CN107695858A - A kind of slicing single crystal silicon production burnishing device - Google Patents
A kind of slicing single crystal silicon production burnishing device Download PDFInfo
- Publication number
- CN107695858A CN107695858A CN201710900423.2A CN201710900423A CN107695858A CN 107695858 A CN107695858 A CN 107695858A CN 201710900423 A CN201710900423 A CN 201710900423A CN 107695858 A CN107695858 A CN 107695858A
- Authority
- CN
- China
- Prior art keywords
- casing
- wall
- welded
- fluid box
- inwall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000012530 fluid Substances 0.000 claims abstract description 44
- 238000005498 polishing Methods 0.000 claims abstract description 20
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 238000010992 reflux Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 239000010426 asphalt Substances 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of slicing single crystal silicon production burnishing device, including bottom plate, bottom plate top outer wall is welded with casing, the side outer wall of the casing is provided with operation window, the top inwall of the casing is welded with fluid box, casing bottom inwall is welded with lower fluid box, and lower fluid box and upper fluid box are respectively positioned on the side away from operation window, polishing fluid is filled in the upper fluid box and lower fluid box, and the top outer wall of the bottom outer wall of upper fluid box and lower fluid box is bolted the regulation liquid flow switch equidistantly distributed, casing side outer wall is provided with first through hole close to top end, casing side outer wall is provided with the second through hole close to bottom end.The present invention is simple in construction, novel in design, and staff can be allowed easily and fast to operate the equipment, time saving and energy saving, and can allow the quality of finish of monocrystalline silicon is higher to be more easy to meet required requirement.
Description
Technical field
The present invention relates to slicing single crystal silicon production technical field, more particularly to a kind of slicing single crystal silicon production polishing dress
Put.
Background technology
Monocrystalline silicon is a kind of active nonmetalloid of comparison, is the important component of crystalline material, in new material
The forward position of development, its main application are used as semi-conducting material and thrown using solar energy power generating, heat supply etc., slicing single crystal silicon
Light, refer to that monocrystalline silicon surface needs to improve microdefect, so as to obtain the polishing of high flat degree, at present, the polishing of slicing single crystal silicon
There is the shortcomings that polishing that is complicated and can not obtaining high flat degree in device, reduce operating efficiency, waste resource mostly.
The content of the invention
The invention aims to solve shortcoming present in prior art, and a kind of slicing single crystal silicon proposed produces
Use burnishing device.
To achieve these goals, present invention employs following technical scheme：
A kind of slicing single crystal silicon production burnishing device, including bottom plate, bottom plate top outer wall are welded with casing, the casing
Side outer wall be provided with operation window, the top inwall of the casing is welded with fluid box, and casing bottom inwall is welded with
Lower fluid box, and lower fluid box and upper fluid box are respectively positioned on the side away from operation window, in the upper fluid box and lower fluid box
Polishing fluid is filled, and the top outer wall of the bottom outer wall of upper fluid box and lower fluid box has been bolted equidistant point
The regulation liquid flow switch of cloth, casing side outer wall are provided with first through hole close to top end, and casing side outer wall is close
Bottom end is provided with the second through hole, and the second through hole and first through hole are respectively positioned on the side away from operation window, the first through hole
Inwall is welded with the first return duct, and the top of the bottom plate is welded with fixed seat, and the top of fixed seat has been bolted
Reflux pump, the inwall of second through hole is welded with the second return duct, and the one end of the second return duct away from lower fluid box is with returning
The entrance point connection of pump is flowed, the side inwall of the casing is welded with two fixed blocks, the side outer wall of two fixed blocks
Groove is provided with, and is plugged with roller bearing and lower roller bearing in two grooves respectively, the outer wall of the upper roller bearing and lower roller bearing covers
Burnishing barrel is connected to, the both sides inwall of the casing is provided with electronic chute, and the inwall of two electronic chutes, which is rabbeted, to be had
Slide, and two slides are respectively positioned between two burnishing barrels, the bottom inwall of the casing is welded with waste-collecting box, and waste-collecting box
Positioned at the lower section of burnishing barrel, the side outer wall of the casing is welded with motor case body, and motor case body top inwall passes through
Bolt is fixed with motor, and the side outer wall of the casing is bolted having time relay, and the time relay is positioned at remote
From the side of motor, the side outer wall of the casing has been bolted control panel, and control panel is located at the time relay
Lower section, the top of the bottom plate have been bolted battery.
