722851A
CN107722851A CN201711086362.7A CN201711086362A CN107722851A CN 107722851 A CN107722851 A CN 107722851A CN 201711086362 A CN201711086362 A CN 201711086362A CN 107722851 A CN107722851 A CN 107722851A
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CN
China
Prior art keywords
parts
mucigel
adhesive tape
acid
styrene
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Pending
Application number
CN201711086362.7A
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Chinese (zh)
Inventor
张永宏
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Individual
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Individual
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Priority to CN201711086362.7A priority Critical patent/CN107722851A/en
Publication of CN107722851A publication Critical patent/CN107722851A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C08K2003/321—Phosphates
    • C08K2003/322—Ammonium phosphate
    • C08K2003/323—Ammonium polyphosphate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention provides the mucigel of acid and alkali-resistance electric adhesive tape, is related to adhesive tape area, the mucigel is made up of the component of following parts by weight：22 35 parts of melamine copolymer resins, 22 35 parts of styrene maleic anhydride copolymer, 22 35 parts of acrylonitrile-butadiene rubber powder, 8 12 parts of ethanol, 16 23 parts of dioctyl phthalate, 5.5 10 parts of APP, 12 16 parts of triphenyl phosphate, 20 25 parts of styrene-butadiene-copolymer, 5 10 parts of graphene, 5.5 10 parts of triethylamine, 15 19 parts of polyimides, 5 10 parts of activated carbon, 14 20 parts of sodium allylsulfonate, 25 parts of polyester resin, 48 parts of dimethicone, 12 16 parts of MDA, 0.4 0.5 parts of calcium sulphate dihydrate, 8 16 parts of amyl propionate；The invention provides the mucigel of acid and alkali-resistance electric adhesive tape, the mucigel viscosity of electric adhesive tape of the present invention is good, and application cost is low, the cost of material is low, is easily achieved, the product quality of production is stable, has good acid-proof alkaline, there is higher application value.

