CN107901545A - Method for producing shell, housing and electronic equipment - Google Patents
Method for producing shell, housing and electronic equipment Download PDFInfo
- Publication number
- CN107901545A CN107901545A CN201711040232.XA CN201711040232A CN107901545A CN 107901545 A CN107901545 A CN 107901545A CN 201711040232 A CN201711040232 A CN 201711040232A CN 107901545 A CN107901545 A CN 107901545A
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- CN
- China
- Prior art keywords
- base material
- housing
- prefilter layer
- electronic equipment
- producing shell
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the present application discloses a kind of method for producing shell, housing and electronic equipment, by in base material towards forming prefilter layer on the surface on the outside of electronic equipment, the surface of the prefilter layer has pore structure, the pore structure includes some holes, the pore structure occurs light-catalyzed reaction, organic matter is decomposed into carbon dioxide and water when receiving light irradiation, namely oils degradation in the fingerprint of surface of shell is will attach to, so as to achieve the purpose that to eliminate fingerprint automatically.
Description
Technical field
This application involves technical field of electronic equipment, and in particular to a kind of method for producing shell, housing and electronic equipment.
Background technology
At present, electronic equipment, for example mobile phone, the housing outer surface of tablet computer easily glue fingerprint.
The content of the invention
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment, can be with automated cleaning housing appearance
The fingerprint in face.
The embodiment of the present application provides a kind of method for producing shell, and the housing is applied to electronic equipment, and the housing makes
Method includes：
There is provided a base material, the base material includes first surface and second surface, and the first surface is towards in electronic equipment
Side, second surface is towards on the outside of electronic equipment；
In the second surface of the base material, prefilter layer is set；And
Etch prefilter layer and form pore structure, the pore structure includes some holes, and the pore structure is receiving light
When line irradiates, light-catalyzed reaction degradation of organic substances occurs.
The embodiment of the present application also provides a kind of housing, and applied to electronic equipment, the housing is preposition including a base material and one
Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction
On the outside of sub- equipment, the surface of the prefilter layer has pore structure, and the pore structure includes some holes, the pore structure
When receiving light irradiation, light-catalyzed reaction degradation of organic substances occurs.
The embodiment of the present application additionally provides a kind of electronic equipment, including housing, and the housing is preposition including a base material and one
Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction
On the outside of sub- equipment, the surface of the prefilter layer has pore structure, and the pore structure includes some holes, the pore structure
When receiving light irradiation, light-catalyzed reaction degradation of organic substances occurs.
Method for producing shell provided by the embodiments of the present application, by base material towards being formed on the surface on the outside of electronic equipment
Prefilter layer, the surface of the prefilter layer have pore structure, and the pore structure includes some holes, and the pore structure is connecing
When receiving light irradiation, light-catalyzed reaction occurs, organic matter is decomposed into carbon dioxide and water, namely will attach to surface of shell
Oils degradation in fingerprint, so as to achieve the purpose that to eliminate fingerprint automatically.
Brief description of the drawings
In order to illustrate more clearly of the technical solution in the embodiment of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the structure diagram of electronic equipment provided by the embodiments of the present application.
Fig. 2 is the structure diagram of housing provided by the embodiments of the present application.
Fig. 3 is the structure diagram of rear cover provided by the embodiments of the present application.
Fig. 4 is profiles of the Fig. 3 in the first embodiment in A-A directions.
Fig. 5 is profiles of the Fig. 3 in second of embodiment in A-A directions.
Fig. 6 is profiles of the Fig. 3 in the third embodiment in A-A directions.
Fig. 7 is another structure diagram of housing provided by the embodiments of the present application.
Fig. 8 is another structure diagram of rear cover provided by the embodiments of the present application.
Fig. 9 is another structure diagram of electronic equipment provided by the embodiments of the present application.
Figure 10 is the first flow diagram of rear cover production method provided by the embodiments of the present application.
Figure 11 is second of flow diagram of rear cover production method provided by the embodiments of the present application.
Figure 12 is the third flow diagram of rear cover production method provided by the embodiments of the present application.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, the technical solution in the embodiment of the present application is carried out clear, complete
Site preparation describes.Obviously, described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, the every other implementation that those skilled in the art are obtained without creative efforts
Example, shall fall in the protection scope of this application.
