CN106987211A - The glued membrane and preparation method of a kind of bonding Dome chip architecture skeletons - Google Patents
The glued membrane and preparation method of a kind of bonding Dome chip architecture skeletons Download PDFInfo
- Publication number
- CN106987211A CN106987211A CN201710195475.4A CN201710195475A CN106987211A CN 106987211 A CN106987211 A CN 106987211A CN 201710195475 A CN201710195475 A CN 201710195475A CN 106987211 A CN106987211 A CN 106987211A
- Authority
- CN
- China
- Prior art keywords
- glued membrane
- mill
- weight
- parts
- skeletons
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C09J161/14—Modified phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Abstract
The present invention relates to a kind of glued membrane of bonding Dome chip architecture skeletons and preparation method, following component is included：Structural bond resin：46~60 parts by weight；Can film forming rubber：12~40 parts by weight；Curing agent：4.6~9 parts by weight；Antiager：1.5~3.0 parts by weight；Stabilizer：1.0~2.5 parts by weight；Defoamer：0.2~0.6 parts by weight.The present invention by preferred structure adhering resin and with preferred consolidation agent, high rigidity after glued membrane solidification can effectively be solved, high rigidity and high temperature tolerance problem, it is preferred that film forming rubber and antiager, stabilizer and defoamer make glued membrane have good stability and filming performance, it is easy to realize ultrathin requirement of the Dome pieces to glued membrane by heat pressing process.
Description
Technical field
The invention belongs to vibrating diaphragm Dome chip architecture adhesives technical fields, more particularly to a kind of hot melt of heating curable
Glued membrane.
Technical background
Hot melt adhesive film is divided into general thermoplasticity and the major class of thermosetting glued membrane two, is a kind of bonding for needing to heat realization
Adhesive tape, pollution-free due to without solvent, production technology is relatively easy, is an important composition in adhesive tape product.
The relatively conventional thermoplasticity glued membrane of such glued membrane has following feature：1) hardness is high after solidifying, and shore D reaches 85HD；
2) temperature tolerance after solidifying can be long-term 180 DEG C, short-term 250 DEG C；3) after solidifying, have good bonding with aluminium foil, bubble cotton-like material
Power, and it is resistant to bending, ageing-resistant；4) specific modulus (the E/ ρ of cured glue film：The ratio of modulus of elasticity and density of material) it is high；More than
Performance can meet in voice coil designs to Dome piece requirements.
Traditional glued membrane is usually thermoplastic, such as EVA adhesive film, PVB glued membranes, acrylic glued membrane, and formula includes resin, resisted
Old agent, stabilizer, lubricant and defoamer etc., wherein resin includes：The big polymer of EVA, PVB, polyolefin equimolecular quantity；It is anti-
Old agent can mainly increase glued membrane ageing resistance during production or use；Stabilizer, lubricant and defoamer mainly exist
The problems such as bubble, solid accumulation and unstable viscosity for reducing the unstable of colloid in glued membrane production and occur.
By being limited for traditional glued membrane formula, therefore more than 140 DEG C temperature of long-term heatproof are difficult to realize, hardness is also difficult to reach
Higher level, its high specific modulus is with regard to that can be more difficult to realize.
Patent CN20141772580.6 discloses a kind of preparation method of high temperature heat-resistant solidified glue film, but the film thickness
For 40-60um, it is difficult to meet the bonding requirements of vibrating diaphragm Dome pieces, and the patent glued membrane uses solution coating mode, complex process
And not environmentally.
Disclosed in patent CN201510333468.7 high temperature heat-resistant solidified glue film add heatproof filler, film forming stability compared with
Difference, and do not possess high rigidity after solidification, the performance of high rigidity, therefore also it is unsatisfactory for the viscous requirement of vibrating diaphragm Dome chip architectures.
The content of the invention
It is an object of the invention to provide a kind of adhesive film material of achievable bonding Dome chip architecture skeletons, pass through PUR
Film formulation is designed, it is rapid thermosetting to make it have and solidification after high temperature resistant, hardness it is good, the performance such as specific modulus height realizes sound
Circle design is to the high rigidity, high rigidity, high-temperature resistant of Dome pieces, the performance requirement such as high ratio modulus, high stability.
The technical scheme is that：
A kind of glued membrane of bonding Dome chip architecture skeletons, includes following component：Structural bond resin：46~60 parts by weight；
Can film forming rubber：12~40 parts by weight；Curing agent：4.6~9 parts by weight；Antiager：1.5~3.0 parts by weight；Stabilizer：1.0
~2.5 parts by weight；Defoamer：0.2~0.6 parts by weight.
Preferably：Structural bond resin is linear phenolic resin, epoxy modified phenolic resin, ba phenolic resin and organic
At least one of Si modification phenolic resin.
