CN107911964B

CN107911964B - Shell manufacturing method, shell and electronic equipment

Info

Publication number: CN107911964B
Application number: CN201711052520.7A
Authority: CN
Inventors: 杨光明; 张涛; 孙文峰
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-10-30
Filing date: 2017-10-30
Publication date: 2020-08-14
Anticipated expiration: 2037-10-30
Also published as: CN107911964A

Abstract

The embodiment of the application discloses a shell manufacturing method, a shell and electronic equipment, wherein the shell manufacturing method comprises the following steps: providing a shell substrate, and polishing the outer surface of the shell substrate; performing sand blasting treatment on the outer surface of the polished shell substrate, wherein in the sand blasting treatment, the sand blasting treatment is performed on a pre-sand blasting area close to the first edge or/and the third edge to form a sand blasting layer with a rough structure in the pre-sand blasting area; then, carrying out oxidation treatment on the outer surface of the shell substrate subjected to sand blasting treatment so as to form an oxide layer on the outer surface of the shell substrate and the sand blasting layer; and carrying out at least one time of paint spraying treatment on the outer surface of the shell substrate after the oxidation treatment to form at least one paint layer on the oxidation layer. The paint layer is located the outermost layer of casing surface, can make casing surface smooth and flat, difficult finger print that glues, can keep the casing surface clean and tidy.

Description

Shell manufacturing method, shell and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a shell manufacturing method, a shell and electronic equipment.

Background

At present, the raw materials for preparing and processing the shell of electronic equipment, such as a mobile phone and a tablet personal computer, are usually aluminum materials, and the commercially available aluminum materials cannot be directly used due to the problems of hardness and the like. The raw aluminum material needs to be processed for multiple times to form the required shell structure. However, after the shell in the prior art is processed, fingerprint marks are easily adhered to the outer surface of the shell.

Disclosure of Invention

The embodiment of the application provides a shell manufacturing method, a shell and electronic equipment, which can reduce fingerprint sticking on the outer surface of the shell.

In a first aspect, an embodiment of the present application provides a method for manufacturing a housing, where the housing is applied to an electronic device, and the method for manufacturing the housing includes:

providing a shell substrate, wherein the shell substrate comprises a first edge, a second edge, a third edge and a fourth edge which are connected end to end, and the shell substrate further comprises a pre-sandblasting area which is close to the first edge or/and the third edge;

polishing the outer surface of the shell substrate;

performing sand blasting treatment on the outer surface of the polished shell substrate, wherein the sand blasting treatment is performed in the pre-sand blasting area, and a sand blasting layer with a rough structure is formed in the pre-sand blasting area;

carrying out oxidation treatment on the outer surface of the shell substrate subjected to sand blasting treatment to form an oxide layer on the outer surface of the shell substrate and the sand blasting layer;

and carrying out at least one paint spraying treatment on the outer surface of the shell substrate subjected to the oxidation treatment, and forming at least one paint layer on the oxidation layer.

In a second aspect, embodiments of the present application further provide a housing, where the housing is formed by using the housing manufacturing method described above.

In a third aspect, an embodiment of the present application further provides a housing applied to an electronic device, where the housing includes a first edge, a second edge, a third edge, and a fourth edge that are connected end to end, the housing includes an inner surface and an outer surface that are oppositely disposed, the housing further includes a pre-sandblasting area near the first edge or/and the third edge, the sandblasting area is located on the outer surface of the housing, the housing further includes a sandblasting layer, an oxidation layer, and a paint layer, the sandblasting layer has a rough structure, the sandblasting layer is formed on the pre-sandblasting area, the oxidation layer is formed on the outer surface of the housing and on the sandblasting layer, and the paint layer is formed on the oxidation layer.

In a fourth aspect, an embodiment of the present application further provides an electronic device, which includes a housing, where the housing is the housing described above.

The method for manufacturing the shell comprises the steps of firstly, providing a shell substrate, and polishing the outer surface of the shell substrate; performing sand blasting treatment on the outer surface of the polished shell substrate, wherein in the sand blasting treatment, the sand blasting treatment is performed on a pre-sand blasting area close to the first edge or/and the third edge to form a sand blasting layer with a rough structure in the pre-sand blasting area; then, carrying out oxidation treatment on the outer surface of the shell substrate subjected to sand blasting treatment so as to form an oxide layer on the outer surface of the shell substrate and the sand blasting layer; and carrying out at least one time of paint spraying treatment on the outer surface of the shell substrate after the oxidation treatment to form at least one paint layer on the oxidation layer so as to form an integral shell structure. The user holds electronic equipment with the hand, often holds the lateral part edge of electronic equipment casing, and this application can increase frictional force at the sandblast layer that the first edge of casing or/and third edge position formed coarse structure, increases anti-skidding effect. And the paint layer is positioned on the outermost layer of the outer surface of the shell, so that the surface of the shell is smooth and flat, fingerprints are not easy to stick, and the outer surface of the shell can be kept clean.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a housing according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a rear cover according to an embodiment of the present application.

Fig. 4 is a cross-sectional view in the direction a-a of fig. 3.

Fig. 5 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 6 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 7 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 8 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 9 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 10 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 11 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 12 is another schematic structural diagram of a rear cover according to an embodiment of the present application.

Fig. 13 is a cross-sectional view of fig. 12 in the direction B-B.

Fig. 14 is another cross-sectional view in the direction B-B of fig. 12.

Fig. 15 is another cross-sectional view in the direction B-B of fig. 12.