In the description of the present application, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Describe the application and simplify to describe, rather than indicate or imply that signified device or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In the description of the present application, " multiple " are meant that two or more, unless otherwise specifically defined.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；It can be directly connected, can also be by between intermediary
Connect connected, can be the interaction relationship of connection inside two elements or two elements.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to
Simplify disclosure herein, hereinafter the component and setting of specific examples are described.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, this application provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment.It will carry out respectively below detailed
Explanation.
In the present embodiment, will be described from the angle of rear cover production method, the method for producing shell can be formed
Housing, the housing can be set in the electronic device, such as mobile phone, tablet computer, palm PC (Personal Digital
Assistant, PDA) etc..
Refer to the structure diagram that 1, Fig. 1 is electronic equipment provided by the embodiments of the present application.The electronic equipment 1 includes
Housing 10, display screen 20, printed circuit board 30, battery 40.
Referring to Fig. 2, Fig. 2 is the structure diagram of housing provided by the embodiments of the present application.
Wherein, the housing 10 can include cover board 11, center 12 and rear cover 13.The cover board 11,12 and of the center
The rear cover 13 is mutually combined to form the housing 10.The housing 10, which has, passes through the cover board 11, the center 12 and institute
A confined space of the formation of rear cover 13 is stated, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
In certain embodiments, the lid of cover board 11 is set on the center 12.The lid of rear cover 13 is set to the center
On 12.The cover board 11 and rear cover 13 are located at the opposite face of the center 12.The cover board 11 and rear cover 13 are oppositely arranged.It is described
The confined space of housing 10 is between the cover board 11 and rear cover 13.
The cover board 11 can be transparent glass cover plate.In some embodiments, the cover board 11 can be with such as
Glass cover-plate made of the materials such as sapphire.
The center 12 can be metal shell, such as aluminium alloy center 12.It should be noted that in the embodiment of the present application
The material of frame 12 is not limited to this, and can also use other manner, such as：The center 12 can ceramic center, glass center.
For another example：The center 12 can be plastic cement center.Also such as：The center 12 can be the knot that metal and plastic cement cooperate
Structure, can form plastic portions and being molded on sheet metal.
The rear cover 13 can be with metal back cover, such as aluminium alloy rear cover, stainless steel rear cover.The rear cover 13 can also be glass
Glass rear cover or ceramic rear cover.
Also referring to Fig. 3, Fig. 3 is the structure diagram of rear cover provided by the embodiments of the present application.
The rear cover 13 can include inner surface 131 and the outer surface 132 being oppositely arranged.The inner surface of the rear cover 13
131 close to center 12 and cover board 11, forms a part for the inner surface of the housing 10.The outer surface 132 of the rear cover 13 is remote
From center 12 and cover board 11, a part for the outer surface of the housing 10 is formed.The rear cover 13 can also include through hole 133,
The through hole 133 can be used for installing camera.
Also referring to Fig. 4, Fig. 4 is profiles of the Fig. 3 in A-A directions.
For purposes of illustration only, housing is illustrated by taking rear cover 13 as an example below.
The rear cover 13 can include a base material 134 and a prefilter layer 135.The prefilter layer 135 is arranged at the rear cover
13 surfaces away from cover board 11, namely the prefilter layer 135 are arranged at the outer surface of the housing 11.
Wherein, the base material 134 can use aluminium, such as aluminium alloy, can also use stainless steel, can also use glass
Glass, ceramics etc..
The base material 134 includes first surface 1341 and second surface 1342.The first surface 1341 is set towards electronics
Standby inner side, second surface 1342 is towards on the outside of electronic equipment.In one embodiment, the first surface 1341 is towards cover board 11
Set with the direction of center 12.The first surface 1341 can be the inner surface 131 of rear cover 13.The first surface 1341 is
The inner surface of the housing 11.The second surface 1342 faces away from cover board 11 and the direction of center 12 is set.Described second
Surface 1342 is the outer surface of the housing 11.
The prefilter layer 135 is arranged at the second surface 1342 of the base material 134.The surface 135a of the prefilter layer 135
With pore structure 136.The pore structure 136 includes some holes 1361.The prefilter layer 135 is receiving light irradiation
When, light-catalyzed reaction degradation of organic substances occurs.