Preferably：Can film forming rubber be butadiene-styrene rubber, nitrile rubber, at least one of natural rubber.
Preferably：Curing agent be aromatic series, finger ring race and aliphatic category curing agent, can for vinyl triamine DETA,
Aminoethyl piperazine AE, m-phenylene diamine (MPD) m-PDA, MPD, diaminodiphenyl-methane DDM, HT-972, DEH-50, di-2-ethylhexylphosphine oxide hexamethylene
One or more in alkanamine, di-2-ethylhexylphosphine oxide phenylenediamine.
Preferably：One or more in antiager 124, RD, MB, DNP, NBC.
Preferably：Stabilizer be hydroquinones, p methoxy phenol, 1,4-benzoquinone, monofunctional acrylates' alicyclic monomer, it is double
Functional group's acrylate monomer.
Preferably：Defoamer is silicone emulsion, the fatty acid ester compounded thing of higher alcohols, polyoxyethylene polyoxypropylene Ji Wusi
Alcohol ether, polyoxyethylene polyoxy propyl alcohol amidogen ether, polypropylene glycerol aether and polyoxyethylene polyoxypropylene glycerin ether, polydimethylsiloxanes
One or more in alkane.
The present invention also provides the method for preparing above-mentioned glued membrane, comprises the following steps：
1) first can film forming rubber mill in mill, and add antiager, mill to Mooney viscosity 60~80；
2) by structural bond resin side mill, while mill can film forming rubber be added thereto, resin total amount add 1/
After 3-2/3, stabilizer and defoamer are added, and remaining resin is added thereto in the lump, continues mill to Mooney viscosity
70 or so；
3) mill can film forming rubber and resin Mooney viscosity reach requirement after, curing agent is all added and continued out
Refining, up to Mooney viscosity to 80~85；
4) by after mill can film forming rubber cut into slices, and using hot press carry out it is hot-forming be glued membrane.
Preferably：Film thickness 5um~20um.
Main advantages of the present invention are：
By preferred structure adhering resin and with preferred consolidation agent, can effectively solve glued membrane solidification after high rigidity, Gao Gang
Property and high temperature tolerance problem, preferably film forming rubber and antiager, stabilizer and defoamer make glued membrane have good stability and
Filming performance, it is easy to which ultrathin requirement of the Dome pieces to glued membrane is realized by heat pressing process.
Hot-forming using hot press progress, it is 5-20um to control film thickness, so as to reach that Dome pieces adhesive property will
Ask.Hot press forming technology is simple, and easy to operate, production cost is low, more competitive advantage.
By above-mentioned preferred feedstock and technique, made film thickness 5-20um, can 160 DEG C~180 DEG C, 3-30S
Interior solidification, with very high adhesive strength；The adhesive strength to aluminium foil, foam after solidification is high, peel strength ＞ 1.5KN/m
(to aluminium foil, foam material body without destruction)；Hardness is high after glued membrane individually solidifies, up to more than shore D85HD；Be bonded aluminium foil and
180 DEG C of foam test specimen, 168 hours unchanged；Specific modulus (the E/ ρ of cured glue film：The ratio of modulus of elasticity and density of material)
Height, reaches 2.67*105。
Embodiment
Embodiment 1：
First by nitrile rubber 3.5Kg in mill mill, and add antiager 0.15Kg hexamethylenetetramines, mill is extremely
Mooney viscosity is to 60~80；By epoxide modified phenolic aldehyde 5.5Kg resins side mill, rubber edge is added thereto, in epoxide modified phenolic aldehyde
Total amount is added after half, and 0.15Kg p methoxy phenols and 0.05Kg silicone emulsions are added, and will be remaining epoxide modified
Phenolic aldehyde is added thereto in the lump, continues mill Mooney viscosity to 70 or so；In mill rubber and the Mooney viscosity of epoxide modified phenolic aldehyde
Reach after requirement, 0.8Kg hexamethylenetetramines are all added and continue mill, up to Mooney viscosity to 80~85；By mill
Rubber afterwards is cut into slices, and hot-forming using hot press progress, and controls thickness 5-10um；As glued membrane.
Glued membrane is put between aluminium foil and aluminium foil, the hot pressing 5s under 170 DEG C, 3MPa pressure conditions obtains test sample, shelled
From intensity：1.55kN/m；Shore hardness after solidification:85HD；Test sample after above-mentioned solidification is placed in 180 DEG C of ageing ovens
168 hours, exemplar performance was constant.