Fig. 16 is a schematic structural view of the back cover according to the embodiment of the present application, where the outer surface of the back cover is subjected to sand blasting.

Fig. 17 is another schematic structural diagram of a rear cover according to an embodiment of the present application.

Fig. 18 is a cross-sectional view in the direction C-C of fig. 17.

Fig. 19 is another schematic structural diagram of the housing according to the embodiment of the present application.

Fig. 20 is another schematic structural diagram of a rear cover according to an embodiment of the present application.

Fig. 21 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 22 is a schematic flow chart of a method for manufacturing a rear cover according to an embodiment of the present application.

Fig. 23 is a schematic flow chart of a painting process according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiment of the application provides a shell manufacturing method, a shell and electronic equipment. The details will be described below separately.

In the present embodiment, the method for manufacturing the rear cover will be described in terms of a method for manufacturing the rear cover, which may form a housing that may be provided in an electronic device, such as a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), and the like.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 1 comprises a housing 10, a display 20, a printed circuit board 30, and a battery 40.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a housing according to an embodiment of the present disclosure. Wherein, the casing 10 may include a cover plate 11, a middle frame 12 and a rear cover 13, the cover plate 11, the middle frame 12 and the rear cover 13 are combined with each other to form the casing 10, and the casing 10 has a closed space formed by the cover plate 11, the middle frame 12 and the rear cover 13 to accommodate the display screen 20, the printed circuit board 30, the battery 40 and the like. In some embodiments, the cover plate 11 is covered on the middle frame 12, the rear cover 13 is covered on the middle frame 12, the cover plate 11 and the rear cover 13 are located on opposite sides of the middle frame 12, the cover plate 11 and the rear cover 13 are oppositely arranged, and the closed space of the housing 10 is located between the cover plate 11 and the rear cover 13.

The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire. The middle frame 12 may be a metal casing, such as an aluminum alloy middle frame 12. It should be noted that the material of the frame 12 in the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: the middle frame 12 can be a ceramic middle frame or a glass middle frame. For another example: the middle frame 12 may be a plastic middle frame. Also for example: the middle frame 12 may be a structure in which metal and plastic are matched with each other, and the plastic part may be formed by injection molding on a metal plate. Wherein the rear cover 13 may be a metal rear cover, such as an aluminum alloy rear cover.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a rear cover according to an embodiment of the present disclosure. The rear cover 13 may include an inner surface 131 and an outer surface 132 opposite to each other, the inner surface 131 of the rear cover 13 is close to the middle frame 12 and the cover plate 11 to form an inner surface of the housing 10, and the outer surface 132 of the rear cover 13 is far from the middle frame 12 and the cover plate 11 to form an outer surface of the housing 10. The rear cover 13 may further include an opening 133, and the opening 133 may be mounted with a camera.

In some embodiments, the rear cover 13 includes a first side 111, a second side 112, a third side 113, and a fourth side 114 that are connected end-to-end, wherein the first side 111 and the third side 113 are opposite, and the second side 112 and the fourth side 114 are opposite. In some embodiments, the second side 112 may be located at the bottom of the electronic device 1, the fourth side 114 may be located at the top of the electronic device 1, and the first side 111 and the third side 113 may be located at both sides of the electronic device 1. Wherein the opening 133 may be located at the fourth side 114.

Referring to fig. 4, fig. 4 is a cross-sectional view taken along a-a direction of fig. 3. The rear cover 13a may include a rear cover substrate 137, an oxide layer 134, and a paint layer 136.

The rear cover substrate 137 may be made of aluminum, such as aluminum alloy. The rear cover substrate 137 includes an inner surface 131 and an outer surface 132, the inner surface of the rear cover substrate 137 may be understood as an inner surface of the rear cover 13, and the outer surface of the rear cover substrate 137 may be understood as an outer surface before the rear cover is not oxidized, painted, or the like. The rear cover substrates 137 rear covers 13a have the same first side 111, second side 112, third side 113, and fourth side 114.

Wherein an oxide layer 134 is formed on the outer surface 132 of the back cover substrate 137. The oxide layer 134 may be formed by a single oxidation to form an oxide layer 134. Such as: the oxide layer 134 is formed by monochromatic oxidation, and may be formed by coloring after the oxidation process. It should be noted that in some embodiments, a multi-layer oxide layer may also be formed by two or more oxidations.

Such as: referring to fig. 5, fig. 5 is another cross-sectional view taken along a-a direction of fig. 3. Fig. 5 differs from fig. 4 in that: the oxide layer 134 of the back cover 13b includes two layers, i.e., a first oxide layer 1341 and a second oxide layer 1342. A first oxide layer 1341 is formed on the outer surface 132 of the back cover substrate 137 and a second oxide layer 1342 is formed on the first oxide layer 1341, which may cover only a portion of the first oxide layer in some embodiments. The first oxide layer 1341 and the second oxide layer 1342 may increase the bonding force with the paint layer 136. The multi-layer structure of the oxide layer is not illustrated here. In some embodiments, the first oxide layer may be a colored oxide layer, and the second oxide layer may also be a colored oxide layer. The color of the first oxide layer may be different from or the same as the color of the second oxide layer.

Wherein the paint layer 136 is formed on the oxide layer 134, and the oxide layer 134 is located between the paint layer 136 and the back cover substrate 137. In some embodiments, the paint layer 136 may be formed by spraying a layer of paint on the oxide layer 134. The paint layer 136 is located on the outermost layer of the outer surface of the rear cover 13, and the surface of the paint layer is smooth and flat, so that fingerprint is not easy to stick on the paint layer, and the outer surface of the rear cover can be kept clean and smooth.