The prefilter layer 135 can use TiO2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The prefilter layer 135 can also
Using the TiO of metal ion mixing2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The metal ion for doping can be silver
Ion, copper ion etc..
The prefilter layer 135 can use physical vapour deposition (PVD) (PVD), chemical vapor deposition (CVD), sol-gal process or
The methods of person's hydro-thermal method, is formed.The prefilter layer 135 is attached to the second surface 1342 of the base material 134.
In one embodiment, can be in vacuum when forming the prefilter layer 135 using the method for chemical vapor deposition
Under the conditions of, argon gas is heated by metallorganic in certain temperature, the temperature can be 500-900 DEG C, when metal has
When the air pressure of machine thing reaches the threshold of reaction, the metallorganic is just decomposed and deposits to described the second of the base material 134
On surface 1342, the prefilter layer 135 is formed.The metallorganic can be Ti (O-I-C3H7)4。
In one embodiment, when forming the prefilter layer 135 using sol-gal process, it is molten presoma can first to be prepared
The precursor sol, the second surface of the base material 134 is arranged at by the method for spraying, spin coating or immersion by glue
1342。
In one embodiment, metal alkoxide can be used for raw material, add solvent, water, catalyst etc., by hydrolysis and
Polymerisation obtains precursor sol.The metal alkoxide can use Ti (OC2H5)4、Ti(OC3H7 i)4、Ti(OC4H9 n)4Deng.
In one embodiment, after first layer precursor sol is set up, described can be made by dry mode
One layer of precursor sol forms first layer gel, is set second layer precursor sol by the method for spraying, spin coating or immersion
It is placed on first layer gel, then by dry mode, second layer precursor sol is formed second layer gel, successively class
Push away, the thickness of gel by way of repeatedly precursor solution is set, can be adjusted, finally, to the base for being attached with gel
Material 134 is heat-treated, so that gel after chemical reaction forms the prefilter layer 135.
In one embodiment, can be to the base material 134 not when forming the prefilter layer 135 using hydro-thermal method
Need to set the region of prefilter layer 135 that mask is set；Precursor solution is configured, the base material 134 is soaked in the presoma
In solution, prefilter layer 135 is grown in the second surface 1342 of the base material 134 by controlling reaction temperature and pressure.
In one embodiment, in order to enable the prefilter layer 135 to be more firmly adhered to the of the base material 134
Two surfaces 1342, can be processed by shot blasting the second surface 1342 of the base material 134, to increase the of the base material 134
The flatness on the surface on two surfaces 1342, so as to add second surface 1342 of the prefilter layer 135 in the base material 134
Adhesive force, and then the prefilter layer 135 is firmly adhered to the second surface 1342 of the base material 134.
It should be noted that referring to Fig. 5-6, in certain embodiments, can be set on the surface 1342 of the base material 134
Put the prefilter layer 135 of different colours.The second surface 1342 of the base material 134 includes at least two vitellarium 1342a/1342b.
Different materials is set to form prefilter layer 135 in different vitellarium 1342a/1342b successively.The prefilter layer 135 can wrap
At least two colour attaching areas 1351/1352 are included, the color of each colour attaching area 1351/1352 is different.The vitellarium 1342a/1342b
Corresponded with the colour attaching area 1351/1352.
For example, the second surface 1342 of the base material 134 includes the first vitellarium 1342a and the second vitellarium 1342b.Institute
The first colour attaching area 1351 and the second colour attaching area 1352 can be included by stating prefilter layer 135.The first vitellarium 1342a corresponds to first
Colour attaching area 1351.The second vitellarium 1342b corresponds to the second colour attaching area 1352.First vitellarium can 1342a to set
TiO2.The color of first colour attaching area 1351 can be white.The second vitellarium 1342b can set CdS.Described
The color of two colour attaching areas 1352 can be yellow.For another example the second surface 1342 of the base material 134 can also include the three lives
Long area 1342c.The prefilter layer 135 can also include the 3rd colour attaching area 1353.The 3rd vitellarium 1342c correspondences the 3rd
Color area 1353.The 3rd vitellarium 1342c can set Fe2O3.The color of 3rd colour attaching area 1353 can be reddish brown
Color.
