CN107841745A - Method for producing shell, housing and electronic equipment - Google Patents
Method for producing shell, housing and electronic equipment Download PDFInfo
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- CN107841745A CN107841745A CN201711036409.9A CN201711036409A CN107841745A CN 107841745 A CN107841745 A CN 107841745A CN 201711036409 A CN201711036409 A CN 201711036409A CN 107841745 A CN107841745 A CN 107841745A
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- China
- Prior art keywords
- layer
- base material
- housing
- electronic equipment
- prefilter
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the present application discloses a kind of method for producing shell, housing and electronic equipment, by in base material towards sequentially forming dyed layer and prefilter layer on the surface on the outside of electronic equipment, the surface of the prefilter layer has pore structure, the pore structure includes some holes, the pore structure occurs light-catalyzed reaction, organic matter is decomposed into carbon dioxide and water when receiving light irradiation, namely the oils degradation that will attach in the fingerprint of surface of shell, so as to reach the automatic purpose for eliminating fingerprint.
Description
Technical field
The application is related to technical field of electronic equipment, and in particular to a kind of method for producing shell, housing and electronic equipment.
Background technology
At present, electronic equipment, for example mobile phone, the housing outer surface of tablet personal computer easily glue fingerprint.
The content of the invention
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment, can be with automated cleaning housing appearance
The fingerprint in face.
The embodiment of the present application provides a kind of method for producing shell, and the housing is applied to electronic equipment, and the housing makes
Method includes：
There is provided a base material, the base material includes first surface and second surface, and the first surface is towards in electronic equipment
Side, second surface is towards on the outside of electronic equipment；
In the second surface of the base material, dyed layer is set；
Prefilter layer is set on the dyed layer；And
Etch prefilter layer and form pore structure, the pore structure includes some holes, and the pore structure is receiving light
When line irradiates, light-catalyzed reaction degradation of organic substances occurs.
The embodiment of the present application also provides a kind of housing, and applied to electronic equipment, the housing includes a base material, a dyed layer
With a prefilter layer, the base material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, the second table
Facing on the outside of electronic equipment, the dyed layer and the prefilter layer are set in turn in the second surface of the base material, before described
Putting the surface of layer has a pore structure, and the pore structure includes some holes, the pore structure when receiving light irradiation,
Generation light-catalyzed reaction degradation of organic substances.
The embodiment of the present application additionally provides a kind of electronic equipment, including housing, and the housing includes a base material, a dyed layer
With a prefilter layer, the base material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, the second table
Facing on the outside of electronic equipment, the dyed layer and the prefilter layer are set in turn in the second surface of the base material, before described
Putting the surface of layer has a pore structure, and the pore structure includes some holes, the pore structure when receiving light irradiation,
Generation light-catalyzed reaction degradation of organic substances.
The method for producing shell that the embodiment of the present application provides, by base material towards on the surface on the outside of electronic equipment successively
Forming dyed layer and prefilter layer, the surface of the prefilter layer has pore structure, and the pore structure includes some holes, described
Pore structure occurs light-catalyzed reaction, organic matter is decomposed into carbon dioxide and water, will also be adhered to when receiving light irradiation
Oils degradation in the fingerprint of surface of shell, so as to reach the automatic purpose for eliminating fingerprint.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the embodiment of the present application, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, for
For those skilled in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
Fig. 1 is the structural representation for the electronic equipment that the embodiment of the present application provides.
Fig. 2 is the structural representation for the housing that the embodiment of the present application provides.
Fig. 3 is the structural representation for the bonnet that the embodiment of the present application provides.
Fig. 4 is profiles of the Fig. 3 in the first embodiment in A-A directions.
Fig. 5 is another structural representation for the housing that the embodiment of the present application provides.
Fig. 6 is another structural representation for the bonnet that the embodiment of the present application provides.
Fig. 7 is another structural representation for the electronic equipment that the embodiment of the present application provides.
Fig. 8 is the first schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.
