CN107702788A - A kind of ceramic high temperature vibrating sensor and preparation method thereof - Google Patents
A kind of ceramic high temperature vibrating sensor and preparation method thereof Download PDFInfo
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- CN107702788A CN107702788A CN201711166472.4A CN201711166472A CN107702788A CN 107702788 A CN107702788 A CN 107702788A CN 201711166472 A CN201711166472 A CN 201711166472A CN 107702788 A CN107702788 A CN 107702788A
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- layer
- potsherd
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- high temperature
- inductance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H13/00—Measuring resonant frequency
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
Abstract
The invention discloses a kind of ceramic high temperature vibrating sensor, the sensor is formed by upper epidermis, supporting layer and layer by being laminated sinter molding solidificationShape；Upper epidermis is formed by four layers of potsherd lamination, and the potsherd upper surface of the superiors is printed with inductance, and undermost potsherd lower surface is printed with electric capacity top crown, and offers first through hole at four layers of potsherd center；Supporting layer is formed by three layers of potsherd lamination；The layer is formed by three layers of potsherd lamination, and electric capacity bottom crown is printed with the outer surface of undermost potsherd；The second through hole is offered on the right side of all potsherds in upper epidermis, supporting layer and layer, inductance is connected with electric capacity top crown by the platinum pulp layer in first through hole, and inductance is connected with electric capacity bottom crown by the platinum pulp layer in the second through hole.The ceramic high temperature vibrating sensor and can that can either work at normal temperatures of the present invention enough works in high temperature environments, and its is simple in construction, simple process, it is easy to accomplish industrialized production.
Description
Technical field
The present invention relates to the technical field of high-temperature vibrating sensor, more particularly to a kind of ceramic high temperature vibrating sensor and its
Preparation method.
Background technology
In the heavy mechanical equipments such as turbogenerator, steelmaking furnace, compressor and gas turbine, operating temperature range is led to
It it is often 600-1000 DEG C, parts manufacture, detection and measurement of dynamic parameter for this kind equipment etc. proposes active demand
And severe challenge.In the engine of aircraft, the detection to vibration helps to control the mixing of burning gases and fuel to adjust
Whole flight attitude, reduce risk out of control.Due to being restricted by making material and system architecture, current existing vibrating sensor without
Method works under this type high temp adverse circumstances.Therefore, it is necessary to develop a kind of vibrating sensor for hot environment, hair is improved
The safety in operation and test accuracy of the large scale equipments such as motivation, aircraft.
The content of the invention
The present invention is directed to vibrating sensor in existing high-temperature severe environment, there is provided one kind is operable with hot environment
Ceramic high temperature vibrating sensor and preparation method thereof.
The present invention adopts the following technical scheme that realization：
A kind of ceramic high temperature vibrating sensor, the sensor are sintered by upper epidermis, supporting layer and layer by being laminated
What forming and hardening formedShape；
The upper epidermis is formed by four layers of potsherd lamination, and the potsherd upper surface of the superiors is printed with inductance, orlop
Potsherd lower surface be printed with electric capacity top crown, and offer first through hole at four layers of potsherd center；
The supporting layer is formed by three layers of potsherd lamination；The layer is formed by three layers of potsherd lamination, orlop
Potsherd outer surface on be printed with electric capacity bottom crown；
The second through hole, the electricity are offered on the right side of all potsherds in the upper epidermis, supporting layer and layer
Sense is connected with electric capacity top crown by the platinum pulp layer in first through hole, and the inductance passes through in the second through hole with electric capacity bottom crown
Platinum pulp layer is connected.
Preferably, the potsherd uses HTCC low-temperature co-burning ceramic materials, and the material is a kind of alumina ceramic material,
The material inherits the characteristics of traditional ceramics material, and stable mechanical performance under high temperature, anticorrosive, cost is relatively low, technical maturity.Electricity
Sense and capacitor plate printing slurry are starched using platinum.
Preferably, the inductance is planar square-spiral inductance.
Preferably, the first through hole is laid in the center ring heart vertical direction of inductance coil.