Description

The mucigel of acid and alkali-resistance electric adhesive tape
Technical field
The present invention relates to adhesive tape area, and in particular to the mucigel of acid and alkali-resistance electric adhesive tape.
Background technology
With the rapid development of electronic technology, integrated circuit physical size gradually reduces, integrated level is improving constantly.So far Untill FPC manufacturing process be nearly all to be also known as etching method using subtractive process to process, generally using copper coated foil plate as the material that sets out Material, using photoetching process formed resist layer, etching remove should not part copper face formed circuit conductor, then HTHP pressing cover Epiphragma forms wiring board.Acid and alkali-resistance, High temperature-resistanadhesive adhesive tape are needed in this wiring board formation process, copper coated foil plate is protected, It is not corroded the circuit pack to photoetching by acid-base property decoction in circuit etching, and protected in cover layer bonding processes It is not destroyed, and needs to remove this adhesive tape after the laminating end of cover layer, therefore it is required that this adhesive tape not only has resistance to elevated temperatures, and Want acid-alkali-corrosive-resisting, water-fast.At present, FPC manufacturing process is still individual layer operation, and production efficiency is poor, can also further carry It is high.
The content of the invention
In view of the shortcomings of the prior art, the invention provides the mucigel of acid and alkali-resistance electric adhesive tape so that adhesive tape has good Good acid-proof alkaline..
To realize object above, the present invention is achieved by the following technical programs：The mucigel of acid and alkali-resistance electric adhesive tape, The mucigel is made up of the component of following parts by weight：Melamine copolymer resins 22-35 parts, styrene-maleic anhydride copolymer Thing 22-35 parts, acrylonitrile-butadiene rubber powder 22-35 parts, ethanol 8-12 parts, dioctyl phthalate 16-23 parts, APP 5.5-10 It is part, triphenyl phosphate 12-16 parts, styrene-butadiene-copolymer 20-25 parts, graphene 5-10 parts, triethylamine 5.5-10 parts, poly- Acid imide 15-19 parts, activated carbon 5-10 parts, sodium allylsulfonate 14-20 parts, polyester resin 2-5 parts, dimethicone 4-8 parts, two Diaminodiphenylmethane 12-16 parts, calcium sulphate dihydrate 0.4-0.5 parts, amyl propionate 8-16 parts, amido silicon oil 6-10 parts, alkylol Acid amides 16-18 parts, epoxy modified phenolic resin 30-45 parts, Hydroxylated acrylic resin 16-18 parts.
Preferably, the mucigel is made up of the component of following parts by weight：Melamine copolymer resins 26-35 parts, benzene second Alkene-copolymer-maleic anhydride 22-30 parts, acrylonitrile-butadiene rubber powder 22-30 parts, ethanol 8-10 parts, dioctyl phthalate 16-20 Part, APP 5.5-8 parts, triphenyl phosphate 12-14 parts, styrene-butadiene-copolymer 20-23 parts, graphene 5-8 parts, three Ethamine 8-10 parts, polyimides 18-19 parts, activated carbon 7-10 parts, sodium allylsulfonate 14-18 parts, polyester resin 2-5 parts, diformazan Base silicone oil 4-8 parts, MDA 12-16 parts, calcium sulphate dihydrate 0.4-0.5 parts, amyl propionate 8-16 parts, amido silicon oil 6-10 parts, alkylolamides 16-18 parts, epoxy modified phenolic resin 30-40 parts, Hydroxylated acrylic resin 16-17 parts.
Preferably, the mucigel is made up of the component of following parts by weight：29 parts of melamine copolymer resins, styrene- 28 parts of copolymer-maleic anhydride, 28 parts of acrylonitrile-butadiene rubber powder, 9 parts of ethanol, 18 parts of dioctyl phthalate, 7 parts of APP, phosphorus 13 parts of triphenyl phosphate ester, 22 parts of styrene-butadiene-copolymer, 5 parts of graphene, 9 parts of triethylamine, 18 parts of polyimides, activated carbon 7 Part, 16 parts of sodium allylsulfonate, 2 parts of polyester resin, 4 parts of dimethicone, 16 parts of MDA, calcium sulphate dihydrate 0.4 Part, 14 parts of amyl propionate, 8 parts of amido silicon oil, 16 parts of alkylolamides, 35 parts of epoxy modified phenolic resin, hydroxy acrylic acid tree 16 parts of fat.
The invention provides the mucigel of acid and alkali-resistance electric adhesive tape, the mucigel viscosity of electric adhesive tape of the present invention Good, application cost is low, and the cost of material is low, is easily achieved, and the product quality of production is stable, has good acid-proof alkaline, has Higher application value.
Embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, Obviously, described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based in the present invention Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all Belong to the scope of protection of the invention.
In description of the invention, it is also necessary to explanation, unless otherwise clear and definite regulation and limitation, term " setting ", " peace Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly Connection, can be mechanical connection or electrical connection, can be directly connected to or be connected by intermediary, can To be the connection of two element internals.For the ordinary skill in the art, can understand as the case may be above-mentioned The concrete meaning of term in the present invention.
Embodiment 1：
The mucigel of acid and alkali-resistance electric adhesive tape, the mucigel are made up of the component of following parts by weight：Melamine is copolymerized Resin 22-35 parts, styrene-maleic anhydride copolymer 22-35 parts, acrylonitrile-butadiene rubber powder 22-35 parts, ethanol 8-12 parts, adjacent benzene two Formic acid dioctyl ester 16-23 parts, APP 5.5-10 parts, triphenyl phosphate 12-16 parts, styrene-butadiene-copolymer 20-25 Part, graphene 5-10 parts, triethylamine 5.5-10 parts, polyimides 15-19 parts, activated carbon 5-10 parts, sodium allylsulfonate 14-20 Part, polyester resin 2-5 parts, dimethicone 4-8 parts, MDA 12-16 parts, calcium sulphate dihydrate 0.4-0.5 parts, third Sour pentyl ester 8-16 parts, amido silicon oil 6-10 parts, alkylolamides 16-18 parts, epoxy modified phenolic resin 30-45 parts, hydroxyl third Olefin(e) acid resin 16-18 parts.
Embodiment 2：
The mucigel of acid and alkali-resistance electric adhesive tape, the mucigel are made up of the component of following parts by weight：Melamine is copolymerized 29 parts of resin, 28 parts of styrene-maleic anhydride copolymer, 28 parts of acrylonitrile-butadiene rubber powder, 9 parts of ethanol, dioctyl phthalate 18 Part, 7 parts of APP, 13 parts of triphenyl phosphate, 22 parts of styrene-butadiene-copolymer, 5 parts of graphene, 9 parts of triethylamine, polyamides 18 parts of imines, 7 parts of activated carbon, 16 parts of sodium allylsulfonate, 2 parts of polyester resin, 4 parts of dimethicone, MDA 16 Part, 0.4 part of calcium sulphate dihydrate, 14 parts of amyl propionate, 8 parts of amido silicon oil, 16 parts of alkylolamides, epoxy modified phenolic resin 35 Part, 16 parts of Hydroxylated acrylic resin.
The invention provides the mucigel of acid and alkali-resistance electric adhesive tape, the mucigel viscosity of electric adhesive tape of the present invention Good, application cost is low, and the cost of material is low, is easily achieved, and the product quality of production is stable, has good acid-proof alkaline, has Higher application value.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments The present invention is described in detail, it will be understood by those within the art that：It still can be to foregoing each implementation Technical scheme described in example is modified, or carries out equivalent substitution to which part technical characteristic；And these modification or Replace, the essence of appropriate technical solution is departed from the spirit and scope of various embodiments of the present invention technical scheme.

