CN107689420A - A kind of OLED flexible base boards, OLED display panel and preparation method - Google Patents
A kind of OLED flexible base boards, OLED display panel and preparation method Download PDFInfo
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- CN107689420A CN107689420A CN201710722976.3A CN201710722976A CN107689420A CN 107689420 A CN107689420 A CN 107689420A CN 201710722976 A CN201710722976 A CN 201710722976A CN 107689420 A CN107689420 A CN 107689420A
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- 238000002360 preparation method Methods 0.000 title claims description 12
- 239000010410 layer Substances 0.000 claims abstract description 120
- 239000012044 organic layer Substances 0.000 claims abstract description 69
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000011368 organic material Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical group [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 241000790917 Dioxys <bee> Species 0.000 claims 1
- 229910003978 SiClx Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000005452 bending Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of OLED flexible base boards, the flexible base board includes substrate layer, and substrate layer includes the first organic layer and inorganic layer being sequentially laminated;Wherein, the first organic layer is whole face formula film layer, and inorganic layer is pattern structure.By the above-mentioned means, the present invention can strengthen the bendable folding endurance of flexible base board.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of OLED flexible base boards, OLED display panel and making
Method.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) Display Technique because its have it is spontaneous
Light, wide viewing angle, high-contrast, the display mainstream technology for increasingly becoming compared with the advantages that low power consumption, high reaction speed market.
OLED display can be divided into rigid display device and flexible display apparatus again, wherein, flexible display apparatus have it is bent,
Impact resistance is preferably, shock resistance is relatively strong, lighter in weight, small volume and the advantages that be convenient for carrying, by the extensive of people
Concern.
Flexible display apparatus generally includes the display device of flexible base board and formation on flexible substrates, invention of the invention
People has found in long-term research and development, and in currently available technology, flexible base board generally comprises a substrate layer, and substrate layer is still adopted
With the structure similar with conventional rigid display device, whole substrate layer is whole face formula, and this set can be caused follow-up curved
Folding s tress can not discharge greatly very much during folding, may result in flexible base board fracture, reduction of service life.
The content of the invention
The present invention solves the technical problem of provide a kind of OLED flexible base boards, OLED display panel and making side
Method, the bendable folding endurance of flexible base board can be strengthened.
In order to solve the above technical problems, one aspect of the present invention is:A kind of OLED flexible base boards are provided, should
Flexible base board includes substrate layer, and substrate layer includes the first organic layer and inorganic layer being sequentially laminated;Wherein, the first organic layer is whole
Face formula film layer, inorganic layer are pattern structure.
In order to solve the above technical problems, another technical solution used in the present invention is:A kind of OLED display panel is provided,
The display panel includes flexible base board, TFT backplate and the pixel unit layer being sequentially laminated;Wherein, flexible base board includes substrate layer,
Substrate layer includes the first organic layer and inorganic layer being sequentially laminated;First organic layer is whole face formula film layer, and inorganic layer is patterning
Structure.
In order to solve the above technical problems, another technical solution used in the present invention is:A kind of OLED flexible base boards are provided
Preparation method, this method includes:Underlay substrate is provided;The first organic layer is formed on underlay substrate, wherein, the first organic layer
For whole face formula film layer;Inorganic layer is formed on the first organic layer, inorganic layer is pattern structure.
The beneficial effects of the invention are as follows:The situation of prior art is different from, the application provides a kind of OLED flexible base boards, should
Flexible base board includes substrate layer, and substrate layer includes the first organic layer and inorganic layer being sequentially laminated;Wherein, the first organic layer is whole
Face formula film layer, inorganic layer are pattern structure.By the way that inorganic layer is arranged into pattern structure, just have extremely in such inorganic layer
A few gap, when flexible base board produces deformation because of bending, folding s tress can be discharged, subtracts the stress that inorganic layer is subject to
It is small, and then avoid it from being broken off or peeled off with the first organic layer, to strengthen the bendable folding endurance of flexible base board, extend flexible base board
Service life.