Preferably, second through hole is laid in the vertical direction of inductance coil end ring heart.
Preferably, one end of the inductance coil is connected by the platinum pulp layer in first through hole with electric capacity top crown, end
End passes through the platinum pulp layer and electric capacity bottom crown phase downlink connection in the second through hole.
Present invention also offers the preparation method of above-mentioned ceramic high temperature vibrating sensor, comprise the following steps：
S1, by required size green band is cut into ceramic chips, and be put into drying oven and preheated；
S2, by perforating device at four layers of potsherd center for completing pre-warmed upper epidermis and upper epidermis, support
Through hole is opened up on the right side of all potsherds in layer and layer；
After S3, punching are completed, through hole is filled using platinum slurry using the method for top layer suction, and in heating furnace
Carry out drying heating and realize its metallization；
S4, printing screen plate placed on the printer, adjusting the position of half tone and ceramic chips makes both align centers, then
Platinum slurry is added, required circuit diagram will be printed on the potsherd upper surface of the superiors of upper epidermis by screen printing technique
Shape, form inductance；Repeat the above steps the undermost potsherd lower surface for completing upper epidermis, the undermost ceramics of layer
The printing of capacitor plate on piece；
S5, the ceramic chips printed are placed in drying oven carry out drying and processing, make platinum slurry dry and hard, will be printed by laminating machine
The each several part ceramic chips brushed are superimposed by by above-mentioned level and order；
S6, the multilager base plate after the completion of lamination is subjected to vacuum sealing and being put into laminating machine be laminated, certain
Under temperature and pressure (45 DEG C, 5MPa) environment, every layer of ceramics is held tightly together, form a complete green idiosome,
And put it into and high temperature co-firing is carried out in high temperature sintering furnace, make its curing molding.
Inductance coil and capacitor plate are starched using the high temperature resistant platinum to match with HTCC ceramic chips in the present invention, with life
Ceramics can be good at bonding, be not in layering, peel off phenomena such as.
The invention has the advantages that：
The present invention using HTCC technologies by cutting, punching, filling perforation, printing, lamination, lamination, sintering form a kind of ceramics
High-temperature vibrating sensor, the sensor have the advantages that heat-resisting quantity, rational in infrastructure, dependable performance, longevity of service.The sensing
Vibration signal can not only be converted into frequency signal at normal temperatures and send test equipment to by device, and in an environment of high temperature
Prolonged stably measured can be realized, for operating temperature up to more than 800 DEG C, high sensitivity, stability are good；Design structure is skilful
Wonderful, technological operation simple possible, it is easy to industrialized development, there is application in fields such as Aero-Space, automotive electronics, bioengineering
Value.
Brief description of the drawings
Fig. 1 is the overall structure diagram of ceramic high temperature vibrating sensor of the embodiment of the present invention
Fig. 2 is the inductance coil schematic diagram of sensor in the embodiment of the present invention
Fig. 3 is the capacitor plate schematic diagram of sensor in the embodiment of the present invention.
Embodiment
Detailed explanation is done to the embodiment of invention with reference to accompanying drawing.
As shown in Figure 1-Figure 3, the embodiments of the invention provide a kind of ceramic high temperature vibrating sensor, the sensor is by upper table
What layer, supporting layer and layer were formed by being laminated sinter molding solidificationShape；The upper epidermis is laminated by four layers of potsherd
Form, the potsherd upper surface of the superiors is printed with inductance, and undermost potsherd lower surface is printed with electric capacity top crown, and four
Layer potsherd offers first through hole at center；The supporting layer is formed by three layers of potsherd lamination；The layer is by three
Layer potsherd lamination is formed, and electric capacity bottom crown is printed with the outer surface of undermost potsherd；The upper epidermis, supporting layer with
And the second through hole is offered on the right side of all potsherds in layer, the inductance passes through in first through hole with electric capacity top crown
Platinum pulp layer be connected, the inductance is connected with electric capacity bottom crown by the platinum pulp layer in the second through hole.When the external world vibrates,
Spacing between capacitor plate can change, and capacitance can change so that the LC circuit resonant frequencies of sensor become therewith
Change.
