CN107683045A - Method for producing shell, housing and electronic equipment - Google Patents
Method for producing shell, housing and electronic equipment Download PDFInfo
- Publication number
- CN107683045A CN107683045A CN201711036404.6A CN201711036404A CN107683045A CN 107683045 A CN107683045 A CN 107683045A CN 201711036404 A CN201711036404 A CN 201711036404A CN 107683045 A CN107683045 A CN 107683045A
- Authority
- CN
- China
- Prior art keywords
- automatically cleaning
- protective layer
- cleaning particle
- housing
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000002245 particle Substances 0.000 claims abstract description 103
- 238000004140 cleaning Methods 0.000 claims abstract description 102
- 239000011241 protective layer Substances 0.000 claims abstract description 77
- 239000000463 material Substances 0.000 claims abstract description 67
- 238000006555 catalytic reaction Methods 0.000 claims abstract description 13
- 230000015556 catabolic process Effects 0.000 claims abstract description 12
- 238000006731 degradation reaction Methods 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims description 10
- 239000010410 layer Substances 0.000 claims description 9
- 238000005422 blasting Methods 0.000 claims description 8
- 238000011045 prefiltration Methods 0.000 claims description 5
- 239000003086 colorant Substances 0.000 claims description 4
- 238000011282 treatment Methods 0.000 claims description 4
- 239000002519 antifouling agent Substances 0.000 claims description 2
- 238000004040 coloring Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000013339 cereals Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 239000005416 organic matter Substances 0.000 abstract description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 abstract description 3
- 239000001569 carbon dioxide Substances 0.000 abstract description 3
- VUZPPFZMUPKLLV-UHFFFAOYSA-N methane;hydrate Chemical compound C.O VUZPPFZMUPKLLV-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003921 oil Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 10
- 238000005498 polishing Methods 0.000 description 10
- 229910052681 coesite Inorganic materials 0.000 description 8
- 229910052906 cristobalite Inorganic materials 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052682 stishovite Inorganic materials 0.000 description 8
- 229910052905 tridymite Inorganic materials 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
- 239000002105 nanoparticle Substances 0.000 description 6
- 230000001699 photocatalysis Effects 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 150000004703 alkoxides Chemical class 0.000 description 4
- 238000001027 hydrothermal synthesis Methods 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 229910002915 BiVO4 Inorganic materials 0.000 description 2
- 229920002160 Celluloid Polymers 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 2
- 229910003074 TiCl4 Inorganic materials 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007146 photocatalysis Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- -1 aluminium alloy Chemical compound 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
- C03C17/009—Mixtures of organic and inorganic materials, e.g. ormosils and ormocers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5072—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with oxides or hydroxides not covered by C04B41/5025
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the present application discloses a kind of method for producing shell, housing and electronic equipment; by in base material towards forming protective layer on the surface on the outside of electronic equipment; the protective layer includes automatically cleaning particle; the automatically cleaning particle is exposed to the surface of the protective layer; the automatically cleaning particle occurs light-catalyzed reaction, organic matter is decomposed into carbon dioxide and water when receiving light irradiation; namely the oils degradation that will attach in the fingerprint of surface of shell, so as to reach the automatic purpose for eliminating fingerprint.
Description
Technical field
The application is related to technical field of electronic equipment, and in particular to a kind of method for producing shell, housing and electronic equipment.
Background technology
At present, electronic equipment, for example mobile phone, the housing outer surface of tablet personal computer easily glue fingerprint.
The content of the invention
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment, can be with automated cleaning housing appearance
The fingerprint in face.
The embodiment of the present application provides a kind of method for producing shell, and the housing is applied to electronic equipment, and the housing makes
Method includes：
There is provided a base material, the base material includes first surface and second surface, and the first surface is towards in electronic equipment
Side, second surface is towards on the outside of electronic equipment；And
Protective layer is set in the second surface of the base material, the protective layer includes automatically cleaning particle, the automatically cleaning
Particle is exposed to the surface of the protective layer, and when receiving light irradiation light-catalyzed reaction degraded occurs for the automatically cleaning particle
Organic matter.