In one embodiment, the thickness of the prefilter layer 135 is more than 10 microns.When the thickness of the prefilter layer 135 is small
When 10 microns, since the thickness of the prefilter layer 135 is smaller, photopermeability is high, is easily done be subject to 134 self color of base material
Disturb, it is bad to the utilization rate of the color of itself of prefilter layer 135.In one embodiment, the thickness of the prefilter layer 135 can
With more than 100 microns.
In one embodiment, the internal diameter of described hole 1361 is less than 500 nanometers, so that the prefilter layer 135 has
Good photocatalytic, at the same time so that user can't experience the hole 1361 on its surface when touching the housing.
In a kind of embodiment, the internal diameter of described hole 1361 can be 50 nanometers -100 nanometers.When the internal diameter of described hole 1361 is less than
During 50nm, since the internal diameter of described hole 1361 is smaller, cause manufacture cost it is higher, the selection to etching solution is more harsh, system
Make complex process；When the internal diameter of described hole 1361 is more than 100nm, since the internal diameter of described hole 1361 is larger, cause institute
The photocatalytic for stating prefilter layer 135 is weaker.
In certain embodiments, the acid solution such as the concentrated sulfuric acid, concentrated hydrochloric acid, hydrofluoric acid or wherein several mixed can be used
Solution is closed to be etched the prefilter layer 135 to form pore structure 136.In certain embodiments, can also be in dense sulphur
Additive is added in the acid solutions such as acid, concentrated hydrochloric acid, hydrofluoric acid or wherein several mixed solutions with to the prefilter layer 135
It is etched to form pore structure 136.
It should be noted that the structure of the embodiment of the present application housing is not limited to this, such as, referring to Fig. 7, Fig. 7 is this
Apply for another structure diagram for the housing that embodiment provides.
The housing 10a includes cover board 16 and rear cover 17.In certain embodiments, the cover board 16 directly lid is set to described
On rear cover 17.The cover board 16 and the rear cover 17 are mutually combined to form the housing 10a.The housing 10a, which has, passes through institute
The confined space that cover board 16 and rear cover 17 are formed is stated, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
Compared to the housing 10 shown in Fig. 2, the housing 10a of Fig. 7 does not include center, or perhaps by the center in Fig. 2
12 and rear cover 13 be integrally formed to form 17 structure of a rear cover.
Specifically, referring to Fig. 8, Fig. 8 is another structure diagram of rear cover provided by the embodiments of the present application.
In certain embodiments, rear cover 17 includes inner surface 171 and outer surface 172,172 phase of inner surface 171 and outer surface
To setting, the whole surface of rear cover 17 is formed.Each Rotating fields of the rear cover 17 can refer to rear cover 13, and details are not described herein.
The printed circuit board 30 is installed in the housing 10, and the printed circuit board 30 can be the mainboard of electronic equipment 1,
Antenna, motor, microphone, camera, light sensor, receiver and processor etc. can be integrated with printed circuit board 30
Functional unit.In certain embodiments, the printed circuit board 30 is fixed in housing 10.Specifically, the printed circuit board
30 can be screwed on center 12 by screw, card can also be fitted on by the way of buckle on center 12.It should be noted that
The mode that the embodiment of the present application printed circuit board 30 is specifically fixed on center 12 is not limited to this, can with other manner, than
Such as by way of being buckled and screw is fixed jointly.
The battery 40 is installed in the housing 10, and battery 40 is electrically connected with the printed circuit board 30, with to electronics
Equipment 1 provides power supply.Housing 10 can be as the battery cover of battery 40.Housing 10 covers battery 40 to protect battery 40, specifically
Be that rear cover 13 covers battery 40 to protect battery 40, reduce battery 40 due to electronic equipment 1 collision, fall etc. and be subject to
Damage.
The display screen 20 is installed in the housing 10, meanwhile, the display screen 20 is electrically connected on printed circuit board 30, with
Form the display surface of electronic equipment 1.The display screen 20 includes display area 14 and non-display area 15.The display area 14
It can be used for showing the picture of electronic equipment 1 or carry out touching manipulation etc. for user.The top region of the non-display area 15
Domain opens up the perforate for sound and light conduction, and fingerprint module, touch controlled key can be set on 15 bottom of non-display area
Deng functional unit.Wherein described cover board 11 is installed on display screen 20, to cover display screen 20, is formed identical with display screen 20
Display area and non-display area, can specifically refer to display area and the non-display area of display screen 20.
