CN107671601A - A kind of contact membranes carries the laser blast wave burnishing device of micro groove - Google Patents
A kind of contact membranes carries the laser blast wave burnishing device of micro groove Download PDFInfo
- Publication number
- CN107671601A CN107671601A CN201710851510.3A CN201710851510A CN107671601A CN 107671601 A CN107671601 A CN 107671601A CN 201710851510 A CN201710851510 A CN 201710851510A CN 107671601 A CN107671601 A CN 107671601A
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- CN
- China
- Prior art keywords
- contact membranes
- micro groove
- contact
- blast wave
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000012528 membrane Substances 0.000 title claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 210000002615 epidermis Anatomy 0.000 claims description 10
- 238000005498 polishing Methods 0.000 abstract description 22
- 230000003746 surface roughness Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 2
- 230000035939 shock Effects 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- 210000004379 membrane Anatomy 0.000 description 41
- 239000000463 material Substances 0.000 description 9
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 229910000639 Spring steel Inorganic materials 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 2
- 210000001367 artery Anatomy 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Abstract
The present invention discloses the laser blast wave burnishing device that a kind of contact membranes carries micro groove, and the structure of the device includes high energy pulse laser, restraint layer, laser blast wave, absorbed layer, band micro groove rigid contact film.Its detailed process is：High energy pulse laser light restraint layer is irradiated on absorbed layer, absorbed layer rapid vaporization produces plasma and explodes and induce high-pressure shocking wave, in the presence of the shock wave, rigid contact film with micro groove will roll microprotrusion, due to offering micro groove on contact membranes, contact membranes has good flexibility, it is easier to be fitted on curved surface, and ensure the uniformity of polishing area surface roughness in polishing, the presence of micro groove simultaneously makes contact membranes bottom to recover original shape after laser blast wave effect, it is not only able to ensure the surface precision after workpiece surface polishing when large area polishes, and make contact membranes reusable.Present invention can apply to the polishing of metal surface large area free form surface.
Description
Technical field
The present invention relates to field of surface treatment, and in particular to a kind of laser blast wave polishing dress of contact membranes with micro groove
Put
Background technology
Polishing refers to the effect using machinery, chemistry or electrochemistry, reduces workpiece surface roughness, with obtain it is bright,
The processing method of flat surface.Polishing can not improve the dimensional accuracy or geometrical precision of workpiece, but to obtain smooth table
For the purpose of face or bright luster.
In the prior art, mechanical polishing can only be processed by shot blasting to regular surfaces；Chemical polishing and electrochemical polish consumption
Duration, efficiency are low；" a kind of polishing method and device 201410250823.X " based on laser blast wave propose logical Chinese patent
Cross dynamic yield strength of the surge pressure between metal works of control laser blast waveWith Yu Gongniu limit HEL it
Between, the microprotrusion of surface of workpiece is pressed by repeat impact, so as to reduce the surface roughness of metal works, the patent
Using the contact membranes of only lower surface polishing, it is not also easy to produce in view of contact membranes during rolling compared with High angle, from
And cause to roll uneven, while in large area polishing process, larger change can occur in the presence of residual stress for contact membranes
Shape, so as to influence the surface surface precision after workpiece polishing, while the polishing effect at hot spot edge is poor, therefore polishing efficiency
It is low, preferable polishing effect can not be obtained.
The content of the invention
It is an object of the invention to provide the laser blast wave burnishing device that a kind of contact membranes carries micro groove, to improve profit
The shortcomings that efficiency is low, effect is poor in metal works is polished with laser blast wave.
In order to solve the above technical problems, the concrete technical scheme that the present invention uses is as follows：
A kind of contact membranes carries the laser blast wave burnishing device of micro groove, and high energy pulse laser light restraint layer acts on
The upper surface of absorbed layer；Restraint layer, absorbed layer, contact membranes are sequentially coated on the surface of metal works, it is characterised in that：It is described
Contact membranes is the contact membranes with micro groove；The horizontal and vertical of the upper epidermis of contact membranes offers micro groove array, micro groove
The upper epidermis of contact membranes is set to be divided into multiple fritters.
The polished processing in lower surface of the contact membranes, hardness are higher than the hardness of metal works.
The contact film thickness is 50~150 μm.
The nick groove depth h is the 60%~70% of contact film thickness, and width d is 10~15 μm, between adjacent micro groove
Space D be 40~50 μm.