Brief description of the drawings
Fig. 1 is the structural representation of OLED flexible base boards in the prior art;
Fig. 2 is the structural representation of the embodiment of OLED flexible base boards one of the present invention;
Fig. 3 is the top view of inorganic layer in the embodiment of OLED flexible base boards one of the present invention;
Fig. 4 is the structural representation of the embodiment of OLED flexible base boards one of the present invention;
Fig. 5 is the structural representation of the embodiment of OLED display panel one of the present invention;
Fig. 6 is the schematic flow sheet of the embodiment of preparation method one of OLED flexible base boards of the present invention;
Fig. 7 is the schematic flow sheet of the embodiment of preparation method one of OLED flexible base boards of the present invention.
Embodiment
To make the purpose of the present invention, technical scheme and effect clearer, clear and definite, develop simultaneously embodiment pair referring to the drawings
The present invention is further described.
Referring to Fig. 2, Fig. 2 is the structural representation of the embodiment of OLED flexible base boards one of the present invention;Wherein, Fig. 2 a are these
The side cutaway view of the embodiment of OLED flexible base boards one is invented, Fig. 2 b are nothings in the embodiment of OLED flexible base boards one of the present invention
The top view of machine layer.The embodiment provides a kind of OLED flexible base boards, and the flexible base board includes substrate layer 20, and substrate layer 20 wraps
Include the first organic layer 201 and inorganic layer 202 being sequentially laminated;Wherein, the first organic layer 201 is whole face formula film layer, inorganic layer 202
For pattern structure.
Wherein, whole face formula film layer refers to one whole uniformly seamless film, specifically, referring to Fig. 1, Fig. 1 is existing skill
The structural representation of OLED flexible base boards in art, wherein, Fig. 1 a are the side cutaway views of OLED flexible base boards in the prior art, figure
1b is the top view of organic layer/inorganic layer in OLED flexible base boards in the prior art;In the prior art, in OLED flexible base boards
Organic layer and inorganic layer are all whole face formula film layers, i.e., same film layer is that integral type sets (Fig. 1 a and Fig. 1 b) very close to each other.It is this
Whole face formula is set, and because the pliability of inorganic layer is poor, when producing deformation because of bending, caused folding s tress is very big, and can not
Release, finally easily cause inorganic fault rupture or peeled off with organic layer, and then cause scrapping for flexible base board.
And in present embodiment, inorganic layer 202 is arranged to pattern structure, wherein, pattern structure refers to film layer not
It is a whole face, gap is present among film layer, specifically, refer to Fig. 2 b, the pattern structure can be the concavo-convex knot at interval
Structure, also in other words, inorganic layer 202 include inorganic material layer 2021 and middle gap 2022.In the embodiment, because inorganic
Gap 2022 be present in layer 202, it can discharge folding s tress when producing deformation because of bending, and make that inorganic layer 202 is subject to should
Power reduces, and then avoids it from being broken off or peeled off with the first organic layer 201, to strengthen the bendable folding endurance of flexible base board, extends soft
The service life of property substrate.
Referring to Fig. 3, Fig. 3 is the top view of inorganic layer in the embodiment of OLED flexible base boards one of the present invention.In the implementation
In mode, the pattern structure of inorganic layer 202 can also be other pattern forms, such as zigzag structure, discontinuous stripe-shaped
Structure (Fig. 3 a), decussate texture (Fig. 3 b) etc., as long as making that there is gap in inorganic layer 202, folding s tress can be discharged,
Specific pattern magnitude, the gap length between pattern, pattern form can according to the size and later stage of flexible base board
The size of the folding s tress that can be subject to and adaptability is set.
Referring to Fig. 4, Fig. 4 is the structural representation of the embodiment of OLED flexible base boards one of the present invention.In the embodiment,
Flexible base board includes substrate layer 40, and substrate layer 40 is in addition to including the first organic layer 401 being sequentially laminated and inorganic layer 402, also
The second organic layer 403 including being covered in the top of inorganic layer 402, the second organic layer 403 is whole face formula film layer.