It should be noted that the structure of the display screen 20 is not limited to this.For example the display screen can be to shield comprehensively
Or opposite sex screen, specifically, referring to Fig. 9, Fig. 9 is another structure diagram of electronic equipment provided by the embodiments of the present application.Fig. 9
In electronic equipment and Fig. 1 in electronic equipment difference lies in：The non-display area 15a is formed directly into display screen 20a
On, for example in the non-display area 15a of display screen 20a it is arranged to transparent configuration, so that optical signal passes through, or directly showing
The non-display area of screen 20a is opened up for structures such as the perforate of light conduction or notches, can be by front camera, photoelectric sensor
Etc. being arranged at non-display area position, so that front camera takes pictures, photoelectric sensor detection.The display area 14a is paved with
Electronic equipment 1a whole surfaces.It should be noted that housing 10, printed circuit board 30 and battery 40 in the electronic equipment 1a
Above content can be referred to Deng device, details are not described herein.
The present invention also provides a kind of production method of housing.
It should be noted that illustrated below by taking rear cover as an example, but the embodiment of the present application method for producing shell is not
It is limited to rear cover.
Also referring to Figure 10, Figure 10 is the flow diagram of rear cover production method provided by the embodiments of the present application.It is described
Method for producing shell comprises the following steps：
Step S101 a, there is provided base material 134, the base material 134 includes first surface 1341 and second surface 1342, described
First surface 1341 is towards on the inside of electronic equipment, and second surface 1342 is towards on the outside of electronic equipment.
The base material 134 can be metal material, such as aluminium, further, such as aluminium alloy.It should be noted that
The base material 134 can be directly commercially available, and sheet fabrication can also be obtained, for example, aluminum alloy plate materials are forged and pressed, when
The process such as effect obtain.The base material 134 can also use glass, ceramics etc..
The first surface 1341 is set towards the direction of cover board 11 and center 12.After the first surface 1341 can be
The inner surface 131 of lid 13.The first surface 1341 is the inner surface of the housing 11.The second surface 1342 faces away from
The direction of cover board 11 and center 12 is set.The second surface 1342 is the outer surface of the housing 11.
Step S102, prefilter layer 135 is set in the second surface 1342 of the base material 134.
In one embodiment, 1 is please referred to Fig.1, the step S102 can be：
Step S102a：The second surface 1342 of the base material 134 is processed by shot blasting；And
Step S102b：The second surface 1342 of the base material 134 after the grinding process is processed by shot blasting.
The second surface 1342 of the base material 134 is processed by shot blasting, to increase the second surface of the base material 134
The flatness on 1342 surface, so as to add attachment of the prefilter layer 135 in the second surface 1342 of the base material 134
Power, and then the prefilter layer 135 is firmly adhered to the second surface 1342 of the base material 134.
In certain embodiments, can be by the way of machinery, chemistry, electrochemistry or ultrasonic wave etc. to the base material 134
Second surface 1342 realize polishing.So that 1342 roughness of second surface of the base material 134 reduces, with obtain it is bright,
The second surface 1342 of the base material 134 of flat surface.Wherein, chemical polishing mode is the second table to the base material 134
Face 1342 carries out regular dissolving and reaches smooth.Wherein, electrochemical polish mode is by the second surface of the base material 134
1342 conduct anodes, insoluble petal are cathode, and the two poles of the earth are immersed in electrolytic cell at the same time, are led to direct current and are produced selective sun
Pole solution, so that 1342 brightness of the second surface increase of the base material 134 is big.The mode wherein mechanically polished is by cutting
Cut the second surface 1342 of the base material 134 so that after the plastic deformation of second surface 1342 of the base material 134 removes polishing
Convex portion and obtain even surface.The mode of wherein ultrasonic polishing is that the base material 134 is put into abrasive suspension and is put together
In ultrasound field, by the oscillation action of ultrasonic wave, make abrasive material in 1342 grinding-polishing of second surface of the base material 134.
In certain embodiments, can be first right before being processed by shot blasting to the second surface 1342 of the base material 134
The second surface 1342 of the base material 134 carries out grinding process, then again to the second table of the base material 134 after grinding process
Face 1342 is processed by shot blasting, makes polishing treatment better so that the second surface 1342 of the base material 134 is more smooth.