Fig. 9 is second of schematic flow sheet of the bonnet preparation method that the embodiment of the present application provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is carried out clear, complete
Site preparation describes.Obviously, described embodiment is only some embodiments of the present application, rather than whole embodiments.It is based on
Embodiment in the application, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made
Example, belong to the scope of the application protection.
In the description of the present application, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Describe the application and simplify to describe, rather than indicate or imply that signified device or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In the description of the present application, " multiple " are meant that two or more, unless otherwise specifically defined.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to
Simplify disclosure herein, hereinafter the part and setting of specific examples are described.Certainly, they are only example, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, this application provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment.It will carry out respectively below detailed
Explanation.
In the present embodiment, will be described from the angle of bonnet preparation method, the method for producing shell can be formed
Housing, the housing can be set in the electronic device, such as mobile phone, tablet personal computer, palm PC (Personal Digital
Assistant, PDA) etc..
Refer to the structural representation that 1, Fig. 1 is the electronic equipment that the embodiment of the present application provides.The electronic equipment 1 includes
Housing 10, display screen 20, printed circuit board 30, battery 40.
Referring to Fig. 2, Fig. 2 is the structural representation for the housing that the embodiment of the present application provides.
Wherein, the housing 10 can include cover plate 11, center 12 and bonnet 13.The cover plate 11, the and of the center 12
The bonnet 13 is mutually combined to form the housing 10.The housing 10, which has, passes through the cover plate 11, the center 12 and institute
A confined space of the formation of bonnet 13 is stated, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
In certain embodiments, the lid of cover plate 11 is set on the center 12.The lid of bonnet 13 is set to the center
On 12.The cover plate 11 and bonnet 13 are located at the opposite face of the center 12.The cover plate 11 and bonnet 13 are oppositely arranged.It is described
The confined space of housing 10 is between the cover plate 11 and bonnet 13.
The cover plate 11 can be transparent glass cover plate.In some embodiments, the cover plate 11 can be with such as
Glass cover-plate made of the materials such as sapphire.
The center 12 can be metal shell, such as aluminium alloy center 12.It should be noted that in the embodiment of the present application
The material of frame 12 is not limited to this, can also use other manner, such as：The center 12 can ceramic center, glass center.
For another example：The center 12 can be plastic cement center.Also such as：The center 12 can be the knot that metal and plastic cement cooperate
Structure, plastic portions and being molded on sheet metal can be formed.
The bonnet 13 can be with metal back cover, such as aluminium alloy bonnet, stainless steel bonnet.The bonnet 13 can also be glass
Glass bonnet or ceramic bonnet.
Also referring to Fig. 3, Fig. 3 is the structural representation for the bonnet that the embodiment of the present application provides.
The bonnet 13 can include inner surface 131 and the outer surface 132 being oppositely arranged.The inner surface of the bonnet 13
131 close to center 12 and cover plate 11, forms a part for the inner surface of the housing 10.The outer surface 132 of the bonnet 13 is remote
From center 12 and cover plate 11, a part for the outer surface of the housing 10 is formed.The bonnet 13 can also include through hole 133,
The through hole 133 can be used for installing camera.
Also referring to Fig. 4, Fig. 4 is profiles of the Fig. 3 in A-A directions.
For purposes of illustration only, housing is illustrated by taking bonnet 13 as an example below.
The bonnet 13 can include a base material 134, a dyed layer 137 and a prefilter layer 135.The He of dyed layer 137
Prefilter layer 135 is set in turn in the surface of the bonnet 13 away from cover plate 11, namely the dyed layer 137 be arranged at it is described preposition
Between layer 135 and the outer surface of the housing 11.
Wherein, the base material 134 can use aluminium, such as aluminium alloy, can also use stainless steel, can also use glass
Glass, ceramics etc..