The pulse duration range of described high energy pulse laser is 10~30ns, and power density scope is 109~1010GW/cm2。
The present invention operation principle be：In laser blast wave polishing process, using band micro groove rigid contact film, nick
The depth of groove is the 60%~70% of contact film thickness, and the width of groove is 10~15 μm, and the spacing between adjacent grooves is 40-50
μm, the upper epidermis of contact membranes is divided into multiple miniature fritters by these micro grooves.The depth of groove is the 60% of contact film thickness
~70%, it can make contact membranes that there is good flexibility, ensure that contact membranes can be fitted in workpiece surface well, and offer
The groove that width is only 10~15 μm, spacing is 40~50 μm, can ensure that contact membranes has enough rigidity, makes contact membranes again
With good polishing effect, due to the width very little of groove, laser blast wave can't act directly on contact membranes layer
Material, the deformation of following table layer material belong to elastic deformation, can return to original state well；Acted in high pressure laser blast wave
Under, when these micro grooves are not present in contact membranes upper epidermis, the skin-material of contact membranes will produce residual compressive stress, so that
Reversal deformation occurs for contact membranes, and upper epidermis opens up the groove that width is 10~15 μm, spacing is 40~50 μm, can be very good to release
Residual stress of superficial layer is put, so that reversal deformation does not occur for contact membranes, ensure that contact membranes can be very good to be fitted in workpiece
Surface.
The device have the advantages that：Using the nick cavity feature on contact membranes, contact membranes can be made to be easier to be bonded
Without thickness thinning on curved surface, be advantageous to ensure surface precision in curved surface polishing；Micro groove makes contact membranes in laser light
Spot edge part has enough flexibilities, it is ensured that the uniformity of polishing area surface roughness；The presence of micro groove can be with
Residual compressive stress caused by discharging laser blast wave, prevent contact membranes from producing reversal deformation after laser blast wave effect, make to connect
Tactile film can be fitted in workpiece surface well all the time；The presence of micro groove makes contact membranes bottom energy after laser blast wave effect
Enough recover original shape, be not only able to ensure the surface precision after workpiece surface polishing when large area polishes, and make contact membranes
It is reusable.
Brief description of the drawings
Fig. 1 is the laser blast wave burnishing device that contact membranes carries micro groove.
In figure：The absorbed layer 5 of 1 high energy pulse laser, 2 restraint layer, 3 high-pressure shocking wave 4 is with the microprotrusion of groove contact membranes 6
7 nicks cheat 8 metal works h nick groove depths.
Fig. 2 is the top view with groove contact membranes.
In figure：The spacing between fritter d micro groove width D micro grooves on the contact membranes of micro groove 52 on 51 contact membraneses
Embodiment
Preferably to illustrate the implementation detail of the present invention, below in conjunction with the accompanying drawings with specific embodiment to technical side of the invention
Case is described in further details.
A kind of laser blast wave burnishing device of the contact membranes of the present invention with micro groove is as shown in figure 1, including high energy arteries and veins
Impulse light 1, restraint layer 2, high-pressure shocking wave 3, absorbed layer 4, band groove contact membranes 5, microprotrusion 6, nick hole 7 and metal works 8.
Restraint layer 2, absorbed layer 4, it is sequentially coated in the surface to be treated of metal works 8 with groove contact membranes 5.
Embodiment one
In this example, the pulsewidth of high energy pulse laser 1 is 10ns, laser spot diameter 3mm；Restraint layer 2 goes for flowing
Ion moisture film, its thickness are about 1mm；Material with groove contact membranes 5 is 60Si2CrVA spring steel, hardness 700HV, it is thick
Spend for 100 μm, d=15 μm of upper epidermis nick well width, space D is 50 μm, h=60 μm of depth, and the roughness of lower surface is
100nm；The material of metal works 8 is LY2 aluminium alloys, and its hardness is 130HV, and initial surface roughness is 2.04 μm, primary face type
Error is 2.9 μm.
By controlling the motion of metal works 8,20mm × 20mm of metal works 8 region is used power density for
1.5×109GW/cm2High energy pulse laser 1 carry out the polishing of 6 laser blast waves after, the line average roughness measured is 0.25 μ
M, processing region face type error is measured as 2.7 μm by interferometer.
Embodiment two
In this example, the pulsewidth of high energy pulse laser 1 is 10ns, laser spot diameter 3mm；Restraint layer 2 goes for flowing
Ion moisture film, its thickness are about 1mm；Material with groove contact membranes 5 is 60Si2CrVA spring steel, hardness 700HV, it is thick
Spend for 80 μm, d=12 μm of upper epidermis nick well width, space D is 45 μm, h=48 μm of depth, and the roughness of lower surface is
100nm；The material of metal works 8 is LY2 aluminium alloys, and its hardness is 130HV, and initial surface roughness is 1.78 μm, primary face type
Error is 2.3 μm.
By controlling the motion of metal works 8,20mm × 20mm of metal works 8 region is used power density for
1.5×109GW/cm2High energy pulse laser 1 carry out the polishing of 6 laser blast waves after, the line average roughness measured is 0.175
μm, processing region face type error is measured as 2.2 μm by interferometer.