The embodiment of the present application also provides a kind of housing, and applied to electronic equipment, the housing includes a base material and a protection
Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction
On the outside of sub- equipment, the protective layer is arranged at the second surface of the base material, and the protective layer includes automatically cleaning particle, described
Automatically cleaning particle is exposed to the surface of the protective layer, and when receiving light irradiation photocatalysis occurs for the automatically cleaning particle anti-
Answer degradation of organic substances.
The embodiment of the present application additionally provides a kind of electronic equipment, including housing, and the housing includes a base material and a protection
Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction
On the outside of sub- equipment, the protective layer is arranged at the second surface of the base material, and the protective layer includes automatically cleaning particle, described
Automatically cleaning particle is exposed to the surface of the protective layer, and when receiving light irradiation photocatalysis occurs for the automatically cleaning particle anti-
Answer degradation of organic substances.
The method for producing shell that the embodiment of the present application provides, by base material towards being formed on the surface on the outside of electronic equipment
Protective layer, the protective layer include automatically cleaning particle, and the automatically cleaning particle is exposed to the surface of the protective layer, it is described from
Particle is cleaned when receiving light irradiation, light-catalyzed reaction occurs, organic matter is decomposed into carbon dioxide and water, will also be adhered to
Oils degradation in the fingerprint of surface of shell, so as to reach the automatic purpose for eliminating fingerprint.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the embodiment of the present application, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, for
For those skilled in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
Fig. 1 is the structural representation for the electronic equipment that the embodiment of the present application provides.
Fig. 2 is the structural representation for the housing that the embodiment of the present application provides.
Fig. 3 is the structural representation for the bonnet that the embodiment of the present application provides.
Fig. 4 is profiles of the Fig. 3 in the first embodiment in A-A directions.
Fig. 5 is profiles of the Fig. 3 in second of embodiment in A-A directions.
Fig. 6 is profiles of the Fig. 3 in the third embodiment in A-A directions.
Fig. 7 is another structural representation for the housing that the embodiment of the present application provides.
Fig. 8 is another structural representation for the bonnet that the embodiment of the present application provides.
Fig. 9 is another structural representation for the electronic equipment that the embodiment of the present application provides.
Figure 10 is the first schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.
Figure 11 is second of schematic flow sheet of the bonnet preparation method that the embodiment of the present application provides.
Figure 12 is the third schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is carried out clear, complete
Site preparation describes.Obviously, described embodiment is only some embodiments of the present application, rather than whole embodiments.It is based on
Embodiment in the application, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made
Example, belong to the scope of the application protection.
In the description of the present application, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Describe the application and simplify to describe, rather than indicate or imply that signified device or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In the description of the present application, " multiple " are meant that two or more, unless otherwise specifically defined.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to
Simplify disclosure herein, hereinafter the part and setting of specific examples are described.Certainly, they are only example, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, this application provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment.It will carry out respectively below detailed
Explanation.
In the present embodiment, will be described from the angle of bonnet preparation method, the method for producing shell can be formed
Housing, the housing can be set in the electronic device, such as mobile phone, tablet personal computer, palm PC (Personal Digital
Assistant, PDA) etc..
Refer to the structural representation that 1, Fig. 1 is the electronic equipment that the embodiment of the present application provides.The electronic equipment 1 includes
Housing 10, display screen 20, printed circuit board 30, battery 40.
Referring to Fig. 2, Fig. 2 is the structural representation for the housing that the embodiment of the present application provides.
Wherein, the housing 10 can include cover plate 11, center 12 and bonnet 13.The cover plate 11, the and of the center 12
The bonnet 13 is mutually combined to form the housing 10.The housing 10, which has, passes through the cover plate 11, the center 12 and institute
A confined space of the formation of bonnet 13 is stated, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
In certain embodiments, the lid of cover plate 11 is set on the center 12.The lid of bonnet 13 is set to the center
On 12.The cover plate 11 and bonnet 13 are located at the opposite face of the center 12.The cover plate 11 and bonnet 13 are oppositely arranged.It is described
The confined space of housing 10 is between the cover plate 11 and bonnet 13.
The cover plate 11 can be transparent glass cover plate.In some embodiments, the cover plate 11 can be with such as
Glass cover-plate made of the materials such as sapphire.
