CN107709602B - 制造蒸镀掩模、有机半导体元件和有机el显示器的方法、蒸镀掩模准备体、及蒸镀掩模 - Google Patents

制造蒸镀掩模、有机半导体元件和有机el显示器的方法、蒸镀掩模准备体、及蒸镀掩模 Download PDF

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CN107709602B
CN107709602B CN201680036462.6A CN201680036462A CN107709602B CN 107709602 B CN107709602 B CN 107709602B CN 201680036462 A CN201680036462 A CN 201680036462A CN 107709602 B CN107709602 B CN 107709602B
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vapor deposition
resin
mask
deposition mask
protective sheet
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Chinese (zh)
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CN107709602A (zh
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武田利彦
穗刈久实子
曾根康子
小幡胜也
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to CN202010960637.0A priority Critical patent/CN112176284B/zh
Priority to CN202010959943.2A priority patent/CN112267091B/zh
Priority claimed from PCT/JP2016/069250 external-priority patent/WO2017006821A1/ja
Publication of CN107709602A publication Critical patent/CN107709602A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201680036462.6A 2015-07-03 2016-06-29 制造蒸镀掩模、有机半导体元件和有机el显示器的方法、蒸镀掩模准备体、及蒸镀掩模 Active CN107709602B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010960637.0A CN112176284B (zh) 2015-07-03 2016-06-29 制造蒸镀掩模、有机半导体元件和有机el显示器的方法、蒸镀掩模准备体、及蒸镀掩模
CN202010959943.2A CN112267091B (zh) 2015-07-03 2016-06-29 制造蒸镀掩模、有机半导体元件和有机el显示器的方法、蒸镀掩模准备体、及蒸镀掩模

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2015-134806 2015-07-03
JP2015134806 2015-07-03
JP2015134805 2015-07-03
JP2015-134805 2015-07-03
JP2016128114A JP6160747B2 (ja) 2015-07-03 2016-06-28 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、及び蒸着マスク
JP2016-128114 2016-06-28
PCT/JP2016/069250 WO2017006821A1 (ja) 2015-07-03 2016-06-29 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及び蒸着マスク

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CN202010960637.0A Division CN112176284B (zh) 2015-07-03 2016-06-29 制造蒸镀掩模、有机半导体元件和有机el显示器的方法、蒸镀掩模准备体、及蒸镀掩模
CN202010959943.2A Division CN112267091B (zh) 2015-07-03 2016-06-29 制造蒸镀掩模、有机半导体元件和有机el显示器的方法、蒸镀掩模准备体、及蒸镀掩模

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CN107709602A CN107709602A (zh) 2018-02-16
CN107709602B true CN107709602B (zh) 2020-10-13

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US (4) US10396283B2 (enExample)
JP (3) JP6160747B2 (enExample)
KR (1) KR20180020972A (enExample)
CN (1) CN107709602B (enExample)
TW (2) TWI740578B (enExample)

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JP6160747B2 (ja) 2015-07-03 2017-07-12 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、及び蒸着マスク
CN110512172A (zh) * 2018-05-21 2019-11-29 鸿富锦精密工业（深圳）有限公司 蒸镀遮罩的制造方法及有机发光材料的蒸镀方法
JP7059839B2 (ja) * 2018-07-11 2022-04-26 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク製造装置、蒸着パターン形成方法、および有機半導体素子の製造方法
JP7187883B2 (ja) * 2018-08-09 2022-12-13 大日本印刷株式会社 蒸着マスクの製造方法
CN110875356B (zh) * 2018-08-30 2024-09-20 上海和辉光电股份有限公司 一种柔性显示母板、柔性amoled显示面板及柔性显示器件
US20220181594A1 (en) * 2019-03-27 2022-06-09 Sakai Display Products Corporation Method for manufacturing resin film having fine pattern, method for manufacturing organic el display device, base material film for use in formation of fine pattern, and resin film having support member attached thereto
CN112296534B (zh) * 2019-10-09 2024-10-01 宁德时代新能源科技股份有限公司 极片切割装置及方法
JP7120262B2 (ja) * 2020-02-06 2022-08-17 大日本印刷株式会社 蒸着マスク準備体の製造方法、フレーム付き蒸着マスク準備体の製造方法、及びフレーム付き蒸着マスク準備体
JP7579510B2 (ja) * 2020-04-02 2024-11-08 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌ表示装置の製造方法及び蒸着方法
JP7645138B2 (ja) * 2021-06-17 2025-03-13 株式会社アルバック ハードマスクの製造方法及び太陽電池の製造方法
KR102615023B1 (ko) * 2021-06-22 2023-12-19 (주)휴넷플러스 대면적 다중 박막 초고해상도 증착용 마스크
KR20230020035A (ko) * 2021-08-02 2023-02-10 삼성디스플레이 주식회사 증착용 마스크
CN217238987U (zh) * 2022-01-18 2022-08-19 荣耀终端有限公司 显示组件及电子设备
CN118048100A (zh) * 2022-11-17 2024-05-17 重庆康佳光电技术研究院有限公司 一种保护胶及蒸镀设备使用方法
KR20250122025A (ko) * 2024-02-05 2025-08-13 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조 방법

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JP2014133938A (ja) * 2013-01-11 2014-07-24 Dainippon Printing Co Ltd 蒸着マスクの製造方法、金属マスク付き樹脂層、及び有機半導体素子の製造方法
CN104041185A (zh) * 2012-01-12 2014-09-10 大日本印刷株式会社 蒸镀掩模的制造方法及有机半导体元件的制造方法
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CN104041185A (zh) * 2012-01-12 2014-09-10 大日本印刷株式会社 蒸镀掩模的制造方法及有机半导体元件的制造方法
CN104053813A (zh) * 2012-01-12 2014-09-17 大日本印刷株式会社 蒸镀掩模、蒸镀掩模装置的制造方法及有机半导体元件的制造方法
JP2014133938A (ja) * 2013-01-11 2014-07-24 Dainippon Printing Co Ltd 蒸着マスクの製造方法、金属マスク付き樹脂層、及び有機半導体素子の製造方法

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TWI740578B (zh) 2021-09-21
TW202041695A (zh) 2020-11-16
CN107709602A (zh) 2018-02-16
US20180190906A1 (en) 2018-07-05
US20210098702A1 (en) 2021-04-01
KR20180020972A (ko) 2018-02-28
US10873029B2 (en) 2020-12-22
JP2017014620A (ja) 2017-01-19
TW201716601A (zh) 2017-05-16
JP6160747B2 (ja) 2017-07-12
JP2021004416A (ja) 2021-01-14
US20190363256A1 (en) 2019-11-28
TWI701352B (zh) 2020-08-11
US10396283B2 (en) 2019-08-27
JP2017206774A (ja) 2017-11-24
US20200235299A1 (en) 2020-07-23
US10651386B2 (en) 2020-05-12
JP7024837B2 (ja) 2022-02-24
JP6769396B2 (ja) 2020-10-14

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