The base material 134 includes first surface 1341 and second surface 1342.The first surface 1341 is set towards electronics
Standby inner side, second surface 1342 is towards on the outside of electronic equipment.In one embodiment, the first surface 1341 is towards cover plate 11
Set with the direction of center 12.The first surface 1341 can be the inner surface 131 of bonnet 13.The first surface 1341 is
The inner surface of the housing 11.The second surface 1342 faces away from cover plate 11 and the direction of center 12 is set.Described second
Surface 1342 is the outer surface of the housing 11.
The dyed layer 137 is arranged at the second surface 1342 of the base material 134.The dyed layer 137 can pass through one
Secondary oxidation forms layer of oxide layer.Such as：Monochrome oxidation forms the oxide layer, specifically can be by being carried out after oxidation technology
Color is formed.
It should be noted that in some embodiments, it is also possible to formed using oxidation twice or oxidation more than twice more
Layer oxide layer.
In one embodiment, in order that the dyed layer 137 can more be firmly adhered to the of the base material 134
Two surfaces 1342, the second surface 1342 of the base material 134 can be processed by shot blasting, to increase the of the base material 134
The flatness on the surface on two surfaces 1342, so as to add second surface 1342 of the dyed layer 137 in the base material 134
Adhesive force, and then the dyed layer 137 is firmly adhered to the second surface 1342 of the base material 134.
In one embodiment, the dyed layer 137 can have multiple painted areas, and different painted areas set different
Color, to form pattern.
The prefilter layer 135 is arranged at the second surface 1342 of the base material 134.The surface 135a of the prefilter layer 135
With pore structure 136.The pore structure 136 includes some holes 1361.The prefilter layer 135 is receiving light irradiation
When, light-catalyzed reaction degradation of organic substances occurs.
The prefilter layer 135 can use TiO2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The prefilter layer 135 can also
Using the TiO of metal ion mixing2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The metal ion for doping can be silver
Ion, copper ion etc..
The prefilter layer 135 can use physical vapour deposition (PVD) (PVD), chemical vapor deposition (CVD), sol-gal process or
The methods of person's hydro-thermal method, is formed.The prefilter layer 135 is attached to the second surface 1342 of the base material 134.
In one embodiment, can be in vacuum when forming the prefilter layer 135 using the method for chemical vapor deposition
Under the conditions of, argon gas is heated in certain temperature by metallorganic, the temperature can be 500-900 DEG C.When the gold
When the air pressure of category organic matter reaches the threshold of reaction, the metallorganic is just decomposed and deposited on the dyed layer 137, shape
Into the prefilter layer 135.The metallorganic can be Ti (O-I-C3H7)4。
In one embodiment, when forming the prefilter layer 135 using sol-gal process, it is molten presoma can first to be prepared
Glue, the precursor sol is arranged at by the dyed layer 137 by the method for spraying, spin coating or immersion.
In one embodiment, metal alkoxide can be used for raw material, add solvent, water, catalyst etc., by hydrolysis and
Polymerisation obtains precursor sol.The metal alkoxide can use Ti (OC2H5)4、Ti(OC3H7 i)4、Ti(OC4H9 n)4Deng.
In one embodiment, after first layer precursor sol is set up, described can be made by dry mode
One layer of precursor sol forms first layer gel, is set second layer precursor sol by the method for spraying, spin coating or immersion
It is placed on first layer gel, then by dry mode, second layer precursor sol is formed second layer gel, successively class
Push away, the thickness of gel by way of repeatedly precursor solution is set, can be adjusted, finally, to the base for being attached with gel
Material 134 is heat-treated, to cause gel after chemical reaction to form the prefilter layer 135.
In one embodiment, can be to the base material 134 and institute when forming the prefilter layer 135 using hydro-thermal method
Stating dyed layer 137 need not set the region of prefilter layer 135 to set mask；Precursor solution is configured, the base material 134 is soaked
In the precursor solution, prefilter layer 135 is grown in the dyed layer 137 by controlling reaction temperature and pressure.