It is noted that in some embodiments, two or more layers of paint may be sprayed on the oxide layer 134 to form two or more paint layers. Such as: referring to fig. 6, fig. 6 is another cross-sectional view taken along a-a direction of fig. 3. Fig. 6 differs from fig. 4 in that: the paint layers 136 of the rear cover 13c include a first paint layer 1361 and a second paint layer 1362. The first paint layer 1361 is formed on the oxide layer 134 and the second paint layer 1362 is formed on the first paint layer 1361. In some embodiments, the thickness of the second paint layer 1362 is greater than the thickness of the first paint layer 1361, and further, the thickness of the second paint layer 1362 is twice the thickness of the first paint layer 1361, such as the thickness of the second paint layer 1362 is 10um and the thickness of the first paint layer 1361 is 5 um. It should be noted that there may be some error value in the production process, such as an error value of 0.5um, for example, between the second paint layer 1362 and the first paint layer 1361. The setting of second paint layer and first paint layer thickness can provide better protection to the back lid surface, makes the bonding inseparabler moreover between the two-layer paint layer.

For another example: referring to fig. 7, fig. 7 is another cross-sectional view taken along a-a direction of fig. 3. Fig. 7 differs from fig. 4 in that: the paint layers 136 of the rear cover 13d include a first paint layer 1361, a second paint layer 1362 and a third paint layer 1363. The first paint layer 1361 is formed on the oxide layer 134, the second paint layer 1362 is formed on the first paint layer 1361, and the third paint layer 1363 is formed on the second paint layer 1362. Forming two or three paint layers on the oxide layer 134 may increase the bonding force between the oxide layer and the paint layer, and may provide better protection for the rear cover. In some embodiments, the thickness of the third paint layer 1363 is greater than the thickness of the second paint layer 1362, and the thickness of the second paint layer 1362 is greater than the thickness of the first paint layer 1361. Further, the thickness of the third paint layer 1363 is twice the thickness of the second paint layer 1362, the thickness of the second paint layer 1362 is twice the thickness of the first paint layer 1361, for example, the thickness of the third paint layer 1363 is 8um, the thickness of the second paint layer 1362 is 4um, and the thickness of the first paint layer 1361 is 2 um.

In some embodiments, the thicknesses of the third paint layer 1363, the second paint layer 1362, and the first paint layer 1361 are sequentially reduced by equal thickness, such as the thickness of the third paint layer 1363 is 9um, the thickness of the second paint layer 1362 is 6um, and the thickness of the first paint layer 1361 is 3 um. The setting of third paint layer, second paint layer and first paint layer thickness can provide better protection to the back lid surface, makes bonding more inseparabler between the three-layer paint layer moreover.

In some embodiments, the paint layer may be provided transparently. It should be noted that when the paint layers are at least two layers, at least one of the paint layers may be disposed to be transparent. Further, all paint layers are arranged in a transparent mode. The back cover oxide layer is the color of the outer surface of the back cover.

To increase the bonding force between the paint layer 136 and the oxide layer 134, in some embodiments, please refer to fig. 8, which is another cross-sectional view of fig. 3 along the direction a-a. Fig. 8 differs from fig. 4 in that: the rear cover 13e may further include a bonding layer 135. The bonding layer 135 is formed on the oxide layer 134, and the paint layer 136 is formed on the bonding layer 135. In some embodiments, the bonding layer 135 may be formed on the oxide layer 134 by PVD (Physical Vapor Deposition). The bonding layer 135 is positioned between the oxide layer 134 and the paint layer 136, and may increase the bonding force between the oxide layer 134 and the paint layer 136. It should be noted that, in the embodiments of the present application, the bonding layer may also be formed on the oxide layer in other manners to increase the bonding force between the oxide layer and the paint layer.

In some embodiments, referring to fig. 9, fig. 9 is another cross-sectional view taken along a-a direction of fig. 3, where fig. 9 differs from fig. 4 in that: back lid 13f back lid base plate 137's surface forms sandblast layer 1371 that has coarse structure, and the coarse structure on this sandblast layer 1371 can adopt the mode of sandblast to form through the sandblast machine for back lid base plate 137 surface is clean, coarse, and then can increase the cohesion that forms between oxide layer 134 and the paint layer 136 on this sandblast layer 1371. In some embodiments, the sandblasted layer 1371 covers the entire outer surface of the back cover substrate 137.

In some embodiments, the rough structure may be a concave-convex structure, and the concave-convex structure may be a regular structure, that is, the concave-convex structure is uniformly arranged on the outer surface of the back cover substrate 137; an irregular structure, that is, an arrangement with different pitches on the outer surface of the rear cover substrate 137 may be also possible. It should be noted that the rough structure of the embodiment of the present application is not limited to this, and may also be only a protruding structure, such as: referring to fig. 10, fig. 10 is another cross-sectional view taken along a-a of fig. 3, and fig. 10 is different from fig. 9 in that: the rough structure in fig. 10 is a convex structure, and may be uniformly distributed bumps or unevenly distributed bumps. Also for example: referring to fig. 11, fig. 11 is another cross-sectional view taken along a-a of fig. 3, and fig. 11 is different from fig. 9 in that: the rough structure in fig. 11 is a concave structure, and may be uniformly distributed pits or unevenly distributed pits.

