CN107702788B - A kind of ceramic high temperature vibrating sensor and preparation method thereof - Google Patents
A kind of ceramic high temperature vibrating sensor and preparation method thereof Download PDFInfo
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- CN107702788B CN107702788B CN201711166472.4A CN201711166472A CN107702788B CN 107702788 B CN107702788 B CN 107702788B CN 201711166472 A CN201711166472 A CN 201711166472A CN 107702788 B CN107702788 B CN 107702788B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title claims description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000003990 capacitor Substances 0.000 claims abstract description 31
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 27
- 210000002615 Epidermis Anatomy 0.000 claims abstract description 23
- 238000003475 lamination Methods 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000007711 solidification Methods 0.000 claims abstract description 3
- 239000002002 slurry Substances 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 238000010344 co-firing Methods 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials 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[O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000009628 steelmaking Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000003752 improving hair Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000002035 prolonged Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H13/00—Measuring resonant frequency
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
Abstract
The invention discloses a kind of ceramic high temperature vibrating sensor, which is passed through made of lamination sinter molding solidification as upper epidermis, supporting layer and layerShape；Upper epidermis is laminated by four layers of potsherd, and the potsherd upper surface of top layer is printed with inductance, and undermost potsherd lower surface is printed with capacitor top crown, and offers first through hole at four layers of potsherd center；Supporting layer is laminated by three layers of potsherd；The layer is laminated by three layers of potsherd, and capacitor bottom crown is printed on the outer surface of undermost potsherd；The second through-hole is offered on the right side of all potsherds in upper epidermis, supporting layer and layer, inductance is connected with capacitor top crown by the platinum pulp layer in first through hole, and inductance is connected with capacitor bottom crown by the platinum pulp layer in the second through-hole.Ceramic high temperature vibrating sensor of the invention can either work at normal temperature and can work under high temperature environment, and its structure is simple, simple process, it is easy to accomplish industrialized production.
Description
Technical field
The present invention relates to the technical field of high-temperature vibrating sensor more particularly to a kind of ceramic high temperature vibrating sensor and its
Preparation method.
Background technique
In the heavy mechanical equipments such as turbogenerator, steelmaking furnace, compressor and gas turbine, operating temperature range is logical
Often it is 600-1000 DEG C, urgent need is proposed for components manufacture, detection and the measurement of dynamic parameter etc. of such equipment
And severe challenge.In the engine of aircraft, the mixing of control burning gases and fuel is facilitated to adjust to the detection of vibration
Whole flight attitude reduces risk out of control.Due to being restricted by making material and system structure, current existing vibrating sensor without
Method works under this type high temp adverse circumstances.Therefore, it is necessary to develop a kind of vibrating sensors for hot environment out, improve hair
The safety in operation and test accuracy of the large scale equipments such as motivation, aircraft.
Summary of the invention
The present invention provides one kind and is operable under hot environment for vibrating sensor in existing high-temperature severe environment
Ceramic high temperature vibrating sensor and preparation method thereof.
The present invention adopts the following technical scheme that realization:
A kind of ceramic high temperature vibrating sensor, the sensor pass through lamination sintering by upper epidermis, supporting layer and layer
Made of forming and hardeningShape；
The upper epidermis is laminated by four layers of potsherd, and the potsherd upper surface of top layer is printed with inductance, lowest level
Potsherd lower surface be printed with capacitor top crown, and offer first through hole at four layers of potsherd center；
The supporting layer is laminated by three layers of potsherd；The layer is laminated by three layers of potsherd, lowest level
Potsherd outer surface on be printed with capacitor bottom crown；
The second through-hole, the electricity are offered on the right side of all potsherds in the upper epidermis, supporting layer and layer
Sense is connected with capacitor top crown by the platinum pulp layer in first through hole, and the inductance and capacitor bottom crown pass through in the second through-hole
Platinum pulp layer is connected.
Preferably, the potsherd uses HTCC low-temperature co-burning ceramic material, which is a kind of alumina ceramic material,
The material inherits the characteristics of traditional ceramics material, and stable mechanical performance under high temperature, anticorrosive, cost is relatively low, technical maturity.Electricity
Sense and capacitor plate printing slurry are all made of platinum slurry.
Preferably, the inductance is planar square-spiral inductance.
Preferably, the first through hole is laid in the center ring heart vertical direction of inductance coil.
Preferably, second through-hole is laid in the vertical direction of inductance coil end ring heart.
Preferably, one end of the inductance coil is connected by the platinum pulp layer in first through hole with capacitor top crown, end
End passes through the platinum pulp layer and capacitor bottom crown phase downlink connection in the second through-hole.