The center 12 can be metal shell, such as aluminium alloy center 12.It should be noted that in the embodiment of the present application
The material of frame 12 is not limited to this, can also use other manner, such as：The center 12 can ceramic center, glass center.
For another example：The center 12 can be plastic cement center.Also such as：The center 12 can be the knot that metal and plastic cement cooperate
Structure, plastic portions and being molded on sheet metal can be formed.
The bonnet 13 can be with metal back cover, such as aluminium alloy bonnet, stainless steel bonnet.The bonnet 13 can also be glass
Glass bonnet or ceramic bonnet.
Also referring to Fig. 3, Fig. 3 is the structural representation for the bonnet that the embodiment of the present application provides.
The bonnet 13 can include inner surface 131 and the outer surface 132 being oppositely arranged.The inner surface of the bonnet 13
131 close to center 12 and cover plate 11, forms a part for the inner surface of the housing 10.The outer surface 132 of the bonnet 13 is remote
From center 12 and cover plate 11, a part for the outer surface of the housing 10 is formed.The bonnet 13 can also include through hole 133,
The through hole 133 can be used for installing camera.
Also referring to Fig. 4, Fig. 4 is profiles of the Fig. 3 in A-A directions.
For purposes of illustration only, housing is illustrated by taking bonnet 13 as an example below.
The bonnet 13 can include a base material 134 and a protective layer 135.The protective layer 135 is arranged at the bonnet
13 surfaces away from cover plate 11.
Wherein, the base material 134 can use aluminium, such as aluminium alloy, can also use stainless steel, can also use glass
Glass, ceramics etc..
The base material 134 includes first surface 1341 and second surface 1342.The first surface 1341 is set towards electronics
Standby inner side, second surface 1342 is towards on the outside of electronic equipment.In one embodiment, the first surface 1341 is towards cover plate 11
Set with the direction of center 12.The first surface 1341 can be the inner surface 131 of bonnet 13.The first surface 1341 is
The inner surface of the housing 11.The second surface 1342 faces away from cover plate 11 and the direction of center 12 is set.Described second
Surface 1342 is the outer surface of the housing 11.
The protective layer 135 is arranged at the second surface 1342 of the base material 134.The protective layer 135 is included from clear
Clean particle 136, the automatically cleaning particle 136 are exposed to the surface of the protective layer 135.The automatically cleaning particle 136 is receiving
When light irradiates, light-catalyzed reaction degradation of organic substances occurs.
The protective layer 136 can use celluloid paint.
In one embodiment, in order that the protective layer 135 can more be firmly adhered to the of the base material 134
Two surfaces 1342, the second surface 1342 of the base material 134 can be processed by shot blasting, to increase the of the base material 134
The flatness on the surface on two surfaces 1342, so as to add second surface 1342 of the protective layer 135 in the base material 134
Adhesive force, and then the protective layer 135 is firmly adhered to the second surface 1342 of the base material 134.
The automatically cleaning particle 136 can use TiO2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The automatically cleaning particle
136 can also use the TiO of metal ion mixing2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The metal ion for doping
Can be silver ion, copper ion etc..
The automatically cleaning particle 136 can use physical vapour deposition (PVD) (PVD), chemical vapor deposition (CVD), collosol and gel
The methods of method or hydro-thermal method, is formed.
In one embodiment, when forming the automatically cleaning particle 136 using the method for chemical vapor deposition, can adopt
Use TiCl4And O2, by the control to temperature and pressure, generate TiO2Nano particle, namely form the automatically cleaning particle 136.
In one embodiment, when forming the automatically cleaning particle 136 using sol-gal process, forerunner can first be prepared
Body colloidal sol, pass through the control to PH, additive and temperature etc., gel of the generation with certain space structure, by gel
It is dried and calcines, forms nano particle, namely form the automatically cleaning particle 136.
In one embodiment, metal alkoxide can be used for raw material, add solvent, water, catalyst etc., by hydrolysis and
Polymerisation obtains precursor sol.The metal alkoxide can use Ti (OC2H5)4、Ti(OC3H7 i)4、Ti(OC4H9 n)4Deng.