In some embodiments, please refer to fig. 12, and fig. 12 is another structural schematic diagram of the rear cover according to the embodiment of the present application. The outer surface of the rear cover 13g includes two pre-blasting regions 115, and the two pre-blasting regions 115 are spaced apart from each other. Specifically, two pre-sandblasting areas 115 are respectively adjacent to the first side 111 and the third side 113. Namely, a pre-blasting area 115 is disposed adjacent to the first edge 111, or a pre-blasting area 115 is disposed adjacent to the first edge 111; another pre-sandblasting area 115 is located adjacent to the third edge 113, or one pre-sandblasting area 115 is located adjacent to the third edge 113.

In some embodiments, the pre-blasting region 115 may be treated by blasting with a blasting machine to form a roughness structure in the pre-blasting region 115. Specifically, referring to fig. 13, fig. 13 is a cross-sectional view taken along the direction B-B in fig. 12. A sandblasted layer 1373 having a rough structure is formed in the pre-sandblasted region 115, and the sandblasted layer 1373 has two portions, i.e., a first sandblasted layer 1371 and a second sandblasted layer 1372. Wherein the first sandblasting layer 1371 is formed on one of the pre-sandblasting areas 115, and the first sandblasting layer 1371 is adjacent to the first side 111. Wherein the second blasting layer 1372 is formed on the other pre-blasting region 115, the second blasting layer 1372 being adjacent to the third side 113. The first blasting layer 1371 and the second blasting layer 1372 are spaced apart from each other.

In some embodiments, the rough structure may be a concave-convex structure, and the concave-convex structure may be a regular structure, that is, the concave-convex structure is uniformly arranged on the outer surface of the back cover substrate 137; an irregular structure, that is, an arrangement with different pitches on the outer surface of the rear cover substrate 137 may be also possible. It should be noted that the rough structure of the embodiment of the present application is not limited to this, and may also be only a protruding structure, such as: referring to fig. 14, fig. 14 is another cross-sectional view of fig. 12 in the direction B-B, and fig. 14 is different from fig. 13 in that: the rough structure in fig. 14 is a convex structure, and may be uniformly distributed bumps or unevenly distributed bumps. Also for example: referring to fig. 15, fig. 15 is another cross-sectional view taken along the direction B-B of fig. 12, and fig. 15 is different from fig. 13 in that: the rough structure in fig. 15 is a concave structure, and may be uniformly distributed pits or unevenly distributed pits.

In some embodiments, please refer to fig. 16, fig. 16 is a schematic structural view illustrating a structure of performing a sand blasting process on an outer surface of a back cover according to an embodiment of the present disclosure. The distance between the second side 112 and the fourth side 114 is H1, the sandblasting layer 1373 is close to the second side 112, and the height of the sandblasting layer 1373 in the direction from the second side 112 to the fourth side 114 is H2, wherein 2/5H1 < H2 < 4/5H 1. It should be noted that in some other embodiments, the height of the sandblasting layer 1373 can be set according to actual requirements.

The width of the sandblasting layer 1373 in the direction from the first side 111 to the third side 113 is W, wherein W is more than 1cm and less than 2 cm. It should be noted that the width of the sandblasting layer 1373 can be set according to actual requirements.

In some embodiments, the blasting layer 1373 may be an arc-shaped structure, and a bending direction of the arc-shaped structure may be a direction from the first side 111 to the third side 113.

It should be noted that, in the process of holding the electronic device 1, the area where the user holds the electronic device 1 for a long time is the outer surface of the housing of the electronic device 1, specifically, the user holds the electronic device 1 to the two side edges of the rear cover of the housing. More specifically, the width of the outer surface of the back cover in the width direction is 1-2cm, and the width of the fingers is 1-2 cm. In addition, the height duration for the user to hold the electronic apparatus 1 with the hand is more than half of the height of the electronic apparatus 1. Therefore, according to the habit of holding the electronic device 1 by a user, the region and the like, the sandblasting treatment is performed at the two side edge positions of the rear cover, and a sandblasting layer with a rough structure can be formed, so that the friction force can be increased, and the anti-skid effect can be increased.

It should be noted that the pre-blasting area 115 according to the embodiment of the present application is not limited thereto, and may be one. Specifically, referring to fig. 17 and 18, fig. 17 is another structural schematic view of a rear cover according to an embodiment of the present application, and fig. 18 is a cross-sectional view of fig. 17 in a direction C-C. The differences between fig. 17 and 18 and fig. 12 and 13 are that: the pre-blasting area 115 is one, and the pre-blasting area 115 is close to the first edge 111, or the pre-blasting area 115 is adjacent to the first edge 111.

It should be noted that, when there is one pre-blasting region 115, one pre-blasting region 115 may be disposed near the third side 113. It should be further noted that the roughness structure in fig. 17 and 18 may include a concave-convex structure, a convex structure, or a concave structure, which may be referred to above specifically, and will not be described herein again.

It should be noted that the paint layer may be formed on the entire outer surface of the rear cover, or may be formed on the sandblast layer. When the paint layer is formed on the blasting layer, the paint layer may overlap the blasting layer. When the paint layers are two or more, one of the paint layers may be disposed on the sandblasted layer, or one or more of the paint layers may be disposed on the entire outer surface of the rear cover.