Wherein, the second organic layer 403 is identical with the material of the first organic layer 401, such as the second organic layer 403 has with first
Machine layer 401 can be polyimide layer (polyimide).In other embodiments, the second organic layer 403 and first organic
The material of layer 401 can also be different, can be PEN, PET, poly- virtue specifically
One or more in ester, polycarbonate, PEI or polyether sulfone.By setting two layers of organic layer, can protect inorganic
Layer is not easy to break, peels off, and makes flexible base board performance more stable.
Alternatively, in one embodiment, the gap of the pattern of inorganic layer 402 is filled with organic material, wherein, this is organic
Material is identical with the material of the second organic layer 403.In other embodiments, other organic materials can also be filled in gap,
For example, organic memory material etc. can be filled.By filling organic material in gap, the first organic layer and second can be increased
Adhesion between organic layer, further protection inorganic layer is not easy to break, peels off;Simultaneously can also be in the bending of flexible base board
During play certain stress buffer effect, further lift the bendable folding endurance of flexible base board.
Alternatively, in one embodiment, inorganic layer 402 is dielectric isolation layer, and its material can select silicon monoxide, two
One or more in silica, silicon nitride, silicon oxynitride.
Alternatively, in one embodiment, the thickness of the first organic layer 401, the thickness of inorganic layer 402 and the second organic layer
403 thickness can be set according to being actually needed with actual preparative capacibility, for example, the thickness of the first organic layer 401 and
The thickness of two organic layers 403 can be more than or equal to 2 μm, and the thickness of inorganic layer 402 can be 150nm~500nm etc..
Referring to Fig. 5, Fig. 5 is the structural representation of the embodiment of OLED display panel one of the present invention.The application also provides
A kind of OLED display panel, in the embodiment, OLED display panel includes flexible base board 501, the TFT backplate being sequentially laminated
502 and pixel unit layer 503;Wherein, flexible base board 501 includes substrate layer, and substrate layer includes the first organic layer being sequentially laminated
5011 and inorganic layer 5012;First organic layer 5011 is whole face formula film layer, and inorganic layer 5012 is pattern structure.Wherein, it is flexible
The concrete structure of substrate 501 refers to the description of above-mentioned embodiment, will not be repeated here;TFT backplate 502 and pixel unit layer
503 structure is identical with existing structure, will not be repeated here.The OLED display panel has and above-mentioned OLED flexible base boards phase
Same beneficial effect, will not be repeated here.It is medium that the OLED display panel can be applied to mobile phone, intelligent watch, Intelligent bracelet.
Referring to Fig. 6, Fig. 6 is the schematic flow sheet of the embodiment of preparation method one of OLED flexible base boards of the present invention.This
Apply also providing a kind of preparation method of flexible base board, in the embodiment, the preparation method of OLED flexible base boards is including as follows
Step:
S601:Underlay substrate is provided.
Wherein, underlay substrate can be the transparency carriers such as glass substrate, organic plastic substrate.
S602:The first organic layer is formed on underlay substrate, wherein, the first organic layer is whole face formula film layer.
Specifically, the modes such as coating, spraying, printing can be selected to form the first organic layer, formation first can be first provided
The coating fluid of the organic material of organic layer,, will then by being coated with, spraying, the mode such as printing for example, polyimide coating liquid
The coating fluid for forming the organic material of the first organic layer is overlayed on underlay substrate, the painting of the organic material of the first organic layer to be formed
After the toasted dry solidification of cloth liquid, you can to form the first organic layer, wherein the first organic layer is uniformly seamless one whole
Film.
S603:Inorganic layer is formed on the first organic layer, wherein, inorganic layer is pattern structure.
Specifically, exposure imaging or the method for etching can be selected to form the pattern of inorganic layer, its pattern is according to actual need
Adaptability is wanted to set.Wherein, exposure imaging or the method for etching are usual manner.
Referring to Fig. 7, Fig. 7 is the schematic flow sheet of the embodiment of preparation method one of OLED flexible base boards of the present invention.
In the embodiment, the preparation method of OLED flexible base boards also includes step S604:The second organic layer is formed on inorganic layer, its
In, the organic material of the second organic layer is filled to the pattern interval of inorganic layer simultaneously.