In one embodiment, when forming the protective layer 135 using hydro-thermal method, precursor solution is first prepared, is passed through
Control to temperature and pressure, nano particle is generated, namely form the automatically cleaning particle 136.
It should be noted that referring to Fig. 5-6, in certain embodiments, the protective layer 135 includes at least two colorings
Area 1351/1352, the color of each colour attaching area 1351/1352 is different, and the colour attaching area 1351/1352 of different colours uses color not
Same automatically cleaning particle 1361/1362.
For example, the protective layer 135 includes the first colour attaching area 1351 and the second colour attaching area 1352.First colour attaching area
1351 can use the first automatically cleaning particle 1361.The first automatically cleaning particle 1361 can be white.Described first from clearly
Clean particle 1361 can use TiO2, ZnO etc..Second colour attaching area 1352 can use the second automatically cleaning particle 1362.Institute
It can be yellow to state the second automatically cleaning particle 1362.The second automatically cleaning particle 1362 can use CdS, BiVO4Deng.Example again
Such as, the protective layer 135 can also include the 3rd colour attaching area 1353.3rd colour attaching area 1353 uses the 3rd automatically cleaning particle
1363.The 3rd automatically cleaning particle 1363 can be rufous.The 3rd automatically cleaning particle 1363 can use Fe2O3。
In one embodiment, the thickness of the protective layer 135 is more than 10 microns.When the thickness of the protective layer 135 is small
When 10 microns, because the thickness of the protective layer 135 is smaller, photopermeability is high, is easily done by the self color of base material 134
Disturb, it is bad to the utilization rate of the automatically cleaning particle 136 of the protective layer 135 color of itself, simultaneously as the protective layer
135 thickness is smaller, easily punches protective layer 135 in polishing process, is unfavorable for the formation of protective layer 135.A kind of real
Apply in mode, the thickness of the protective layer 135 can be more than 100 microns.
In one embodiment, the diameter of the automatically cleaning particle 136 is less than 500 nanometers, to cause the automatically cleaning
Grain 136 has good photocatalytic, meanwhile, user can't experience the automatically cleaning on its surface when touching the housing
Particle 136.In one embodiment, the diameter of the automatically cleaning particle 136 can be 50 nanometers -100 nanometers.When described from clear
When the diameter of clean particle 136 is less than 50nm, because the diameter of the automatically cleaning particle 136 is smaller, cause manufacturing cost higher, make
Make complex process；When the diameter of the automatically cleaning particle 136 is more than 100nm, due to the automatically cleaning particle 136 diameter compared with
Greatly, cause the photocatalytic of the automatically cleaning particle 136 weaker.
It should be noted that the structure of the embodiment of the present application housing is not limited to this, such as, referring to Fig. 7, Fig. 7 is this
Apply for another structural representation for the housing that embodiment provides.
The housing 10a includes cover plate 16 and bonnet 17.In certain embodiments, the cover plate 16 directly lid is set to described
On bonnet 17.The cover plate 16 and the bonnet 17 are mutually combined to form the housing 10a.The housing 10a, which has, passes through institute
The confined space that cover plate 16 and bonnet 17 are formed is stated, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
Compared to the housing 10 shown in Fig. 2, Fig. 7 housing 10a does not include center, or perhaps by the center in Fig. 2
12 and bonnet 13 be integrally formed to form the structure of a bonnet 17.
Specifically, referring to Fig. 8, Fig. 8 is another structural representation for the bonnet that the embodiment of the present application provides.
In certain embodiments, bonnet 17 includes inner surface 171 and outer surface 172, inner surface 171 and the phase of outer surface 172
To setting, the whole surface of bonnet 17 is formed.Each Rotating fields of the bonnet 17 can refer to bonnet 13, will not be repeated here.
The printed circuit board 30 is installed in the housing 10, and the printed circuit board 30 can be the mainboard of electronic equipment 1,
Antenna, motor, microphone, camera, light sensor, receiver and processor etc. can be integrated with printed circuit board 30
Functional unit.In certain embodiments, the printed circuit board 30 is fixed in housing 10.Specifically, the printed circuit board
30 can be screwed on center 12 by screw, can also be fitted on using card by the way of buckle on center 12.It should be noted that
The mode that the embodiment of the present application printed circuit board 30 is specifically fixed on center 12 is not limited to this, can with other manner, than
Such as by way of buckle and screw are fixed jointly.