It should be noted that the structure of the rear cover is not limited to this, for example: the rear cover may include two or more oxide layers, two or more paint layers. For another example: the rear cover may include two or more oxide layers, two or more paint layers, and an anchor layer. For another example: the rear cover may include two or more oxide layers, two or more paint layers, and a sandblast layer. It should be noted that the number of layers of the oxide layer, the sandblasting layer, the bonding layer and the paint layer is within the protection scope of the embodiments of the present application, and will not be illustrated herein.

It should be noted that the structure of the housing according to the embodiment of the present application is not limited to this, for example, please refer to fig. 19, and fig. 19 is another schematic structural diagram of the housing according to the embodiment of the present application. Among them, a case 10a shown in fig. 19 includes a cover plate 16 and a rear cover 17. In some embodiments, the cover plate 16 is directly covered on the rear cover 17, the cover plate 16 and the rear cover 17 are combined with each other to form the housing 10a, and the housing 10a has a closed space formed by the cover plate 16 and the rear cover 17 to accommodate the display 20, the printed circuit board 30, the battery 40, and the like. Compared with the housing 10 shown in fig. 2, the housing 10a does not include the middle frame, or the middle frame 12 and the rear cover 13 in fig. 2 are integrally formed to form a rear cover 17 structure (of course, the middle frame structure may be named herein). Specifically, please refer to fig. 20, fig. 20 is another schematic structural diagram of the rear cover according to the embodiment of the present application. In some embodiments, the rear cover 17 includes an inner surface 171 and an outer surface 172, with the inner surface 171 and the outer surface 172 being oppositely disposed to form the entire surface of the rear cover 17. The various layers of the rear cover 17 can be referred to as the rear cover 13, and are not described in detail here.

The printed circuit board 30 is installed in the housing 10, the printed circuit board 30 may be a main board of the electronic device 1, and functional components such as an antenna, a motor, a microphone, a camera, a light sensor, a receiver, and a processor may be integrated on the printed circuit board 30. In some embodiments, the printed circuit board 30 is secured within the housing 10. Specifically, the printed circuit board 30 may be screwed to the middle frame 12 by screws, or may be snapped to the middle frame 12 by a snap-fit manner. It should be noted that the way of fixing the printed circuit board 30 to the middle frame 12 is not limited to this, and other ways, such as a way of fixing by a snap and a screw, may also be used.

Wherein the battery 40 is mounted in the housing 10, and the battery 40 is electrically connected to the printed circuit board 30 to supply power to the electronic device 1. The case 10 may serve as a battery cover of the battery 40. The case 10 covers the battery 40 to protect the battery 40, and particularly, the rear cover 13 covers the battery 40 to protect the battery 40, reducing damage to the battery 40 due to a collision, a fall, or the like of the electronic apparatus 1.

Wherein the display screen 20 is installed in the housing 10, and at the same time, the display screen 20 is electrically connected to the printed circuit board 30 to form a display surface of the electronic device 1. The display screen 20 includes a display area 14 and a non-display area 15. The display area 14 may be used to display a screen of the electronic device 1 or provide a user with touch control. The top area of the non-display area 15 is provided with an opening for transmitting sound and light, and the bottom of the non-display area 15 can be provided with functional components such as a fingerprint module, a touch key and the like. The cover plate 11 is mounted on the display screen 20 to cover the display screen 20, and forms the same display area and non-display area as the display screen 20, which can be referred to specifically as the display area and the non-display area of the display screen 20.

The structure of the display screen 20 is not limited to this. For example, the display screen may be a full-screen or an opposite-type screen, specifically, please refer to fig. 21, and fig. 21 is another schematic structural diagram of the electronic device according to the embodiment of the present application. The electronic device in fig. 21 differs from the electronic device in fig. 1 in that: the non-display area 15a is directly formed on the display screen 20a, for example, the non-display area 15a of the display screen 20a is provided with a transparent structure so that an optical signal can pass through, or the non-display area of the display screen 20a is directly provided with an opening or a notch for light conduction, and the like, and a front camera, a photoelectric sensor, and the like can be arranged at the position of the non-display area so that the front camera can take a picture and the photoelectric sensor can detect. The display area 14a is spread over the entire surface of the electronic apparatus 1 a. It should be noted that the components of the housing 10, the printed circuit board 30, the battery 40, and the like in the electronic device 1a can refer to the above contents, and are not described herein again.

It should be noted that the display screen may also be displayed in full screen without setting the non-display area.

In order to further describe the housing structure of the embodiments of the present application, a housing manufacturing method is taken as an example and described in detail below. The manufacturing method of the housing may specifically include a rear cover manufacturing method and a middle frame manufacturing method. The following description will be made by taking a method for manufacturing a case and a method for manufacturing a rear cover as an example, and it is to be understood that the method for manufacturing a case in the embodiment of the present application is not limited to the rear cover.

Referring to fig. 22, fig. 22 is a schematic flow chart illustrating a method for manufacturing a rear cover according to an embodiment of the present disclosure. The manufacturing method of the rear cover comprises the following steps:

in step 101, a back cover substrate is provided. The rear cover substrate may be a metal material, such as aluminum, and further, such as aluminum alloy. The rear cover substrate may be purchased as it is, or may be obtained by processing a plate material, for example, by performing processes such as forging and aging on an aluminum alloy plate material. It should be noted that, the above contents may be referred to for the rear cover substrate, and are not described herein again.