Preferably, gap, and the height of the height in gap and slicing single crystal silicon are left between regulation liquid flow switch described in two rows
Degree is adapted.
Preferably, the burnishing barrel is made up of asphalt material, and the length of burnishing barrel arrives for the 2/3 of box width
Between 4/5.
Preferably, the side inwall of the casing is provided with two equal-sized circular holes, and two roller bearings are away from fixed block
One end extended to respectively by circular hole outside casing.
Preferably, the output shaft of the motor and the lower one end of roller bearing away from the time relay are welded with gear, and two
The outer wall of individual foot wheel is engaged with same driving chain.
Preferably, electronic chute, the time relay, control panel, regulation liquid flow switch and the motor are respectively connected with control
Device, and the model of controller is DATA-7311.
Preferably, the battery is located at the lower section of motor case body, and battery passes through wire and the time relay, liquid
Flow switch, electronic chute connect with control panel.
Beneficial effects of the present invention are：The device structure is simple, the setting for the dynamic chute that is powered, the monocrystalline to polishing can be achieved
Silicon section is timed sprinkling polishing fluid；By the setting of upper and lower burnishing barrel, the twin polishing of slicing single crystal silicon can be achieved；
The setting of passage time relay and regulation liquid flow switch, when can accurately control polishing fluid and the reaction on slicing single crystal silicon surface
Between；By the setting of reflux pump, the first return duct and the second return duct, polishing fluid recycling resource can be saved；
By the setting of operation window, staff can true observation polishing progress；By the setting of control panel, staff can be allowed
The flatness of accurate control polishing.
Brief description of the drawings
Fig. 1 is a kind of structural representation of slicing single crystal silicon production burnishing device proposed by the present invention；
Fig. 2 is a kind of cross-sectional view of slicing single crystal silicon production burnishing device proposed by the present invention.
In figure：1 casing, roller bearing on 2,3 operation windows, 4 burnishing barrels, the miscellaneous groove of 5 collection, 6 bottom plates, fluid box, 8 liquid flows on 7
Measure switch, 9 slicing single crystal silicons, 10 reflux pumps, 11 electronic chutes, 12 slides, 13 time relays, 14 control panels, 15 motors, 16
Driving chain, 17 batteries.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.
Reference picture 1-2, a kind of slicing single crystal silicon production burnishing device, including bottom plate 6, the top outer wall of bottom plate 6 are welded with
Casing 1, the side outer wall of casing 1 are provided with operation window 3, and the top inwall of casing 1 is welded with fluid box 7, the bottom inwall of casing 1
Lower fluid box is welded with, and lower fluid box and upper fluid box 7 are respectively positioned on the side away from operation window 3, upper fluid box 7 and lower liquid
Polishing fluid is filled in case, and the top outer wall of the bottom outer wall of upper fluid box 7 and lower fluid box has been bolted
The regulation liquid flow switch 8 of range distribution, the side outer wall of casing 1 are provided with first through hole close to top end, and the side outer wall of casing 1 is close
Bottom end is provided with the second through hole, and the second through hole and first through hole are respectively positioned on the side away from operation window 3, the inwall of first through hole
The first return duct is welded with, the top of bottom plate 6 is welded with fixed seat, and the top of fixed seat has been bolted reflux pump
10, the inwall of the second through hole is welded with the second return duct, and the one end of the second return duct away from lower fluid box and reflux pump 10
Entrance point connects, and the side inwall of casing 1 is welded with two fixed blocks, and the side outer wall of two fixed blocks is provided with groove, and
It is plugged with roller bearing 2 and lower roller bearing in two grooves respectively, the outer wall of upper roller bearing 2 and lower roller bearing is socketed with burnishing barrel 4, case
The both sides inwall of body 1 is provided with electronic chute 11, and the inwall of two electronic chutes 11, which is rabbeted, slide 12, and two slides 12
It is respectively positioned between two burnishing barrels 4, the bottom inwall of casing 1 is welded with waste-collecting box 5, and waste-collecting box 5 is located at burnishing barrel 4
Lower section, the side outer wall of casing 1 are welded with motor case body, and motor case body top inwall has been bolted motor 15, casing 1
Side outer wall be bolted having time relay 13, and the time relay 13 is located remotely from the side of motor 15, casing 1
Side outer wall be bolted control panel 14, and control panel 14 is located at the lower section of the time relay 13, the top of bottom plate 6
It has been bolted battery 17.