Embodiment three：
In this example, the pulsewidth of high energy pulse laser 1 is 20ns, laser spot diameter 3mm；Restraint layer 2 goes for flowing
Ion moisture film, its thickness are about 1mm；Material with groove contact membranes 5 is 60Si2CrVA spring steel, hardness 700HV, it is thick
Spend for 50 μm, d=10 μm of upper epidermis nick well width, space D is 40 μm, and depth h is 30 μm, and the roughness of lower surface is
100nm；The material of metal works 8 is LY2 aluminium alloys, and its hardness is 130HV, and initial surface roughness is 1.12 μm, primary face type
Error is 5.6 μm.
By controlling the motion of metal works 8,20mm × 20mm of metal works 8 region is used power density for
3.9×109GW/cm2High energy pulse laser 1 carry out the polishing of 5 laser blast waves after, the line average roughness measured is 0.135
μm, processing region face type error is measured as 5.4 μm by interferometer.
Claims (5)
1. a kind of contact membranes carries the laser blast wave burnishing device of micro groove, high energy pulse laser light restraint layer acts on suction
Receive the upper surface of layer；Restraint layer, absorbed layer, contact membranes are sequentially coated on the surface of metal works, it is characterised in that：It is described to connect
Tactile film is the contact membranes with micro groove；The horizontal and vertical of the upper epidermis of contact membranes offers micro groove array, and micro groove makes
The upper epidermis of contact membranes is divided into multiple fritters.
2. a kind of contact membranes as claimed in claim 1 carries the laser blast wave burnishing device of micro groove, it is characterised in that：Institute
The polished processing in lower surface of contact membranes is stated, hardness is higher than the hardness of metal works.
3. a kind of contact membranes as claimed in claim 1 carries the laser blast wave burnishing device of micro groove, it is characterised in that：Institute
It is 50~150 μm to state contact film thickness.
4. a kind of contact membranes as claimed in claim 1 carries the laser blast wave burnishing device of micro groove, it is characterised in that：Institute
60%~70% that nick groove depth h is contact film thickness is stated, width d is 10~15 μm, and the space D between adjacent micro groove is 40
~50 μm.
5. a kind of contact membranes as claimed in claim 1 carries the laser blast wave burnishing device of micro groove, it is characterised in that：Institute
The pulse duration range for the high energy pulse laser stated is 10~30ns, and power density scope is 109~1010GW/cm2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710851510.3A CN107671601B (en) | 2017-09-19 | 2017-09-19 | A kind of contact membranes have the laser blast wave burnishing device of micro groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710851510.3A CN107671601B (en) | 2017-09-19 | 2017-09-19 | A kind of contact membranes have the laser blast wave burnishing device of micro groove |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107671601A true CN107671601A (en) | 2018-02-09 |
| CN107671601B CN107671601B (en) | 2019-08-02 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710851510.3A Active CN107671601B (en) | 2017-09-19 | 2017-09-19 | A kind of contact membranes have the laser blast wave burnishing device of micro groove |
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| CN (1) | CN107671601B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110732780A (en) * | 2019-09-30 | 2020-01-31 | 江苏大学 | manufacturing method of high-efficiency microtexture based on laser shock wave coupling effect |
| CN111944989A (en) * | 2020-09-04 | 2020-11-17 | 武汉大学 | Method for rapidly selecting area laser reinforcement |
| CN112720231A (en) * | 2020-12-30 | 2021-04-30 | 福建省佳美集团公司 | Polishing equipment and polishing method for ceramic processing |
| CN113832334A (en) * | 2021-09-25 | 2021-12-24 | 温州大学 | Laser shock peening device for controlling crack propagation |
| CN113832335A (en) * | 2021-09-25 | 2021-12-24 | 温州大学 | Device and method for strengthening aero-engine blade through laser shock |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101524819A (en) * | 2009-02-03 | 2009-09-09 | 广东工业大学 | Composite technique for polishing sapphire by using green and ultraviolet laser |
| US7776165B1 (en) * | 2000-06-09 | 2010-08-17 | Lsp Technologies, Inc. | Method of modifying a workpiece following laser shock processing |
| CN104044017A (en) * | 2014-06-06 | 2014-09-17 | 江苏大学 | Polishing method and device based on laser shock wave |
| CN105583524A (en) * | 2015-12-18 | 2016-05-18 | 江苏大学 | Precise laser polishing device and method thereof |
| CN106001927A (en) * | 2016-07-05 | 2016-10-12 | 温州大学 | Measurement and processing integrated laser leveling polishing method |
-
2017