The rear cover substrate may include an inner surface and an outer surface that are oppositely disposed, and the rear cover substrate and the inner surface and the outer surface thereof may refer to the above contents, which are not described herein again. The rear cover substrate may further include a first edge, a second edge, a third edge, and a fourth edge that are connected end to end, and the first edge, the second edge, the third edge, and the fourth edge of the rear cover substrate may be understood as the first edge, the second edge, the third edge, and the fourth edge of the rear cover.

In some embodiments, the outer surface of the rear cover substrate may include two pre-blasting regions, and the two pre-blasting regions are spaced apart from each other. Specifically, the two pre-sandblasted areas are respectively close to the first edge and the third edge of the back cover substrate. Namely, one pre-sandblasting area is close to the first edge, or one pre-sandblasting area is arranged adjacent to the first edge; the other pre-sandblasting area is close to the third side, or one pre-sandblasting area is arranged adjacent to the third side.

It should be noted that there may be one pre-blasting area, and when there is one pre-blasting area, the pre-blasting area may be disposed near the first edge, or may be disposed near the third edge.

In step 102, a polishing process is performed on an outer surface of the back cover substrate. So that the outer surface of the back cover substrate is flat.

In some embodiments, the outer surface of the back cover substrate may be polished mechanically, chemically, electrochemically, ultrasonically, or the like. So that the surface roughness of the back cover substrate is reduced to obtain a bright and flat surface of the outer surface of the back cover substrate. The chemical polishing mode is to regularly dissolve the outer surface of the back cover substrate to achieve smoothness and flatness. The electrochemical polishing mode is that the outer surface of the back cover is used as an anode, insoluble metal is used as a cathode, the two electrodes are immersed into an electrolytic tank at the same time, and direct current is conducted to generate selective anode solution, so that the brightness of the outer surface of the back cover substrate is increased. The mechanical polishing is carried out by cutting the outer surface of the rear cover substrate, and the polished convex part is removed by plastic deformation of the outer surface of the rear cover substrate to obtain a smooth surface. The ultrasonic polishing mode is that the back cover substrate is put into the abrasive suspension and placed in an ultrasonic field together, and the abrasive is ground and polished on the surface of a workpiece under the oscillation action of ultrasonic waves.

In some embodiments, before polishing the outer surface of the rear cover substrate, the outer surface of the rear cover substrate may be polished, and then the outer surface of the rear cover substrate after polishing is polished, so that the polishing effect is better, and the outer surface of the rear cover substrate is smoother. Here, it should be noted that the grinding process is understood as a rough process before the polishing process. That is, the outer surface of the rear cover substrate may be subjected to rough polishing once and then to fine polishing once, thereby completing the polishing process.

In step 103, the outer surface of the polished rear cover substrate is subjected to sand blasting at a position in a pre-sand blasting area, and a sand blasting layer having a rough structure is formed in the pre-sand blasting area.

The sandblasted layer having the coarse structure can increase the bonding force between the oxide layer and the paint layer.

In some embodiments, in conjunction with fig. 12-18, the pre-blasting region 115 may be treated by blasting with a blasting machine to form a blasting layer 1373 having a rough structure in the pre-blasting region 115, and the blasting layer 1373 may have two parts, i.e., a first blasting layer 1371 and a second blasting layer 1372. Wherein the first sandblasting layer 1371 is formed on one of the pre-sandblasting areas 115, and the first sandblasting layer 1371 is adjacent to the first side 111. Wherein the second blasting layer 1372 is formed on the other pre-blasting region 115, the second blasting layer 1372 being adjacent to the third side 113. The first blasting layer 1371 and the second blasting layer 1372 are spaced apart from each other.

In some embodiments, please refer to fig. 16, wherein the distance between the second side 112 and the fourth side 114 is H1, the sandblasting layer 1373 is close to the second side 112, and the height of the sandblasting layer 1373 in the direction from the second side 112 to the fourth side 114 is H2, wherein 2/5H1 < H2 < 4/5H 1. It should be noted that in some other embodiments, the height of the sandblasting layer 1373 can be set according to actual requirements.

In some embodiments, the blasting layer 1373 may be an arc-shaped structure, and a bending direction of the arc-shaped structure may be a direction from the first side 111 to the third side 113. The rough structure of the sandblasting layer 1373 may include a concave-convex structure, a convex structure or a concave structure, which is not described herein again.

It should be noted that the blasting layer may be one, such as the first blasting layer 1371. The blasting layer may be a second blasting layer. Specifically, fig. 17, fig. 18 and the above contents may be combined, and are not described herein again.

In some embodiments, the sandblasting layer having the rough structure may increase a bonding area between the oxide layer and the paint layer, and may further increase a bonding force between the oxide layer and the paint layer.

In step 104, the outer surface of the sandblasted rear cover substrate is subjected to oxidation treatment.

In some embodiments, the sandblasted outer surface of the substrate of the back cover may be subjected to at least one oxidation process to form an oxide layer, or oxide film. Each oxidation may be colored during the oxidation process to provide the desired appearance color. Such as: the outer surface of the rear cover after the sand blasting may be subjected to a primary oxidation treatment to form an oxide layer, and the oxidation treatment may be followed by a coloring treatment to form a desired color, such as red, blue, or the like.

In some embodiments, the outer surface of the substrate of the back cover after the sand blasting may be oxidized twice or more to form at least two oxide layers, and the substrate may be colored during the oxidation process to form a desired appearance color. The protective effect on the outer surface of the rear cover is better through two or more times of oxidation treatment, and the bonding force between at least two layers formed after two or more times of oxidation and the paint layer is better.