In the present invention, gap, and the height in gap and the height of slicing single crystal silicon 9 are left between two discharging liquid flow switches 8
Degree is adapted, and burnishing barrel 4 is made up of asphalt material, and the length of burnishing barrel 4 for the width of casing 1 2/3 to 4/5 it
Between, the side inwall of casing 1 is provided with two equal-sized circular holes, and two one end of roller bearing 2 away from fixed block pass through respectively
Circular hole is extended to outside casing 1, and the output shaft of motor 15 and the lower one end of roller bearing away from the time relay 13 are welded with gear, and
The outer wall of two foot wheels is engaged with same driving chain 16, electronic chute 11, the time relay 13, control panel 14, liquid flow
Amount switch 8 and motor 15 are respectively connected with controller, and the model of controller is DATA-7311, and battery 17 is located at motor housing
The lower section of body, and battery 17 passes through wire and the time relay 13, regulation liquid flow switch 8, electronic chute 11 and control panel 14
Connection.
Operation principle：In use, the card of slicing single crystal silicon 9 is placed on slide 12, polishing fluid is set in control panel 14
After spraying time, start motor 15, now motor 15 drives burnishing barrel 4 to carry out twin polishing, polishing to slicing single crystal silicon 9
After certain time, slicing single crystal silicon 9 is moved under the drive of slide 12 at the gap of upper and lower regulation liquid flow switch, now liquid
Flow switch, which starts, to be started to cut monocrystalline silicon light sprinkling polishing fluid, and after reaching setting time, slicing single crystal silicon 9 is again by slide 12
Move to origin-location to be polished, go round and begin again, reaching requirement to polishing can terminate.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (7)
1. a kind of slicing single crystal silicon production burnishing device, including bottom plate（6）, it is characterised in that the bottom plate（6）Top outer wall
It is welded with casing（1）, the casing（1）Side outer wall be provided with operation window（3）, the casing（1）Top inwall be welded with
Upper fluid box（7）, the casing（1）Bottom inwall is welded with lower fluid box, and lower fluid box and upper fluid box（7）It is respectively positioned on remote
From operation window（3）Side, the upper fluid box（7）With polishing fluid, and upper fluid box are filled in lower fluid box（7）Bottom
The top outer wall of outer wall and lower fluid box is bolted the regulation liquid flow switch equidistantly distributed（8）, the casing
（1）Side outer wall is provided with first through hole, the casing close to top end（1）Side outer wall is provided with the second through hole close to bottom end,
And second through hole and first through hole be respectively positioned on away from operation window（3）Side, the inwall of the first through hole is welded with first time
Flow tube, the bottom plate（6）Top be welded with fixed seat, and the top of fixed seat has been bolted reflux pump（10）, institute
The inwall for stating the second through hole is welded with the second return duct, and the second return duct one end and reflux pump away from lower fluid box（10）'s
Entrance point connects, the casing（1）Side inwall be welded with two fixed blocks, the side outer wall of two fixed blocks is opened
It is fluted, and roller bearing is plugged with respectively in two grooves（2）With lower roller bearing, the upper roller bearing（2）It is equal with the outer wall of lower roller bearing
It is socketed with burnishing barrel（4）, the casing（1）Both sides inwall be provided with electronic chute（11）, two electronic chutes
（11）Inwall rabbet and have slide（12）, and two slides（12）It is respectively positioned on two burnishing barrels（4）Between, the casing
（1）Bottom inwall be welded with waste-collecting box（5）, and waste-collecting box（5）Positioned at burnishing barrel（4）Lower section, the casing（1）One
Side outer wall is welded with motor case body, and motor case body top inwall has been bolted motor（15）, the casing（1）'s
Side outer wall is bolted having time relay（13）, and the time relay（13）It is located remotely from motor（15）Side,
The casing（1）Side outer wall be bolted control panel（14）, and control panel（14）Positioned at the time relay（13）
Lower section, the bottom plate（6）Top be bolted battery（17）.
A kind of 2. slicing single crystal silicon production burnishing device according to claim 1, it is characterised in that liquid described in two rows
Flow switch（8）Between leave gap, and the height and slicing single crystal silicon in gap（9）Height be adapted.