In one embodiment, in order that the prefilter layer 135 can more be firmly adhered to the dyed layer 137,
The dyed layer 137 can be processed by shot blasting, to increase the flatness on the surface of the dyed layer 137, so as to add
The prefilter layer 135 is in the adhesive force of the dyed layer 137, and then it is described the prefilter layer 135 is firmly adhered to
Dyed layer 137.
In one embodiment, the thickness of the prefilter layer 135 is 1 micron -10 microns.When the thickness of the prefilter layer 135
When degree is less than 1 micron, because the thickness of the prefilter layer 135 is smaller, easily by the eating thrown of prefilter layer 135 in etching process, no
Beneficial to the formation of pore structure 136；When prefilter layer 135 thickness be more than 10 microns when, due to the prefilter layer 135 thickness compared with
Greatly, cause the photopermeability of the prefilter layer 135 poor, easily block the color of the dyed layer 137.
In one embodiment, the internal diameter of described hole 1361 is less than 500 nanometers, to cause the prefilter layer 135 to have
Good photocatalytic, meanwhile, user can't experience the hole 1361 on its surface when touching the housing.In one kind
In embodiment, the internal diameter of described hole 1361 can be 50 nanometers -100 nanometers.When the internal diameter of described hole 1361 is less than 50nm
When, because the internal diameter of described hole 1361 is smaller, cause manufacturing cost higher, the selection to etching solution is more harsh, manufactures work
Skill is complicated；When the internal diameter of described hole 1361 is more than 100nm, because the internal diameter of described hole 1361 is larger, cause it is described before
The photocatalytic for putting layer 135 is weaker.
In certain embodiments, the acid solution such as the concentrated sulfuric acid, concentrated hydrochloric acid, hydrofluoric acid or wherein several mixed can be used
Solution is closed to be etched the prefilter layer 135 to form pore structure 136.In certain embodiments, can also be in dense sulphur
Additive is added in the acid solutions such as acid, concentrated hydrochloric acid, hydrofluoric acid or wherein several mixed solutions with to the prefilter layer 135
It is etched to form pore structure 136.
It should be noted that the structure of the embodiment of the present application housing is not limited to this, such as, referring to Fig. 5, Fig. 5 is this
Apply for another structural representation for the housing that embodiment provides.
The housing 10a includes cover plate 16 and bonnet 17.In certain embodiments, the cover plate 16 directly lid is set to described
On bonnet 17.The cover plate 16 and the bonnet 17 are mutually combined to form the housing 10a.The housing 10a, which has, passes through institute
The confined space that cover plate 16 and bonnet 17 are formed is stated, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
Compared to the housing 10 shown in Fig. 2, Fig. 5 housing 10a does not include center, or perhaps by the center in Fig. 2
12 and bonnet 13 be integrally formed to form the structure of a bonnet 17.
Specifically, referring to Fig. 6, Fig. 6 is another structural representation for the bonnet that the embodiment of the present application provides.
In certain embodiments, bonnet 17 includes inner surface 171 and outer surface 172, inner surface 171 and the phase of outer surface 172
To setting, the whole surface of bonnet 17 is formed.Each Rotating fields of the bonnet 17 can refer to bonnet 13, will not be repeated here.
The printed circuit board 30 is installed in the housing 10, and the printed circuit board 30 can be the mainboard of electronic equipment 1,
Antenna, motor, microphone, camera, light sensor, receiver and processor etc. can be integrated with printed circuit board 30
Functional unit.In certain embodiments, the printed circuit board 30 is fixed in housing 10.Specifically, the printed circuit board
30 can be screwed on center 12 by screw, can also be fitted on using card by the way of buckle on center 12.It should be noted that
The mode that the embodiment of the present application printed circuit board 30 is specifically fixed on center 12 is not limited to this, can with other manner, than
Such as by way of buckle and screw are fixed jointly.
The battery 40 is installed in the housing 10, and battery 40 is electrically connected with the printed circuit board 30, with to electronics
Equipment 1 provides power supply.Housing 10 can be as the battery cover of battery 40.Housing 10 covers battery 40 to protect battery 40, specifically
Be that bonnet 13 covers battery 40 to protect battery 40, reduce battery 40 due to electronic equipment 1 collision, fall etc. and be subject to
Damage.