Claims (3)

1. the mucigel of acid and alkali-resistance electric adhesive tape, it is characterised in that the mucigel is made up of the component of following parts by weight：Trimerization Cyanamide copolymer resins 22-35 parts, styrene-maleic anhydride copolymer 22-35 parts, acrylonitrile-butadiene rubber powder 22-35 parts, ethanol 8-12 Part, dioctyl phthalate 16-23 parts, APP 5.5-10 parts, triphenyl phosphate 12-16 parts, styrene butadiene are common Polymers 20-25 parts, graphene 5-10 parts, triethylamine 5.5-10 parts, polyimides 15-19 parts, activated carbon 5-10 parts, propene sulfonic acid Sodium 14-20 parts, polyester resin 2-5 parts, dimethicone 4-8 parts, MDA 12-16 parts, calcium sulphate dihydrate 0.4- 0.5 part, amyl propionate 8-16 parts, amido silicon oil 6-10 parts, alkylolamides 16-18 parts, epoxy modified phenolic resin 30-45 Part, Hydroxylated acrylic resin 16-18 parts.
2. the mucigel of acid and alkali-resistance electric adhesive tape as claimed in claim 1, it is characterised in that the mucigel is by following weight The component of part is made：Melamine copolymer resins 26-35 parts, styrene-maleic anhydride copolymer 22-30 parts, acrylonitrile-butadiene rubber powder 22-30 parts, ethanol 8-10 parts, dioctyl phthalate 16-20 parts, APP 5.5-8 parts, triphenyl phosphate 12-14 parts, Styrene-butadiene-copolymer 20-23 parts, graphene 5-8 parts, triethylamine 8-10 parts, polyimides 18-19 parts, activated carbon 7-10 Part, sodium allylsulfonate 14-18 parts, polyester resin 2-5 parts, dimethicone 4-8 parts, MDA 12-16 parts, two water Calcium sulfate 0.4-0.5 parts, amyl propionate 8-16 parts, amido silicon oil 6-10 parts, alkylolamides 16-18 parts, epoxide modified phenolic aldehyde Resin 30-40 parts, Hydroxylated acrylic resin 16-17 parts.
3. the mucigel of acid and alkali-resistance electric adhesive tape as claimed in claim 1, it is characterised in that the mucigel is by following weight The component of part is made：29 parts of melamine copolymer resins, 28 parts of styrene-maleic anhydride copolymer, 28 parts of acrylonitrile-butadiene rubber powder, second 9 parts of alcohol, 18 parts of dioctyl phthalate, 7 parts of APP, 13 parts of triphenyl phosphate, 22 parts of styrene-butadiene-copolymer, 5 parts of graphene, 9 parts of triethylamine, 18 parts of polyimides, 7 parts of activated carbon, 16 parts of sodium allylsulfonate, 2 parts of polyester resin, dimethyl 4 parts of silicone oil, 16 parts of MDA, 0.4 part of calcium sulphate dihydrate, 14 parts of amyl propionate, 8 parts of amido silicon oil, alkylol acyl 16 parts of amine, 35 parts of epoxy modified phenolic resin, 16 parts of Hydroxylated acrylic resin.
CN201711086362.7A 2017-11-07 2017-11-07 The mucigel of acid and alkali-resistance electric adhesive tape Pending CN107722851A (en)

Priority Applications (1)

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CN201711086362.7A CN107722851A (en) 2017-11-07 2017-11-07 The mucigel of acid and alkali-resistance electric adhesive tape

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CN201711086362.7A CN107722851A (en) 2017-11-07 2017-11-07 The mucigel of acid and alkali-resistance electric adhesive tape

Publications (1)

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CN107722851A true CN107722851A (en) 2018-02-23

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106987211A (en) * 2017-03-29 2017-07-28 常州驰科光电科技有限公司 The glued membrane and preparation method of a kind of bonding Dome chip architecture skeletons

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106987211A (en) * 2017-03-29 2017-07-28 常州驰科光电科技有限公司 The glued membrane and preparation method of a kind of bonding Dome chip architecture skeletons

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Application publication date: 20180223

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