A kind of 3. slicing single crystal silicon production burnishing device according to claim 1, it is characterised in that the burnishing barrel
（4）Be made up of asphalt material, and burnishing barrel（4）Length be casing（1）Between 2/3 to the 4/5 of width.
A kind of 4. slicing single crystal silicon production burnishing device according to claim 1, it is characterised in that the casing（1）
Side inwall be provided with two equal-sized circular holes, and two roller bearings（2）Prolonged respectively by circular hole one end away from fixed block
Extend casing（1）Outside.
A kind of 5. slicing single crystal silicon production burnishing device according to claim 1, it is characterised in that the motor（15）
Output shaft and lower roller bearing away from the time relay（13）One end be welded with gear, and the outer wall of two foot wheels is engaged with together
One driving chain（16）.
A kind of 6. slicing single crystal silicon production burnishing device according to claim 1, it is characterised in that the electronic chute
（11）, the time relay（13）, control panel（14）, regulation liquid flow switch（8）And motor（15）Controller is respectively connected with, and is controlled
The model of device is DATA-7311.
A kind of 7. slicing single crystal silicon production burnishing device according to claim 1, it is characterised in that the battery
（17）Positioned at the lower section of motor case body, and battery（17）Pass through wire and the time relay（13）, regulation liquid flow switch（8）、
Electronic chute（11）And control panel（14）Connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710900423.2A CN107695858A (en) | 2017-09-28 | 2017-09-28 | A kind of slicing single crystal silicon production burnishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710900423.2A CN107695858A (en) | 2017-09-28 | 2017-09-28 | A kind of slicing single crystal silicon production burnishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107695858A true CN107695858A (en) | 2018-02-16 |
Family
ID=61175229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710900423.2A Pending CN107695858A (en) | 2017-09-28 | 2017-09-28 | A kind of slicing single crystal silicon production burnishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107695858A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09174429A (en) * | 1995-12-22 | 1997-07-08 | Tokyo Seimitsu Co Ltd | Wafer polishing device |
| US5700179A (en) * | 1995-07-28 | 1997-12-23 | Shin-Etsu Handotai Co., Ltd. | Method of manufacturing semiconductor wafers and process of and apparatus for grinding used for the same method of manufacture |
| CN1498724A (en) * | 2002-10-25 | 2004-05-26 | 不二越机械工业株式会社 | Lapping machine and method of grinding workpiece |
| CN204450231U (en) * | 2015-01-29 | 2015-07-08 | 新中合光电科技（保靖）有限公司 | A kind of circulation of the dropping liquid for FA end surface grinding and protector |
| CN204819116U (en) * | 2014-07-01 | 2015-12-02 | K.C.科技股份有限公司 | Chemically mechanical polishing device |
| CN106737087A (en) * | 2017-01-12 | 2017-05-31 | 重庆四联特种装备材料有限公司 | Finlling automatically system |
| CN207480345U (en) * | 2017-09-28 | 2018-06-12 | 阜宁浔朋新材料科技有限公司 | A kind of slicing single crystal silicon production burnishing device |
-
2017
- 2017-09-28 CN CN201710900423.2A patent/CN107695858A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5700179A (en) * | 1995-07-28 | 1997-12-23 | Shin-Etsu Handotai Co., Ltd. | Method of manufacturing semiconductor wafers and process of and apparatus for grinding used for the same method of manufacture |
| JPH09174429A (en) * | 1995-12-22 | 1997-07-08 | Tokyo Seimitsu Co Ltd | Wafer polishing device |
| CN1498724A (en) * | 2002-10-25 | 2004-05-26 | 不二越机械工业株式会社 | Lapping machine and method of grinding workpiece |
| CN204819116U (en) * | 2014-07-01 | 2015-12-02 | K.C.科技股份有限公司 | Chemically mechanical polishing device |
| CN204450231U (en) * | 2015-01-29 | 2015-07-08 | 新中合光电科技（保靖）有限公司 | A kind of circulation of the dropping liquid for FA end surface grinding and protector |
| CN106737087A (en) * | 2017-01-12 | 2017-05-31 | 重庆四联特种装备材料有限公司 | Finlling automatically system |
| CN207480345U (en) * | 2017-09-28 | 2018-06-12 | 阜宁浔朋新材料科技有限公司 | A kind of slicing single crystal silicon production burnishing device |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180216 |
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| WD01 | Invention patent application deemed withdrawn after publication |