In some embodiments, the oxide layer covers the outer surface of the back cover substrate, and the oxide layer is formed on the sandblasting layer and the outer surface of the back cover substrate.

In step 105, the outer surface of the oxidized rear cover substrate is subjected to at least one paint spraying process to form at least one paint layer on the outer surface of the rear cover substrate, so as to form a complete rear cover structure. The at least one paint layer is formed on the oxide layer. The at least one paint layer is positioned on the outermost layer of the outer surface of the rear cover substrate, the surface of the at least one paint layer is smooth and flat, fingerprints are not easy to stick, and the outer surface of the rear cover can be kept clean and smooth.

In some embodiments, a paint layer may be formed by performing a painting process on the oxide layer once, or two or more paint layers may be formed by performing a painting process on the oxide layer twice or more. When the oxide layer has only one layer or two or more layers, a paint layer may be formed by directly performing one-time painting treatment on the oxide layer, or two or more paint layers may be formed by performing two or more times of painting treatment on the oxide layer.

In some embodiments, after the at least one paint spraying process is performed on the outer surface of the oxidized rear cover substrate, the outer surface of the rear cover substrate may be baked at least once, and a high temperature baking may be used to dry the paint sprayed on the outer surface of the rear cover substrate to form a paint layer. For example, the baking temperature is 80 ℃ and the baking time is 1 hour, and the outer surface of the rear cover is baked. It should be noted that, after each paint spraying treatment, a baking treatment may be performed. Referring to fig. 23, a flow chart of the painting process provided in the embodiment of the present application is shown in fig. 23. The process of the paint spraying treatment comprises the following steps:

in step 1051, a first painting process is performed on the outer surface of the oxidized rear cover substrate. And spraying paint for the first time on the outer surface of the oxidized rear cover substrate, and spraying a layer of transparent paint.

In some embodiments, the first painting process may be performed on the entire outer surface of the rear cover, that is, the first painting process may be performed on the entire outer surface of the rear cover substrate.

It should be noted that in other embodiments, the first painting process may be performed only at the location of the blasting layer. In the first paint spraying treatment process of the sand blasting layer, the rest positions of the outer surface of the rear cover substrate can be shielded, and the first paint spraying treatment is carried out. The area of the first painting process may overlap the blasting layer or may be slightly smaller or slightly larger than the blasting layer. It will be appreciated that there is some error in the actual painting process.

In step 1052, a first baking process is performed on the outer surface of the rear lid substrate after the first paint spraying process, so as to form a first paint layer on the outer surface of the rear lid substrate. The first painting process and the baking process may increase the bonding force of the oxide layer and the first paint.

In some embodiments, the first paint layer may cover the entire outer surface of the rear cover substrate. In other embodiments, the first paint layer may cover a portion of the outer surface of the rear cover substrate, and in particular the first paint layer may cover the sandblasted layer, overlapping the sandblasted layer.

In step 1053, a second painting process is performed on the outer surface of the rear cover substrate after the first baking process. And carrying out secondary paint spraying treatment on the outer surface of the rear cover substrate subjected to the primary baking treatment, and spraying transparent paint.

In some embodiments, the second painting process may be performed on the entire outer surface of the backplane, or may be performed on a portion of the outer surface of the backplane, such as at the location of the sandblasted layer.

It should be noted that, in the first painting process and the second painting process, at least one painting process is performed to cover the entire outer surface of the rear cover substrate. The two-time paint spraying treatment process can be used for performing paint spraying treatment on the sand blasting layer once and performing paint spraying treatment on the whole outer surface of the rear cover once. Or the whole outer surface of the rear cover substrate can be painted twice.

In step 1054, a second baking process is performed on the outer surface of the rear cover substrate after the second painting process, and a second paint layer is formed on the outer surface of the rear cover substrate.

Wherein the second paint layer may be formed on the first paint layer. The second paint layer may also be formed on the oxide layer and the first paint layer. In some embodiments, at least one of the first and second paint layers covers the entire outer surface of the rear cover substrate.

In some embodiments, the first and second paint layers are both formed of clear paint. It should be noted that one of the first and second paint layers may be a transparent paint layer.

It should be noted that three paint spraying treatments and three baking treatments may also be performed, and are not described herein again. The thickness relationship among the paint layers can be referred to above, and is not described herein again. Further, the painting treatment and the baking treatment may be performed three or more times.

In some embodiments, the outer surface of the oxidized substrate may be subjected to a physical vapor deposition process prior to the painting process to form a bonding layer on the outer surface of the substrate. And then carrying out paint spraying treatment on the outer surface of the rear cover substrate subjected to physical vapor deposition treatment.

Specifically, after the oxidation treatment, in order to increase the bonding force between the paint layer and the oxide layer, a bonding layer may be formed on the oxide layer by physical vapor deposition, and then a paint spraying treatment may be performed on the bonding layer to form the paint layer on the bonding layer. The bonding layer can increase the bonding force of the oxide layer and the paint layer, and the protective effect on the outer surface of the rear cover is better.

To sum up, the back lid manufacturing method that this application embodiment provided can form the sandblast layer that is located back lid surface specific area in proper order, and has coarse structure, at least one deck oxide layer, one deck or two-layer or multilayer paint layer at back lid surface, and the sandblast layer can increase the user and take the frictional force who holds the electronic equipment part, and the paint layer forms the outmost at back lid surface, and its surface is high-bright, penetrating for its surface is smooth, difficult fingerprint that glues, can keep back lid surface clean and tidy.