Embodiment 2：
First by butadiene-styrene rubber 3.0Kg in mill mill, and add 0.15Kg hexamethylenetetramines, mill is viscous to Mooney
Spend to 60~80；By ba phenolic resin 2.5Kg and Effect of Organosilicon-modified Phenol-formaldehyde Resin 3.5Kg, resin side mill rubber edge adds it
In, after resin total amount adds half, 0.15Kg p methoxy phenols and 0.05Kg silicone emulsions are added, and will be remaining
Resin is added thereto in the lump, continues mill Mooney viscosity to 70 or so；Requirement is reached in the Mooney viscosity of mill rubber and resin
Afterwards, 0.8Kg hexamethylenetetramines are all added and continues mill, up to Mooney viscosity to 80~85；By the rubber after mill
Cut into slices, and it is hot-forming using hot press progress, and control 10~20um of thickness；As glued membrane.
Glued membrane is put between aluminium foil and aluminium foil, the hot pressing 5s under 170 DEG C, 3MPa pressure conditions obtains test sample, shelled
From intensity：1.56kN/m；Shore hardness after solidification:86HD；Test sample after above-mentioned solidification is placed in 180 DEG C of ageing ovens
168 hours, exemplar performance was constant.
Claims (9)
1. a kind of glued membrane of bonding Dome chip architecture skeletons, it is characterised in that：Include following component：
Structural bond resin：46~60 parts by weight；Can film forming rubber：12~40 parts by weight；Curing agent：4.6~9 parts by weight；It is anti-
Old agent：1.5~3.0 parts by weight；Stabilizer：1.0~2.5 parts by weight；Defoamer：0.2~0.6 parts by weight.
2. a kind of glued membrane of bonding Dome chip architecture skeletons as claimed in claim 1, it is characterised in that：Structural bond resin is
Linear phenolic resin, epoxy modified phenolic resin, at least one of ba phenolic resin and Effect of Organosilicon-modified Phenol-formaldehyde Resin.
3. a kind of glued membrane of bonding Dome chip architecture skeletons as claimed in claim 1, it is characterised in that：Can film forming rubber be fourth
Benzene rubber, nitrile rubber, at least one of natural rubber.
4. a kind of glued membrane of bonding Dome chip architecture skeletons as claimed in claim 1, it is characterised in that：Curing agent is fragrance
Race, finger ring race and aliphatic category curing agent, can for vinyl triamine DETA, aminoethyl piperazine AE, m-phenylene diamine (MPD) m-PDA,
One kind in MPD, diaminodiphenyl-methane DDM, HT-972, DEH-50, di-2-ethylhexylphosphine oxide hexamethylene alkanamine, di-2-ethylhexylphosphine oxide phenylenediamine
Or it is several.
5. a kind of glued membrane of bonding Dome chip architecture skeletons as claimed in claim 1, it is characterised in that：Antiager 124, RD,
One or more in MB, DNP, NBC.
6. a kind of glued membrane of bonding Dome chip architecture skeletons as claimed in claim 1, it is characterised in that：Stabilizer is to benzene two
Phenol, p methoxy phenol, 1,4-benzoquinone, monofunctional acrylates' alicyclic monomer, difunctional acrylate monomer.
7. a kind of glued membrane of bonding Dome chip architecture skeletons as claimed in claim 1, it is characterised in that：Defoamer is emulsification silicon
Oil, the fatty acid ester compounded thing of higher alcohols, polyoxyethylene polyoxypropylene pentaerythrite ether, polyoxyethylene polyoxy propyl alcohol amidogen ether, polyoxy
One or more in propylene glycerin ether, polyoxyethylene polyoxypropylene glycerin ether and dimethyl silicone polymer.
8. prepare the method for the glued membrane as described in claim 1-7 is any, it is characterised in that comprise the following steps：
1) first can film forming rubber mill in mill, and add antiager, mill to Mooney viscosity 60~80；
2) by structural bond resin side mill, while mill can film forming rubber be added thereto, resin total amount add 1/3-2/3
Afterwards, stabilizer and defoamer are added, and remaining resin is added thereto in the lump, continue mill left to Mooney viscosity 70
It is right；
3) mill can film forming rubber and resin Mooney viscosity reach requirement after, curing agent is all added and continues mill,
Up to Mooney viscosity to 80~85；
4) by after mill can film forming rubber cut into slices, and using hot press carry out it is hot-forming be glued membrane.