The battery 40 is installed in the housing 10, and battery 40 is electrically connected with the printed circuit board 30, with to electronics
Equipment 1 provides power supply.Housing 10 can be as the battery cover of battery 40.Housing 10 covers battery 40 to protect battery 40, specifically
Be that bonnet 13 covers battery 40 to protect battery 40, reduce battery 40 due to electronic equipment 1 collision, fall etc. and be subject to
Damage.
The display screen 20 is installed in the housing 10, meanwhile, the display screen 20 is electrically connected on printed circuit board 30, with
Form the display surface of electronic equipment 1.The display screen 20 includes viewing area 14 and non-display area 15.The viewing area 14
It can be used for showing the picture of electronic equipment 1 or carry out touching manipulation etc. for user.The top region of the non-display area 15
Domain opens up the perforate for sound and light conduction, and fingerprint module, touch controlled key can be set on the bottom of non-display area 15
Deng functional unit.Wherein described cover plate 11 is installed on display screen 20, to cover display screen 20, is formed and the identical of display screen 20
Viewing area and non-display area, it can specifically refer to viewing area and the non-display area of display screen 20.
It should be noted that the structure of the display screen 20 is not limited to this.For example the display screen can be to shield comprehensively
Or opposite sex screen, specifically, referring to Fig. 9, Fig. 9 is another structural representation for the electronic equipment that the embodiment of the present application provides.Fig. 9
In electronic equipment and Fig. 1 in the difference of electronic equipment be：The non-display area 15a is formed directly into display screen 20a
On, for example in display screen 20a non-display area 15a it is arranged to transparent configuration, so that optical signal passes through, or directly showing
Screen 20a non-display area is opened up for structures such as the perforate of light conduction or breach, can be by front camera, photoelectric sensor
Etc. being arranged at non-display area position, so that front camera takes pictures, photoelectric sensor detection.The viewing area 14a is paved with
Electronic equipment 1a whole surfaces.It should be noted that housing 10, printed circuit board 30 and battery 40 in the electronic equipment 1a
Above content can be referred to Deng device, will not be repeated here.
The present invention also provides a kind of preparation method of housing.
It should be noted that illustrated below by taking bonnet as an example, but the embodiment of the present application method for producing shell is not
It is limited to bonnet.
Also referring to Figure 10, Figure 10 is the schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.It is described
Method for producing shell comprises the following steps：
Step S101 a, there is provided base material 134, the base material 134 includes first surface 1341 and second surface 1342, described
First surface 1341 is towards on the inside of electronic equipment, and second surface 1342 is towards on the outside of electronic equipment.
The base material 134 can be metal material, such as aluminium, further, such as aluminium alloy.It should be noted that
The base material 134 can be directly commercially available, and sheet fabrication can also be obtained, for example, aluminum alloy plate materials are forged and pressed, when
The PROCESS FOR TREATMENTs such as effect obtain.The base material 134 can also use glass, ceramics etc..
The first surface 1341 is set towards the direction of cover plate 11 and center 12.After the first surface 1341 can be
The inner surface 131 of lid 13.The first surface 1341 is the inner surface of the housing 11.The second surface 1342 faces away from
The direction of cover plate 11 and center 12 is set.The second surface 1342 is the outer surface of the housing 11.
Step S102, protective layer 135 is set in the second surface 1342 of the base material 134, the protective layer 135 includes
Automatically cleaning particle 136, the automatically cleaning particle 136 are exposed to the surface of the protective layer 135, and the automatically cleaning particle 135 exists
When receiving light irradiation, light-catalyzed reaction degradation of organic substances occurs.
In one embodiment, Figure 11 is referred to, the step S102 may include：
Step S1021：The second surface 1342 of the base material 134 is processed by shot blasting；And
Step S1022：In the second surface 1342 of the base material 134 of polishing, protective layer 135, the guarantor are set
Sheath 135 includes automatically cleaning particle 136, and the automatically cleaning particle 136 is exposed to the surface of the protective layer 135, it is described from
Particle 135 is cleaned when receiving light irradiation, light-catalyzed reaction degradation of organic substances occurs.