Those skilled in the art will appreciate that the structure of the electronic device 1 shown in fig. 1 does not constitute a limitation of the electronic device 1. The electronic device 1 may comprise more or fewer components than shown, or some components may be combined, or a different arrangement of components. The electronic device 1 may further include a memory, a bluetooth module, etc., which will not be described herein.

The above detailed description is provided for the housing manufacturing method, the housing and the electronic device provided in the embodiments of the present application, and the principle and the implementation of the present application are described in this document by applying specific examples, and the description of the above embodiments is only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A shell manufacturing method is applied to electronic equipment, and is characterized by comprising the following steps:

polishing the outer surface of the shell substrate;

performing paint spraying treatment on the outer surface of the shell substrate subjected to the oxidation treatment for at least three times, and forming at least three paint layers on the oxidation layer, wherein the at least three paint layers comprise a first paint layer, a second paint layer and a third paint layer, the first paint layer is formed on the oxidation layer, the second paint layer is formed on the first paint layer, and the third paint layer is formed on the second paint layer;

the thicknesses of the third paint layer, the second paint layer and the first paint layer are sequentially decreased in an equal thickness mode; or

The thickness of the third paint layer is twice the thickness of the second paint layer, which is twice the thickness of the first paint layer, to prevent fingerprint sticking on the outer surface of the housing.

2. The method of making a housing of claim 1, wherein the sandblasted layer is arcuate in configuration.

3. The method of claim 1, wherein the sandblasted layer comprises a first sandblasted layer and a second sandblasted layer on the same layer, the first sandblasted layer and the second sandblasted layer being spaced apart and parallel to each other, the first sandblasted layer being adjacent to the first edge, and the second sandblasted layer being adjacent to the third edge.

4. The method of manufacturing a case according to claim 1, wherein the distance between the second side and the fourth side is H1, the sandblasted layer is adjacent to the second side, the height of the sandblasted layer in the direction from the second side to the fourth side is H2, wherein,

5. the method of manufacturing a housing of claim 4, wherein the sandblasted layer has a width W in the direction from the first edge to the third edge, wherein 1cm < W <2 cm.

6. The housing production method according to any one of claims 1 to 5, wherein the step of performing at least three paint spraying treatments on the outer surface of the housing substrate after the oxidation treatment includes:

performing primary paint spraying treatment on the outer surface of the shell substrate subjected to the oxidation treatment;

carrying out primary baking treatment on the outer surface of the shell after the primary paint spraying treatment to form a first paint layer on the oxide layer;

carrying out secondary paint spraying treatment on the outer surface of the shell subjected to the primary baking treatment;

carrying out secondary baking treatment on the outer surface of the shell after the secondary paint spraying treatment to form a second paint layer on the first paint layer;

carrying out third paint spraying treatment on the outer surface of the shell subjected to the second baking treatment;

and carrying out third baking treatment on the outer surface of the shell subjected to the third paint spraying treatment to form a third paint layer on the second paint layer.

7. The method of claim 6 wherein at least one of the first, second and third paint layers is a transparent paint layer.

8. The method of claim 6 wherein the thickness of the third paint layer is 8um, the thickness of the second paint layer is 4um, and the thickness of the first paint layer is 2 um.

9. The method of claim 6 wherein the third paint layer is 9um thick, the second paint layer is 6um thick, and the first paint layer is 3um thick.

10. A shell applied to electronic equipment is characterized by comprising a first edge, a second edge, a third edge and a fourth edge which are connected end to end, the shell comprises an inner surface and an outer surface which are oppositely arranged, the shell also comprises a pre-sandblasting area which is close to the first edge or/and the third edge, the pre-sandblasting area is positioned on the outer surface of the shell, the shell also comprises a sandblasting layer, an oxidation layer and at least three paint layers, the sand blasting layer has a rough structure, the sand blasting layer is formed on the pre-sand blasting area, the oxidation layer is formed on the outer surface of the shell and the sand blasting layer, the at least three paint layers include a first paint layer, a second paint layer, and a third paint layer, the first paint layer being formed on the oxide layer, the second paint layer is formed on the first paint layer, and the third paint layer is formed on the second paint layer;

11. The housing of claim 10, wherein the sandblasted layer is arcuate in configuration.

12. The housing of claim 10, wherein the sandblasted layer comprises a first sandblasted layer and a second sandblasted layer on the same layer, the first sandblasted layer and the second sandblasted layer being spaced apart and parallel to each other, the first sandblasted layer being adjacent to the first edge, the second sandblasted layer being adjacent to the third edge.

13. The case of claim 10, wherein the second and fourth edges are a distance H1, the sandblasted layer being proximate to the second edge, the sandblasted layer having a height in a direction from the second edge to the fourth edge of H2, wherein,

14. the housing of claim 13, wherein the sandblasted layer has a width W in the direction of the first edge to the third edge, wherein 1cm < W <2 cm.

15. The housing according to any of the claims 10 to 14, characterized in that the thickness of the third paint layer is 8um, the thickness of the second paint layer is 4um and the thickness of the first paint layer is 2 um.

16. The housing according to any of claims 10 to 14, characterized in that the thickness of the third paint layer is 9um, that of the second paint layer is 6um, and that of the first paint layer is 3 um.

17. The housing according to any one of claims 10 to 14, wherein at least one of the first, second and third paint layers is a transparent paint layer.

18. An electronic device characterized by comprising a housing as claimed in any one of claims 10 to 17.