9. method as claimed in claim 8, it is characterised in that：Film thickness 5um~20um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710195475.4A CN106987211A (en) | 2017-03-29 | 2017-03-29 | The glued membrane and preparation method of a kind of bonding Dome chip architecture skeletons |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710195475.4A CN106987211A (en) | 2017-03-29 | 2017-03-29 | The glued membrane and preparation method of a kind of bonding Dome chip architecture skeletons |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106987211A true CN106987211A (en) | 2017-07-28 |
Family
ID=59412327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710195475.4A Pending CN106987211A (en) | 2017-03-29 | 2017-03-29 | The glued membrane and preparation method of a kind of bonding Dome chip architecture skeletons |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106987211A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107722851A (en) * | 2017-11-07 | 2018-02-23 | 张永宏 | The mucigel of acid and alkali-resistance electric adhesive tape |
| CN108893076A (en) * | 2018-06-21 | 2018-11-27 | 厦门华厦学院 | A kind of high-performance masking tape and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110317869A1 (en) * | 2010-06-25 | 2011-12-29 | Bridgestone Corporation | Loudspeaker diaphragm and loudspeaker including the loudspeaker diaphragm |
| CN104449434A (en) * | 2014-12-12 | 2015-03-25 | 青岛驰科工业技术有限公司 | High-temperature-resistant heat curing adhesive film and preparation method |
| CN104877583A (en) * | 2015-06-16 | 2015-09-02 | 黑龙江省科学院石油化学研究院 | High-temperature-resistant phenolic unsupported structural adhesive film and preparation method thereof |
| CN205017574U (en) * | 2015-10-13 | 2016-02-03 | 歌尔声学股份有限公司 | Speaker vibrates board and is equipped with speaker of this vibration board |
-
2017
- 2017-03-29 CN CN201710195475.4A patent/CN106987211A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110317869A1 (en) * | 2010-06-25 | 2011-12-29 | Bridgestone Corporation | Loudspeaker diaphragm and loudspeaker including the loudspeaker diaphragm |
| CN104449434A (en) * | 2014-12-12 | 2015-03-25 | 青岛驰科工业技术有限公司 | High-temperature-resistant heat curing adhesive film and preparation method |
| CN104877583A (en) * | 2015-06-16 | 2015-09-02 | 黑龙江省科学院石油化学研究院 | High-temperature-resistant phenolic unsupported structural adhesive film and preparation method thereof |
| CN205017574U (en) * | 2015-10-13 | 2016-02-03 | 歌尔声学股份有限公司 | Speaker vibrates board and is equipped with speaker of this vibration board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107722851A (en) * | 2017-11-07 | 2018-02-23 | 张永宏 | The mucigel of acid and alkali-resistance electric adhesive tape |
| CN108893076A (en) * | 2018-06-21 | 2018-11-27 | 厦门华厦学院 | A kind of high-performance masking tape and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103797043B (en) | Structure sticker and bonding application thereof | |
| CN102329594B (en) | Two-component urethane resin adhesive for polymer lithium ion battery flexible package film | |
| CN106987211A (en) | The glued membrane and preparation method of a kind of bonding Dome chip architecture skeletons | |
| CN111592849B (en) | Semi-cured epoxy adhesive film and preparation method thereof | |
| JP2014175459A (en) | Semiconductor device and semiconductor device manufacturing method | |
| CN105567145B (en) | Double-component structural adhesive and preparation method thereof | |
| TW202309232A (en) | Adhesive composition for laminating electrical steel sheet | |
| JP5742346B2 (en) | Curing agent composition for epoxy resin adhesive and adhesive for porous body | |
| JP2023017948A (en) | Adhesive composition, film-like adhesive, adhesive sheet, and method for manufacturing semiconductor device | |
| JP2017528576A (en) | Fast-curing composition | |
| CN105315933B (en) | A kind of antistripping instant drying adhesive and preparation method thereof | |
| CN103044859A (en) | Waterproof insulation epoxy resin composition, adhesive tape and preparation method thereof | |
| JP2017168850A (en) | Semiconductor device, manufacturing method of semiconductor device, and film-like adhesive | |
| CN107474750A (en) | A kind of glued membrane and its manufacture method | |
| JP6885339B2 (en) | Prepreg and fiber reinforced composites | |
| JP2004346092A (en) | Resin composition for prepreg | |
| CN109825033A (en) | A kind of light composite material and preparation method thereof of high Tg | |
| CN110740997A (en) | Epoxy resin system for composite materials | |
| CN102504742B (en) | Bonding glue quickly solidified at room temperature | |
| CN110184014A (en) | A kind of high viscosity Laminating adhesive and preparation method thereof | |
| CN114163975A (en) | Hot-melt pressure-sensitive adhesive and preparation method and use method thereof | |
| CN106497496A (en) | A kind of preparation method of montmorillonite modified polyurethane adhesive | |
| RU2628786C1 (en) | Multilayer self-adhesive material | |
| CN113930198A (en) | Oil-filled star-shaped rubber hot melt adhesive and preparation method thereof | |
| CN103242789B (en) | Sticking glue for sticking electrolytic zinc cathode plate insulation bar and production process of sticking glue |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170728 |
|
| RJ01 | Rejection of invention patent application after publication |