The display screen 20 is installed in the housing 10, meanwhile, the display screen 20 is electrically connected on printed circuit board 30, with
Form the display surface of electronic equipment 1.The display screen 20 includes viewing area 14 and non-display area 15.The viewing area 14
It can be used for showing the picture of electronic equipment 1 or carry out touching manipulation etc. for user.The top region of the non-display area 15
Domain opens up the perforate for sound and light conduction, and fingerprint module, touch controlled key can be set on the bottom of non-display area 15
Deng functional unit.Wherein described cover plate 11 is installed on display screen 20, to cover display screen 20, is formed and the identical of display screen 20
Viewing area and non-display area, it can specifically refer to viewing area and the non-display area of display screen 20.
It should be noted that the structure of the display screen 20 is not limited to this.For example the display screen can be to shield comprehensively
Or opposite sex screen, specifically, referring to Fig. 7, Fig. 7 is another structural representation for the electronic equipment that the embodiment of the present application provides.Fig. 7
In electronic equipment and Fig. 1 in the difference of electronic equipment be：The non-display area 15a is formed directly into display screen 20a
On, for example in display screen 20a non-display area 15a it is arranged to transparent configuration, so that optical signal passes through, or directly showing
Screen 20a non-display area is opened up for structures such as the perforate of light conduction or breach, can be by front camera, photoelectric sensor
Etc. being arranged at non-display area position, so that front camera takes pictures, photoelectric sensor detection.The viewing area 14a is paved with
Electronic equipment 1a whole surfaces.It should be noted that housing 10, printed circuit board 30 and battery 40 in the electronic equipment 1a
Above content can be referred to Deng device, will not be repeated here.
The present invention also provides a kind of preparation method of housing.
It should be noted that illustrated below by taking bonnet as an example, but the embodiment of the present application method for producing shell is not
It is limited to bonnet.
Also referring to Fig. 8, Fig. 8 is the schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.The shell
Body preparation method comprises the following steps：
Step S101 a, there is provided base material 134, the base material 134 includes first surface 1341 and second surface 1342, described
First surface 1341 is towards on the inside of electronic equipment, and second surface 1342 is towards on the outside of electronic equipment.
The base material 134 can be metal material, such as aluminium, further, such as aluminium alloy.It should be noted that
The base material 134 can be directly commercially available, and sheet fabrication can also be obtained, for example, aluminum alloy plate materials are forged and pressed, when
The PROCESS FOR TREATMENTs such as effect obtain.The base material 134 can also use glass, ceramics etc..
The first surface 1341 is set towards the direction of cover plate 11 and center 12.After the first surface 1341 can be
The inner surface 131 of lid 13.The first surface 1341 is the inner surface of the housing 11.The second surface 1342 faces away from
The direction of cover plate 11 and center 12 is set.The second surface 1342 is the outer surface of the housing 11.
Step S102, dyed layer 137 is set in the second surface 1342 of the base material 134.
In one embodiment, referring to Fig. 9, the step S102 can be：
Step S1021：The second surface 1342 of the base material 134 is processed by shot blasting；
Step S1022：Dyed layer 137 is set on the second surface 1342 of the base material 134 of the polishing；
And
Step S1023：The dyed layer 137 is processed by shot blasting.
In one embodiment, in order that the dyed layer 137 can more be firmly adhered to the of the base material 134
Two surfaces 1342, the second surface 1342 of the base material 134 can be processed by shot blasting, to increase the of the base material 134
The flatness on the surface on two surfaces 1342, so as to add second surface 1342 of the dyed layer 137 in the base material 134
Adhesive force, and then the dyed layer 137 is firmly adhered to the second surface 1342 of the base material 134.