Wherein, in order that the protective layer 135 can more be firmly adhered to the second surface of the base material 134
1342, the second surface 1342 of the base material 134 can be processed by shot blasting, to increase the second surface of the base material 134
The flatness on 1342 surface, so as to add attachment of the protective layer 135 in the second surface 1342 of the base material 134
Power, and then the protective layer 135 is firmly adhered to the second surface 1342 of the base material 134.
In certain embodiments, can be by the way of machinery, chemistry, electrochemistry or ultrasonic wave etc. to the base material 134
Second surface 1342 realize polishing.To cause the roughness of second surface 1342 of the base material 134 to reduce, with obtain it is bright,
The second surface 1342 of the base material 134 of flat surface.Wherein, chemical polishing mode is the second table to the base material 134
Face 1342 carries out regular dissolving and reaches smooth.Wherein, electrochemical polish mode is by the second surface of the base material 134
1342 conduct anodes, insoluble petal are negative electrode, and the two poles of the earth are immersed in electrolytic cell simultaneously, are led to direct current and are produced selective sun
Pole solution, so that the brightness of second surface 1342 increase of the base material 134 is big.The mode wherein mechanically polished is by cutting
Cut the second surface 1342 of the base material 134 so that after the plastic deformation of second surface 1342 of the base material 134 removes polishing
Convex portion and obtain even surface.The mode of wherein ultrasonic polishing is that the base material 134 is put into abrasive suspension and put together
In ultrasound field, by the oscillation action of ultrasonic wave, make abrasive material in the grinding-polishing of second surface 1342 of the base material 134.
In certain embodiments, can be first right before being processed by shot blasting to the second surface 1342 of the base material 134
The second surface 1342 of the base material 134 carries out grinding process, then again to the second table of the base material 134 after grinding process
Face 1342 is processed by shot blasting, makes polishing better so that the second surface 1342 of the base material 134 is more smooth.
Here, it should be noted that the grinding process can be understood as to the roughing before polishing.I.e., it is possible to first to bonnet
Outer surface carries out once thick polishing, then is once carefully polished, and completes polishing.
The protective layer 136 can use celluloid paint.
The automatically cleaning particle 136 can use TiO2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The automatically cleaning particle
136 can also use the TiO of metal ion mixing2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The metal ion for doping
Can be silver ion, copper ion etc..
The automatically cleaning particle 136 can use physical vapour deposition (PVD) (PVD), chemical vapor deposition (CVD), collosol and gel
The methods of method or hydro-thermal method, is formed.
In one embodiment, when forming the automatically cleaning particle 136 using the method for chemical vapor deposition, can adopt
Use TiCl4And O2, by the control to temperature and pressure, generate TiO2Nano particle, namely form the automatically cleaning particle 136.
In one embodiment, when forming the automatically cleaning particle 136 using sol-gal process, forerunner can first be prepared
Body colloidal sol, pass through the control to PH, additive and temperature etc., gel of the generation with certain space structure, by gel
It is dried and calcines, forms nano particle, namely form the automatically cleaning particle 136.
In one embodiment, metal alkoxide can be used for raw material, add solvent, water, catalyst etc., by hydrolysis and
Polymerisation obtains precursor sol.The metal alkoxide can use Ti (OC2H5)4、Ti(OC3H7 i)4、Ti(OC4H9 n)4Deng.
In one embodiment, when forming the protective layer 135 using hydro-thermal method, precursor solution is first prepared, is passed through
Control to temperature and pressure, nano particle is generated, namely form the automatically cleaning particle 136.
It should be noted that in certain embodiments, the protective layer 135 includes at least two colour attaching areas 1351/1352,
The color of each colour attaching area 1351/1352 is different, and the colour attaching area 1351/1352 of different colours is using the different automatically cleaning of color
Grain 1361/1362.
