CN107689492A - A kind of electrode silver plasm encapsulating structure applied to sensor - Google Patents
A kind of electrode silver plasm encapsulating structure applied to sensor Download PDFInfo
- Publication number
- CN107689492A CN107689492A CN201710612805.5A CN201710612805A CN107689492A CN 107689492 A CN107689492 A CN 107689492A CN 201710612805 A CN201710612805 A CN 201710612805A CN 107689492 A CN107689492 A CN 107689492A
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- CN
- China
- Prior art keywords
- connection groove
- copper cash
- rear connection
- groove
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The invention discloses a kind of electrode silver plasm encapsulating structure applied to sensor, it includes sensor base plate, sensor base plate is provided with wire connecting portion, the front of the wire connecting portion of sensor base plate offers four front connection grooves in uniform intervals distribution, and each front connection groove extends straight and inserts side opening towards copper cash respectively respectively；The back side of the wire connecting portion of sensor base plate offers four rear connection grooves in uniform intervals distribution, and each rear connection groove extends straight and inserts side opening towards copper cash respectively respectively；Solderable silver paste is filled with respectively in each front connection groove, each rear connection groove, intercalation has copper cash respectively in each front connection groove, each rear connection groove, each copper cash welds with the solderable silver paste in respective faces connecting groove, rear connection groove respectively, and each front connection groove, the opening of each rear connection groove are filled with the encapsulated layer for encapsulating corresponding copper cash respectively.The advantages of present invention has modern design, connection reliability good and can be effectively reduced thermal contact resistance.
Description
Technical field
The present invention relates to sensor technical field, more particularly to a kind of electrode silver plasm encapsulating structure applied to sensor.
Background technology
As intelligent level constantly improves and intellectual technology constantly popularization and application, miscellaneous sensor quilt
It is widely used in intelligent apparatus, such as in intelligent appliance, intelligent detection equipment, automated production equipment.
It need to be explained further, for existing sensor, it typically clamps two panels using a U-shaped folder or marmon clamp
Ceramics, electrode terminal are realized with copper cash by way of a contact and are electrically connected with；However, for a way of contact, going out
In the case of now vibrating, it is easy to loose contact, the insecure problem of connection occur.
The content of the invention
The purpose of the present invention is to solve the shortcomings of the prior art and a kind of electrode silver plasm applied to sensor is provided and sealed
Assembling structure, the electrode silver plasm encapsulating structure modern design of sensor should be applied to, connection reliability is good and can be effectively reduced
Thermal contact resistance.
To reach above-mentioned purpose, the present invention is achieved through the following technical solutions.
A kind of electrode silver plasm encapsulating structure applied to sensor, include sensor base plate, sensor base plate is provided with
Wire connecting portion, the front of the wire connecting portion of sensor base plate offer four front connection grooves in uniform intervals distribution, and each front connects
Wire casing extends straight and inserts side opening towards copper cash respectively respectively；
The back side of the wire connecting portion of sensor base plate offers four rear connection grooves in uniform intervals distribution, each rear connection groove
Extend straight respectively and insert side opening towards copper cash respectively；
Solderable silver paste is filled with each front connection groove, each rear connection groove respectively, in each front connection groove, each rear connection groove
Intercalation has copper cash respectively, and each copper cash welds with the solderable silver paste in respective faces connecting groove, rear connection groove respectively, and each front connects
Wire casing, the opening of each rear connection groove are filled with the encapsulated layer for encapsulating corresponding copper cash respectively.
Wherein, the encapsulated layer is high temp glass encapsulated layer or ceramic package layer.
Wherein, the cross section of each front connection groove is square-shaped.
Wherein, the cross section of each rear connection groove is square-shaped.
Beneficial effects of the present invention are：A kind of electrode silver plasm encapsulating structure applied to sensor of the present invention, its
Include sensor base plate, sensor base plate is provided with wire connecting portion, and the front of the wire connecting portion of sensor base plate offers four and is in
The front connection groove of uniform intervals distribution, each front connection groove extend straight and insert side opening towards copper cash respectively respectively；Pass
The back side of the wire connecting portion of sensor substrate offers four rear connection grooves in uniform intervals distribution, and each rear connection groove is in respectively
Linear extension and respectively towards copper cash insert side opening；Solderable silver paste is filled with respectively in each front connection groove, each rear connection groove,
Intercalation has a copper cash respectively in each front connection groove, each rear connection groove, each copper cash respectively with respective faces connecting groove, rear connection
Solderable silver paste welding in groove, each front connection groove, the opening of each rear connection groove are filled with encapsulate corresponding copper cash respectively
Encapsulated layer.By said structure design, the present invention has modern design, connection reliability is good and can be effectively reduced contact
The advantages of thermal resistance.
