CN107696647B - 一种pcb钻孔用垫板及其制备方法 - Google Patents

一种pcb钻孔用垫板及其制备方法 Download PDF

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CN107696647B
CN107696647B CN201710840847.4A CN201710840847A CN107696647B CN 107696647 B CN107696647 B CN 107696647B CN 201710840847 A CN201710840847 A CN 201710840847A CN 107696647 B CN107696647 B CN 107696647B
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paper
parts
resin glue
latex bonded
bonded fibre
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CN107696647A (zh
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沈志刚
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LEKAITE TECHNOLOGY (TONGLING) Co Ltd
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LEKAITE TECHNOLOGY (TONGLING) Co Ltd
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27D—WORKING VENEER OR PLYWOOD
    • B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/10—Next to a fibrous or filamentary layer
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    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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    • B32B5/08—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer the fibres or filaments of a layer being of different substances, e.g. conjugate fibres, mixture of different fibres
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Forests & Forestry (AREA)
  • Paper (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Laminated Bodies (AREA)

Abstract

本发明公开了一种pcb钻孔用垫板，包括木纤维基板、粘附于基板上表面的浸胶纤维纸润滑层以及粘附于基板下表面的浸胶纤维纸增强层。润滑层具有一定的硬度和良好的润滑、导热功效，可有效的抑制电路板钻孔出孔处的披锋问题，同时以纤维纸作为基材也提高了树脂层的平滑度和致密度，改善了钻孔加工性能；增强层是由芳纶纤维、玄武岩纤维、剑麻纤维等原料抄造而成的纤维纸浸润树脂胶后制成的，增强层表面平整，有良好的缓冲、隔热效果，起到保护钻头和台面的作用；本发明的上下面层在成型过程中先制成半固化状态后再与基材一起热压成型，面层与基材中不额外添加粘接剂，有效的防止了粘结剂对钻孔的不良影响，提高了钻孔精度。

Description

一种pcb钻孔用垫板及其制备方法
技术领域
本发明涉及pcb钻孔垫板技术领域，尤其涉及一种pcb钻孔用垫板及其制备方法。
背景技术
在pcb钻孔过程中，垫板是一种不可或缺的辅助材料，它的作用在于防止pcb底部披锋、提高钻孔精度、保护钻机台面。常用的垫板有普通纸质垫板、高密度纸质垫板、酚醛垫板、环氧树脂板等等。随着pcb逐渐朝向多层化、功能化、积层化、集成化和轻、薄、短、小化的方向发展，钻孔技术逐步微孔化、高精度化、高品质化，因此对垫板的综合性能提出了更高的要求，尤其是对垫板的功能性需求越来越高，传统的性能单一的垫板显然已经不能满足生产所需。
发明内容
本发明为了弥补已有技术的缺陷，提供一种pcb钻孔用垫板及其制备方法。
本发明是通过以下技术方案实现的：
一种pcb钻孔用垫板，包括木纤维基板、粘附于基板上表面的浸胶纤维纸润滑层以及粘附于基板下表面的浸胶纤维纸增强层。
所述的浸胶纤维纸润滑层是将纤维纸浸入树脂胶经压制后形成的，所述的纤维纸是将10-15份含氟纤维、30-50份剑麻纤维、1-5份膨胀石墨、1-10份聚乙烯醇复混后投入打浆机中打浆，再经过双盘磨浆机在线打磨得到浆料，打浆浓度为2.25-5.5%，然后再加入10-15份的水性树脂乳液，搅拌均匀后进行上网抄造及压榨处理后得到的。
所述的浸胶纤维纸增强层是将纤维纸浸入树脂胶经压制后形成的，所述的纤维纸是将12-16份芳纶纤维、10-15份玄武岩纤维、30-50份剑麻纤维、1-10份聚乙烯醇复混后投入打浆机中打浆，再经过双盘磨浆机在线打磨得到浆料，打浆浓度为3.5-6%，然后再加入12-18份的水性树脂乳液，搅拌均匀后进行上网抄造及压榨处理后得到的。
所述的含氟纤维为聚四氟乙烯纤维、四氟乙烯-六氟丙烯共聚物纤维、三氟氯乙烯-乙烯共聚物纤维、聚偏氟乙烯纤维或相应的改性材料。
所述的树脂胶为热固性酚醛树脂胶或改性酚醛树脂胶。
所述的一种pcb钻孔用垫板的制备方法，包括以下步骤：
（1）分别将两类浸胶纤维纸浸入树脂胶中，完成浸胶后取出，使用橡胶辊滚压，然后使用网纹辊修平，最后在145-185℃条件下进行半固化处理，使树脂胶转换为B阶段；
（2）将木纤维基板与半固化后的两类浸胶纤维纸按照顺序完成叠放，进行热压固化后即得所述的垫板。
本发明制得垫板的上表面润滑层是由含氟纤维、剑麻纤维、膨胀石墨等成分抄造而成的纤维纸浸润树脂胶形成的，这种润滑层具有一定的硬度和良好的润滑、导热功效，可有效的抑制电路板钻孔出孔处的披锋问题，同时以纤维纸作为基材也提高了树脂层的平滑度和致密度，改善了钻孔加工性能；本发明的垫板下表面是由芳纶纤维、玄武岩纤维、剑麻纤维等原料抄造而成的纤维纸浸润树脂胶后制成的，这种增强层表面平整，有良好的缓冲、隔热效果，起到保护钻头和台面的作用；此外，本发明的上下面层在成型过程中先制成半固化状态后再与基材一起热压成型，面层与基材中不额外添加粘接剂，有效的防止了粘结剂对钻孔的不良影响，提高了钻孔精度。
具体实施方式
一种pcb钻孔用垫板，包括木纤维基板、粘附于基板上表面的浸胶纤维纸润滑层以及粘附于基板下表面的浸胶纤维纸增强层。
所述的浸胶纤维纸润滑层是将纤维纸浸入热固性酚醛树脂胶经压制后形成的，所述的纤维纸是将10份聚四氟乙烯纤维、30份剑麻纤维、1份膨胀石墨、1份聚乙烯醇复混后投入打浆机中打浆，再经过双盘磨浆机在线打磨得到浆料，打浆浓度为2.25%，然后再加入10份的水性树脂乳液，搅拌均匀后进行上网抄造及压榨处理后得到的。
所述的浸胶纤维纸增强层是将纤维纸浸入热固性酚醛树脂胶经压制后形成的，所述的纤维纸是将12份芳纶纤维、10份玄武岩纤维、30份剑麻纤维、1份聚乙烯醇复混后投入打浆机中打浆，再经过双盘磨浆机在线打磨得到浆料，打浆浓度为3.5%，然后再加入12份的水性树脂乳液，搅拌均匀后进行上网抄造及压榨处理后得到的。
该实施例的一种pcb钻孔用垫板的制备方法，包括以下步骤：
（1）分别将两类浸胶纤维纸浸入树脂胶中，完成浸胶后取出，使用橡胶辊滚压，然后使用网纹辊修平，最后在145℃条件下进行半固化处理，使树脂胶转换为B阶段；
（2）将木纤维基板与半固化后的两类浸胶纤维纸按照顺序完成叠放，进行热压固化后即得所述的垫板。