Here, it should be noted that the grinding process can be understood as to the roughing before polishing treatment.I.e., it is possible to first to rear cover
Outer surface carries out once thick polishing, then is once carefully polished, and completes polishing treatment.
The prefilter layer 135 can use TiO2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The prefilter layer 135 can also
Using the TiO of metal ion mixing2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The metal ion for doping can be silver
Ion, copper ion etc..
The prefilter layer 135 can use physical vapour deposition (PVD) (PVD), chemical vapor deposition (CVD), sol-gal process or
The methods of person's hydro-thermal method, is formed.The prefilter layer 135 is attached to the second surface 1342 of the base material 134.
In one embodiment, can be in vacuum when forming the prefilter layer 135 using the method for chemical vapor deposition
Under the conditions of, argon gas is heated by metallorganic in certain temperature, the temperature can be 500-900 DEG C, when metal has
When the air pressure of machine thing reaches the threshold of reaction, the metallorganic is just decomposed and deposits to described the second of the base material 134
On surface 1342, photocatalysis film is formed, so as to form the prefilter layer 135.The metallorganic can be Ti (O-I-
C3H7)4。
2 are please referred to Fig.1, please refers to Fig.1 2, when forming the prefilter layer 135 using sol-gal process, the step
S103 can include：
Step S1031, prepares precursor sol.
In one embodiment, metal alkoxide can be used for raw material, add solvent, water, catalyst etc., by hydrolysis and
Polymerisation obtains precursor sol.The metal alkoxide can use Ti (OC2H5)4、Ti(OC3H7 i)4、Ti(OC4H9 n)4Deng.
Precursor sol, is arranged at the second surface 1342 of the base material 134 by step S1032.
Wherein it is possible to the precursor sol is arranged at by the base material 134 by the method for spraying, spin coating or immersion
Second surface 1342.
Step S1033, the dry precursor sol form gel.
In one embodiment, it is described precursor sol is arranged to the base material second surface the step of and it is described dry
The step of dry precursor sol forms gel is repeatedly., can be by dry after first layer precursor sol is set up
Dry mode, will by the method for spraying, spin coating or immersion after the first layer precursor sol is formed first layer gel
Second layer precursor sol is arranged on first layer gel, then by dry mode, forms second layer precursor sol
Second layer gel, and so on, the thickness of gel by way of repeatedly precursor solution is set, can be adjusted.
Step S1034, is heat-treated the base material 134 for being attached with the gel, obtains the prefilter layer 135.
Wherein, the base material 134 for being attached with the gel is heat-treated, it is anti-by chemistry by being heat-treated gel
Photocatalysis film should be formed, so as to form prefilter layer 135.
In one embodiment, can be to the base material 134 not when forming the prefilter layer 135 using hydro-thermal method
Need to set the region of prefilter layer 134 that mask is set；Precursor solution is configured, the base material 134 is soaked in the presoma
In solution, prefilter layer 134 is grown in the second surface 1342 of the base material 134 by controlling reaction temperature and pressure.
In one embodiment, in order to enable the prefilter layer 135 to be more firmly adhered to the of the base material 134
Two surfaces 1342, can be processed by shot blasting the second surface 1342 of the base material 134, to increase the of the base material 134
The flatness on the surface on two surfaces 1342, so as to add second surface 1342 of the prefilter layer 135 in the base material 134
Adhesive force, and then the prefilter layer 135 is firmly adhered to the second surface 1342 of the base material 134.
It should be noted that in certain embodiments, different colours can be set on the surface 1342 of the base material 134
Prefilter layer 135.The second surface 1342 of the base material 134 includes at least two vitellarium 1342a/1342b.Successively in different lifes
Long area 1342a/1342b sets different materials to form prefilter layer 135.The prefilter layer 135 can include at least two
Color area 1351/1352, the color of each colour attaching area 1351/1352 are different.The vitellarium 1342a/1342b and the colour attaching area
1351/1352 corresponds.