- 2017-09-19 CN CN201710851510.3A patent/CN107671601B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7776165B1 (en) * | 2000-06-09 | 2010-08-17 | Lsp Technologies, Inc. | Method of modifying a workpiece following laser shock processing |
| CN101524819A (en) * | 2009-02-03 | 2009-09-09 | 广东工业大学 | Composite technique for polishing sapphire by using green and ultraviolet laser |
| CN104044017A (en) * | 2014-06-06 | 2014-09-17 | 江苏大学 | Polishing method and device based on laser shock wave |
| CN105583524A (en) * | 2015-12-18 | 2016-05-18 | 江苏大学 | Precise laser polishing device and method thereof |
| CN106001927A (en) * | 2016-07-05 | 2016-10-12 | 温州大学 | Measurement and processing integrated laser leveling polishing method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110732780A (en) * | 2019-09-30 | 2020-01-31 | 江苏大学 | manufacturing method of high-efficiency microtexture based on laser shock wave coupling effect |
| CN111944989A (en) * | 2020-09-04 | 2020-11-17 | 武汉大学 | Method for rapidly selecting area laser reinforcement |
| CN111944989B (en) * | 2020-09-04 | 2021-09-14 | 武汉大学 | Method for rapidly selecting area laser reinforcement |
| CN112720231A (en) * | 2020-12-30 | 2021-04-30 | 福建省佳美集团公司 | Polishing equipment and polishing method for ceramic processing |
| CN113832334A (en) * | 2021-09-25 | 2021-12-24 | 温州大学 | Laser shock peening device for controlling crack propagation |
| CN113832335A (en) * | 2021-09-25 | 2021-12-24 | 温州大学 | Device and method for strengthening aero-engine blade through laser shock |
| WO2023045581A1 (en) * | 2021-09-25 | 2023-03-30 | 温州大学 | Device and method for laser shock strengthening of aero-engine blade |
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| Publication number | Publication date |
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| CN107671601B (en) | 2019-08-02 |
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Effective date of registration: 20201228 Address after: 224200 No.8 Beihai Road, Dongtai City, Yancheng City, Jiangsu Province Patentee after: Dongtai science and Technology Service Center Address before: No. 101, Nanxu Avenue, Zhenjiang City, Jiangsu Province, 212000 Patentee before: JIANGSU HUIZHI INTELLECTUAL PROPERTY SERVICES Co.,Ltd. Effective date of registration: 20201228 Address after: No. 101, Nanxu Avenue, Zhenjiang City, Jiangsu Province, 212000 Patentee after: JIANGSU HUIZHI INTELLECTUAL PROPERTY SERVICES Co.,Ltd. Address before: Zhenjiang City, Jiangsu Province, 212013 Jingkou District Road No. 301 Patentee before: JIANGSU University |
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Effective date of registration: 20210325 Address after: Room 809, Kechuang building, Dongtai hi tech Industrial Development Zone, Yancheng City, Jiangsu Province 224200 Patentee after: Dongtai tepusong Machinery Equipment Co.,Ltd. Address before: 224200 No.8 Beihai Road, Dongtai City, Yancheng City, Jiangsu Province Patentee before: Dongtai science and Technology Service Center |
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Effective date of registration: 20210425 Address after: 48 No. 224200 Yancheng City Dongtai city of Jiangsu Province East New District East Avenue Patentee after: Dongtai Chengdong science and Technology Pioneer Park Management Co.,Ltd. Address before: Room 809, Kechuang building, Dongtai hi tech Industrial Development Zone, Yancheng City, Jiangsu Province 224200 Patentee before: Dongtai tepusong Machinery Equipment Co.,Ltd. |
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Application publication date: 20180209 Assignee: Dongtai tepusong Machinery Equipment Co.,Ltd. Assignor: Dongtai Chengdong science and Technology Pioneer Park Management Co.,Ltd. Contract record no.: X2023980043158 Denomination of invention: A laser shock wave polishing device with micro grooves on the contact film Granted publication date: 20190802 License type: Common License Record date: 20231012 |
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Application publication date: 20180209 Assignee: Dongtai Donggao Electronic Information Technology Co.,Ltd. Assignor: Dongtai Chengdong science and Technology Pioneer Park Management Co.,Ltd. Contract record no.: X2023980045160 Denomination of invention: A laser shock wave polishing device with micro grooves on the contact film Granted publication date: 20190802 License type: Common License Record date: 20231102 |
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Application publication date: 20180209 Assignee: Dongtai Gaoxin Mechanical Equipment Co.,Ltd. Assignor: Dongtai Chengdong science and Technology Pioneer Park Management Co.,Ltd. Contract record no.: X2023980046304 Denomination of invention: A laser shock wave polishing device with micro grooves on the contact film Granted publication date: 20190802 License type: Common License Record date: 20231110 |