For example, the protective layer 135 includes the first colour attaching area 1351 and the second colour attaching area 1352.First colour attaching area
1351 can use the first automatically cleaning particle 1361.The first automatically cleaning particle 1361 can be white.Described first from clearly
Clean particle 1361 can use TiO2, ZnO etc..Second colour attaching area 1352 can use the second automatically cleaning particle 1362.Institute
It can be yellow to state the second automatically cleaning particle 1362.The second automatically cleaning particle 1362 can use CdS, BiVO4Deng.Example again
Such as, the protective layer 135 can also include the 3rd colour attaching area 1353.3rd colour attaching area 1353 uses the 3rd automatically cleaning particle
1363.The 3rd automatically cleaning particle 1363 can be rufous.The 3rd automatically cleaning particle 1363 can use Fe2O3。
In one embodiment, Figure 12 is referred to, methods described can also include：
Step 103：Automatically cleaning particle 136 is uniformly mixed in protective paint and forms predecessor.
The step S102 also includes：
Step S102a：The predecessor is coated on to the second surface 1342 of the base material 134；
Step S102b：The predecessor for drying the second surface 1342 of the base material 134 obtains prefilter layer；
Step S102c：Blasting treatment is carried out to the prefilter layer, exposure automatically cleaning particle 136, forms protective layer 135, institute
Automatically cleaning particle 136 is stated when receiving light irradiation, light-catalyzed reaction degradation of organic substances occurs.
In one embodiment, the step 101 can be carried out before step S103, can also be after step s 103
Carry out, can also be carried out simultaneously with step S103.The step S101 and step S103 are respectively positioned on before the step S102.
In one embodiment, the hardness of abrasive material used in the blasting treatment is more than the hardness of the prefilter layer, small
In the hardness of the automatically cleaning particle 136.
In one embodiment, the thickness of the protective layer 135 is more than 10 microns.When the thickness of the protective layer 135 is small
When 10 microns, because the thickness of the protective layer 135 is smaller, photopermeability is high, is easily done by the self color of base material 134
Disturb, it is bad to the utilization rate of the automatically cleaning particle 136 of the protective layer 135 color of itself, simultaneously as the protective layer
135 thickness is smaller, easily punches protective layer 135 in polishing process, is unfavorable for the formation of protective layer 135.A kind of real
Apply in mode, the thickness of the protective layer 135 can be more than 100 microns.
In one embodiment, the diameter of the automatically cleaning particle 136 is less than 500 nanometers, to cause the automatically cleaning
Grain 136 has good photocatalytic, meanwhile, user can't experience the automatically cleaning on its surface when touching the housing
Particle 136.In one embodiment, the diameter of the automatically cleaning particle 136 can be 50 nanometers -100 nanometers.When described from clear
When the diameter of clean particle 136 is less than 50nm, because the diameter of the automatically cleaning particle 136 is smaller, cause manufacturing cost higher, make
Make complex process；When the diameter of the automatically cleaning particle 136 is more than 100nm, due to the automatically cleaning particle 136 diameter compared with
Greatly, cause the photocatalytic of the automatically cleaning particle 136 weaker.
In summary, the method for producing shell that the embodiment of the present application provides, by base material towards on the outside of electronic equipment
Protective layer is formed on surface, the protective layer includes automatically cleaning particle, and the automatically cleaning particle is exposed to the protective layer
Surface, the automatically cleaning particle receive light irradiation when, occur light-catalyzed reaction, by organic matter be decomposed into carbon dioxide and
Water, namely the oils degradation that will attach in the fingerprint of surface of shell, so as to reach the automatic purpose for eliminating fingerprint.
It will be understood by those skilled in the art that the structure of the electronic equipment 1 shown in Fig. 1 is not formed to electronic equipment 1
Restriction.Electronic equipment 1 can be included than illustrating more or less parts, either combine some parts or different portions
Part is arranged.Electronic equipment 1 can also include memory, bluetooth module etc., will not be repeated here.
Method for producing shell, housing and the electronic equipment provided above the embodiment of the present application is described in detail, this
Apply specific case in text to be set forth the principle and embodiment of the application, the explanation of above example is only intended to
Help understands the application.Meanwhile for those skilled in the art, according to the thought of the application, in embodiment and answer
With there will be changes in scope, in summary, this specification content should not be construed as the limitation to the application.