Brief description of the drawings
The present invention is further detailed below with accompanying drawing, but the embodiment in accompanying drawing is not formed to this hair
Bright any restrictions.
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the structural representation at another visual angle of the present invention.
Include in Fig. 1：
1 --- sensor base plate 11 --- wire connecting portion
21 --- front connection groove 22 --- rear connection grooves
3 --- solderable silver paste 4 --- copper cash
5 --- encapsulated layer.
Embodiment
With reference to specific embodiment, the present invention will be described.
As depicted in figs. 1 and 2, a kind of electrode silver plasm encapsulating structure applied to sensor, includes sensor base plate 1,
Sensor base plate 1 is provided with wire connecting portion 11, and the front of the wire connecting portion 11 of sensor base plate 1 offers four and is distributed in uniform intervals
Front connection groove 21, each front connection groove 21 extend straight respectively and respectively towards copper cash 4 insert side opening.
Wherein, the back side of the wire connecting portion 11 of sensor base plate 1 offers four rear connection grooves in uniform intervals distribution
22, each rear connection groove 22 extends straight and inserts side opening towards copper cash 4 respectively respectively.
Further, each front connection groove 21, be filled with solderable silver paste 3 respectively in each rear connection groove 22, each front connects
Intercalation has a copper cash 4 respectively in wire casing 21, each rear connection groove 22, each copper cash 4 respectively with respective faces connecting groove 21, rear connection
Solderable silver paste 3 in groove 22 is welded, and each front connection groove 21, the opening of each rear connection groove 22 are filled with corresponding copper respectively
The encapsulated layer 5 that line 4 encapsulates.
It need to be explained further, encapsulated layer 5 of the invention can be high-temperature glass material or ceramic material, i.e., of the invention
Encapsulated layer 5 is high temp glass encapsulated layer 5 or ceramic package layer 5；Certainly, above-mentioned material is not construed as limiting the invention,
I.e. encapsulated layer 5 of the invention can also be prepared using other materials.
As shown in Fig. 2 the front connection groove 21 of the present invention, rear connection groove 22 can be respectively designed to square shape；Certainly, on
State shape design not to be construed as limiting the invention, i.e., front connection groove 21 of the invention, rear connection groove 22 can also be set
Count into other shapes.
It should further be noted that during copper cash 4 and sensor base plate 1 realize encapsulation connection, first solderable silver paste 3 is filled out
It is filled to each front connection groove 21, in rear connection groove 22, is then inserted respectively toward each front connection groove 21, each rear connection groove 22
Copper cash 4 simultaneously causes each copper cash 4 to be welded with corresponding solderable silver paste 3, after treating that copper cash 4 welds with solderable silver paste 3, then toward each front
Connecting groove 21, the opening of rear connection groove 22 load encapsulating material to form encapsulated layer 5.
Need to be explained further, the present invention welded by solderable silver paste 3 with copper cash 4, silver paste have good electric conductivity and
Resistance value is very low, can so be effectively reduced thermal contact resistance.And copper cash 4 is packaged by fixation by encapsulated layer 5, so may be used
To ensure the reliability of connection.
From the above situation, it can be seen that, by said structure design, the present invention has modern design, connection reliability good and energy
The advantages of being enough effectively reduced thermal contact resistance.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to the present invention's
Thought, there will be changes, this specification content should not be construed as to the present invention in specific embodiments and applications
Limitation.