Claims (1)

1.一种pcb钻孔用垫板，其特征在于，包括木纤维基板、粘附于基板上表面的浸胶纤维纸润滑层以及粘附于基板下表面的浸胶纤维纸增强层；
所述的浸胶纤维纸润滑层是将纤维纸浸入树脂胶经压制后形成的，所述的纤维纸是将10-15份含氟纤维、30-50份剑麻纤维、1-5份膨胀石墨、1-10份聚乙烯醇复混后投入打浆机中打浆，再经过双盘磨浆机在线打磨得到浆料，打浆浓度为2.25-5.5%，然后再加入10-15份的水性树脂乳液，搅拌均匀后进行上网抄造及压榨处理后得到的；
所述的浸胶纤维纸增强层是将纤维纸浸入树脂胶经压制后形成的，所述的纤维纸是将12-16份芳纶纤维、10-15份玄武岩纤维、30-50份剑麻纤维、1-10份聚乙烯醇复混后投入打浆机中打浆，再经过双盘磨浆机在线打磨得到浆料，打浆浓度为3.5-6%，然后再加入12-18份的水性树脂乳液，搅拌均匀后进行上网抄造及压榨处理后得到的；
所述的含氟纤维为聚四氟乙烯纤维、四氟乙烯-六氟丙烯共聚物纤维、三氟氯乙烯-乙烯共聚物纤维、聚偏氟乙烯纤维或相应的改性材料；
所述的树脂胶为热固性酚醛树脂胶或改性酚醛树脂胶；
所述的一种pcb钻孔用垫板的制备方法包括以下步骤：
（1）分别将两类浸胶纤维纸浸入树脂胶中，完成浸胶后取出，使用橡胶辊滚压，然后使用网纹辊修平，最后在145-185℃条件下进行半固化处理，使树脂胶转换为B阶段；
（2）将木纤维基板与半固化后的两类浸胶纤维纸按照顺序完成叠放，进行热压固化后即得所述的垫板。
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JPS62271612A (ja) * 1986-05-15 1987-11-25 Matsushita Electric Works Ltd プリント配線板のドリル加工方法
CN201491399U (zh) * 2009-09-16 2010-05-26 深圳市深联电路有限公司 一种印刷电路板底层垫板
CN106827771A (zh) * 2016-12-20 2017-06-13 湖南柳鑫电子新材料有限公司 一种高硬度密胺木垫板及其制备方法

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CN201491399U (zh) * 2009-09-16 2010-05-26 深圳市深联电路有限公司 一种印刷电路板底层垫板
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