The potsherd uses HTCC HTCC materials, and the material is a kind of alumina ceramic material, the material
The characteristics of inheriting traditional ceramics material, stable mechanical performance under high temperature, anticorrosive, cost is relatively low, technical maturity.Inductance and electricity
Hold pole plate printing slurry to starch using platinum, the inductance is planar square-spiral inductance.The first through hole is laid in inductor wire
In the center ring heart vertical direction of circle.
Second through hole is laid in the vertical direction of inductance coil end ring heart.One end of the inductance coil passes through
Platinum pulp layer in first through hole is connected with electric capacity top crown, and end passes through the platinum pulp layer in the second through hole and electric capacity bottom crown phase
Downlink connection.
The embodiment of the present invention additionally provides a kind of preparation method of ceramic high temperature vibrating sensor, comprises the following steps：
S1, by size by HTCC green bands cut into needed for size ceramic chips, be put into drying oven and preheated
S2, by perforating device at four layers of potsherd center for completing pre-warmed upper epidermis and upper epidermis, support
Through hole is opened up on the right side of all potsherds in layer and layer；
After S3, punching are completed, through hole is filled using platinum slurry using the method for top layer suction, and in heating furnace
Carry out drying heating and realize its metallization；
S4, printing screen plate placed on the printer, adjusting the position of half tone and ceramic chips makes both align centers, then
Platinum slurry is added, required circuit diagram will be printed on the potsherd upper surface of the superiors of upper epidermis by screen printing technique
Shape, form inductance；Repeat the above steps the undermost potsherd lower surface for completing upper epidermis, the undermost ceramics of layer
The printing of capacitor plate on piece；
S5, the ceramic chips printed are placed in drying oven carry out drying and processing, make platinum slurry dry and hard, will be printed by laminating machine
The each several part ceramic chips brushed are superimposed by by above-mentioned level and order；
S6, the multilager base plate after the completion of lamination is subjected to vacuum sealing and being put into laminating machine be laminated, certain
Under temperature and pressure (45 DEG C, 5MPa) environment, every layer of ceramics is held tightly together, form a complete green idiosome,
And put it into and high temperature co-firing is carried out in high temperature sintering furnace, make its curing molding.
The ceramic high temperature vibrating sensor clever structure of this specific implementation, manufacture craft is simple, production cost is relatively low, is easy to
Realize industrialized production, in the heavy mechanical equipments such as turbogenerator, steelmaking furnace, compressor and gas turbine have compared with
High use value.
In the description of the invention, it is to be understood that term " on ", " under ", "front", "rear", "left", "right", " perpendicular
Directly ", the orientation of the instruction such as " level ", " top ", " bottom ", " interior ", " outer " or position relationship are based on orientation shown in the drawings or position
Relation is put, it is of the invention necessary with simplified description, rather than the device or element of instruction or hint meaning to be for only for ease of description
With specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Claims (7)
- A kind of 1. ceramic high temperature vibrating sensor, it is characterised in that：The sensor is passed through by upper epidermis, supporting layer and layer Lamination sinter molding solidification formsShape；The upper epidermis is formed by four layers of potsherd lamination, and the potsherd upper surface of the superiors is printed with inductance, undermost pottery Ceramics lower surface is printed with electric capacity top crown, and offers first through hole at four layers of potsherd center；The supporting layer is formed by three layers of potsherd lamination；The layer is formed by three layers of potsherd lamination, undermost pottery Electric capacity bottom crown is printed with the outer surface of ceramics；Offer the second through hole on the right side of all potsherds in the upper epidermis, supporting layer and layer, the inductance with Electric capacity top crown is connected by the platinum pulp layer in first through hole, and the inductance is starched with electric capacity bottom crown by the platinum in the second through hole Layer is connected.