For example, the second surface 1342 of the base material 134 includes the first vitellarium 1342a and the second vitellarium 1342b.Institute
The first colour attaching area 1351 and the second colour attaching area 1352 can be included by stating prefilter layer 135.The first vitellarium 1342a corresponds to first
Colour attaching area 1351.The second vitellarium 1342b corresponds to the second colour attaching area 1351.First vitellarium can 1342a to set
TiO2.The color of first colour attaching area 1351 can be white.The second vitellarium 1342b can set CdS.Described
The color of two colour attaching areas 1352 can be yellow.For another example the second surface 1342 of the base material 134 can also include the three lives
Long area 1342c.The prefilter layer 135 can also include the 3rd colour attaching area 1353.The 3rd vitellarium 1342c correspondences the 3rd
Color area 1353.The 3rd vitellarium 1342c can set Fe2O3.The color of 3rd colour attaching area 1353 can be reddish brown
Color.
In one embodiment, the thickness of the prefilter layer 135 is more than 10 microns.When the thickness of the prefilter layer 135 is small
When 10 microns, since the thickness of the prefilter layer 135 is smaller, photopermeability is high, is easily done be subject to 134 self color of base material
Disturb, it is bad to the utilization rate of the color of itself of prefilter layer 135.In one embodiment, the thickness of the prefilter layer 135 can
With more than 100 microns.
Step S103, etching prefilter layer 135 form pore structure 136, and the pore structure 136 includes some holes
1361, when receiving light irradiation light-catalyzed reaction degradation of organic substances occurs for the pore structure 136.
In one embodiment, the internal diameter of described hole 1361 is less than 500 nanometers, so that the prefilter layer 135 has
Good photocatalytic, at the same time so that user can't experience the hole 1361 on its surface when touching the housing.
In a kind of embodiment, the internal diameter of described hole 1361 can be 50 nanometers -100 nanometers.When the internal diameter of described hole 1361 is less than
During 50nm, since the internal diameter of described hole 1361 is smaller, cause manufacture cost it is higher, the selection to etching solution is more harsh, system
Make complex process；When the internal diameter of described hole 1361 is more than 100nm, since the internal diameter of described hole 1361 is larger, cause institute
The photocatalytic for stating prefilter layer 135 is weaker.
In certain embodiments, the acid solution such as the concentrated sulfuric acid, concentrated hydrochloric acid, hydrofluoric acid or wherein several mixed can be used
Solution is closed to be etched the prefilter layer 135 to form pore structure 136.In certain embodiments, can also be in dense sulphur
Additive is added in the acid solutions such as acid, concentrated hydrochloric acid, hydrofluoric acid or wherein several mixed solutions with to the prefilter layer 135
It is etched to form pore structure 136.
In summary, method for producing shell provided by the embodiments of the present application, by base material towards on the outside of electronic equipment
Prefilter layer is formed on surface, the surface of the prefilter layer has pore structure, and the pore structure includes some holes, the hole
Gap structure occurs light-catalyzed reaction, organic matter is decomposed into carbon dioxide and water, namely will attach to when receiving light irradiation
Oils degradation in the fingerprint of surface of shell, so as to achieve the purpose that to eliminate fingerprint automatically.
It will be understood by those skilled in the art that the structure of the electronic equipment 1 shown in Fig. 1 is not formed to electronic equipment 1
Restriction.Electronic equipment 1 can be included than illustrating more or fewer components, either combine some components or different portions
Part is arranged.Electronic equipment 1 can also include memory, bluetooth module etc., and details are not described herein.
Method for producing shell provided by the embodiments of the present application, housing and electronic equipment are described in detail above, this
Specific case is applied in text to be set forth the principle and embodiment of the application, the explanation of above example is only intended to
Help understands the application.Meanwhile for those skilled in the art, according to the thought of the application, in embodiment and answer
With there will be changes in scope, in conclusion this specification content should not be construed as the limitation to the application.
Claims (16)
1. a kind of method for producing shell, the housing is applied to electronic equipment, it is characterised in that the method for producing shell bag
Include：
One base material is provided, the base material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and the
Two surfaces are towards on the outside of electronic equipment；
In the second surface of the base material, prefilter layer is set；And
Etch prefilter layer and form pore structure, the pore structure includes some holes, and the pore structure is receiving light photograph
When penetrating, light-catalyzed reaction degradation of organic substances occurs.
2. method for producing shell as claimed in claim 1, it is characterised in that before the second surface in the base material is set
The step of putting layer, including：
The second surface of the base material is processed by shot blasting；
In the second surface of the base material of polishing treatment, prefilter layer is set.