In one embodiment, in order to enable the prefilter layer 135 more be firmly adhered to institute in subsequent step
Dyed layer 137 is stated, the dyed layer 137 can be processed by shot blasting, to increase the smooth of the surface of the dyed layer 137
Degree, so as to add adhesive force of the prefilter layer 135 in the dyed layer 137, and then enables the prefilter layer 135 firm
Ground is attached to the dyed layer 137.
In certain embodiments, can be by the way of machinery, chemistry, electrochemistry or ultrasonic wave etc. to the base material 134
Second surface 1342 or the dyed layer 137 realize polishing.To cause the second surface 1342 of the base material 134 or described
The roughness of chromatograph 137 reduces, to obtain the second surface 1342 of bright, flat surface the base material 134 or the dyed layer
137.Wherein, chemical polishing mode be the second surface 1342 or the dyed layer 137 of the base material 134 are carried out it is regular molten
Solution reaches smooth.Wherein, electrochemical polish mode is by the second surface 1342 of the base material 134 or the dyed layer
137 conduct anodes, insoluble petal are negative electrode, and the two poles of the earth are immersed in electrolytic cell simultaneously, are led to direct current and are produced selective sun
Pole solution, so that the second surface 1342 of the base material 134 or the increase of the brightness of the dyed layer 137 are big.It is wherein mechanical
The mode of polishing is the second surface 1342 or the dyed layer 137 by cutting the base material 134 so that the base material 134
Second surface 1342 or the dyed layer 137 are plastically deformed the convex portion after removing polishing and obtain even surface.Wherein ultrasonic wave is thrown
The mode of light is by the base material 134 or is provided with the base material 134 of dyed layer 137 and is put into abrasive suspension and puts together
In ultrasound field, by the oscillation action of ultrasonic wave, make second surface 1342 or the coloring of the abrasive material in the base material 134
137 grinding-polishing of layer.
In certain embodiments, it is polished place in second surface 1342 or the dyed layer 137 to the base material 134
Before reason, first the second surface 1342 to the base material 134 or the dyed layer 137 grinding process can be carried out, it is then right again
The second surface 1342 or the dyed layer 137 of the base material 134 after grinding process are processed by shot blasting, imitate polishing
Fruit is more preferably so that the second surface 1342 or the dyed layer 137 of the base material 134 are more smooth.Herein, it is necessary to explanation
It is that the grinding process can be understood as to the roughing before polishing.I.e., it is possible to first rear exterior surface is carried out once thick
Polishing, then once carefully polished, complete polishing.
The dyed layer 137 is arranged at the second surface 1342 of the base material 134.The dyed layer 137 can pass through one
Secondary oxidation forms layer of oxide layer.Such as：Monochrome oxidation forms the oxide layer, specifically can be by being carried out after oxidation technology
Color is formed.
It should be noted that in some embodiments, it is also possible to formed using oxidation twice or oxidation more than twice more
Layer oxide layer.
In one embodiment, the dyed layer 137 can have multiple painted areas, and different painted areas set different
Color, to form pattern.
Step S103, prefilter layer 135 is set on the dyed layer 137.
The prefilter layer 135 can use TiO2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The prefilter layer 135 can also
Using the TiO of metal ion mixing2、SiO2、ZnO、CdS、WO3、Fe2O3Deng.The metal ion for doping can be silver
Ion, copper ion etc..
The prefilter layer 135 can use physical vapour deposition (PVD) (PVD), chemical vapor deposition (CVD), sol-gal process or
The methods of person's hydro-thermal method, is formed.The prefilter layer 135 is attached to the dyed layer 137.
In one embodiment, can be in vacuum when forming the prefilter layer 135 using the method for chemical vapor deposition
Under the conditions of, argon gas is heated in certain temperature by metallorganic, the temperature can be 500-900 DEG C.When the gold
When the air pressure of category organic matter reaches the threshold of reaction, the metallorganic is just decomposed and deposited on the dyed layer 137, shape
Into the prefilter layer 135.The metallorganic can be Ti (O-I-C3H7)4。
In one embodiment, referring to Fig. 9, when forming the prefilter layer 135 using sol-gal process, the step
S103 can include：
Step S1031, prepares precursor sol.