- A kind of 2. ceramic high temperature vibrating sensor as claimed in claim 1, it is characterised in that：The potsherd is high using HTCC Warm material of ceramics burned together, inductance and capacitor plate printing slurry are starched using platinum.
- A kind of 3. ceramic high temperature vibrating sensor as claimed in claim 1, it is characterised in that：The inductance is planar square spiral shell Revolve inductance.
- A kind of 4. ceramic high temperature vibrating sensor as claimed in claim 1, it is characterised in that：The first through hole is laid in electricity In the center ring heart vertical direction for feeling coil.
- A kind of 5. ceramic high temperature vibrating sensor as claimed in claim 1, it is characterised in that：Second through hole is laid in electricity In the vertical direction for feeling coil end ring heart.
- A kind of 6. ceramic high temperature vibrating sensor as claimed in claim 1, it is characterised in that：One end of the inductance coil leads to The platinum pulp layer crossed in first through hole is connected with electric capacity top crown, and end passes through the platinum pulp layer in the second through hole and electric capacity bottom crown Phase downlink connection.
- A kind of 7. preparation method of ceramic high temperature vibrating sensor as claimed in claim 1, it is characterised in that：Including following step Suddenly：S1, by required size green band is cut into ceramic chips, and be put into drying oven and preheated；S2, by perforating device at four layers of potsherd center for completing pre-warmed upper epidermis and upper epidermis, supporting layer with And open up through hole on the right side of all potsherds in layer；After S3, punching are completed, through hole is filled using platinum slurry using the method for top layer suction, and is carried out in heating furnace Its metallization is realized in drying heating；S4, printing screen plate placed on the printer, adjusting the position of half tone and ceramic chips makes both align centers, then adds Platinum is starched, and required circuitous pattern, shape will be printed on the potsherd upper surface of the superiors of upper epidermis by screen printing technique Into inductance；Repeat the above steps complete the undermost potsherd lower surface of upper epidermis, layer undermost potsherd on Capacitor plate printing；S5, the ceramic chips printed are placed in drying oven carry out drying and processing, make platinum slurry dry and hard, will be printed by laminating machine Level and order of each several part ceramic chips as described in claim any one of 1-6 be superimposed；S6, the multilager base plate after the completion of lamination be subjected to vacuum sealing and being put into laminating machine be laminated, temperature be 45 DEG C, In the environment of pressure is 5MPa, every layer of ceramics is held tightly together, form a complete green idiosome, and put it into High temperature co-firing is carried out in high temperature sintering furnace, makes its curing molding.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711166472.4A CN107702788B (en) | 2017-11-21 | 2017-11-21 | A kind of ceramic high temperature vibrating sensor and preparation method thereof |
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| CN201711166472.4A CN107702788B (en) | 2017-11-21 | 2017-11-21 | A kind of ceramic high temperature vibrating sensor and preparation method thereof |
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| CN107702788A true CN107702788A (en) | 2018-02-16 |
| CN107702788B CN107702788B (en) | 2019-10-01 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110360919A (en) * | 2019-08-06 | 2019-10-22 | 中国电子科技集团公司第四十九研究所 | A kind of superhigh temperature displacement sensor |
| CN110542455A (en) * | 2019-09-16 | 2019-12-06 | 中北大学 | HTCC composite microsensor for pressure/vibration synchronous measurement and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110360919A (en) * | 2019-08-06 | 2019-10-22 | 中国电子科技集团公司第四十九研究所 | A kind of superhigh temperature displacement sensor |
| CN110360919B (en) * | 2019-08-06 | 2021-04-02 | 中国电子科技集团公司第四十九研究所 | Ultra-high temperature displacement sensor |
| CN110542455A (en) * | 2019-09-16 | 2019-12-06 | 中北大学 | HTCC composite microsensor for pressure/vibration synchronous measurement and preparation method thereof |
| CN110542455B (en) * | 2019-09-16 | 2021-11-05 | 中北大学 | HTCC composite microsensor for pressure/vibration synchronous measurement and preparation method thereof |
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| CN107702788B (en) | 2019-10-01 |
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