3. method for producing shell as claimed in claim 2, it is characterised in that the second surface to the base material is thrown
The step of light processing, includes：
Grinding process is carried out to the second surface of the base material；And
The second surface of base material after the grinding process is processed by shot blasting.
4. method for producing shell as claimed any one in claims 1 to 3, it is characterised in that described the of the base material
Two surfaces set the step of prefilter layer to include：
Prepare precursor sol；
Precursor sol is arranged to the second surface of the base material；
The dry precursor sol forms gel；And
The base material for being attached with the gel is heat-treated, obtains prefilter layer.
5. method for producing shell as claimed in claim 4, it is characterised in that：It is described that precursor sol is arranged at the base material
Second surface the step of and drying precursor sol the step of forming gel repeatedly.
6. method for producing shell as claimed in claim 1, it is characterised in that the prefilter layer includes at least two colour attaching areas,
The color of each colour attaching area is different.
7. method for producing shell as claimed in claim 6, it is characterised in that before the second surface in the base material is set
The step of putting layer be：
The second surface of the base material includes at least two vitellariums, sets different materials to be formed in different vitellariums successively
Prefilter layer, the vitellarium are corresponded with the colour attaching area.
8. method for producing shell as claimed in claim 1, it is characterised in that the thickness of the prefilter layer is more than 10 microns.
9. method for producing shell as claimed in claim 1, it is characterised in that the internal diameter of described hole is less than 500 nanometers.
10. method for producing shell as claimed in claim 1, it is characterised in that the internal diameter of described hole is received for 50 nanometer -100
Rice.
A kind of 11. housing, applied to electronic equipment, it is characterised in that：The housing includes a base material and a prefilter layer, the base
Material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and second surface is towards outside electronic equipment
Side, the surface of the prefilter layer have pore structure, and the pore structure includes some holes, and the pore structure is receiving light
When line irradiates, light-catalyzed reaction degradation of organic substances occurs.
12. housing as claimed in claim 11, it is characterised in that：The prefilter layer includes at least two colour attaching areas, each
The color in color area is different.
13. housing as claimed in claim 11, it is characterised in that：The thickness of the prefilter layer is more than 10 microns.
14. housing as claimed in claim 11, it is characterised in that：The internal diameter of described hole is less than 500 nanometers.
15. housing as claimed in claim 11, it is characterised in that：The internal diameter of described hole is 50 nanometers -100 nanometers.
16. a kind of electronic equipment, it is characterised in that including housing, the housing is such as any one of claim 11 to 15 institute
The housing stated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711040232.XA CN107901545A (en) | 2017-10-30 | 2017-10-30 | Method for producing shell, housing and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711040232.XA CN107901545A (en) | 2017-10-30 | 2017-10-30 | Method for producing shell, housing and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107901545A true CN107901545A (en) | 2018-04-13 |
Family
ID=61843008
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711040232.XA Pending CN107901545A (en) | 2017-10-30 | 2017-10-30 | Method for producing shell, housing and electronic equipment |
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| Country | Link |
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| CN (1) | CN107901545A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104703934A (en) * | 2012-07-11 | 2015-06-10 | 剑桥实业有限公司 | Mesoporous inorganic coatings with photocatalytic particles in its pores |
| CN204585980U (en) * | 2015-04-02 | 2015-08-26 | 昆山市艾娃光电科技有限公司 | Phone housing |
| CN105609003A (en) * | 2014-11-13 | 2016-05-25 | 三星电子株式会社 | Display apparatus and method of manufacturing the same |
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2017
- 2017-10-30 CN CN201711040232.XA patent/CN107901545A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104703934A (en) * | 2012-07-11 | 2015-06-10 | 剑桥实业有限公司 | Mesoporous inorganic coatings with photocatalytic particles in its pores |
| CN105609003A (en) * | 2014-11-13 | 2016-05-25 | 三星电子株式会社 | Display apparatus and method of manufacturing the same |
| CN204585980U (en) * | 2015-04-02 | 2015-08-26 | 昆山市艾娃光电科技有限公司 | Phone housing |
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| 刘培生著: "《多孔材料引论》", 31 December 2012, 清华大学出版社 * |
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Application publication date: 20180413 |