In one embodiment, metal alkoxide can be used for raw material, add solvent, water, catalyst etc., by hydrolysis and
Polymerisation obtains precursor sol.The metal alkoxide can use Ti (OC2H5)4、Ti(OC3H7 i)4、Ti(OC4H9 n)4Deng.
Step S1032, precursor sol is arranged at the dyed layer 137.
Wherein it is possible to the precursor sol is arranged at by the dyed layer by the method for spraying, spin coating or immersion
137。
Step S1033, dry the precursor sol and form gel.
In one embodiment, after first layer precursor sol is set up, described can be made by dry mode
After one layer of precursor sol forms first layer gel, by the method for spraying, spin coating or immersion by second layer precursor sol
It is arranged on first layer gel, then by dry mode, second layer precursor sol is formed second layer gel, successively class
Push away, the thickness of gel by way of repeatedly precursor solution is set, can be adjusted.
Step S1034, the base material 134 for being attached with the gel is heat-treated, obtains prefilter layer 135.
Wherein, the base material 134 for being attached with the gel is heat-treated, it is anti-by chemistry by being heat-treated gel
Photocatalysis film should be formed, so as to form the prefilter layer 135.
In one embodiment, can be to the base material 134 and institute when forming the prefilter layer 135 using hydro-thermal method
Stating dyed layer 137 need not set the region of prefilter layer 135 to set mask；Precursor solution is configured, the base material 134 is soaked
In the precursor solution, prefilter layer 135 is grown in the dyed layer 137 by controlling reaction temperature and pressure.
In one embodiment, the thickness of the prefilter layer 135 is 1 micron -10 microns.When the thickness of the prefilter layer 135
When degree is less than 1 micron, because the thickness of the prefilter layer 135 is smaller, easily by the eating thrown of prefilter layer 135 in etching process, no
Beneficial to the formation of pore structure 136；When prefilter layer 135 thickness be more than 10 microns when, due to the prefilter layer 135 thickness compared with
Greatly, cause the photopermeability of the prefilter layer 135 poor, easily block the color of the dyed layer 137.
Step S104, etching prefilter layer 135 form pore structure 136, and the pore structure 136 includes some holes
1361, when receiving light irradiation light-catalyzed reaction degradation of organic substances occurs for the pore structure 136.
In one embodiment, the internal diameter of described hole 1361 is less than 500 nanometers, to cause the prefilter layer 135 to have
Good photocatalytic, simultaneously so that user can't experience the hole 1361 on its surface when touching the housing.
In a kind of embodiment, the internal diameter of described hole 1361 can be 50 nanometers -100 nanometers.When the internal diameter of described hole 1361 is less than
During 50nm, because the internal diameter of described hole 1361 is smaller, cause manufacturing cost higher, the selection to etching solution is more harsh, system
Make complex process；When the internal diameter of described hole 1361 is more than 100nm, because the internal diameter of described hole 1361 is larger, cause institute
The photocatalytic for stating prefilter layer 135 is weaker.
In certain embodiments, the acid solution such as the concentrated sulfuric acid, concentrated hydrochloric acid, hydrofluoric acid or wherein several mixed can be used
Solution is closed to be etched the prefilter layer 135 to form pore structure 136.In certain embodiments, can also be in dense sulphur
Additive is added in the acid solutions such as acid, concentrated hydrochloric acid, hydrofluoric acid or wherein several mixed solutions with to the prefilter layer 135
It is etched to form pore structure 136.
In summary, the method for producing shell that the embodiment of the present application provides, by base material towards on the outside of electronic equipment
Dyed layer and prefilter layer are sequentially formed on surface, the surface of the prefilter layer has pore structure, if the pore structure includes
Dry hole hole, the pore structure receive light irradiation when, occur light-catalyzed reaction, by organic matter be decomposed into carbon dioxide and
Water, namely the oils degradation that will attach in the fingerprint of surface of shell, so as to reach the automatic purpose for eliminating fingerprint.