The present invention also provides the preparation methods of above-mentioned ceramic high temperature vibrating sensor, include the following steps:
S1, green band is cut into ceramic chips by required size, and is put into drying oven and is preheated；
S2, by perforating device complete preheating upper epidermis four layers of potsherd center at and upper epidermis, support
Through-hole is opened up on the right side of all potsherds in layer and layer；
After S3, punching are completed, through-hole is filled using platinum slurry using the method for top layer suction, and in heating furnace
It carries out drying heating and realizes its metallization；
S4, printing screen plate is placed on the printer, the position of adjustment halftone and ceramic chips makes the two align center, then
Platinum slurry is added, by screen printing technique by circuit diagram needed for printing on the potsherd upper surface of the top layer of upper epidermis
Shape forms inductance；Repeat the above steps the undermost ceramics of the undermost potsherd lower surface, layer of completing upper epidermis
The printing of the capacitor plate of on piece；
S5, it the ceramic chips printed is placed in drying oven carries out drying and processing, keep platinum slurry dry and hard, will be printed by laminating machine
Each section ceramic chips brushed are superimposed by by above-mentioned level and order；
S6, the multilager base plate after the completion of lamination is carried out to vacuum sealing and is put into laminating machine to be laminated, certain
Under temperature and pressure (45 DEG C, 5MPa) environment, every layer of tile is made to hold tightly together, forms a complete green idiosome,
And put it into and carry out high temperature co-firing in high temperature sintering furnace, make its curing molding.
Inductance coil and capacitor plate are starched using the high temperature resistant platinum to match with HTCC ceramic chips in the present invention, with life
Phenomena such as tile can be good at bonding, and be not in layering, removing.
The invention has the following advantages:
The present invention forms a kind of ceramics by cutting, punching, filling perforation, printing, lamination, lamination, sintering using HTCC technology
High-temperature vibrating sensor, the sensor have many advantages, such as heat-resisting quantity, structurally reasonable, reliable performance, longevity of service.The sensing
Vibration signal can not only be converted into frequency signal at normal temperature and send test equipment to by device, and in an environment of high temperature
Prolonged stably measured may be implemented, for operating temperature up to 800 DEG C or more, high sensitivity, stability are good；Design structure is skilful
It is wonderful, technological operation simple possible, be easy to industrialized development, the fields such as aerospace, automotive electronics, bioengineering have application
Value.
Detailed description of the invention
Fig. 1 is the overall structure diagram of ceramic high temperature of embodiment of the present invention vibrating sensor
Fig. 2 is the inductance coil schematic diagram of sensor in the embodiment of the present invention
Fig. 3 is the capacitor plate schematic diagram of sensor in the embodiment of the present invention.
Specific embodiment
Detailed explanation is done in conjunction with specific embodiment of the attached drawing to invention.
As shown in Figure 1-Figure 3, the embodiment of the invention provides a kind of ceramic high temperature vibrating sensor, the sensor is by upper table
Layer, supporting layer and layer pass through made of lamination sinter molding solidificationShape；The upper epidermis is laminated by four layers of potsherd
It forms, the potsherd upper surface of top layer is printed with inductance, and undermost potsherd lower surface is printed with capacitor top crown, and four
Layer potsherd offers first through hole at center；The supporting layer is laminated by three layers of potsherd；The layer is by three
Layer potsherd is laminated, and capacitor bottom crown is printed on the outer surface of undermost potsherd；The upper epidermis, supporting layer with
And the second through-hole, the inductance and capacitor top crown are offered on the right side of all potsherds in layer and is passed through in first through hole
Platinum pulp layer be connected, the inductance is connected with capacitor bottom crown by the platinum pulp layer in the second through-hole.When the external world vibrates,
Spacing between capacitor plate can change, and capacitance can change, so that the LC circuit resonant frequencies of sensor become therewith
Change.
The potsherd uses HTCC high-temperature co-fired ceramics material, which is a kind of alumina ceramic material, the material
The characteristics of inheriting traditional ceramics material, stable mechanical performance under high temperature, anticorrosive, cost is relatively low, technical maturity.Inductance and electricity
Hold pole plate printing slurry and be all made of platinum slurry, the inductance is planar square-spiral inductance.The first through hole is laid in inductor wire
In the center ring heart vertical direction of circle.
Second through-hole is laid in the vertical direction of inductance coil end ring heart.One end of the inductance coil passes through
Platinum pulp layer in first through hole is connected with capacitor top crown, and end passes through the platinum pulp layer and capacitor bottom crown phase in the second through-hole
Downlink connection.