Claims (4)
- A kind of 1. electrode silver plasm encapsulating structure applied to sensor, it is characterised in that：Include sensor base plate（1）, sensing Device substrate（1）It is provided with wire connecting portion（11）, sensor base plate（1）Wire connecting portion（11）To offer four be in uniform intervals in front The front connection groove of distribution（21）, each front connection groove（21）Extend straight respectively and respectively towards copper cash（4）Insert side opening；Sensor base plate（1）Wire connecting portion（11）The back side offer four in uniform intervals distribution rear connection grooves（22）, Each rear connection groove（22）Extend straight respectively and respectively towards copper cash（4）Insert side opening；Each front connection groove（21）, each rear connection groove（22）Solderable silver paste is inside filled with respectively（3）, each front connection groove （21）, each rear connection groove（22）Inside intercalation has copper cash respectively（4）, each copper cash（4）Respectively with respective faces connecting groove（21）, the back of the body Face connecting groove（22）Interior solderable silver paste（3）Welding, each front connection groove（21）, each rear connection groove（22）Opening difference It is filled with corresponding copper cash（4）The encapsulated layer of encapsulation（5）.
- A kind of 2. electrode silver plasm encapsulating structure applied to sensor according to claim 1, it is characterised in that：The envelope Fill layer（5）For high temp glass encapsulated layer（5）Or ceramic package layer（5）.
- A kind of 3. electrode silver plasm encapsulating structure applied to sensor according to claim 1, it is characterised in that：It is each described Front connection groove（21）Cross section it is square-shaped.
- A kind of 4. electrode silver plasm encapsulating structure applied to sensor according to claim 1, it is characterised in that：It is each described Rear connection groove（22）Cross section it is square-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710612805.5A CN107689492B (en) | 2017-07-25 | 2017-07-25 | A kind of electrode silver plasm encapsulating structure applied to sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710612805.5A CN107689492B (en) | 2017-07-25 | 2017-07-25 | A kind of electrode silver plasm encapsulating structure applied to sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107689492A true CN107689492A (en) | 2018-02-13 |
| CN107689492B CN107689492B (en) | 2019-06-14 |
Family
ID=61152968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710612805.5A Active CN107689492B (en) | 2017-07-25 | 2017-07-25 | A kind of electrode silver plasm encapsulating structure applied to sensor |
Country Status (1)
| Country | Link |
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| CN (1) | CN107689492B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0117953A1 (en) * | 1983-02-03 | 1984-09-12 | Duraplug Electricals Limited | Connection of plug pin to wire conductor |
| JPH10199583A (en) * | 1997-01-09 | 1998-07-31 | Yazaki Corp | Ultrasonic connecting terminal and ultrasonic connecting structure |
| CN101500347A (en) * | 2009-03-03 | 2009-08-05 | 深圳市格普斯纳米电热科技有限公司 | Electricity connection method for electric heating film |
| WO2009132332A1 (en) * | 2008-04-25 | 2009-10-29 | Molex Incorporated | Electric connector |
| CN104205500A (en) * | 2012-03-29 | 2014-12-10 | 矢崎总业株式会社 | Mounting structure of terminal on printed wiring board |
| CN205798635U (en) * | 2016-05-26 | 2016-12-14 | 广东杰思通讯股份有限公司 | A kind of bonding wire auxiliary device |
| CN206282996U (en) * | 2016-12-16 | 2017-06-27 | 惠州威健电路板实业有限公司 | A kind of attachment structure of printed circuit board |
-
2017
- 2017-07-25 CN CN201710612805.5A patent/CN107689492B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0117953A1 (en) * | 1983-02-03 | 1984-09-12 | Duraplug Electricals Limited | Connection of plug pin to wire conductor |
| JPH10199583A (en) * | 1997-01-09 | 1998-07-31 | Yazaki Corp | Ultrasonic connecting terminal and ultrasonic connecting structure |
| WO2009132332A1 (en) * | 2008-04-25 | 2009-10-29 | Molex Incorporated | Electric connector |
| CN101500347A (en) * | 2009-03-03 | 2009-08-05 | 深圳市格普斯纳米电热科技有限公司 | Electricity connection method for electric heating film |
| CN104205500A (en) * | 2012-03-29 | 2014-12-10 | 矢崎总业株式会社 | Mounting structure of terminal on printed wiring board |
| CN205798635U (en) * | 2016-05-26 | 2016-12-14 | 广东杰思通讯股份有限公司 | A kind of bonding wire auxiliary device |
| CN206282996U (en) * | 2016-12-16 | 2017-06-27 | 惠州威健电路板实业有限公司 | A kind of attachment structure of printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107689492B (en) | 2019-06-14 |
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