It will be understood by those skilled in the art that the structure of the electronic equipment 1 shown in Fig. 1 is not formed to electronic equipment 1
Restriction.Electronic equipment 1 can be included than illustrating more or less parts, either combine some parts or different portions
Part is arranged.Electronic equipment 1 can also include memory, bluetooth module etc., will not be repeated here.
Method for producing shell, housing and the electronic equipment provided above the embodiment of the present application is described in detail, this
Apply specific case in text to be set forth the principle and embodiment of the application, the explanation of above example is only intended to
Help understands the application.Meanwhile for those skilled in the art, according to the thought of the application, in embodiment and answer
With there will be changes in scope, in summary, this specification content should not be construed as the limitation to the application.
Claims (12)
1. a kind of method for producing shell, the housing is applied to electronic equipment, it is characterised in that the method for producing shell bag
Include：
One base material is provided, the base material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and the
Two surfaces are towards on the outside of electronic equipment；
In the second surface of the base material, dyed layer is set；
Prefilter layer is set on the dyed layer；And
Etch prefilter layer and form pore structure, the pore structure includes some holes, and the pore structure is receiving light photograph
When penetrating, light-catalyzed reaction degradation of organic substances occurs.
2. method for producing shell as claimed in claim 1, it is characterised in that the second surface in the base material is set
The step of chromatograph, including：
The second surface of the base material is processed by shot blasting；
In the second surface of the base material of polishing, dyed layer is set；And
The dyed layer is processed by shot blasting.
3. method for producing shell as claimed in claim 1 or 2, it is characterised in that it is described set on the dyed layer it is preposition
The step of layer, includes：
Prepare precursor sol；
Precursor sol is arranged at the dyed layer；
Dry the precursor sol and form gel；And
The base material for being attached with the gel is heat-treated, obtains prefilter layer.
4. method for producing shell as claimed in claim 3, it is characterised in that：It is described that precursor sol is arranged at the coloring
The step of the step of layer and the drying precursor sol form gel is repeatedly.
5. method for producing shell as claimed in claim 1, it is characterised in that：The thickness of the prefilter layer is 1 micron -10 micro-
Rice.
6. method for producing shell as claimed in claim 1, it is characterised in that：The internal diameter of described hole is less than 500 nanometers.
7. method for producing shell as claimed in claim 1, it is characterised in that：The internal diameter of described hole is 50 nanometer -100 and received
Rice.
A kind of 8. housing, applied to electronic equipment, it is characterised in that：It is preposition that the housing includes a base material, a dyed layer and one
Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction
Sub- equipment outside, the dyed layer and the prefilter layer are set in turn in the second surface of the base material, the table of the prefilter layer
Face has pore structure, and the pore structure includes some holes, and the pore structure occurs light and urged when receiving light irradiation
Change reaction degradation of organic substances.
9. housing as claimed in claim 8, it is characterised in that：The thickness of the prefilter layer is 1 micron -10 microns.
10. housing as claimed in claim 8, it is characterised in that：The internal diameter of described hole is less than 500 nanometers.
11. housing as claimed in claim 8, it is characterised in that：The internal diameter of described hole is 50 nanometers -100 nanometers.
12. a kind of electronic equipment, it is characterised in that including housing, the housing is as any one of claim 8 to 11
Housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711036409.9A CN107841745A (en) | 2017-10-30 | 2017-10-30 | Method for producing shell, housing and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711036409.9A CN107841745A (en) | 2017-10-30 | 2017-10-30 | Method for producing shell, housing and electronic equipment |
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|---|---|
| CN107841745A true CN107841745A (en) | 2018-03-27 |
Family
ID=61681060
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|---|---|---|---|
| CN201711036409.9A Pending CN107841745A (en) | 2017-10-30 | 2017-10-30 | Method for producing shell, housing and electronic equipment |
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| CN (1) | CN107841745A (en) |
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