The embodiment of the invention also provides a kind of preparation methods of ceramic high temperature vibrating sensor, include the following steps:
S1, the ceramic chips that HTCC green band is cut into required size by size, are put into drying oven and are preheated
S2, by perforating device complete preheating upper epidermis four layers of potsherd center at and upper epidermis, support
Through-hole is opened up on the right side of all potsherds in layer and layer；
After S3, punching are completed, through-hole is filled using platinum slurry using the method for top layer suction, and in heating furnace
It carries out drying heating and realizes its metallization；
S4, printing screen plate is placed on the printer, the position of adjustment halftone and ceramic chips makes the two align center, then
Platinum slurry is added, by screen printing technique by circuit diagram needed for printing on the potsherd upper surface of the top layer of upper epidermis
Shape forms inductance；Repeat the above steps the undermost ceramics of the undermost potsherd lower surface, layer of completing upper epidermis
The printing of the capacitor plate of on piece；
S5, it the ceramic chips printed is placed in drying oven carries out drying and processing, keep platinum slurry dry and hard, will be printed by laminating machine
Each section ceramic chips brushed are superimposed by by above-mentioned level and order；
S6, the multilager base plate after the completion of lamination is carried out to vacuum sealing and is put into laminating machine to be laminated, certain
Under temperature and pressure (45 DEG C, 5MPa) environment, every layer of tile is made to hold tightly together, forms a complete green idiosome,
And put it into and carry out high temperature co-firing in high temperature sintering furnace, make its curing molding.
The ceramic high temperature vibrating sensor clever structure of this specific implementation, manufacture craft is simple, lower production costs, is easy to
Realize industrialized production, in the heavy mechanical equipments such as turbogenerator, steelmaking furnace, compressor and gas turbine have compared with
High use value.
In the description of the present invention, it is to be understood that, term " on ", "lower", "front", "rear", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "top", "bottom", "inner", "outside" is orientation based on the figure or position
Relationship is set, is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
Claims (7)
1. a kind of ceramic high temperature vibrating sensor, it is characterised in that: the sensor is passed through by upper epidermis, supporting layer and layer
It is laminated made of sinter molding solidificationShape；
The upper epidermis is laminated by four layers of ceramic chips, and the ceramic chips upper surface of top layer is printed with inductance coil, lowest level
Ceramic chips lower surface be printed with capacitor top crown, and offer first through hole at four layers of ceramic chips center；
The supporting layer is laminated by three layers of ceramic chips；The layer is laminated by three layers of ceramic chips, undermost life
Capacitor bottom crown is printed on the outer surface of tile；
The second through-hole, the inductor wire are offered on the right side of all ceramic chips in the upper epidermis, supporting layer and layer
Circle is connected with capacitor top crown by the platinum pulp layer in first through hole, and the inductance coil and capacitor bottom crown pass through the second through-hole
Interior platinum pulp layer is connected.
2. a kind of ceramic high temperature vibrating sensor as described in claim 1, it is characterised in that: the ceramic chips use HTCC high
Warm material of ceramics burned together, inductance coil, capacitor top crown and capacitor bottom crown printing slurry are all made of platinum slurry.
3. a kind of ceramic high temperature vibrating sensor as described in claim 1, it is characterised in that: the inductance coil is plane side
Shape Meander line inductor.
4. a kind of ceramic high temperature vibrating sensor as described in claim 1, it is characterised in that: the first through hole is laid in electricity
In the center ring heart vertical direction for feeling coil.
5. a kind of ceramic high temperature vibrating sensor as described in claim 1, it is characterised in that: second through-hole is laid in electricity
In the vertical direction for feeling coil end ring heart.
6. a kind of ceramic high temperature vibrating sensor as described in claim 1, it is characterised in that: one end of the inductance coil is logical
The platinum pulp layer crossed in first through hole is connected with capacitor top crown, and end passes through the platinum pulp layer and capacitor bottom crown in the second through-hole
It is connected.
7. a kind of preparation method of ceramic high temperature vibrating sensor as described in claim 1, it is characterised in that: including walking as follows
It is rapid:
S1, green band is cut into ceramic chips by required size, and is put into drying oven and is preheated；
S2, by perforating device complete preheating upper epidermis four layers of ceramic chips center at and upper epidermis, supporting layer with
And through-hole is opened up on the right side of all ceramic chips in layer；
After S3, punching are completed, through-hole is filled using platinum slurry using the method for top layer suction, and is carried out in heating furnace
Its metallization is realized in drying heating；
S4, printing screen plate is placed on the printer, the position of adjustment printing screen plate and ceramic chips makes the two align center, then
Platinum slurry is added, required circuitous pattern is printed on the ceramic chips upper surface of the top layer of upper epidermis by screen printing technique,
Form inductance coil；It repeats the above steps and completes the undermost life of the undermost ceramic chips lower surface, layer of upper epidermis
The printing of capacitor plate on tile；
S5, it the ceramic chips printed is placed in drying oven carries out drying and processing, keep platinum slurry dry and hard, will be printed by laminating machine
Each section ceramic chips be superimposed by required level and order；
S6, the laminated ceramic chips after the completion of lamination are carried out to vacuum sealing and are put into laminating machine to be laminated, is 45 in temperature
DEG C, pressure be 5MPa in the environment of, so that every layer of ceramic chips is held tightly together, formed a complete green idiosome, and general
It, which is put into high temperature sintering furnace, carries out high temperature co-firing, makes its curing molding.
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| CN110542455A (en) * | 2019-09-16 | 2019-12-06 | 中北大学 | HTCC composite microsensor for pressure/vibration synchronous measurement and preparation method thereof |
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