It is equally possible that forming the second organic layer from modes such as coating, spraying, printings, formation the can be first provided
The coating fluid of the organic material of two organic layers, for example, polyimide coating liquid, then by being coated with, spraying, the mode such as printing,
The coating fluid for the organic material for forming the second organic layer is overlayed on underlay substrate, the organic material of the second organic layer to be formed
After the toasted dry solidification of coating fluid, you can to form the second organic layer, wherein the second organic layer is whole for uniformly seamless one
Open film.Through the above way can simply, OLED flexible base boards are easily made, without increasing new processing procedure, save into
This.
Alternatively, in one embodiment, the application also provides a kind of preparation method of OLED display panel, as above institute
State, after the making of substrate layer is completed, then TFT backplate is made on substrate layer, then make anode layer and pixel defining layer
(PDL) OLED luminous organic materials, are finally deposited and encapsulate, OLED display panel is made.Wherein, anode uses ITO/Ag/
ITO, pixel defining layer (PDL) use polyimide layer (polyimide) material;Wherein, TFT backplate, anode layer, pixel definition
Layer (PDL) and the specifically manufacturing process and method of evaporation OLED luminous organic materials and encapsulation use existing method.
To sum up, the above-mentioned embodiment of the application provides a kind of OLED flexible base boards, and the flexible base board includes substrate layer, serves as a contrast
Bottom includes the first organic layer and inorganic layer being sequentially laminated;Wherein, the first organic layer is whole face formula film layer, and inorganic layer is pattern
Change structure.By the way that inorganic layer is arranged into pattern structure, just there is at least one gap in such inorganic layer, in flexible base board
When producing deformation because of bending, folding s tress can be discharged, reduce the stress that inorganic layer is subject to, so avoid its be broken off or with
First organic layer is peeled off, and to strengthen the bendable folding endurance of flexible base board, extends the service life of flexible base board.
Embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this
The equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, it is included within the scope of the present invention.
Claims (10)
1. a kind of OLED flexible base boards, it is characterised in that the flexible base board includes substrate layer, and the substrate layer includes sequentially layer
The first folded organic layer and inorganic layer;Wherein, first organic layer is whole face formula film layer, and the inorganic layer is tied for patterning
Structure.
2. flexible base board according to claim 1, it is characterised in that the substrate layer also includes being covered in the inorganic layer
Second organic layer of top, second organic layer are whole face formula film layer.
3. flexible base board according to claim 2, it is characterised in that the gap of the pattern structure is filled with organic material
Material, wherein, the organic material is identical with the material of second organic layer.
4. flexible base board according to claim 2, it is characterised in that first organic layer and/or described second organic
The material of layer is polyimides.
5. flexible base board according to claim 1, it is characterised in that the material of the inorganic layer is silicon monoxide, dioxy
One or more in SiClx, silicon nitride, silicon oxynitride.
6. flexible base board according to claim 1, it is characterised in that the pattern structure is zigzag structure, interruption
One kind in formula stripe-shaped structure, decussate texture, concaveconvex structure.
7. a kind of OLED display panel, it is characterised in that the display panel includes flexible base board, the TFT backplate being sequentially laminated
And pixel unit layer;Wherein, the flexible base board includes substrate layer, the substrate layer include the first organic layer being sequentially laminated and
Inorganic layer;First organic layer is whole face formula film layer, and the inorganic layer is pattern structure.
8. a kind of preparation method of OLED flexible base boards, it is characterised in that methods described includes:
Underlay substrate is provided;
The first organic layer is formed on the underlay substrate, wherein, first organic layer is whole face formula film layer;
Inorganic layer is formed on first organic layer, wherein, the inorganic layer is pattern structure.
9. according to the method for claim 8, it is characterised in that methods described also includes:Is formed on the inorganic layer
Two organic layers, wherein, the organic material of second organic layer is filled to the gap of the pattern structure simultaneously.
10. according to the method for claim 8, it is characterised in that described that inorganic layer step is formed on first organic layer
Suddenly include:The inorganic layer is formed using the method for exposure imaging or etching.
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