Claims (13)
1. a kind of method for producing shell, the housing is applied to electronic equipment, it is characterised in that the method for producing shell bag
Include：
One base material is provided, the base material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and the
Two surfaces are towards on the outside of electronic equipment；And
Protective layer is set in the second surface of the base material, the protective layer includes automatically cleaning particle, the automatically cleaning particle
Exposed to the surface of the protective layer, when receiving light irradiation light-catalyzed reaction degraded occurs for the automatically cleaning particle organic
Thing.
2. method for producing shell as claimed in claim 1, it is characterised in that protection is set in the second surface of the base material
Layer, the protective layer include automatically cleaning particle, and the automatically cleaning particle is exposed to the surface of the protective layer, the automatically cleaning
Particle is in addition to equal by automatically cleaning particle before the step of light-catalyzed reaction degradation of organic substances occurs when receiving light irradiation
Even is mixed in protective paint the step of forming predecessor.
3. method for producing shell as claimed in claim 2, it is characterised in that protection is set in the second surface of the base material
Layer, the protective layer include automatically cleaning particle, and the automatically cleaning particle is exposed to the surface of the protective layer, the automatically cleaning
Particle receive light irradiation when, occur light-catalyzed reaction degradation of organic substances the step of in, including：
The predecessor is coated on to the second surface of the base material；
The predecessor for drying the second surface of the base material obtains prefilter layer；And
Blasting treatment is carried out to the prefilter layer, exposure automatically cleaning particle forms protective layer, and the automatically cleaning particle is receiving light
When line irradiates, light-catalyzed reaction degradation of organic substances occurs.
4. method for producing shell as claimed in claim 1, it is characterised in that：The protective layer includes at least two colour attaching areas,
The color of each colour attaching area is different, and the colour attaching area of different colours is using the different automatically cleaning particle of color.
5. method for producing shell as claimed in claim 1, it is characterised in that：The thickness of the protective layer is more than 10 microns.
6. method for producing shell as claimed in claim 1, it is characterised in that：The diameter of the automatically cleaning particle is received less than 500
Rice.
7. method for producing shell as claimed in claim 1, it is characterised in that：A diameter of 50 nanometers of the automatically cleaning particle-
100 nanometers.
A kind of 8. housing, applied to electronic equipment, it is characterised in that：The housing includes a base material and a protective layer, the base
Material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and second surface is towards outside electronic equipment
Side, the protective layer are arranged at the second surface of the base material, and the protective layer includes automatically cleaning particle, the automatically cleaning
Grain is exposed to the surface of the protective layer, and when receiving light irradiation, light-catalyzed reaction degraded occurs to be had the automatically cleaning particle
Machine thing.
9. housing as claimed in claim 8, it is characterised in that：The protective layer includes at least two colour attaching areas, each coloring
The color in area is different, and the colour attaching area of different colours is using the different automatically cleaning particle of color.
10. housing as claimed in claim 8, it is characterised in that：The thickness of the protective layer is more than 10 microns.
11. housing as claimed in claim 8, it is characterised in that：The diameter of the automatically cleaning particle is less than 500 nanometers.
12. housing as claimed in claim 8, it is characterised in that：A diameter of 50 nanometers -100 nanometers of the automatically cleaning particle.
13. a kind of electronic equipment, it is characterised in that including housing, the housing is as any one of claim 8 to 12
Housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711036404.6A CN107683045B (en) | 2017-10-30 | 2017-10-30 | Shell manufacturing method, shell and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711036404.6A CN107683045B (en) | 2017-10-30 | 2017-10-30 | Shell manufacturing method, shell and electronic equipment |
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| Publication Number | Publication Date |
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| CN107683045A true CN107683045A (en) | 2018-02-09 |
| CN107683045B CN107683045B (en) | 2020-08-04 |
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| CN201711036404.6A Expired - Fee Related CN107683045B (en) | 2017-10-30 | 2017-10-30 | Shell manufacturing method, shell and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933202A (en) * | 2018-09-19 | 2020-03-27 | 苹果公司 | Ceramic substrate with glass filler for decoration and housing material |
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| CN107683045B (en) | 2020-08-04 |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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Granted publication date: 20200804 |